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MEMS in GaN - microGaN MicroGaN HeTech 2009.pdf · MEMS in GaN Peter Benkart, Ulrich Heinle, Mike...

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MEMS in GaN Peter Benkart, Ulrich Heinle, Mike Kunze, Ingo Daumiller and Ertugrul Sönmez
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MEMS in GaNPeter Benkart, Ulrich Heinle, Mike Kunze,

Ingo Daumiller and Ertugrul Sönmez

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

GaN-MEMS Overview

GaN-MEMS sensor GaN-MEMS actuator

Application examples: - sensing elements in pressure sensors - proximity sensor with sub-micron resolution

Advantages of GaN-MEMS - high measurement signal - functionality shown until 300°C (more can be expected) - electronic devices are possible on one chip

Application examples: - varaktors and switches for RF power applications - actuator/resonator for biomedical analysis

Advantages of GaN-MEMS - low driving voltages and power dissipation - compact and variable design is possible - suitable for harsh environments

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

side view top view

Si-substrate

new wafer

GaN-MEMS Process Overview

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

side view top view

Si-substrate

structuring the active layers

GaN-MEMS Process Overview

sensing element mechanical part of the cantilever

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

side view top view

Si-substrate

deposition of contacts and passivation

GaN-MEMS Process Overview

passivation ohmic and schottky contacts

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

side view top view

Si-substrate

wiring

GaN-MEMS Process Overview

electric wires and contact pads

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

side view top view

Si-substrate

structuring the substrate

GaN-MEMS Process Overview

freestanding cantilever

silicon frame for mechanical stability

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

beam bent upwards

cantilever with a length of 750µm and a width of 200µm at room temperature

0,00 3,00 6,00 9,00 12,00 15,00 18,00 21,00 24,00 27,00 30,0030,00

35,00

40,00

45,00

50,00

55,00

60,00

65,00

Zeit (min)

Stro

m (µ

A)

0µm

20µm40µm

60µm80µm

100µm120µm

160µm

180µm

Cur

rent

(µA)

time (min)

deflection

Sensor signal vs time of a cantilever

Stability measurement

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

Sensor signal at high temperature

0 5 10 15 20 25 30 35 40 450

2

4

6

8

10

12

14

16

18

20

RT100°C200°C300°C

Auslenkung (µm)

rela

tives

Sig

nal (

%)

rela

tive

sens

or s

igna

l (%

)

deflection (µm)

beam bent upwards

Hotplate

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

500µm

GaN actuator beam

GaN is a polar material and lateral stress changes the polarization field

Theory predicts the change of the lattice constants by mani-pulating the polarization field. It should function as actuator.

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

Actuation with square wave voltages of different frequencies

Beam length: 800µmBeam width: 200µm

Amplitude: ~3,2µm

GaN actuator beam

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

Actuators Capacity

Atuator

Actuator

Initial position (Cmin)

lower electrode actuated (Cmax)

RF-contact

Si-frame

sideview

GaN-MEMS Varaktor

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

Actuators Capacity

Square wave driving voltage (1Hz und 2Hz)

GaN-MEMS varaktor in action

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

0 2 4 6 8 10 12 14 16 180

100

200

300

400

500

600

700

800

900

Aktorspannung (V)

Kap

azitä

t (fF

)C

apac

ity (f

F)

Driving voltage (V)

Varactor capacity vs driving voltage of a GaN-MEMS varaktor

actuators

capacity

Capacity variation

A further use, dissemination or publication of this material is only allowed after pre-approval and along with theauthor's permission. All rights at MicroGaN GmbH.

Conclusion

The piezoelectric effect in GaN opens the possibility for sensors with high signals on one hand.

On the other hand, turning the sensor principle upside down, the same material system functions as actuator.

This effect allows not only the applications discussed before, but also new fields of application where sensor and actuator are needed in combination.


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