50
October 2017 From Technologies to Markets Sample Memory Packaging Market & Technology Trends 2017
October 2017
From Technologies to Markets
Sample
Memory Packaging Market &
Technology Trends 2017
2
REPORT OBJECTIVES
o To understand overall market trends of different memory types and the key applications driving it.
o To know the different types of memory packaging technology and market and technology trends
o To understand the memory packaging evolution and roadmap
o To provide a market forecast of different memory packaging technology for coming years, and estimate future trends
o To gain insight of the latest happenings in the memory packaging landscape
o To analyze the memory packaging supply chain and landscape
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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REPORT METHODOLOGY
Technology analysis methodology Information collection
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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TABLE OF CONTENTS
Part 1/1
Report scope and definitions
Scope of the report
Companies cited in this report
Glossary
Executive summary
Memory packaging technologies and classifications
Memory packaging evolution and roadmap
Memory packaging supply chain
2016-2022 Market forecast of different memory packaging technology by
wafer starts, package units and revenue
Status of memory industry
What’s happening in memory business?
Focus on DRAM/ NAND flash/NOR flash/other memory business
trends
Revenue forecasts, market share and supply chain
Key application driving memory market
Focus on DRAM packaging
DRAM technology evolution & roadmap
Packaging evolution, roadmap and trends
Market forecast by wafer starts, package units and revenue
Focus on NAND flash packaging
NAND technology evolution & roadmap
Packaging evolution, roadmap and trends
Market forecast by wafer starts, package units and revenue
Focus on NOR flash packaging
NOR flash memory market trends
Packaging evolution, roadmap and trends
Market forecast by wafer starts, package units and revenue
Focus on 3D TSV packaging
Market and technology trend
Market forecast by wafer starts, package units and revenue
Bumping trends in memory packaging
Market trends and forecast by wafers and revenue
OSATs strategy
Trends for emerging Non-Volatile memory (ENVM) technologies
Focus on MRAM/STTMRAM, PCM and ReRAM
Status of industrialization and near-term opportunities
China Memory Landscape
Status and Prospects
Announced investments
Conclusion
Appendix
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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4DS, A*STAR, Adesto, Aeroflex, Altis, Apple, Atmel, Avalanche, Buffalo, CEA Leti, ChipMOS, Cisco, CNE, Crocus, Crossbar, Cypress, Dell, Ebay, EMC, Evaderis, Everspin, Facebook, Freescale, Fujitsu, Fusion IO,
Fujian Jinhua Integrated Circuit Co., Ltd, Gemalto, Giesecke & Devrient, GlobalFoundries, Google, Hana Micron, Hefei Chang Xin, H-Grace, HLMC, Honeywell, HP, Huawei, IBM, Imec, Infineon, Innovative Silicon, Intel, ITRI, Knowm, Lenovo, Macronix, Maxim, Mediatek, Microchip, Micron-Elpida, Morpho,
Nantero, Nanya, National Tsing Hua University, NEC, NetApp, Nike, Nokia, Numonyx, NXP, Oberthur, Panasonic, Powertech Technology (PTI), Qualcomm, Quantum, Rambus - Unity, Renesas, Samsung,
Sandisk, Seagate, SGI, Sino King Technology, SK hynix, Skyera, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Transfer Technology, Spreadtrum, STMicroelectronics, Stanford University, STEC, Sun,
Symetrix, TDK, Tezzaron, TMS, Tohoku University, Toshiba, Towerjazz, TPSCO, Tsinghua Unigroup , TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XMC, Yangtze River Storage Technology
COMPANIES CITED IN THIS REPORT
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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Biographies & contacts
ABOUT THE AUTHOR
Santosh Kumar
Santosh Kumar works as a Senior Technology & Market Research Analyst at Yole Développement, the "More than Moore" market research and strategy consulting company. He is involved in the market, technology, and strategic analysis of microelectronic assembly and packaging technologies. He received a bachelor’s degree and a master’s degree in Engineering from the Indian Institute of Technology (IIT) Roorkee and the University of Seoul, respectively. He has published more than 40 papers in peer-reviewed journals and has obtained two patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
Contact: [email protected]
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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SOME DEFINITIONS
Solid-State Semiconductor Memory
Non-Volatile Memory (NVM)
Standard NVM
NAND Flash
NOR Flash
NVSRAM
EEPROM
Emerging NVM
FeRAM
PCM
MRAM/
STTMRAM
RRAM
CBRAM
Volatile Memory
DRAM
SDRAM
DDR-SDRAM
LPDDR
(Mobile DRAM)
GDDR (Graphics DRAM)
SRAM
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MEMORY PACKAGING PLATFORMS
Memory devices use wide varieties of packages
Memory Packaging platforms
Wire bond-BGA
(WB-BGA)
Flip Chip-BGA
(FC-BGA)3D IC (TSV) WLCSPLead frame
Can be Multi chip /stacked /SiP format Single chip format
BGA can be FBGA, VBGA, BOC, COB etc
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Die
Single die package
Multi die package
Homogeneous stacking
Heterogeneous stacked
PoP format
MCP format
MEMORY PACKAGING
Different types of package integration
Multiple package on board / PCB in module format (e.g DIMM )
(e.g DRAM die stack or
NAND die stack)
(e.g AP+ Memory)
(e.g NAND + controller or
NAND + DRAM + controller)©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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MEMORY PACKAGE FORECAST BY PACKAGE TECHNOLOGY
By wafer starts (in M units 12”eq wpm)
The total memory package
market by wafer starts will reach ~
XX M 12” eqwafers by
2022
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PLAYERS INVOLVED IN MEMORY PACKAGING-OSATS
Non exhaustive list. Majority of players are based in Asia
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MEMORY PACKAGING MARKET SHARE BY OSAT PLAYERS
XX is the market leader in memory packaging business followed by XY
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MEMORY PRICE TREND
DRAM
DRAM ASP reach
historic high since last 5
yrs.
Various factors
pushing DRAM
prices towards
historic high =>
creating supply-
demand mismatch
Source: WSTS, IC Insights
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NOR FLASH MEMORY- PLAYERS INVOLVED IN PACKAGING
Top NOR flash manufactures Micron and Cypress are cutting the NOR flash production to focus on theirother high value business
Memory Packaging
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STAND-ALONE MEMORY - SUPPLY CHAIN
Key market players
Market concentration has increased
over the last few years : 5 players owns 95% of the
business
NAND DRAM NOR/PCM
Alliance: Toshiba Sandisk/WD
Acquired Inotera memory from Nanya in Dec 2016
• Samsung, Micron, SK hynix,Toshiba and Western Digital – Sandisk are dominating the business
• Toshiba is selling off its NAND memory business => Big change in the competitive landscape! Who will win?
• Current players : SK hynix, Micron,WD.. ?
• Or new players : Foxconn, Apple, Google, Broadcom?
JV Flash Technologies since 2006
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DEMAND IN MEMORY FUELLED BY VARIETY OF APPLICATION
Memory devices demand
Computing
Wired Communicat
ion
Mobile
Consumer
Automotive
Industrial
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DRAM PACKAGING EVOLUTION & ROADMAP
DRAM packaging evolve from leadframepackage to wire-bond to flip-chip BGA TO TSV
Ass
embly
den
sity
Low
High
1970s 1980s 1990s 2000s 2010s
Through hole
single-sided
Surface mount
double-sided
High pin count
and small
Multi chip
DIP
ZIP
SOP
QFP
BGA
WLCSP
MCP
TSV
FC-BGA/CSP
Fo-SiP
BOC
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DRAM PACKAGING TECHNOLOGY FORECAST
In terms of number of wafer starts
DRAM package market by wafer starts grow at XX% CAGR to reach ~ XXM wafers by 2022
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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NAND PACKAGING EVOLUTION & ROADMAP
NAND packaging evolve from leadframepackage to wire-bond BGA TO TSV
Ass
embly
den
sity
Low
High
1970s 1980s 1990s 2000s 2010s
Through hole
single-sided
Surface mount
double-sided
High pin count
and small
Multi chip
DIP
ZIP
SOP
QFP
BGA WLCSP
QFN
MCP
TSV
Memory card
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NAND PACKAGING FORECAST
In terms of number of wafer starts
NAND package
market by wafer starts grow at X %
CAGR to reach ~XXM
wafers by 2022
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2016 2017 2018 2019 2020 2021 2022
WB 456 466 465 486 507 534 560
WLCSP 24 26 27 30 33 36 40
Lead Frame 240 246 246 258 270 285 300
0
100
200
300
400
500
600
700
800
900
1000
K u
nits
NOR flash package forecast by wafer starts
(K units, 12"eq wafers)
NOR PACKAGING FORECAST
In terms of number of wafer starts
NOR package market by
wafer starts grow at 4% CAGR to
reach ~0.9M wafers by 2022
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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EMERGING NON-VOLATILE MEMORY
Market status
Various factors
contributed to delay of adoption of emerging NVM on
large scale.
Why emerging
NVM strong
market adoption
keep delaying
UNTIL NOW
despite showing
great potential ?
• Limited density product availability
• High density products introduction delayed by emerging NVM pioneers: IntelMicron
delayed introduction of PCM based memory.
• Technical challenges due to introduction of new materials and process steps.
• Big logic foundries (e.gTSMC, Samsung, Global Foundries) non involvement in
emerging NVM business for embedded application
• Big memory players (Samsung, Micron, SK/Hynix/Toshiba) abandon or postpone
introduction of emerging NVM for stand alone products in order to not cannibalize
their existing business.
• Mainstream memories DRAM & NAND continued scalability improvement (higher
performance at low cost) => catching a running train
• No key emerging application that would substitute DRAM & NAND
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EMERGING NVM - APPLICATIONS
Emerging NVM Applications
Industry & Transportation &
consumer electronics
Enterprise Storage
Client SCMMass Storage
Memory
Micro Controllers
(MCUs)
Mobile Devices
SRAM
Embedded L3 cache SRAM high
performance
Embedded NVM SoC
Industrial Automation
Smart Meter
Journal Memory
Automotive
Storage-Class
Memory (SCM)
NAND
Memory
Smartphones
& Tablets
Volatile DRAM
General Purpose
Automotive
Work Station
Notebook
Smard card
Stand alone Embedded
Increasing densityIncreasing density
IoT
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EMERGING NVM MARKET - FORECAST BY APPLICATIONS
2016 - 2022 (in $M)
SCM will drive the stand alone and the overall emerging NVM market growth
Yole Développement © June 2017
$-
$1 000
$2 000
$3 000
$4 000
2016 2017 2018 2019 2020 2021 2022 CAGR
2016-2022
Emerging NVM Market Forecast by
Application (in $M)
Applications : industrial, enterprise
storage DRAM, mass storage,
embedded MCU embedded mobile
SRAM, embedded cache HPT,
embedded NVM SoC
SCM market
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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EMERGING NVM - KEY INDUSTRIAL PLAYERS
By player category
Player
categoriesMRAM/STTMRAM PCM RRAM
“Big guys”,
IDMs
Emerging NVM
pioneers
Foundries
Emerging NVM
IP or fabless
Embedded
players
Recent new entrant
RRAM and STTMRAM
are the most popular in terms of
players. PCM is driven by
two key players:
Micron and Intel.
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
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CHINA MEMORY LANDSCAPE
China emerged as top market for memory devices
• In 2016, China DRAM market share by revenue more than doubled as compared to 2015 to reach 50% world widemarket share. NAND flash market represented ~30% of the world wide market share. No doubt China is the keymarket memory devices and continues to grow strongly thanks to the high demand in mobile/wireless, automotiveand servers market.
• Memory accounts for almost 30% of China IC purchase. There is huge gap between local production andconsumption of memory chips in China. Over 90% of the memory chips consumed in China are manufactured bythe global players. That’s why Chinese government in partnership with private players is pumping billions of dollarsto develop local memory manufacturing.
DRAM sales in China
accounts for 50% of
worldwide market!
Total memory market in
2016 ~ $77B
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RELATED REPORTS
©2017 | www.yole.fr | Memory Packaging Technology and Market Trends | Sample
The memory industry is experiencing a strong growth phase. The total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching ~$135B by 2022 – with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device ASP, resulting in big memory IDMs reaping record profits.
Memory demand is coming from all sectors, particularly from the mobile and computing (mainly servers) markets. On average, DRAM memory capacity per smartphone will rise more than threefold, reaching around 6GB by 2022, while NAND capacity per smartphone will increase more than fivefold, reaching >150GB by 2022. For servers, DRAM capacity per unit will increase to a whopping >0.5TB by 2022 and NAND capacity per SSD for the enterprise market will reach >5TB by 2022. Growth in these markets is fueled by applications such as deep learning, data centers, networking, AR/VR, and autonomous driving.
The automotive market which generally use low density (low-MB) memory will see the adoption
of DRAM memory led by emerging trend of autonomous driving and in-vehicle infotainment. Also, the NOR flash memory market is resurgent and expected to grow at an impressive 16% CAGR, attaining ~$4.4B by 2022 due to its application in new areas like AMOLED display, touch display driver ICs, and industrial IoTs.
On the supply side, player consolidation coupled with the difficulty in migrating to advanced nodes due to technical challenges, along with higher investment and migration from 2D to 3D NAND, has caused a shortfall in DRAM and NAND flash supply. DRAM players want to retain high ASP and profitability to justify their huge capex investment for advanced node migration, and as such are not inclined to increase capacity.
This Memory Packaging report details the market trends and roadmaps for different memory devices and furnishes market forecasts, supply chain analyses, player-by-player landscape reviews, and more. Also include is a detailed analysis of the Chinese memory landscape.
MEMORY PACKAGING Market & Technology report - October 2017
THE MEMORY SEMICONDUCTOR BUSINESS IS BOOMING
Wire bond is still the dominant interconnect for memory packaging, but flip-chip is making inroads into mainstream memory packaging.
KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Memory packaging market forecast
2016 – 2022: in units, $US, and number of wafers by different packaging platform
• Competitive landscape and market dynamics
• Market share for memory OSATs and IDMs
• Memory packaging roadmap• Segmentation, description, main
technical trends per technology, main players, and roadmap for different memory packaging solutions
REPORT OBJECTIVES • Understand the overall market
trends of different memory types and the key applications driving them
• Know the different types of memory packaging technology, along with market and technology trends
• Grasp memory packaging’s evolution and roadmap
• See a market forecast of the different memory packaging technologies for the coming years, along with an estimate of future trends
• Gain insight into the latest memory packaging landscape’s developments
• Analyze memory packaging’s supply chain and landscape
DRAM and NAND capacity demand (GB per units) for smartphones and servers (log scale)
(Yole Développement, October 2017)
MEMORY DEVICES USE DIVERSE PACKAGING, FROM LEAD-FRAME-BASED TO TSV
There are many different memory device packaging options, implying a wide range of packaging technologies ranging from low pin-count SOP packages to high pin-count TSV options, all depending on product requirements like density,
performance, and cost. Yole Développement has identified five core memory device packaging platforms: viz lead frame, wire-bond BGA, flip-chip BGA, WLCSP, and TSV. Note though that each one includes many variations, along with
0
1
2
3
4
2016 2017 2018 2019 2020 2021 2022
DRAM-Smartphones DRAM-Servers
NAND-Smartphones NAND-Server SSDs
Cap
acity
dem
and
(GB
per
units
, log
sca
le)
MEMORY PACKAGING MARKET & TECHNOLOGY TRENDS
WHILE MEMORY PACKAGING’S VALUE IS HUGE (IN $B), IT’S CONTROLLED BY IDMS
The total 2016 memory packaging market is estimated at ~ $20B. Many OSATs are involved in the memory packaging business, and >80% of packaging (by value) is still done internally by memory IDMs. Majority of
these are small OSATs and have low end packaging capability. Global-memory IDMs have considerable experience in packaging, accumulated over years of projects, and have their own sizeable internal capacity.
different terminology. Ultimately, the total memory package market is expected to grow at a 4.6% CAGR2016-2022, reaching ~$25B by 2022.
In 2016, wire-bond BGA accounted for more than 80% of the packaging market in dollar terms. Also in 2016, flip-chip began making inroads in DRAM memory packaging, and is expected to grow at a ~20% CAGR over the next five years, accounting for >10% of the total memory packaging market. Increased adoption in the DRAM PC/server segment, fueled by high bandwidth requirements, drives flip-chip growth. Samsung has already converted >90% of its DRAM packaging line, SK Hynix has also started converting, and other players will begin adopting flip-
chip in the future. In fact, we believe that all DDR5 memory for PC/servers will eventually use flip-chip.
Spurred on by high bandwidth and memory chips’ low latency demands for high-performance computing in various applications, TSV is being employed in high-bandwidth memory devices. The 2016 TSV market was only <1% of the total memory market, but this will grow to a >30% CAGR, reaching ~8% of memory packaging in dollar terms by 2022. Also, WLSCP packaging is used in NOR flash and niche memory devices (EEPROMs/EPROM/ROM) and is expected to grow at a >10% CAGR, but in terms of value will remain only <1% of the market by 2022.
For mobile applications, memory packaging will mostly remain on the wire-bond BGA platform. However, it will soon begin moving towards the multi-chip package (ePoP) for high-end smartphones.
NAND flash devices’ main requirement is high storage density at low cost. NAND are stacked using wire bonding in order to provide high density in a single package. NAND flash packaging will remain in wire bond BGA form and will not migrate to flip-chip. However, Toshiba will start using TSV packaging in NAND devices to increase data transfer rate for high-end applications. After Toshiba, we believe Samsung and SKHynix will bring TSV packaged NAND devices to market.
This report details the trends and roadmaps for different memory devices’ packaging, and includes market forecasts, supply chain analyses, players’ landscape, and more.
Memory devices use wide varieties of packages
(Yole Développement, October 2017)
2016-2022 memory package forecast by revenue
(Yole Développement, October 2017)
Memory packaging platforms
Wire bond-BGA (WB-BGA)
Flip Chip-BGA (FC-BGA) 3D IC (TSV) WLCSP Lead frame
Can be Multi chip / stacked / SiP format Single chip format
BGA can be FBGA, VBGA, BOC, COB etc.
TSOP-SD2 (2+0) staircase
SOT/TSOP
0
5
10
15
20
25
30
2016 2017 2018 2019 2020 2021 2022
WB-BGA FC-BGA Lead Frame WLCSP TSV
CAGR ~ 4.6%
Rev
enue
($B
)
Find more details about
this report here:
MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)4DS, A*STAR, Acer, Adesto, Aeroflex, Altis, Apple, Apacer, ASE, Atmel, ATPAvalanche, Buffalo, CEA Leti, ChipMOS, Cisco, CNE, Crocus, Crossbar, Cypress, Dell, Ebay, EMC, Evaderis, Everspin, Facebook, Formosa Advanced Technologies, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated Circuit Co., Ltd, Gemalto, Giesecke & Devrient, Gigadevice, GlobalFoundries, Google, Greatek Electronics, Hana Micron, Hefei Chang Xin, H-Grace, HLMC, Honeywell, HP, Huawei, IBM, Imec, Infineon, Innovative Silicon, Intel, Integrated Silicon Solution (ISSI), Intelligent Memory, ITRI, Kingston, Knowm, KYEC, LBSemicon, Lenovo, Lingsen, LG Electronics, Macronix, Maxim, Mediatek, Microchip, Micron-Elpida, Morpho, Nantero, Nanya, National Tsing Hua University, NEC, NEPES, NetApp, Nike, Nokia, Numonyx, NXP, Oberthur, Panasonic, Powertech Technology (PTI), Qualcomm, Quantum, Rambus - Unity, Renesas, Samsung, Sandisk, Seagate, SFA Semicon, SGI, Signetics, Sino King Technology, SK Hynix, Skyera, Smart Modular Technologies, SMIC, Sony, Spansion, SPIL, Spin Transfer Technology, Spreadtrum, STMicroelectronics, Stanford University, STEC, Sun, Symetrix, Taiwan IC Packaging Corporation, TDK, Tezzaron, TMS, Tohoku University, Toshiba, Towerjazz, TPSCO, Tsinghua Unigroup, TSMC, UTAC, UMC, Violin Memory, Walton, Weebit, Western Digital, Winbond, XMC, Yangtze River Storage Technology and more.
AUTHORSantosh Kumar works as a Senior Technology & Market Research Analyst at Yole Développement, the “More than Moore” market research and strategy consulting company. He is involved in the market, technology, and strategic analysis of microelectronic assembly and packaging technologies. He received a bachelor’s degree and a master’s degree in Engineering from the Indian Institute of Technology (IIT) Roorkee and the University of Seoul, respectively. He has published more than 40 papers in peer-reviewed journals and has obtained two patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
Report scope and definitions > Report scope > Companies cited in this report> Glossary
Executive summary
Memory packaging technologies and classifications
Memory packaging evolution and roadmap
Memory packaging supply chain
2016-2022 market forecast of different memory packaging technologies by wafer starts, package units, and revenue
Status of memory industry
> What’s happening in memory business? > Revenue forecasts and market share > Supply chain
Key Applications driving memory market
Focus on DRAM packaging
> DRAM technology evolution & roadmap> Packaging evolution, roadmap, and trends> Market forecast by wafer starts, package
units, and revenueFocus on NAND flash packaging
> NAND technology evolution & roadmap> Packaging evolution, roadmap, and trends
> Market forecast by wafer starts, package units, and revenue
Focus on NOR flash packaging
> NOR flash memory market trends> Packaging evolution, roadmap, and trends> Market forecast by wafer starts, package
units, and revenueFocus on 3D TSV packaging
> Market and technology trends> Market forecast by wafer starts, package
units, and revenue
Bumping trends in memory packaging: forecast by wafers & revenue
OSAT strategies
Trends for Emerging Non-Volatile Memory (ENVM) technologies
> Focus on MRAM/STTMRAM, PCM, and ReRAM
> Status of industrialization, and near-term opportunities
China’s memory landscape
> Status and prospects> Announced investments
Conclusion
Appendix
TABLE OF CONTENTS
• Status of the Advanced Packaging Industry 2017
• 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
• NVIDIA Tesla P100 Graphics Processing Unit (GPU) with HBM2
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OSATs have limited opportunity to impact IDM packaging activity. However, many Chinese players are entering the memory business with a more than $50B investment committed. Unlike global IDMs, these new players lack experience in memory
assembly/packaging and they will outsource most of their packaging activity to OSATs.
This report details the different OSATs involved in memory packaging, and addresses roadmaps, market share, and strategies.
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Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”.
“Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests.
“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights.
“License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license:• One user license: one person at the company can use the report.• Multi-user license: the report can be used by unlimited users
within the company. Subsidiaries and Joint-Ventures are not included.
• Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included.
“Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
1. SCOPE 1.1 The Contracting Parties undertake to observe the following
general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted.
2. MAILING OF THE PRODUCTS 2.1 Products are sent by email to the Buyer:
• within [1] month from the order for Products already released; or • within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk.
3. PRICE, INVOICING AND PAYMENT 3.1 Prices are given in the orders corresponding to each Product
sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. LIABILITIES 4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection.
5. FORCE MAJEURE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. PROTECTION OF THE SELLER’S IPR 6.1 All the IPR attached to the Products are and remain the
property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: • Information storage and retrieval systems; • Recordings and re-transmittals over any network (including
any local area network); • Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display; • Posting any Product to any other online service (including
bulletin boards or the Internet);• Licensing, leasing, selling, offering for sale or assigning the
Product. 6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. TERMINATION 7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION 9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES
© 2017
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons
32©2017 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS
MEMS & Sensors
Solid State Lighting(LED, OLED, …)
Compound Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices &
Techno.
Advanced
Substrates
Software
33©2017 | www.yole.fr | About Yole Développement
3 BUSINESS MODELS
o Consulting and Analysis
• Market data & research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
M&A with our partner)
www.yole.fr
o Reports
• Market & technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns & reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast
services
• Events: TechDays, forums,…
www.i-Micronews.com
34©2017 | www.yole.fr | About Yole Développement
A GROUP OF COMPANIES
Market, technology
and strategy
consulting
www.yole.fr
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
35©2017 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
36©2017 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Multi-
Customers
Action
Technology
and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
37©2017 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plans along the entire
supply chain
Integrators and
end-users
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors,
R&D centers
38©2017 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We workacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management
39©2017 | www.yole.fr | About Yole Développement
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 19 years, we worked on more than 2 000 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
REPORTS COLLECTION
www.i-Micronews.com
40©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Acoustic MEMS and Audio Solutions 2017
− Integrated Passive Devices Market Status 2017
− 3D Imaging & Sensing 2017
− Status of the MEMS Industry 2017
− Silicon Photonics 2017*
− MEMS & Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017**
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment & Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market & Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Integrated Passive Devices Market Status 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market & Technology Trends 2017*
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced QFN: Market & Technology Trends 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING & OPTOELECTRONICS
− 3D Imaging & Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology & Market Trends 2017*
− Solid State Medical Imaging 2017
− Embedded Software for Machine Vision Systems 2017**
o BATTERY AND ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry*2016 version still available / **To be confirmed
41©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power MOSFET 2017: Market and Technology Trends
− IGBT Market and Technology Trends 2017
− Power Module Packaging: Material Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Integrated Passive Devices Market Status 2017
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− MicroLED IP 2017
− Quantum Dots for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and VCSELs - Technology Applications and Industry Trends 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management Technology and Market Perspectives in Power Electronics
and LEDs 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk
and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− MicroLEDs: Patent Landscape Analysis 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− FLUIDIGM Patent Portfolio Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
*2016 version still available / **To be confirmed
42©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
43©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).
44©2017 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
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Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager.
45©2017 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
• Email: [email protected] - +33 4 72 83 01 80
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