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Epitaxial GrowthTechniques
598XL
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Crystal Growth
Advancement in crystal growth techniques is one of the majorfactors responsible for semiconductor technology momentum today. LEDs Lasers Detectors
Solar Cells HBT, HEMT, .
Thermodynamics Chemical reactions Phase diagrams
Figure of merit: material quality, uniformity and controllability Thickness Composition Interface Doping
Defects
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Deposition Techniques
Epitaxial growth techniques: epi definition LPE HVPE MOCVD MBE
Deposition of dielectric films or polycrystalsemiconductors
PECVD Evaporation Sputtering
ALD
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Hot HCl (g) + Ga (l) ------> GaCl (g)
GaCl (g) + NH3 (g) -------> GaN (s) + HCl (g) + H2 (g)
Hydride gaseous sourceMetal liquid atomic source
Fast growth rate (> 100 um/h)Surface defects for non-nitride materials Oxford Instruments
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MBE Inventor:
Bell Lab, Alfred Cho
UHV : 10-11 torr
Not thermodynamic equilibriumcondition Governed by the kinetics of the
surface process
Solid atomic source effusioncell-controlled vapor pressure
Shutters Substrate-heated GSMBE and MOMBE (CBE) Slower growth rate
Better thickness andheterojunction control
Lower growth temperature High cost
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RHEED 5- 50 keV
Glancing angleincidence
Surface sensitive
ML
Rice U.
UHV
in situ monitoring
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MOCVD Nomenclature
MOCVD OMVPE MOVPE OMCVD AP-MOCVD LP-MOCVD
Most widely used epitaxial technique at commercial scale Major components:
Gas handling system Reactor chamber Heating system Exhaust system
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Vacuum and
Exhaust
system
Gas handle
system
ComputerControl
Reactor
MOCVD Growth System
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A MOVD growth system
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Gas Handling System
Sources: Metalorganics (MO) or alkyls: TMGa, TEGa, TMAl, TMIn, DMZn, etc. Bubbler Partial pressure of the MO in the bubbler:
Log[p(torr)]=B-A/T
Hydride: AsH3, PH3, NH3, Si2H6 Cylinder Gas cabinet
Carrier gas: H2 or N2 H2 purifier Valves, MFCs, tubes, pumps etc. Purity, cleanness, leak-tight
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MOCVD Gas Handling System
Aixtro
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MOCVD: gas handling system
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Metalorganic (MO) Compound
Vapor pressure: Determines the concentration of source
material in the reactor and the deposition rate. Too low: difficult to transport the source into
the deposition zone and to achieve reasonable
growth rates.
Too high: may raise safety concerns
Liquid vs solid MO sources: easier to control
the delivery from a liquid than from a solid.
Log[p(torr)]=B-A/T
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Vapor pressure of most common MO compounds
Compound P at 298 K
(torr)
A B Melt point
(oC)
(Al(CH3)3)2
TMAl 14.2 2780 10.48 15
Al(C2H
5)3
TEAl 0.041 3625 10.78 -52.5
Ga(CH3)3
TMGa 238 1825 8.50 -15.8
Ga(C2H5)3 TEGa 4.79 2530 9.19 -82.5
In(CH3)3
TMIn 1.75 2830 9.74 88
In(C2H
5)3
TEIn 0.31 2815 8.94 -32
Zn(C2H
5)2
DEZn 8.53 2190 8.28 -28
Mg(C5H
5)2
Cp2Mg 0.05 3556 10.56 175
Log[p(torr)]=B-A/T
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The mole flow rate of MO sources andAlloy Composition
The flow rate:
F (mol/min)=p MO/p Bubbler*[flow rate (ml/min)]/22400(mol/ml)
Alloys composition:
e.g the Al% in AlxGa1-xAs can be estimated byx Al=FAl/(FAl+ F Ga)
IF the pyrolysis and incorporation efficiencies of
Al and Ga sources are the same.
Gas phase ratio vs solid phase ratio needs to be calibrated!
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Example: MOCVD growth of GaN and related materials
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Example: MOCVD growth of GaN and related materials
Georgia Tech
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In situ Monitoring in MOCVD
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Control Parameters Temperature
Pressure Growth rate
V/III ratio
Doping
Growth pulse
Substrate orientation Desorption condition
Black box?
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Comparison of Epitaxial
Techniques
Growth method time features limit
LPE
(Liquid phaseepitaxy)
1963 Growth from
supersaturatedsolution onto substrate
Limited substrate areas
and poor control over thegrowth of very thin
layers
HVPE
(Hydride vapor
phase epitaxy
1958 Use metal halide as
transport agents to
grow
No Al contained
compound,
thick layer
MBE
(Molecular Beam
Epitaxy)
1958
1967
Deposit epilayer at
ultrahigh vacuum
Slow and Hard to grow
materials with high
vapor pressure
MOCVD
(Metal-Organic
Chemical Vapor
Deposition)
1968 Use metalorganic
compounds as the
sources
Some of the sources like
AsH3 are very toxic.