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Method for reducing seed deposition in electroless plating

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Page 1: Method for reducing seed deposition in electroless plating

POWDD COATING ..NONCONDUCTORSU.S. Patent 5,997,959. Dec. 7, 1999R. Lebioda, assignor to Societe LCSInternational, Villeneuve De LaRiviere, FranceA method and apparatus for elec•trostatically painting parts madeof dielectric or low-conductivitymaterial.

MITROD POll ...DUCING saD.........OIlIINIUCTllOUUPLATINGU.S. Patent 5,997,997. Dec. 7, 1999A.P. Angelopoulos et al., assignors toInternational Business MachinesCorp., Armonk, N.Y.A circuit structure produced bythe following method: providing aworkpiece comprising a substratecoated with a polymeric dielectric

layer, wherein the polymeric di•electric layer comprises hydroxylgroups and scavenging groupshaving sulfur moieties or atoms;baking the workpieces; applying apolymeric surfactant to the poly•meric dielectric layer, wherein thepolymeric surfactant is capable ofhydrogen bonding to the hydroxylgroups on the polymeric dielectriclayer; applying a seed to the di•electric layer; and electrolesslyplating metal to the seed.

.... COA'IING PAINTU.S. Patent 5,998,035. Dec. 7, 1999G. Iwamura et al., assignors toMazda Motor Corp., Hiroshima,Japan, and Dainippon Ink andChemicals Inc., Tokyo

A base coating paint composition

comprising a hydroxy group-con•taining oligomer and an amin•oplast resin, which together arecurable upon being subjected toheat, said composition furthercontaining a basic curing catalyst,wherein the basic curing catalystis present for the purpose of act•ing as a curing catalyst for a clearcoating paint to be coated in awet-on-wet state on the base coat•ing paint composition, with thetwo coatings being subsequentlybaked.

POIICILalNINAMIL COMPOSITIONPOIIIUCTIIONIC APPLICATIONSU.S. Patent 5,998,037. Der. 7, 1999S. Sridharan et al., assignors toFerro Corp., Cleveland

A coating for use in forming a

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