Date post: | 16-Jul-2015 |
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An overview and applications
Presented by:
Khatib Minajoddin Alimoddin
TE (Mech)
UCOER
MEMS: Micro Electro Mechanical System
Combination of mechanical function (sensing, motion,
heating) and electric function (switching, deciding) to
produce component on micro scale.
Thickness of component is less than
human hair…
1889-Discovery of semiconductor
1958-discovery of IC by Jack Kilby
1974-Ultra Large Scale Integration Technology
(ULSI)
1988-Micromachining Technology discovered
Mechatronics does not bother about size of component
Size of component in MEMS limited to ‘Micro scale
only’
MEMS can combine with number of branches
like BIO, COMPUTER, ROBOTICS etc.
Sensor: Device experience external change in
parameter
Transducer: Energy convertor
Actuator: Other form of energy to mechanical
convertor
Semiconductor:
Silicon, polonium
Polymer:
Metal:
Gold, nickel, silver, titanium etc.
High reliability
Deposited by electroplating, evaporation
Three basic steps are:
Deposition process
Photo-lithography
Etching
Deposition of thin film of material on substrates Thickness of film from nanometer to 100 millimeter
Two types are:
1)Physical deposition process
Physical vapour deposition
Casting
2)Chemical deposition process
Chemical vapour deposition
Electro deposition
Thermal oxidation
Defining the shape of micro machine
Shape to the substrate given by image transfer
by Ultraviolet Light
Two types are:
1)Positive resist transfer
2)Negative resist transfer
Etching process
• Formation of functional MEMS structure on
substrate
Two types are:
1)Dry etching
Material dissolved in chemical solution by reactive
ion or vapour phase etchant
2)Wet etching
Material is dissolved in chemical solution itself
Joining of different component together to function as single
unit
Some technique are:
Bulk micromachining
Surface micromachining
Micro molding
3-d micro machined structure
Linear rack gear reduction drive
Application of MEMS
Bio-MEMS
Lab-on-chip
Micro total analysis
Microfluidics
Micro drug
delivery
Smart pill
Accelerometer
Pressure sensor
MEMS gyroscope
Micro engine
Advanced memory
Devices
Application
ADVANTAGES DISADVANTAGES
1)Minimize energy and
material used in
manufacturing
1)Farm establishment require
huge investment
2)Improved reproducibility 2)Very complex design
procedure
3)Cost and performance
advantages
3)Prior knowledge is needed
for integration of MEMS
devices
4)Higher accuracy, sensitivity,
selectivity
4)Market value of component
are high
MEMS application will be driven by enabling higher
functionality
Combining different areas of research
i.e. Bio MEMS, microfludics, NEMS ,etc
Future product involve higher level of electro
mechanical product with complex integration
and more intimate interaction with physical world
Online Resources BSAC http://www-bsac.eecs.berkeley.edu/
DARPA MTO http://www.darpa.mil/mto/
IEEE Explore http://ieeexplore.ieee.org/Explore/DynWel.jsp
Introduction to Microengineeringhttp://www.dbanks.demon.co.uk/ueng/
MEMS Clearinghouse http://www.memsnet.org/
MEMS Exchange http://www.mems-exchange.org/
MEMS Industry Group http://www.memsindustrygroup.org/
Journals Journal of Micromechanical Systems
journal of Micromechanics and Micro engineering
Micromachine Devices
Sensors Magazine