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Mectron and its Space Program Mectron and its Space Program UK – Brazil Workshop on Space Science and Technology UK – Brazil Workshop on Space Science and Technology
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Mectron and itsSpace ProgramMectron and itsSpace Program

UK – Brazil Workshop on Space Science and TechnologyUK – Brazil Workshop on Space Science and Technology

COMPANY OVERVIEW

FOUNDATION: F eb ru a ry , 1 9 9 1

STOCKHOLDERS: P riva te com p any - 5 p a rtners + B N D E S

MARKET: D efen se an d A erosp ace

CERTIFICATIONS: - ISO 9001/2000- RBQA 2110 ( b ased on NATO AQAP2110) - NBR 15100 ( b ased on AS9100A)

HEADQUARTERS: S ão José d os C am p os/S P - B razi l

TOTAL AREA: 3 7 . 000 m 2 (5 . 2 00 m 2 of b u i lt a rea )

GROSS REVENUE: ≈ U S $ 1 5 M i l l ion s (2 006 )

ADMINISTRATION

QUALITY M arce lo F a rh at

B.U. SENSORS& AVIONICSG ilb erto T rive la to

CEOA zh au ry C . d aC u n h a F i lh o

ADMINISTRATION/FINANCES

João M anoe l D ia sd e O live ira

COMMERCIAL R ogerio

S a lva d or

OPERATIONSH erm es N ilton

M acau

B.U. SPACE Jorge C orb an

B.U. TESTS& LOGISTICSR ob son D u a rte

ADMINISTRATIONCOUNCIL

DEFENSEW agner C am p os

A . S i lva

CHART

HUMAN RESOURCES

TOTAL: ≈ 220ACTIVITIES:

52%

15%

33%

RESEARCH & DEVELOPMENT

PRODUCTION

ADMINISTRATION

EDUCATION LEVEL:

PhDMaster ScienceMBAUniversity Level

TechniciansHigh SchoolOthers

2%6%10%

21%

39%

17%5%75% OF

LABOR COSTS

• FAB - Brazilian Air Force

• Brazilian Army

• Brazilian Navy

• EMBRAER

• AEB - Brazilian Space Agency

• INPE - Brazilian Institute forSpace Research

• Elbit Systems (Israel)

• Galileo Avionica (Italy)

CUSTOMERS

TECHNICAL CAPABILITIES

• AERODYNAMICS

• PROPULSION

• GUIDANCE AND CONTROL

• DIGITAL SIGNAL PROCESSING

• DIGITAL AND ANALOGICELECTRONICS

• MICROPROCESSORS(ON-BOARD SOFTWARE)

• RADIOFREQUENCY

• MATERIALS

• STRUCTURAL AND THERMAL ANALYSIS

• ELETRO-OPTICS

• PYROTECHNICS

• FINE MECHANICS

• TESTS

TECHNICAL CAPABILITIES

FACILITIESFACILITIES

Engineering

IT - INFORMATIONTECHNOLOGY

Final Assembly Area

CLEAN ROOMclass 100.000, positive pressure

certified by INPE

RF Lab

DevelopmentLab

PCB Assembly Area

AccelerationTest Facility(Centrifuge)

VibrationTest Facility(Shaker)

Radar Test Facility

TRANSMITTERTOWER

POSITIONERPLATFORM

RADAR TEST FACILTY(ANTENNAS FIELD)

EnvironmentalTest Facility

HIDROSTATICALFACILITYPressure Chamber 500 bar

Manufacturing Plant

MechanicalIntegration

RESOURCESMECHANICAL DESIGN

Solid Works AutoCAD Cosmos (Analysis ofFinite Elements)

ELECTRONIC DESIGN

OrCAD

RESOURCESINSTRUMENTATION

LabView

SOFTWAREDEVELOPMENT

Hardware/Software Development Workstation for 8X51/ 8X196 Microcontrollers and TMS320C5X / TMS320C3X / TMS320C67XXDSPs

RESOURCES

SMD (also BGA) PRINTED CIRCUIT BOARD ASSEMBLING

Reflow

Screen PrinterWelding/UnweldingWorkstation

Pick-and-Place

Welding Inspection Equipment

RESOURCES

Wave WelderMachine

PCB Automatic Test Equipment

Cable AssembliesAutomatic TestEquipment

SMD (also BGA) PRINTED CIRCUIT BOARD ASSEMBLING

RECURSOSMECHANICAL MANUFACTURING

ComputerNumerical

ControlMachine

(CNC)

Three Dimensional Inspection

Machine

P R O D U C T SP R O D U C T S

Mectron – Engenharia, Indústria e Comércio S/A

MAA-1 on F-5

Delivery ofMAA-1 Guidance and

Control Sections

Delivery ofMAA-1 Guidance and

Control Sections

WARHEAD

CANARDS

HANGER

PROXIMITY FUSE

ROCKET- MOTOR

WINGS

GUIDANCE AND CONTROL SECTION

MAA-1 MISSILE

Launch Against Maneuvering Target2007

Target shop Damage on target airframe

Damage on target IR source

MECTRON - Engenharia, Indústria e Comércio S.A.

MAA EVOLUTION

CHARACTERISTIC 3rd GENERATION

4th GENERATION

I n frared D etector

S ingle I n S b elem ent, gas cooled ,

one wavelength sens itive

M u ltip le I n S b an d G e elem ents , gas cooled ,

sens itive in two wavelength s for greater

d etection range

M axim u m S eeker B ores igh t A ngle < 4 0° > 60°

R ocket-M otor S ingle S tage T wo stages

M aneu verab ility < 50 g > 60 g

MAA-1

MAA-1B

≈ 90o

MSS 1.2 AC Weapon System

Mectron - Engenharia, Indústria e Comércio S.A.

AMMUNITION ANDFIRING POST

MSS - 1.2 SYSTEM

MSS - 1.2

LAUNCHING MOTOR

SHAPED-CHARGEWARHEAD

BOOSTER MOTOR

IMPACT FUZE

OGIVE

GUIDANCE AND CONTROL SECTION

WINGS (FOLDABLE)

LASER RECEIVER

Installation OverPatrol Vehicle

Mectron - Engenharia, Indústria e Comércio S.A.

MAR-1

Mectron - Engenharia, Indústria e Comércio S.A.

Radar Units

MECTRONGALILEO

AVIONICA

SCP-01 RADAR LOGISTICS FOR PRODUCTION

TAILCHUTE RECOVERY SYSTEMFOR EMBRAER 170 AIRCRAFT

Mectron - Engenharia, Indústria e Comércio S.A.

TAILCHUTE SYSTEM

NORMAL FLIGHTSTAND-BY MODE

RISKY MANEUVERARMED MODE

DEPLOY COMMANDED

1- “TRAILING CONE” IS CUT

AIRCRAFT OUT OF CONTROL

2- PARACHUTE IS DEPLOYED

TAILCHUTE´S PROCEDURE

“JETIISON” COMMANDED (PARACHUTE CABLE IS CUT)

PARACHUTE IS OPENEDSTABILIZING THE AIRCRAFT

(NOSE DOWN)

AFTER DIVING,AIRCRAFT

RECOVERS TO THE NORMALFLIGHT

TAILCHUTE´S PROCEDURE

NEW AVIONICS PRODUCTS

• L BAND TRANSPONDERSFunctions: tracking/identification ofin flight aircrafts by air traffic control radars

• C/X BANDS TRANSPONDERSFunctions: tracking/identification ofin flight missiles, aircrafts and space rockets during development phase/ flight tests

• S or L BAND TELEMETRY TXFunctions: transmission of performancedata of in flight missiles, aircrafts, UAVs,suborbital platforms and satellite launcherplatforms

AVIONICS INTEGRATION

• CMMI certification

• System conception

• Avionics procurementand supply

• Mission Computerhardware/softwaredevelopment andqualification

• Mission Simulator

• Integration Bench

• Ground/flight tests for avionics qualification

• Modification/installation on customers aircrafts

SPACE PROGRAMSPACE PROGRAM

Mectron - Engenharia, Indústria e Comércio S.A.

POWER CONTROL UNIT (PCU)

MULTIMULTI--MISSION PLATFORMMISSION PLATFORM

Mectron - Engenharia, Indústria e Comércio S.A.

MULTI-MISSION PLATFORM

SATELLITE

PAY LOAD PMM

STRUCTURALSUBSYSTEMACDH TT&C

SUBSYSTEMPOWER

SUBSYSTEMPROPULSIONSUBSYSTEM

Imaging and Sensoring

Scientific Research

MULTI-MISSION PLATFORM

PLATAFORM:

- PROPULSION SUBSYSTEM

- STRUCTURE

- POWER SUPPLY SUBSYSTEM

- TT&C SUBSYSTEM

MULTI-MISSION PLATFORM

MULTI-MISSION PLATFORM – LayoutTRANSPONDERS 1 e 2

SADA 1

SADA 2

PCDU

BATERIAS

ANTENA 1

ANTENA 2

PAINÉISSOLARES

1 e 2

DIPLEXERS1 e 2

PMM – Power Supply Subsystem(Block Diagram)

S A W 2

S A W 1

SADA

SADA

P C D U

B A T T E R Y

S witch ed /P rotected L in es

P rotected L in es

E E D L in es

H ea ter L in es

E G S E

A C D H A C D H

P S S

MULTI-MISSION PLATFORM

MULTI-MISSION PLATFORMSAG - Solar Array Generator

SOLAR

WING

SAG – Electrical Part (Orbital)

MULTI-MISSION PLATFORM

SAG Technical Features

Power: 1000 W (BOL - AM0, 28°C and 1353 W/m2)950 W (EOL – 37,5 V, 1326 W/m2, after 4 years)

Consists of ATJ SCA, 26% Efficiency, 40 x 69 mmTwo wingsThree Panels per Wing with four power lines eachDiode BoardResistor BoardEnd-of-Deployment Indication per wingTwo temperature sensors per wingTwo sun sensors per wing with temperature sensor

Weight: less than 13Kg (Electrical Part only)Size: 735 mm x 1429 mm each panelTotal area available for solar cell assembling is 6.3 m2

MULTI-MISSION PLATFORM

MULTI-MISSION PLATFORM

SADA SADA –– SOLAR ARRAY DRIVE ASSEMBLYSOLAR ARRAY DRIVE ASSEMBLY

SADA Technical Features

Consists of an Actuation Step Motor and a Slip Ring Assembly

Actuation Step MotorSine / Cosine typeRedundant WindingsMotor Coil Resistance: 290 OhmsElectrical Time Constant: 2 * 10E-3 sCoil Voltage: 21,8 to 35,8 V

Slip Ring Assembly60 Identical 1,5A Slip RingsRedundant BrushesSlip Ring Resistance: 60 mOhms at room temperature

Weight: less than 3KgSize: 180 ± 1 mm x Ø 100mm with flange of 30 mm x Ø 150 mm

MULTI-MISSION PLATFORM

PCDU - Power Conditioning and Distribution Unit

MULTI-MISSION PLATFORM

PCDU Modules – Engineering Model

MULTI-MISSION PLATFORM

PCDU – DCSM Module

MULTI-MISSION PLATFORM

PCDU Technical Features

Power: 1000 W (for battery charge and power distribution)

Cold-redundant architectureMicrocontroller based1 RS-422 serial communication interface per redundancy24 analog input channels per redundancy (voltage, current, temperature)

Power Conditioning UnitPower Control by Sequential Shunt Switches18 Power Control Channels (9 + 9)Non-regulated voltage bus-barVoltage in the range of 22V to 35V

Power Distribution Unit40 Power Lines with electronic over-current protection25 Heater Lines with fuse over-current protection14 Non-Switched Fuse Protected Power Lines32 EED Lines (16 + 16)SADA Actuation Interface

MULTI-MISSION PLATFORM

PCDU Technical Features

SoftwareBattery Charge Control SoftwareBattery Heater Control SoftwareSADA Actuation ControlFlexible Communication Protocol to exchange data with OBC (master-slave)

Weight: less than 20Kg

Size: 451 ± 1 mm (B), 275 ± 1 mm (L), 235 ± 1mm (H)

MULTI-MISSION PLATFORM

BATTERY (ABSL – UK)

MULTI-MISSION PLATFORM

• Battery Technical Features

Technology: Lithium IonConfiguration: series-parallelConsists of small Sony 18650HC Battery Cells

Capacity: 15 Ah per Battery ModuleEOC Voltage: 33,6V

Weight: less than 4KgSize: 166 ± 1 mm (B), 229 ± 1 mm (L), 95 ± 1mm (H)

MULTI-MISSION PLATFORM

EGSE – PSS – Solar Array/Battery Simulator

MULTI-MISSION PLATFORM

SAS/BTS - MMPSAS 1 - MMP SAS 2 - MMP

S A S -M O D U L E 1O N - O F FE M E R G E N C Y

S A S -M O D U L E 1

S A S /B TS

S A S -M O D U L E 2

S A S -M O D U L E 2

B A T TE R Y S IM U L A T O R (B TS )

S A S /B TS

PMM – TT&C Subsystem (Block Diagram)

SWITCHED BUS

TM & ClockEGSE

NON-SWITCHED BUSTCs do TT&CTC & ClockTT&C TMs

SWITCHED BUS

TM & ClockEGSE

NON-SWITCHED BUSTCs do TT&CTC & ClockTT&C TMs

A n tena 1

Acoplador

Híbrido

D ip lexad or1

TX 1

R X 1

TX 2

R X 2

U p -lin k

D own-lin k

A n tena 2

D ip lexad or2

U p -lin k

D own-lin k

MULTI-MISSION PLATFORM

MULTI-MISSION PLATFORM

Antenna:

Antenna Technical Features

Technology: MicrostripConsists of two arms Spiral printed over a ground plane

Frequency: 2,025 to 2,300 MHzCircular Polarization

Weight: less than 0.5 KgSize: 176 ± 1 mm x Ø 150mm

MULTI-MISSION PLATFORM

TT&C - Transponder and Diplexer

MULTI-MISSION PLATFORM

Transponder Technical Features

Consists of one redundant receiver and one redundant transmitter

TX Frequency: 2,200 to 2,300 MHzRX Frequency: 2,025 to 2,120 MHz

TX RF Power: 1W, 2W and 5W (available versions)

RS-422 Interface with OBC

Weight: less than 5,6 KgSize: 156 ± 1 mm (B), 210 ± 1 mm (L), 94 ± 1mm (H)

MULTI-MISSION PLATFORM

PMM – Metron’s Partners

SUBSYSTEM COMPANY ACTIVITY

TT&C

I N V A P (A rgen tin a ) R X – P S K D em u la tor D esignTX – M od u la tion F i lter D esign

B E T A T e lecom (S JC ) R X – R F D esign an dE G S E D esign

E Q U A TO R I A L (S JC ) T h erm a l an d R a d ia tion A na lys is

C E M E F (S JC ) S tru ctu ra l A n a lys is

POWER SUPPLY

E Q U A TO R I A L (S JC ) T h erm a l an d R a d ia tion A na lys is

O R B I T A L (S JC ) E lectrica l P a rt D esign an d M an u factu re

C E M E F (S JC ) S tru ctu ra l A n a lys is

MULTI-MISSION PLATFORM

CBERS PROGRAMCBERS PROGRAM

Mectron - Engenharia, Indústria e Comércio S.A.

CBERS

TTCS - Transponder for Telemetry, Tracking and Command Subsystem

CBERS

TTCS - Transponder for Telemetry, Tracking and Command Subsystem

Transponder Technical Features

Consists of one redundant receiver and one redundant transmitter

TX Frequency: 2,200 to 2,300 MHzRX Frequency: 2,025 to 2,120 MHzRanging Major Tone: 100 kHzRanging Minor Tone: 16 to 20 kHz

TX RF Power: 1W

TM video, TC video and Lock interface to CTU

Weight: less than 5,0 KgSize: 156 ± 10 mm (B), 210 ± 10 mm (L), 94 ± 10 mm (H)

CBERS

MECTRON’s PARTNERS

CBERS

COMPANY ACTIVITY

Beta Telecom RX – RF Design and EGSE Design

Neuron Eletrônica TX – RF Design

CBERS

DDR - DIGITAL DATA RECORDER SUB-SYSTEM:

D D R D igital S ignal S witch (D D R D S S )

DDR S/S

CAMERAS

S olid S tate R ecord er (S S R )

(MWT S/S)

D Ts

(PIT S/S)

M U X/20m

W F I

P A N

M U X/1 0m

I R S

EPSS

OBDH

28V TM /TC 1 553B

CBERS

DDR - EQUIPMENT:

DSS - Digital Signal SwitchSSR - Solid State Recorder

DDR DSS Block Diagram

CBERS

M U X /2 0m

INMUXCH4

M W T

O U TS S R C H 5 I N S S R C H 4 I N S S R C H 5

S S R

M

O U TS S R C H 4

W F I

MR R

INWFICH5

M

R

M

R

M

R

OUTMWTCH4

OUTMWTCH5

M

R

M U X /2 0M ch anne l A /B se lection

W F I ch anne l A /B se lection

M U X /2 0M P layb ack M od e

W F I P la yb ack M od e

D S SC O N V E R S O R D C -D CE P S S

O B D H

V S ec.2 8 V

M U X /2 0M P la yb ack M od e

W F I P la yb ack M od e

M U X /2 0M ch an ne l A /B se lection

W F I ch anne l A /B se lection

T M

Te lecom m and T u rn -on /off D C /D C converters

S 2S 1

S 3S 4

M MR R

T C

M U X /2 0M P layb ack M od e S tatu s

W F I P la yb ack M od e S tatu s

M U X /2 0M ch an ne l A /B S tatu s

W F I ch anne l A /B S ta tu s

D C /D C converter voltage

DDR DSS Features

Cold redundant

LVDS interfaces to camerasLVDS interfaces to data transmittersLVDS interfaces to SSRReal-time and Play-back mode

Weight: less than 4,0 KgSize: 124 ± 10 mm (B), 170 ± 10 mm (L), 80 ± 10 mm (H)

CBERS

DDR SSR Block Diagram

CBERS

SSR

DT Subsystem

or

DDR Digital Signal Switch

Where:

M is M ain R is R ed und ant

Memory Unit 1

(M)

(R)

Controller 1 Controller 2 (M) (M)

Control 1 (M) Control 2 (M)

Control 1 (R)Control 2 (R)

CH1 (R)

CH1 (M)

CAMERASSubsystem

or

DDR Digital Signal Switch

CH1 (R)

CH1 (M)

CH2 (R)

CH2 (M)

CH4 (R)

CH4 (M)

CH2 (R)

CH2 (M)

CH4 (R)

CH4 (M)

28V (R)

EPSS 28V (M)

OBDH Subsystem

1553B (M)

1553B (R)

On/Off (M)

On/Off(R)

DC/DC Converter (M)

Power (M)

Power (R)

DC/DC Converter (R)

CH1 INPUTI/F

CH2

CH4

CH1

CH2

CH4

INPUTI/F

INPUTI/F

OUTPUTI/F

OUTPUTI/F

OUTPUTI/F

INPUT

I/F CH3 (R)

CH3 (M)CH3

CH3 (R)

CH3 (M)

CH3 OUTPUTI/F

CH5 (R)

CH5 (M)

CH5 INPUTI/F CH5 (R)

CH5 (M)

CH5 OUTPUTI/F

Memory Unit 2

(M)

(R)

Controller 1 Controller 2 (R) (R)

DDR SSR Features

Cold redundant / N out of M redundancy

LVDS interfaces to cameras/DSS/data transmitters1553 interface to CTU

Recording, Play-back and Erase mode

Provide capability to record up to 15 minutes of each related input channelCapacity at Begin of Life (BOL): ≥ 330 Gbits (> 40Gbytes);Capacity at End of Life (EOL): ≥ 274 Gbits (> 34 Gbytes)Technology: SDRAM

Weight: 15.0 ± 0.5Size: 250 ± 10 mm (B), 325 ± 10 mm (L), 235 ± 10mm (H)

CBERS

CBERS

DDR Electrical Test Equipment

Thank YouThank You


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