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Agilent Technologies

Medalist i1000 In-circuit Test System

User Guide

Notices© Agilent Technologies, Inc. 2007

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Manual Part Number

U9401-95000

Edition

First edition, September 2007

Printed in Taiwan

Agilent Technologies, Inc.1601 California Street Palo Alto, CA 94304 USA

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Safety Notices

WARNING

A WARNING notice with this sym-bol indicates a risk of electric shock. The operator must follow the instructions carefully to avoid electric shock.

WARNING

A WARNING notice calls attention to a procedure, practice, or condi-tion which could possibly cause bodily injury or death.

CAUTION

A CAUTION notice calls attention to a procedure, practice, or condi-tion which could possibly cause damage to the equipment of per-manent loss of data.

Medalist i1000 In-circuit Test SystemUser Guide

Medalist i1000 User Guide

Introduction to the Medalist i1000 1

Generating the Test Program 19

Using the Medalist i1000 System 27

Test Interface 33

Test Editors 59

User Management 83

Maintenance and Troubleshooting 87

2 Medalist i1000 User Guide

1

1


1Introduction to the Medalist i1000

Overview 2

Test Methods 3

Medalist i1000 Specifications 17

This chapter introduces the Medalist i1000 In- circuit Test System, the test methods used, and the system specifications.

NOTE The information in this guide applies to both the press down model (U9401A) and vacuum model (U9402A) unless indicated otherwise.


1 Introduction to the Medalist i1000

Overview

The Medalist i1000 In- circuit Test System offers advanced defects coverage features coupled with a simplified software model for a cost- effective ICT solution.

The Medalist i1000 offers the cutting- edge Agilent VTEP v2.0 vectorless test suite. VTEP v2.0 comprises the award- winning iVTEP and the new Network Parameter Measurement (NPM) technology, offering unparalleled coverage of micro ball grid arrays and flip chips, as well as power and ground pins for connectors, commonly found in digital consumer products and desktops PCs.

A user friendly graphical user interface ensures that the system is easy to operate. An AutoDebug feature slashes debugging time from days to just a few hours. An automatic node- guarding feature eliminates the need for manual checks of schematics against guard points.

The Medalist i1000 offers users two different fixture options: the first option accepts a typical MDA- type fixture with cable connections and the second employs a vacuum- type fixture and a mechanical fixture lock- down system using electrical motors. This cableless design provides fast fixture swapping time while maintaining high signal integrity.

Table 1 Specifications

Product Maximum Node Count

Programmable Power Supply

Fixture Type Footprint

U9401A 2240 4 x 100 W Press Down 0.72 m2 (6.67 ft2)

U9402A 2240 4 x 100 W Vacuum 0.72 m2 (6.67 ft2)


Medalist i1000 User Guide 3

Test Methods

• Resistance Measurement

• Capacitance Measurement

• Inductance Measurement

• Guarding

• Measurement of Diodes

• 3- Terminal Measurement of Transistors

• IC Clamping Diode Test

• Open/Short Test

• Jumper Test

• VTEP v2.0 and TestJet Test

• IC SCAN Test



Resistance Measurement

Constant Current Measurement (Mode CC)

When Mode CC is selected, the source current is automatically determined according to the resistance of the resistor being tested.

Constant Voltage Measurement (Mode CV)

When the resistor being tested is in parallel with a capacitor of high capacitance, the charge- up time for the capacitor is extended if Mode CC is used. In such cases, select Mode CV to reduce the time required to process the measurement. The constant voltage for Mode CV is 0.2 V.

Figure 1

Figure 2

ADC

B

A

VI R

R =VI

V

VA

R1 R2

RXA B

IX

RF

IF

VO

Assuming IX = IF

VA

RX

VO

RF

=

VA

VO

RFx∴ RX =



Capacitance Measurement

AC Constant Voltage Source

An AC constant voltage source is used to measure the capacitive reactance of the capacitor being tested. The measurement circuit with guarding is arranged as follows:

Five AC signal sources of 100 Hz, 1 kHz, 10 kHz, 100 kHz, and 1 MHz are used in this measurement that correspond with range settings 1, 2, 3, 4, and 5 respectively.

Phase Measurement (Mode P)

Phase measurement (Mode P) uses the same setup as AC Measurement, but phase calculation is taken into consideration to determine the imaginary component of the resulting response. Thus in cases where a capacitor is in parallel with a resistor, accurate measurement can be done.

Figure 3

AC

C1 C2

CA B

IC

RI

IR

VO

Assuming IC2 = 0 (because of guarding)

VXC

VOR

=

∴ C =

IC2V

G

∴ IC = IR

where XC = impedance of C =

VOV

1WR

x

1WC

(W = 2π x source frequency)



DC Constant Current Source (Mode DC)

When the resistor has a resistance above 3 μF, Mode DC for capacitor measurement will be selected automatically. The capacitor will be charged by a DC constant current source and the capacitance can be calculated based on the charge- up time.

Figure 4

VI

ItC

T

V

V

t

=

C = x ItV



Inductance Measurement

AC Constant Voltage Source

An AC constant voltage source is used to measure the inductive reactance of the inductor being tested.

Phase Measurement

Even when an inductor is not in parallel with a resistor, a wire resistance similar to a resistance in series occurs in the inductor test. In such as situation, phase measurement (an inductor in series with a resistor) should be used.

Figure 5



Guarding

In- circuit testing (ICT) uniquely utilizes a guarding technique to isolate a component under test and to prevent interference from other components in its measurement path.

Guarding, whether in Constant Voltage mode for resistors, or AC or P mode for capacitors and inductors, uses the same setup as shown in Figure 2 on page 4. Utilizing the virtual ground characteristic of the Opamp inputs, the device under test is guarded to ensure that the current flowing through it is equal to the current flowing through the reference resistor, thereby allowing accurate measurement.

For resistor testing using Constant Current Mode (CC), guarding is done by a buffer circuit which is used to set the guarded point to the same potential as the source node such that it will eliminate the current flow. Setting point G at the same potential as point A will cause IR1 to be zero as there will be no potential difference between points A and G.

As illustrated in Figure 6, with guarding the measured resistance (R) is independent of R1 and R2. The Medalist i1000 software can select up to 10 guarding points automatically.

Figure 6

VG = VA

∴ IR1 = 0 & IR = 1

∴ IR = V/I

R1

R2

A

B

IR

ADCV

OP

RG

VA VG

Buffer

IR1

I



Measurement of Diodes

Forward Voltage for Diodes

A sample test setup is as follows (see Figure 8):

Figure 7 Forward voltage for diodes

A (point A of D1): Pin 1

B (point B (cathode)): Pin 2

Mode: LV

Style: V

StdVal (standard value): 0.7 V (expected forward bias voltage)

DAV: 1.5 V (source voltage from DAC to forward bias diode)

A

B

RS

ADC

VS

DAC D1

Figure 8



Breakdown Voltage for Zener Diodes

A sample test setup is as follows (see Figure 10):

Figure 9 Breakdown voltage for zener diodes

A (point A of ZD1 (cathode)): Pin 1

B (point B): Pin 2

Mode: LV

StdVal (standard value): 2 V (10%) (reversed bias voltage between point A and point B)

DAV: 3 V (source voltage from DAC to put device under test into reverse bias)

A

B

RS

ADC

VS

DAC ZD26 V

Figure 10



3-Terminal Measurement of Transistors

Transistor test (Mode NCV, PCV)

For 3- terminal measurement of transistors, sample tests are as follows:

A reference voltage is applied to the collector pin and the test voltage is applied to the base pin to turn the transistor ON and OFF. Voltage across the collector and emitter should measure low when the transistor is turned on.

Figure 11

NPN-type transistor (Q1 in Figure 12)

A (pin C): 32

B (pin E): 33

EA (pin B): 31

PNP-type transistor (Q2 in Figure 12)

A (pin E): 35

B (pin C): 34

EA (pin B): 31



Photon Coupled Transistor Test (Mode NCV)

The method for measuring a Photon Coupled Transistor (PCT) is the same as that for NPN- type transistor. The settings for A, B, EA and EB are as shown in Figure 13.

IC Clamping Diode Test

An IC clamping diode test involves a low- voltage functional testing of two terminals, which may consist of: • an IC PIN and the VCC PIN of the IC, or • an IC pin and the GND PIN of the IC, or • two adjacent IC pins.

The test program is generated through automatic learning (from the Debug menu, select Vectorless Test Generator > IC Clamping Diode). During programming, each IC pin number can be specified as a VCC PIN or GND PIN through the IC Editor.

Figure 12

Figure 13

Pin 25 = A (DAV sets the reference voltage)

Pin 26 = B (Ground)

Pin 1 = EA (EDAV sets the voltage to turn on LED)

Pin 24 = EB (Ground)



Open/Short Test

The open or short test can be learned from a known good board. During learning, the system measures the resistance between any two test points and generates a shorts group table:

S1: 1, 20, 17, 85S3: 3, 51, 62S6: 6, 41S7: 7, 92

As shown in the above example, S1 consists of four test points, namely, pins 1, 20, 17 and 85. S3 consists of three test points, namely, pins 3, 51 and 62, and so on.

If the resistance between any two points is less than 20 Ω, it will be considered a short. Otherwise it is considered an open.

Open and short tests are conducted based on the shorts group table, first the open tests and then the short tests.

An open test is intended to check if any two test points in the same shorts pin group are short. If not, it may be an open. When the resistance between any two points is above the Short threshold, it is considered as an open fail.

An open test is intended to check if any two test points in different shorts pin groups are short, or if any two shorts pin groups are short. When the resistance between any two points tested is less than the Short threshold, it is considered as a short fail.

Jumper Test

A comparator hardware circuit is used for the jumper test. Up to four ranges (1JP, 2JP, 3JP, and 4JP) are available:

1JP: < 10 ohm2JP: >= 10 ohm, < 20 ohm3JP: >= 20 ohm, < 80 ohm4JP: >= 80 ohm

The range settings can be adjusted by setting the Short/Learning/Open Threshold (from the Setup menu, select System Setup > Short/Learning/Open Threshold).



VTEP v2.0 and TestJet Test

Agilent Technologies’ VTEP is a combination of advanced measurement hardware and improved software algorithms which dramatically improve the noise characteristics, stability, accuracy and repeatability of TestJet measurements. With these enhancements, reliable measurements down to single- digit femtofarads can now be made.

VTEP is an unpowered test of the connectivity from each pin on a device to the circuit board. The system uses the VTEP hardware to measure the capacitance from a pin of a device to the VTEP probe. The measurement is repeated for each pin on the device, except power and ground pins. Pins that are tied together are tested as one pin.

iVTEP is a breakthrough for integrated circuits. For the first time, the measured capacitance value is less dependent on shrinking lead- frame geometries. iVTEP will work only on devices with little or no lead- frames (like uBGAs and flip- chips) and devices under heat spreaders. It will not work on connectors. Its noise signature is up to 7 times better than VTEP which is in turn 3 to 7 times better than TestJet. This is a proprietary and patent- pending technique.

Network Parameter Measurement (NPM) is a breakthrough for connectors. Finding opens on power and ground pins using vectorless test has always proved problematic at ICT. First, directly injecting a source voltage on power or ground nets causes significant voltage drops due to the presence of large capacitances on these nets. Second, individual open defects are masked since many pins are typically tied to these nets. NPM does not rely on this direct approach. Instead, existing VTEP hardware is used to make network parameter measurements of the connector pins during the execution of the VTEP test. Opens on power and ground pins are detected and diagnosed based on these network parameter measurements.

VTEP, iVTEP and NPM are collectively known as VTEP v2.0.

The procedure for upgrading from TestJet to VTEP is as follows:

1 Replace mux cards.

2 Replace amp boards.

3 Connect amp boards to mux cards directly with twisted pair wires.

4 Regenerate VTEP tests.



Generating VTEP Tests

VTEP tests are not generated during test development on the Medalist i1000. They have to be generated with a known good board during debug (from the Debug menu, select Vectorless Test Generator > VTEP v2.0/TestJet).

The VTEP test generated will automatically go through the AutoDebug process to have its high and low limits adjusted based on the VTEP parameters that have been set (see “Setting VTEP Parameters” on page 72). In cases where AutoDebug is unable to obtain a stable VTEP test, the AutoDebug process is automatically repeated with the iVTEP test algorithm.

To enable NPM tests on connectors, simply select the appropriate connector library from the Part Number (P/N) column in the IC Editor window (Figure 14). Once selected, the NPM algorithm is applied to all VTEP tests on that particular connector.

Figure 14



IC SCAN Test

IC SCAN is another option for identifying open pins in a SMD IC. The advantages of IC SCAN are:

• Reduced cost as no special sensors are needed.

• No space restriction. Measurements can be made for a stacked IC or an IC provided with a heat sink.

• BGA ICs can be properly tested.

• IC bonding wire open or I/O breakdown can be detected.

• C Pin cold joints can be detected, even if not completely in open connection.

• Automatic debugging: The appropriate test mode and range are selected automatically based on the actual value or the standard value to ensure optimum test results.

IC SCAN tests can be automatically generated through system learning (from the Debug menu, select Vectorless Test Generator > IC SCAN).



Medalist i1000 Specifications

Table 2 Medalist i1000 system

Feature Specification

Power supply Voltage 200 V / 220–240 V

Frequency 60 Hz / 50 Hz

Power Consumption 1000 VA maximum

Operating Temperature 5° to 50° C

Operating Humidity 20% to 80% non-condensing

Weight Press Down Model Approximately 197 kg (standard test points)

Vacuum Model Approximately 234 kg (standard test points)

Dimensions 120 mm x 700 mm 1485 mm (width x depth x height)

Test Points Standard 320 points

Maximum 2,240 points

Controller Windows-based PC

Table 3 Press Down Unit for U9401A

Feature Specification

Pneumatic Cylinder 100 mm x 200 mm (diameter x length)

Pneumatic Valve 1-in-2-out, with central locking

Inlet Air Pressure 5 to 8 kg/cm2

Pressure 470 kg

Fixture Area 480 mm x 350 mm maximum

Dimensions 600 mm x 450 mm x 950 mm (width x depth x height)

Weight Approximately 70 kg



19


2Generating the Test Program

BOM File Format 20

Generate ATD File 24

This chapter describes how to generate the test program for the Medalist i1000 system, using the BOMtoATD software provided.

In order to generate the test program (.atd file), the following data files are required:• Pins file• Nails file• BOM file

The pins and nails files may be generated from CAD files using FabMaster or any other software that produces the same file format. The BOM file must be created according to the format described in this chapter.


2 Generating the Test Program

BOM File Format

Table 4 specifies the contents of the BOM file.

Table 4 BOM file requirements

Item Description

File type Text file

Filename No restrictions

Data format Header:Name Type Value +Tol(%) -Tol(%) Part No Comment ----------------------------------------------------------- The header is optional. Note that semi-colons must not be used in the header.

Data:Name; Type; Value; +Tol(%); -Tol(%); Part No; Comment; The field formats are described below.

Individual field formats

Name Type: AlphanumericLength: maximum 255 charactersRestrictions: None

Type Type: AlphanumericLength: maximum 4 charactersRestrictions: See “Valid Types and Examples”.

Value Type: AlphanumericLength: maximum 10 charactersRestrictions: Must contain the value and unit of measurement. See “Valid Values”.

+Tol (%) Type: AlphanumericLength: maximum 10 characters, including the decimal point (if any) and % signRestrictions: Must be a percentage value ending with the % sign.

-Tol (%) Type: AlphanumericLength: maximum 10 characters, including the decimal point (if any) and % signRestrictions: Must be a percentage value ending with the % sign.

Part No Type: AlphanumericLength: 255 charactersRestrictions: None

Comment Type: AlphanumericLength: 255 charactersRestrictions: None



Valid Types and Examples

The valid Types are:

R Resistor

L Inductor

C Capacitor

JP Jumper

D Diode

Q Transistor or FETs

U IC or Connectors

V Voltage

xPyR Resistor Arrays (x = Number of pins, y = Number of internal resistors)The Comment field must be populated with the appropriate description for some types of resistor arrays. The Comment field can contain:

DIP Type B DIP package

SMT Type B SMT package

COM# Pin number for the common lead. Separated with "," if more than one common lead.



Figure 15 Examples for resistor arrays

R1; 10P5R; 10ko; 5; 5; ; DIP; R1; 16P8R; 10ko; 5; 5; ; SMT;

R3; 10P8R; 10ko; 5; 5; ; COM=1,6;

R2; 10P9R; 10ko, 5; 5; ; COM=1;

Or R3; 10P8R; 10ko; 5; 5; ; COM=5,10;Or R3; 9P8R; 10ko; 5; 5; ; COM=10;

R2; 10P9R; 10ko, 5; 5; ; ; R3; 8P12R; 220o,330o; 5; 5; ; ;where R = 220o and R1 = 330o



Valid Values

The Value must contain the numeric value of the measurement and the unit of measurement in the form YZ, for example, 10ko. The maximum number of characters is 10, including the decimal point (if any) and the unit of measurement.

Only jumpers do not follow this format; see Table 5.

Y can be: M = megak = kilom = milliu = micron = nanop = pico

Z can be:o = ohmF = faradH = henryV = volt

Table 5 Valid units of measurement

Type Description Valid unit of measurement

R Resistor o, ko, Mo

L Capacitor pF, nF, uF, mF, F

C Inductor nH, uH, mH, H

JP Diode mV, V

D Transistor mV, V

Q Jumper 1JP - Closed Jumper4JP - Open Jumper

U IC (None)

V Voltage mV, V



Generate ATD File

With the required files, you can generate the test program (.atd file) for the Medalist i1000. The test program is the main test file that contains all the test steps of the board.

The required files are:• Pins file• Nails file• BOM file

Follow these steps to generate the test program:

1 Launch the BOMtoATD software.

2 Click Open BOM to select the BOM file to load.

The data is loaded into the BOM tab.

3 Click Open Pins to select the Pins file to load.

The data is loaded into the Pin tab.

Figure 16 BOM data



4 Click Open Nails to select the Nails file to load.

The data is loaded into the Nail tab.

5 Click Convert to begin translation.

Once translation is completed, the data appears in the component tabs.

Figure 17 Pins data

Figure 18 Nail data



6 Click Save and enter a name for the test program.

The test program is now ready to be loaded into the Medalist i1000 software.

Figure 19 Converted component data

27


3Using the Medalist i1000 System

Safety Precautions 28

Powering Up the System 29

Logging On to the Medalist i1000 Software 30

Customizing the Medalist i1000 Window 31

This chapter describes how to power up and log on to the Medalist i1000 In- circuit Test System.


3 Using the Medalist i1000 System

Safety Precautions

Press Down Model (U9401A)

• Before powering on the testhead, ensure that no one’s hands are in the working area of the Press Down Unit.

Before operation, ensure that:

• The sensors are activated. Check that the sensor switch at the rear of the Press Down Unit is in the ON position.

• The sensors on both sides of the Press Down Unit are correctly aligned. Perform the necessary alignment of the sensors before further operations. Refer to the Installation Guide for the alignment procedure.

If any adjustment to the press height is needed:

• Be sure to turn off the sensors before adjusting the press height. The RETEST button blinks to indicate that the sensors have been turned off.

• After adjustment is completed, make sure that nobody’s hands are in the working area of the Press Down Unit before reactivating the sensors.

During operation

If there is any malfunction of the EMERGENCY STOP button or safety sensors, turn off the system immediately and call the service center. See “Service and Support” on page 92.

After operation

Press the UP button and make sure that the top plate rises to the highest position. Shut down the computer and turn off the testhead.

WARNING Pinch hazardWhen testing starts, vacuum or compressed air is applied to the fixture. To avoid pinched fingers, keep fingers away from the PC board and test fixture.

WARNING The operator is at risk if the sensors are not properly aligned.

CAUTION Ensure that the top plate has risen to the highest position before loading or unloading the fixture.



Powering Up the System

Turn on the power to the system in the following order:

1 MAIN POWER

2 PC POWER

3 SYSTEM POWER

4 CPU power

5 Testhead power

Shutting Down the System

Be sure to shut down the controller before turning off power to the testhead.

Figure 20 Power up the system

1

54

3 2



Logging On to the Medalist i1000 Software

1 To launch the Medalist i1000 software, click its icon on the desktop.

2 Enter your user name and password. The security level for your user name will be shown automatically. Click OK.

The Medalist i1000 Operator window is displayed (Figure 21).

The Operator window shows basic test information and the progress of each test cycle. Graphical views of the boards and test reports are also available. These features and functions are described in chapter 4, “Test Interface”.

From the Operator window, select Debug to go to the Test Editor window which shows the test steps and highlights failing devices for debugging. For details, see chapter 5, “Test Editors”.

Figure 21 Medalist i1000 Operator window



Customizing the Medalist i1000 Window

You can change the following:

• Hide or show toolbars

Select View, Show Toolbar followed by the name of the toolbar. The toolbars are described in Table 9 on page 39.

• Change display options in the Operator window

• You can the background color of each area in the window. Move the cursor to the top left corner of each area (for example, Test Setup), and when the cursor changes shape, double- click to display a color palette.

• The color of some of the text can also be changed. Point at the text, and when the cursor changes shape, double- click to display a color palette.

• Change language

To change the language for the software interface, select it from the Language menu.



33


4Test Interface

Operator Window 34

Graphical Locators 45

Test Reports 40

Modifying System and Test Parameters 51

The Operator window shows basic test information and the progress of each test cycle. Additional test reports can be displayed, and graphical views of the board help you locate a failing device or pins by highlighting them.


4 Test Interface

Operator Window

Table 6 describes the sections in the Operator window.

Table 6 Features of the Operator window

Feature Description

1 Test Setup Shows information about the test station and production environment. This is where the operator enters board details, if required.

2 Test Status Shows the progress of each test cycle.

3 Test Result Shows the test result (e.g. Pass, Fail, Testing)

4 Test Report Real-time display of production yield results.

5 Test Fail Report Reports on the failures.

6 Test Message Shows the number of boards and pins tested. Also indicates whether the current mode is Test or Retest.

Memo Shows a summary of the tests that were run and the test status.To display the Memo, right-click in the main window and select ON. See “Information in the Memo Area” on page 35.

7 Step Report Shows details of the current test step.

Figure 22 Medalist i1000 Operator window

Test Interface 4


Information in the Memo Area

To display the Memo, right- click in the main window and select ON. The Memo area shows a summary of the tests that were run and the test status.

Figure 23

Table 7

Row Description

Type The test category (listed below). Green indicates that all tests in that category passed; red indicates one or more failures.R – ResistorL – InductorC – CapacitorJP – JumperQ – TransistorV – Voltage testI – Current testTJ – VTEP v2.0/TestJetCD – Clamping diodeIS – IC SCAN

Total Total number of components tested for each type.

Overall Steps The step number (in the entire test program) of the first failed component.Double-click to show this step in the All components tab in the Test Editor. See “Test Editor” on page 60.

Group Step The step number (in the test category) of the first failed component.Double-click to show this step in the tab for this component type in the Test Editor. See “Test Editor” on page 60


4 Test Interface

Menus and Toolbars in the Operator Window

• Menu Options• Toolbars

Menu Options

Table 8 Menu options in the Operator window

Menu Option Description

File New Creates a new test program.

Open Opens a test program. Note that only users with security level higher than “Operator” can load test programs.

Save Saves the current test program.

Save As Saves the current test program under a new name.

Login Allows you to log in using a different user name and/or security level.

Configuration Let you save and re-use the system configuration.• Export – Exports the current configuration to a file.• Import – Imports saved settings from a file.• Clear – Clears any changes made before exiting the Medalist i1000

software.• Backup – Backs up the current configuration to a file named

Backup.REG, which is saved in the same folder as the configuration file.

• Restore – Restores the configuration from the backup file.

Exit Exits the Medalist i1000 software.

Edit Cut, Copy, Paste Performs the standard cut, copy, and paste functions.

Test Test Starts the test.

Stop Stops the test. The status Abort will appear in the Test Result section.

Change Test Mode Switches between Test and Retest modes. The current mode is indicated in the Test Message section.

Learn Learn Discharge Generates discharge information through learning. Any capacitance above 2 uF from any test step will be included in the learning process.

Learn Shorts Groups Generates open and short tests through learning. Use Setup > Short/Learning/Open Threshold to set the learning threshold level.If the measured impedance between any two points is below that threshold, it is considered a short. If it is above the threshold, it is considered an open.

Debug Test Editor Displays the Test Editor for modifying the test program. See “Test Editor” on page 60.

Test Interface 4


View Show Toolbar Lets you display or hide individual toolbars. See “Toolbars” on page 39.

Pin Location Graphic Find a specified pin. See “Find Pin or Nail” on page 46.

Nail Location Graphic Find a specified nail. See “Find Pin or Nail” on page 46.

Device Location Graphic Find a specified device. See “Find Device” on page 47.

Open Fail Graphic Locate open fail pins. See “Locate Open Fail Pin” on page 48.

Short Fail Graphic Locate short fail pins. See “Locate Short Fail Pin” on page 49.

Component Fail Graphic Locate failing components. See “Locate Component Failures” on page 50.

Print Statistic Report Prints a report on the test statistics and number of failures in various test categories.

Test Report Prints a report on the current test.

Report Daily Report Shows the test results for the specified date. An example is shown in Figure 25 on page 42.

Monthly Report Shows the test results for the specified month. An example is shown in Figure 26 on page 42.

Top Ten Fail Report Reports on the type, number of failures and failure rate of the top ten non-conforming components. An example is shown in Figure 27 on page 43.

Test Report Reports on the current test. An example is shown in Figure 28 on page 44.

Last Test Report Reports on the previous test. An example is shown in Figure 29 on page 44.

Clear Report • Statistic Report – clears the test statistics in Test Report and Test Fail Report.

• Histogram Report – clears the test statistics in the histogram report.

Window The Window menu provides the standard window display options.

Diagnostics Reset Hardware If the testhead power was turned off without exiting the Medalist i1000 software, power on the testhead again and select Reset Hardware to synchronize the software with the testhead.

Verify Verify Pin Cards – Verifies that all relays are working properly. Enter the number(s) of the pin cards to test. See “Verify Pin Cards” on page 80.

I/O Cards Verifies testhead I/O actions. See “Verify I/O Cards” on page 81.

Pin Locator Locates nail numbers on the test fixture. See “Pin Locator” on page 82.

Slot Information Verifies the slots. See “Verify Slots” on page 82.

Self-Tested Information Performs a self-test and displays a report.




4 Test Interface

Setup Select Test Groups Select the component types to test. See “Selecting Test Groups” on page 51.

Set Login Status To restrict access to the Medalist i1000 software, select the Login Enabled option. Users will need a username and password to run the software.

User Management (Administrators only) Add or remove users. See “User Management” on page 83.

System Setup • System Parameters – Set up system, network, and test parameters. See “Modifying System and Test Parameters” on page 51.

• Short/Learning/Open Threshold – Set threshold levels for learning.

Barcode Reader Port Disable or enable the barcode reader port. Specify None if no barcode reader is in use.

Language Lets you select the language for the software interface.



Test Interface 4


Toolbars

The toolbars that may appear are as follows:

Figure 24 Toolbars

Table 9 Toolbars

Description

1 File toolbar, providing the standard File functions.

2 Focus toolbar, providing quick access to:a Test editorb Operator windowc AutoDebug

3 Window toolbar, providing the standard window display options.

4 Edit toolbar, showing the standard editing buttons.

5 Graphics Focus Toolbar, providing quick access to:d Component Fail Graphice Open Fail Graphicf Short Fail Graphicg Pin Location Graphich Nail Location Graphici Device Location Graphic


4 Test Interface

Test Reports

Besides the test results and statistics displayed in the main window, you can also obtain the following:

Statistics Report

From the Print menu select Statistics Report to print the test statistics displayed in Test Report and Test Fail Report sections on the screen (number of tests and failures in various test categories). A sample report is shown below.

Example 1 Statistics Report

Date: 2007/2/27Time: 09:43:33Shift: 1Status: TestBoard Name: BoxLine Number: Product Number: Product----------------------------------------Pass: 171 pcsFail: 108 pcsTested: 279 pcsYield Rate: 61.29 %----------------------------------------Open Fail: 0 pcsShort Fail: 0 pcsComponent Fail: 8 pcsFunction Fail: 100 pcs----------------------------------------User ID:

• Statistics Report (printed)• Test Report (printed)• Daily Report• Monthly Report

• Top Ten Fail Report• Test Report• Last Test Report

Test Interface 4


Test Report

From the Print menu select Test Report to print a test report. A sample report is shown below.

Example 2 Test Report

Date:2007/2/27 Time:10:00:31Shift:1 Line Number:File Name:E:\ATD\Box.AtdStatus:TestBoard Name:BoxBarcode:----------------------------------------Board #### 1 ####----------------------------------------====================Type **** R ****1 Name:R_10O A:1 B:2 Cell:ORSTD:10.7o ACT:10o Tst:392.0641 HL: 5% LL:5% DEV:3564.15012 Name: R_100O A:1 B:3 Cell:ORSTD: 0o ACT:100o Tst:-0.1207 HL: 2% LL:2% DEV:-100.1207

3 Name: R_1KO A:1 B:4 Cell:ORSTD: 0Ko ACT:1Ko Tst:5.6481 HL: 2% LL:2% DEV:464.8084 Name: R_10KO A:1 B:5 Cell:VLSTD: 0Ko ACT:10Ko Tst:0 HL: 2% LL:2% DEV:-1006 Name: R_1MO A:1 B:7 Cell:VLSTD: 0Mo ACT:1Mo Tst:0.8997 HL: 5% LL:5% DEV:-10.03428 Name: R_220_G A:1 B:28 Cell:ORSTD: 0o ACT:220o Tst:-0.1207 HL: 2% LL:2% DEV:-100.05499 Name: R_220_G A:1 B:29 Cell:ORSTD: 0o ACT:220o Tst:564.67


4 Test Interface

Daily Report

From the Report menu select Daily Report to view the test statistics for a particular day.

Monthly Report

From the Report menu select Monthly Report to view the test statistics for a particular month.

Figure 25 Daily Report

Figure 26 Monthly Report

Test Interface 4


Top Ten Fail Report

From the Report menu select Top Ten Fail Report for a report on the top ten non- conforming components.

Figure 27 Top Ten Fail Report


4 Test Interface

Test Report

From the Report menu select Test Report to view the failure report on the current board.

Last Test Report

From the Report menu select Last Test Report to view the failure report on the previous failed board.

Figure 28 Test Report

Figure 29 Last Test Report

Test Interface 4


Graphical Locators

The Medalist i1000 software provides graphical views of the board under test and helps you locate specific components or pins by highlighting them.

Graphics Control Toolbar

When a graphics window is open, the following toolbar provides additional options.

To locate a particular pin, nail, or device:• Find Pin or Nail• Find Device

To locate failing pins or components:• Locate Open Fail Pin• Locate Short Fail Pin• Locate Component Failures

Figure 30

1 Move up 7 Rotate

2 Move down 8 Zoom in

3 Move left 9 Zoom out

4 Move right 10 Top view

5 Flip horizontal 11 Bottom view

6 Flip vertical 12 Fit to screen


4 Test Interface

Find Pin or Nail

Find Pin

1 From the View menu select Pin Location Graphic.

2 Enter the number of the pin to find and click OK.

The location of the pin is indicated by a plus sign (+) as shown in Figure 31.

Find Nail

1 From the View menu select Nail Location Graphic.

2 Enter the number of the nail to find and click OK.

The location of the nail is indicated by a plus sign (+) as shown in Figure 31.

Figure 31 Find pin or nail

Test Interface 4


Find Device

1 From the View menu select Device Location Graphic.

2 Enter the name of the device to find and click OK.

The device is highlighted and the device name displayed (Figure 32).

Figure 32 Find device


4 Test Interface

Locate Open Fail Pin

From the View menu select Open Fail Graphic.

In the graphics display, the first open fail pin is indicated by a red plus sign (+) and the subsequent failures by green plus signs (Figure 33).

Figure 33 Locate open fail pin

Test Interface 4


Locate Short Fail Pin

From the View menu select Short Fail Graphic.

In the graphics display, the first short fail pin is indicated by a red x and the subsequent failures by blue x’s (Figure 34).

Figure 34 Locate short fail pin


4 Test Interface

Locate Component Failures

From the View menu select Component Fail Graphic.

In the graphics display, any non- conforming components are highlighted and their names displayed (Figure 35).

Figure 35 Locate fail components

Test Interface 4


Modifying System and Test Parameters

Some of the system and test parameters can be changed. These are described in the following topics:• Selecting Test Groups• Changing Parameters

Selecting Test Groups

You can select the test groups for testing.

1 From the Setup menu, select Select Test Groups.

The dialog box (Figure 36) shows two lists: items selected for testing are shown in blue in the right column, and items skipped are shown in red in the left column.

2 To add an item to the test, select it and click Do.

3 To remove an item from the test sequence, select in and click Delete. To remove all items, you can click the Clear button.

4 Click OK to save the changes.

The test categories are:

Figure 36 Select Test Groups

R Resistor V Voltage test

L Inductor I Current test

C Capacitor TJ VTEP v2.0/TestJet

JP Jumper CD Clamping diode

Q Transistor IS IC SCAN


4 Test Interface

Changing Parameters

1 From the Setup menu, select System Setup.

2 Select each of the tabs to modify these parameters:• System • Test • Network • Panel Test

3 Click OK.

Change System Parameters

Figure 37 System parameters

Test Interface 4


Table 10 System parameters

Option Description

Report

Maximum Fail Report Sets the maximum number of defects (1 to 100) to report.Enter 0 to display all failures.

Open/Short Common Device

Sets the maximum number of open/short failures (1 to 100) to report. Enter 0 to display all failures.

Component Failed Limit When the number of failures for a component type reaches the specified limit (1 to 100), the system suspends testing and displays an alert. When 0 is specified, no alert will be displayed.

Hardware

Printer Enable or disable printing.

Fixture Type The fixture type: press down or vacuum.

Others

Repeat Cycle The number of times to repeat the test cycle (maximum 10,000).Test cycles will be repeated regardless of pass/fail status. Reports will be updated to track the pass/fail results.

Production Yield Limit When the percentage of passing boards falls below the specified limit, the system suspends testing and displays an alert. When 0 is specified, no alert will be displayed.

Decimal Places The number of decimal places to display (maximum 5).

Failure Graphic When ON is selected, a graphical display of the board under test will be displayed any failure is detected.


4 Test Interface

Change Test Parameters

Figure 38 Test parameters

Table 11 Test parameters

Option Description

First Card Position Specifies the first occupied slot (1–36).

Repeat Failed Cycle If a short test or component test fails, the system can be set to automatically re-engage the fixture and run the test again, to avoid any false result due to poor probe contact. Specify the number of times to retest (1–10). 0 indicates no retest.

Retry Failed Cycle During component testing, if a component is found defective, the test cycle will be repeated immediately without re-engaging the fixture.

Open/Short Settling Delay

To improve measurement accuracy, a settling delay interval (0–60,000 ms) can be specified to allow transients to settle before finishing a measurement.

Fixture Release Delay For press down model only. Sets a delay to allow for upward movement of the press after a test cycle. The default value is 2,000 ms.If the time is insufficient, the press will not reach the top; and if the time is longer than required, the press will not move downward until the time is up.

Temperature Threshold Not in use.

Test Interface 4


Discharge Threshold Sets the voltage for discharge detection. If the measured value exceeds this threshold, a discharge interval lasting from 100 ms to 600 ms will be enabled. If the voltage is still higher than the threshold, the remaining tests will be suspended and an error message will be displayed.

Auto start after fixture engaged

Select ON to automatically start testing once the fixture is engaged. Otherwise, the operator must manually start the test by clicking the Test button.

Abort test when opens failed

Select ON to automatically abort testing if the opens test fails.

Abort test when shorts failed

Select ON to automatically abort testing if the shorts test fails.

Enable Discharge Select ON to enable discharge when the measured voltage is higher than the Discharge Threshold.

Enable Open Test Select ON to enable opens testing.

Enable Short Test Select ON to enable shorts testing.

Enable Component Test Select ON to enable component testing.

Enable Function Test Select ON to enable functional testing.

Table 11 Test parameters

Option Description


4 Test Interface

Change Network Parameters

The Network tab contains information about your production environment. Additional information can be entered in the optional fields. If datalogging is enabled, the information from these fields will be included in the log report.

Figure 39 Network parameters

Test Interface 4


Change Panel Test Parameters

Use this tab to define the panel to be tested.

1 On the Panel Test tab, select Panel Setup. Enter the parameters as described in Table 12.

2 Click Make to define a panel according to the parameters.

Figure 40 Panel Setup

Table 12 Panel test parameters

Parameter Description

X axis BD count The number of coordinates (1–50) along the X axis for the panel.

Y axis BD count The number of coordinates (1–50) along the Y axis for the panel.

Panel Offset Type Specify whether the offset between boards on the panel is defined by pin or by board.

Pin Offset The value of the pin offset between two adjacent boards on the panel.For example, if the largest pin number for the first board is 100 and the pin offset value is 3, then the pin numbers will be 104 to 203 for the second board, 207 to 306 for the third board, and so on.

Board Offset The value of the board offset between two adjacent boards on the panel.For example, the board number for the first board is 1 and the board offset value is 1, then the board number will be 3 for the second board, 5 for the third board, and so on.


4 Test Interface

Panel Selection allows you to selectively enable individual boards within the panel for testing. To enable a board for testing, click on the board position. The selected boards are shown in green.

Figure 41 Panel Selection

59


5Test Editors

Test Editor 60

IC Editor 74

Shorts Editor 76

Skip Pin Editor 77

Pins Editor 78

Nails Editor 79

Running Diagnostics 80

The test editor windows show the tests in different test categories, and allow you to quickly make changes to individual tests during debugging.


5 Test Editors

Test Editor

In the Test Editor, the components under test are classified by type, characteristics or test method; and the test groups are shown in separate tabs:

The All tab consolidates all the entries from the other test groups. Changes cannot be made in this tab, but you can double- click any test to display it in its own test group tab, where it can be edited.

Figure 42 shows the Resistor tab as an example. Each row is a test or step in the test program. The columns show the parameters and other details of each test (see Table 13). Clicking in a cell displays the available options (if any) for that parameter in the Memo area.

Modifying thetests

To edit a test parameter, simply double- click on it and make the change.

• Resistor• Inductor• Capacitor• Jumper• Transistor• Voltage

• Current• VTEP v2.0/TestJet• Clamping Diode• IC SCAN• Function• All

Test Editors 5


Figure 42 Test Editor


5 Test Editors

Table 13 Test Editor fields

Column Description

Board Board number

Total Test sequence for the panel

Step Test sequence for the board. The status of each test or step is indicated by the background color.

Grey disabled

Green pass

Red fail

Style Enter one of the following options:

A Abort If the test result is Fail for this step, testing stops.

P NP (No Pins)Component has no test access. 0 will be displayed for both A and B pins.

H Hold On This step is repeated continuously until the operator stops the test.

E Extended PinAllow editing of the fields EA and EB.

V Extended D/A Voltage Allow editing of the fields DAV and EDAV for transistor or diode testing.

L Relay Four Line Status Select four-line mode for the pin card.

W Wait Display a prompt and wait for the operator to take further action.

G Good to Continue This step is repeated until the test result is Pass, then testing continues to the next step.

F Fail to Continue This step is repeated until the test result is Fail, then testing continues to the next step.

Device Name Component name from the BOM, e.g. R132.

LC Location of component on the board under test. The coordinate system consists of coordinates from A to H along the X axis and 1 to 8 along the Y axis (maximum 8 x 8 grid).

StdVal Value indicated in the BOM. The unit of measure is needed for this field. The Medalist i1000 software uses the unit to determine the type of component as well as the test range.

ActVal Actual value of the test after debugging.

Test Editors 5


HL High limit percentage of the measured value.

Positive value

Example:If resistance = 100 ohm and HL = 10%, thenmeasured resistance < 110 ohm is considered as Passmeasured resistance > 110 ohm is considered as Fail

0 or P Any measured value is considered as Pass.

F No tolerance limit is set. The measured value must be equal to the expected value or it is considered as Fail.

Negative value

Example: If resistance = 100 ohm and HL = -10%, thenmeasured resistance < 110 ohm is considered as Failmeasured resistance > 110 ohm is considered as Pass

LL Low limit percentage of the measured value.

Positive value

Example:If resistance = 100 ohm and LL = 10%, then measured resistance > 90 ohm is considered as Passmeasured resistance < 90 ohm is considered as Fail

0 or P Any measured value is considered as Pass.

F No tolerance limit is set. The measured value must be equal to the expected value or it is considered as Fail.

Negative value

Example: If resistance = 100 ohm and LL = -10%, thenmeasured resistance > 90 ohm is considered as Failmeasured resistance < 90 ohm is considered as Pass

Mode Test mode. For a list of test modes, see Table 14.

Range The Medalist i1000 software automatically determines the test range of signal source for the component under test. (For resistor tests using CV mode, the range sets the reference resistor value used for the detection circuit. For resistor tests in CC mode, the range sets the source current level for the test. In capacitor and inductor tests, the range sets the source frequency for the test.)To override the system-defined value, enter the preferred value here.

Delay The delay time (0 to 3,000,000 ms) required for getting a stable read-out after the test signal is transmitted.

Average If the read-out of measured value is not stable for any reason, the test can be repeated to get an average of measured values. Enter the number of times to repeat the test (0 to 10,000).

A High Pin. The test current flows into the component under test through this point. For diodes, transistors, and ICs which are directional, enter the positive voltage pin number. Otherwise the measured value will be incorrect.For resistors, capacitors, and inductors, direction does not matter.

B Low Pin. The test current flows away from the component under test through this point. For diodes, transistors, and ICs, enter the negative voltage pin number.


Column Description


5 Test Editors

EA Extended Pin A (Extended High Pin). Used when the component has a third test pin (such as transistors).

EB Extended Pin B (Extended Low Pin). Used when the component has a fourth test pin.

TestVal Measured value of the component under test.

DEV (%) Deviation percentage, calculated as (TestVal - ActVal) / (ActVal).

Cell The range that the measured value falls into. The range is specified between the upper and low limits for TestVal, consisting of N, VL, L2, L1, -4, -3, -2, -1, 0, 1, 2, 3, 4, H1, H2, VH and OR. OR - Over Range; N - Not available.

MV Measured Voltage. Voltage measured between points A and B.

CT Condition Time. Countdown timer for Style G or F.

DAV D/A Voltage. The output voltage.

EDAV Extended D/A Voltage. Second output voltage.

G-1 to G-10 Guarding points that have been selected (up to 10).

Offset Offset value used for compensation to the measured value.

Retry Number of retries (without re-engaging the fixture) when the test fails.


Column Description

Table 14 Test modes

Component/Test Test mode Description

Resistor CC Constant Current

CV Constant Voltage

Inductor AC AC Test Mode

AC+ AC Test Mode with the range set to one level higher than the current range. (For example, if the current range is 3, the actual range used will be 4.)

P Phase Test Mode

P+ Phase Test Mode with the range set to one level higher than the current range. (For example, if the current range is 3, the actual range used will be 4.)

Test Editors 5


Capacitor AC AC Test Mode

AC+ AC Test Mode with the range set to one level higher than the current range. (For example, if the current range is 3, the actual range used will be 4.)

P Phase Test Mode

P+ Phase Test Mode with the range set to one level higher than the current range. (For example, if the current range is 3, the actual range used will be 4.)

DC DC Test Mode

Jumper JP Jumper Measure

Transistor NCV NPN Constant Voltage

PCV PNP Constant Voltage

LV Low Voltage Measure

Voltage test MV Measured Voltage

LV Low Voltage

Current test CM Current Measure (not in use)

VTEP v2.0/TestJet TJ TestJet Measure

VTEP VTEP Test

iVTEP iVTEP Test

Clamping Diode CD Clamping Diode Measure

IC Scan IS IC SCAN Measure

Function test MV Measured Voltage

LV Low Voltage Measure

DE Specific discharge test between pins A and B

SW Switch A and EA Short

IOR Read system card I/O status

IOW Write to system card I/O

Table 14 Test modes

Component/Test Test mode Description


5 Test Editors

Menus in the Test Editor

The menu options in the Test Editor are described in Table 15.

Table 15 Menu options in the test editors


File New Creates a new test program.

Open Opens a test program. Note that only users with security level higher than “Operator” can load test programs.

Save Saves the current test program.

Save As Saves the current test program under a new name.

Login Allows you to log in using a different user name and/or security level.

Configuration Let you save and re-use the system configuration.• Export – Exports the current configuration to a file.• Import – Imports saved settings from a file.• Clear – Clears any changes made before exiting the Medalist i1000

software.• Backup – Backs up the current configuration to a file named

Backup.REG, which is saved in the same folder as the configuration file.

• Restore – Restores the configuration from the backup file.

Exit Exits the Medalist i1000 software.

Edit Cut, Copy, Paste Performs the standard cut, copy, and paste functions.

Insert Line – Inserts a row above the current row.

Delete Line – Deletes the current row.

Find Finds the specified text.

Exchange STD, ACT Swaps the values in the StdVal and ActVal columns.

Find Next Finds the next occurrence of the specified text.

Copy Parameter Copies the selected test parameter to another test group.

Define Block Steps Options to define and perform operations (edit, copy, move) on a block of test steps.

Step Function • Exchange A/B – Exchanges points A and B.• Skip Step – Skips the selected step.• Go to Step – Goes to the specified step number.• Go to Reject Step – Goes to the failed step for quick debugging.

Test Current Step Test Executes the current test.

Page (Block) Test If a block is selected, executes all the tests in the block.If no block is selected, executes the tests that are displayed (except for those marked “Skip”).

Test Editors 5


Learn Capacitance Compensation Learns the stray capacitance of the fixture cabling without the board connected. This value will be saved in the Offset column and used to offset the actual measured values for the selected capacitance test steps.

Capacitance Compensation-All

Learns the stray capacitance of the fixture cabling without the board connected. This value will be saved in the Offset column and used to offset the actual measured values for all capacitance test steps.

Debug Guard Function • Auto Guard – Automatically selects appropriate guarding points and displays the information in the Memo section. The select guarding points will automatically be included in the test step.

• Find Guard – Automatically identifies (but does not set) appropriate guarding points and displays the information in the Memo section.

• Clear Guard – Clears the guarding points for the current test.

Change Value • Learn Standard with Measure Value – Inserts the value from TestVal into StdVal.

• Learn Actual with Measure Value – Insert the value from TestVal into ActVal.

Vectorless Test Generator • IC Clamping Diode • VTEP v2.0/TestJet • IC SCAN Automatically generates the selected test through learning. See “Generate Tests Through Learning” on page 69.

AutoDebug Runs AutoDebug which automatically attempts to debug the test by trying out different test options.

Analyze Parallel Caps Analyzes the circuit topology and combines parallel capacitors test steps into a single test step.

Parallel Component with Current Step

Identifies all components in parallel with the selected component.

Nail Information Lists test steps of the selected nail.

Information Memo Shows the memo display area.

Auto Resized Memo Automatically resize the memo area.

Find Adjacent Pin Identify pins adjacent to a specific device. See “Find Adjacent Pin” on page 71.

View Show Toolbar Lets you display or hide individual toolbars. See “Toolbars” on page 39.

Pin Location Graphic Find a specified pin. See “Find Pin or Nail” on page 46.

Nail Location Graphic Find a specified nail. See “Find Pin or Nail” on page 46.

Device Location Graphic Find a specified device. See “Find Device” on page 47.




5 Test Editors

Report Coverage Report Generates a test coverage report. See “Generate Coverage Report” on page 71.

Histogram Report Shows the history of the current test in the Memo section. Figure 43 on page 72 shows a sample histogram.

Window The Window menu provides the standard window display options.

Diagnostics Reset Hardware If the testhead power was turned off without exiting the Medalist i1000 software, power on the testhead again and select Reset Hardware to synchronize the software with the testhead.

Verify Verify Pin Cards – Verifies that all relays are working properly. Enter the number(s) of the cards to test. See “Verify Pin Cards” on page 80.

I/O Cards Verifies testhead I/O actions. See “Verify I/O Cards” on page 81.

Pin Locator Locates nail numbers on the test fixture. See “Pin Locator” on page 82.

Slot Information Verifies the slots. See “Verify Slots” on page 82.

Self-Tested Information Performs a self-test and displays a report.

Setup Select Test Groups Selects the component types to test.

Set Learn Parameters Sets the high and low limits for IC Clamping Diode, TestJet and IC SCAN which will be used in the learning process,

Set VTEP Parameters Sets the VTEP parameters, which are described in “Setting VTEP Parameters” on page 72.

Language Lets you select the language for the software interface.



Test Editors 5


Generate Tests Through Learning

The Test Editor can automatically generate the following tests through learning using a known good board:• IC clamping diode test• VTEP v2.0/TestJet• IC SCAN

IC clamping diode test

1 From the Debug menu, select Vectorless Test Generator then IC Clamping Diode.

2 Select one of the following options and click OK.

• Select GND to generate clamping diode tests between ground and signal pins only.

• Select All to generate tests between signal pins to both ground and power nodes.

3 Select an IC from the drop- down list or select All, then click OK.


5 Test Editors

VTEP v2.0/TestJet

1 From the Debug menu, select Vectorless Test Generator then VTEP v2.0/TestJet.

2 Select one of the following options and click OK.

• TestJet (Open) – Generate tests using Agilent TestJet technology for detecting opens.

• TestJet (Short) – Generate tests using Agilent TestJet technology for detecting shorts.

• VTEP/iVTEP – Generate tests using Agilent VTEP v2.0 technology. For details about VTEP v2.0, see “VTEP v2.0 and TestJet Test” on page 14.


IC SCAN

1 From the Debug menu, select Vectorless Test Generator then IC SCAN.


Test Editors 5


Find Adjacent Pin

Use this option to find pins that are adjacent to a specific device during debug. Select the pin number and click Fill to display the adjacent pins in the Node Information table.

Generate Coverage Report

Select Coverage Report from the Report menu in the Test Editor window to generate a coverage report.

This report primarily measures the actual component test coverage percentage and describes untested components. Test coverage reporting is used after the test is developed for your board and after your fixture is built. You can use it during the test debug phase or anytime later, including after a board is in production.

The coverage report generated is a text file and is saved in the folder ../<ATD filename>/Report. The file has a .CRF extension and will have the timestamp as part of its filename.


5 Test Editors

Generate Histogram Report

Select Histogram Report from the Report menu in the Test Editor window to generate a histogram report. Figure 43 shows a sample histogram report.

Setting VTEP Parameters

During debugging of VTEP/TestJet tests, AutoDebug takes 10 readings for each pin and calculates a mean and standard deviation. It determines limits for each pin using two separate calculations, and chooses the limit that is more conservative (wider). These two calculations are done using a user formula and an internal formula.

First, the limits are set using the user parameters (Table 16). Then, internal limits are calculated using the performance parameters of the VTEP or TestJet software and hardware, standard deviation, and minimum CPK. The internal method provides a certain minimum margin between the mean and the limits that are set. This keeps AutoDebug from writing limits that are closer than the measurement capability no matter what user parameters are set.

Generally, the user parameters tend to control the limits for higher valued pins, while the internal parameters tend to control very low values.

Figure 43 Histogram

Test Editors 5


To change the user parameters for VTEP, do the following:

1 From the Setup menu in the Test Editor window, select Set VTEP Parameters.

2 Set the preferred values (described in Table 16) and click OK.

Table 16

Column Description

Lowest Low Limit Controls the lowest limit set. No limit will be set lower than the Lowest Low Limit.

Min CPK Determines when pins are commented out of the test. The recommended value is 10 for the Medalist i1000 system.After the limits are calculated, the Cpk for each pin is also calculated as follows:

Any pin whose Cpk falls below this value will be commented out.Note: The Cpk is calculated using the mean and standard deviation from the set of 10 readings taken when AutoDebug is run on this test. It is not a Cpk across all boards that have run through AutoDebug.

Hi Percent, Hi Min Offset

Parameters used in calculating the high limit. The formula is as follows:Hi Limit = mean + max ((mean*Hi Percent), Hi Min Offset)

Low Percent, Low Min Offset

Parameters used in calculating the low limit. The formula is as follows:Low Limit = mean - max ((mean*Low Percent), Low Min Offset)

Cpk = mean - closest limit

3*standard deviation


5 Test Editors

IC Editor

An IC test program consists of an IC clamping diode test, IC SCAN test and VTEP v2.0/TestJet test. The test program can be generated through learning using a known good board. Before learning, enter the pin number of each IC pin in the IC Editor.

Figure 44 IC Editor

Table 17

Column Description

Board Board number.

Total Test sequence for the panel.

Step Test sequence for the board.

TJ VTEP v2.0/TestJet port number. If VTEP v2.0/TestJet is not used, enter 0.

CD T or 1 – Learning of clamping diode is available with this IC.F or 0 – Learning is not available.

IS T or 1 – Learning of IC SCAN is available with this IC.F or 0 – Learning is not available.

Test Editors 5


IC Editor Menu Options

When using the IC Editor, additional options appear on the menus. These are described in Table 18.

IC Name Name of IC.

LC Location of IC.

P/N Part number of IC or the connector library name when NPM is used.

1–20 Pin number. Red indicates a VCC pin and yellow a GND pin.

Table 17

Column Description

Table 18


Edit IC VCC Marks the current pin as a VCC pin.

IC GND Marks the current pin as a GND pin.

IC Normal Pin Marks the current pin as a normal pin.

Diagnostics VTEP v2.0/ TestJet Port Locator Scans for VTEP v2.0/TestJet ports and displays a report.


5 Test Editors

Shorts Editor

Shorts groups are generated through system learning. These groups and pins can also be manually added or removed in the Shorts Editor.

Figure 45 Shorts Editor

Table 19

Column Description

Board Board number and short pin group number.

Total Total number of all short pin groups.

Short Pin Group Short pin group number.

1–20 Pin number.

Test Editors 5


Skip Pin Editor

Use the Skip Pin Editor to avoid testing pins that are unstable during open/short tests. Simply enter the nail numbers to skip (Figure 46).

CAUTION Skipping pins may result in faults escaping undetected.

Figure 46 Skip Pin Editor


5 Test Editors

Pins Editor

The Pins Editor lists all the pins of the devices together with their XY data. It also shows the netnames and nail numbers.

Figure 47 Pins Editor

Test Editors 5


Nails Editor

The Nails Editor is similar to the Pins Editor but displays the list according to nail numbers.

Figure 48 Nails Editor


5 Test Editors

Running Diagnostics

• Verify Pin Cards• Verify I/O Cards• Pin Locator• Verify Slots

Verify Pin Cards

Use this command to check whether all relays are working properly.

1 From the Diagnostics menu, select Verify, Verify Pin Cards.

2 Enter the slot numbers to check. You can specify more than one slot. For example, enter 1-4 to test slots 1 to 4, or enter 1+4 to test slots 1 and 4. Click OK.

3 Enter the number of times to repeat the test and click OK.

4 Enter the delay time and click OK.

For each slot specified, the relay test starts from point 1 and ends at point 64, in channels A, B, and G.

When testing is completed, the status shows OK if no defects are found. Figure 49 is a sample report showing that two defects were found on slot 1 and one on slot 2.

If any failure is detected, the defective pin card should be replaced, so that the remaining test steps can be carried out without interruption.

If a failure message appears when a good pin card is tested, there may be problems with the measurement board or the system board itself.

Figure 49 Defects report

Test Editors 5


Verify I/O Cards

From the Diagnostics menu, select I/O Cards to verify that the I/O actions of the testhead are normal.

1 Click the Read All button to enable reading from the I/O ports.

2 Activate each signal and observe the response on the display, which should change from red to green.

If no response is detected, contact your Agilent representative.

As can be seen from the following figures, the U9402A (vacuum model) contains many more sensors compared to the U9401A (press down model). On the U9402A, the sensors can be activated by turning on Manual mode from the control box and manually activating the different switches.

Figure 50 Press down model


5 Test Editors

Pin Locator

Use the Pin Locator to locate nail numbers on the test fixture.

1 From the Diagnostics menu, select Pin Locator.

2 Use the debug probe to touch the probes in the fixture.

The red messages in the window indicate the nail numbers. The green messages indicate the slot numbers of pin card and the individual pin numbers of the card being scanned.

Verify Slots

From the Diagnostics menu, select Slot Information to check the status of each slot and display a report as shown in Figure 52.

M refers to the measure board for analog measurements. R refers to the relay board for pin switching.

Figure 51 Vacuum model

Figure 52 Slot information

83


6User Management

Adding Users 84

Enabling/Disabling User Login 85

To use the Medalist i1000 system, a user name and password are required. Administrators can add and delete user accounts.


6 User Management

Adding Users

A user name and password are required to log in to the Medalist i1000 software. User login can be disabled.

Add user

1 From the Setup menu, select User Management to display the User Management dialog box (Figure 53).

2 Enter a new user name and password.

3 Assign a security level. The security level determines what actions the user can perform in the Medalist i1000 software (Table 20).

4 Click Add.

Figure 53 Creating users

User Management 6


Delete user

In the User Management dialog box (Figure 53), select the appropriate tab, then select the user to delete and click the Delete button.

Enabling/Disabling User Login

1 From the Setup menu, select Set Login Status.

2 Select or clear the Login Enabled check box and click OK.

Table 20 Security levels for users

Security level Description

Administrator Has full access to all functions.

Calibrate For support engineers.

Engineer For test developers or engineers.

Operator For operators who are using the system to test boards.


6 User Management

87


7Maintenance and Troubleshooting

System Backup and Recovery 88

Maintenance 89

Troubleshooting 90

Service and Support 92


7 Maintenance and Troubleshooting

System Backup and Recovery

It is recommended that you create regular backups of the files on the Medalist i1000 system controller so that your system and data can be recovered in case of a disaster such as a disk crash.

For backup and recovery instructions, refer to the documentation provided by the PC manufacturer.



Maintenance

• Keep the testhead clean and the test environment dry.

• Do not place unnecessary materials on the test station.

• Perform regular checks to ensure that the cooling fans in the system are operating normally.

• Clean the fan filter under the power supply device with fresh water regularly. Excess water in the air filter should be poured out.

• Remove any copper or tin shavings from the fixture with a brush.

• Clean the controller’s disc drive regularly.

• Press Down Unit: after a period of use, moisture from the incoming compressed air will result in water collecting in the filtering container. Drain the water periodically.



Troubleshooting

Table 21 Troubleshooting

Problem Cause/Action

No power supply • Check the power cables and connections.• Check that the power switches have been turned on.• Check that the circuit breaker has not been tripped. If it has, investigate

the source of the problem before attempting to restore power.

Test is unstable or results in false reject. • If a false reject occurs on specific test steps repeatedly, check the pin in question for poor contact and replace the pin if necessary.

• Verify if relays are working properly: from the Diagnostics menu select Verify > Verify Pin Cards.

• If the relay test passes, the problem may be in the measurement board.

VTEP or TestJet test failure • From the Diagnostics menu select VTEP v2.0/ TestJet Port Locator to verify that the VTEP/TestJet probes are installed correctly.

• Check that the 10-pin mux card cable is connected to the backplane of the testhead.

• Ensure that the VTEP/TestJet probes are wired to the correct ports with twisted pair cables.

• Ensure that the VTEP/TestJet amplifier board is connected correctly to the port of the mux card.

Press down model (U9401A) only

The press does not move up and down. • Check that the control cable is properly connected.• Check that the power cable is properly connected to the system and the

power has been turned on.• Open the access panel at the rear of the Press Down Unit and check the

operation of the relay and solenoid valves.• If the problem persists, performed a detailed check according to the circuit

diagram.

When the operator pushes the DOWN buttons, the press moves down but testing does not start.

1 The software is not configured to start testing automatically. To set the auto-start feature, from the Setup menu, select System Setup > Test tab > Auto start after fixture engaged option.

2 If auto-start is already set, open the access panel at the rear of the Press Down Unit and check the sensor switch to see if it is loose or broken (see Figure 54).

3 The system or the Press Down Unit control board (see Figure 54) may be defective.

4 Check that the control cable is properly connected.



Figure 54 Rear of Press Down Unit (U9401A)

1 Pneumatic cylinder

2 Press Down Unit control board

3 Sensor switch

4 Main cylinder

5 Upper position sensor

6 Lower position sensor

7 Solenoid valve

1

2

4

5

6

7

3



Service and Support

If you need phone support, contact Agilent’s Customer Support Center. Go to www.agilent.com/see/contact_info and select your country.

Any adjustment, maintenance, or repair of this product must be performed by qualified personnel. Contact your customer engineer through your local Agilent Technologies Service Center.

Agilent Technologies, Inc. 2007

Printed in Taiwan 09/07First edition, September 2007U9401-95000

http://www.agilent.com/see/contact_info

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