12
MICRO BACKPLANE DESIGN GUIDE APRIL 2011
2
Two Piece Edge Rate™
Contact System
High Density SEARAY™ Systems
High Speed Ground Plane Pg. 7
High Speed Rugged Contact Systems Pg. 5
High Density High Speed Systems Pg. 6
High Speed Edge Cards Pg. 4
HigH speeDMICRO BACKPLANEs
3
High Speed Edge Card Systems
High Speed, Rugged Ground/Power Plane
Systems
High Speed, Isolated Contact Systems
High IsolationSystems Pg. 8
Data & StorageSolutions Pg. 10-11
3G SDI BroadcastVideo Pg. 9
Signal Integrity Services Pg. 12
4
• Staggeredcontactsforeffective0,5mmpitch
• RuggedEdgeRate™contacts
• Four-row(1,00mm).040"x(1,27mm).050"gridPCB padlayout
• Mateswithstandard .062"(1,60mm)and.093"(2,4mm)cards
• Lead-freesoldercrimpsontail
• BEC5Series
• Lower-costphosphor bronzecontactsavailable (BEC5CSeries)
0,8mmpitch(HSEC8Series)
EdgeRate™contactsoptimized forSignalIntegrityperformance
Vertical,rightangleand edgemount
Dualstackedgecard socket(DSECSeries)
1mmpitch(PCIESeries)
Vertical,rightangleandedgemount
Supportsone,four,eightandsixteen*PCIExpress®links
0,75mmpitch(MTCASeries)
IdenticaltoMolexinform,fit andfunction
170contacts
Pressfittailsforsimple, reliableboardterminations
0,635mm(MEC6Series),1mm(MEC1Series),1,27mm(MECFSeries)&2mm(MEC2Series)
Vertical,rightangleand edgemount
Edge Card SocketsOne Piece Edge Rate™ Micro TCA Connectors PCI Express® Sockets
HigH speeD EdgE CARd sOCKEtsHigh Density Edge Card Sockets
Rugged alignment pins and weld tab
Staggered contacts for 0,5mm pitch
High Density One Piece System
Edge Rate™ Contacts
Board LocksSolder Crimps
Edge Rate™ Contacts
*PCIExpress®isaregistered trademarkofPCI-SIG®
5
Micro Rugged Hermaphroditic Floating Contact System
ERM8-RA to ERF8 - TYPICAL PERFORMANCE*Single-Ended 8.0GHz/16.0Gbps@3dBIL
DifferentialPairs 9.0GHz/18.0Gbps@3dBILCurrentRating 1.6A@85°C
*Forcompletetestdatagotowww.samtec.com?ERM8 [email protected]
0,5mmpitch(LSHMSeries),0,635mmpitch(LSS Series)&0,8mmpitch(LSEMSeries)
HighSpeed/HighDensity
Slimrow-to-rowdesign
Shroudedwith audibleclickwhen properlymated
Lowercostbladeand beamcontact
FS5/FT5Seriesprovide0,5mmcontactfloatinXandYdirectionstocompensateforconnectormisalignment
FT5rightangleformicrobackplaneapplications
Idealformultipleconnectorsonaboard
Narrow0,5mmpitch
Through-holeweldtabs forruggedapplications
SEM/TEMSeries(0,8mm), SFM/TFMSeries (1,27mm(.050")),and SMM/TMM(H)and S2M/T2MSeries (2mm)pitchsystems
Frictionlatchingsystem forhigherwithdrawal forces(optional)
Micro Rugged Tiger Eye™ Systems
HigH speeD RUggEd CONtACt sYstEMsTwo Piece Edge Rate™ Contact System
Vertical, Right Angle and Edge Mount
0,8mm Pitch
Latching Features Available
High Cycle Contact System
Edge Rate™ Contacts
• RuggedEdgeRate™contactsoptimizedforSignalIntegrityperformance
• Robustwhen“zippered” duringunmating
• Smoothbroadmilledsurfaceformating
• Highperformance, lowercostsystem
• 0,5mmand0,8mmpitch
• ERM8/ERF8Series
Right Angle - Perpendicular
Edge Mount - Perpendicular Right Angle - Coplanar Edge Mount - Coplanar
6
HigH speeD HIgH dENsItY sYstEMs
SEARAY™ High Density Edge Rate™ LP Array™ Low Profile Array
Alignment Features Available
Right Angle/ Micro Backplane
Edge Rate™ Contacts
Vertical and Right Angle
Press Fit Option for easy PCB termination
Independent PostPress Fit
Solder Charge
• Rightanglearraysoptimized toreduceskewand impedancemismatch
• Upto500single-endedI/Osor125differentialpairs(usingSamtecrecommendedpinassignments)
• RuggedEdgeRate™contacts
• Lowerinsertion/extractionforces
• Optionalguidepostsfor blindmating
• Optionalpressfittails
• Optionalsolderchargetailsforimprovedsolderability/reliability
• Ultrahighdensity(0,80mm).0315"pitchuses50percentlessboardrealestatethanstandardSEARAY™
• SEAM/SEAFSeries
1,27mmpitch (SEAM/SEAFSeries)
Rightanglearraysoptimized toreduceskewand impedancemismatch
Optionalguidepostsfor blindmating
85Ω-tuned(SEAMISeries)andrisermodule(SEARSeries) indesign
LPAM/LPAFSeries
4mm,4,5mmand5mmstackheights
10to30pinsperrow,4or6row
1,27mmx1,27mm(0.50"x.050")pitch
Dualbeamcontact
Soldercharge
Indevelopment
6
7
HigH speeDgROUNd PLANE sYstEMsRight Angle, Slim Body
Q2™ Right Angle & Edge Mount Q Series® Interface Systems
Coplanar Ground/ Power Plane
Integral ground/power plane
Slim footprint
Vertical and Right Angle
0,80mm Pitch
• Widelyacceptedindustrystandardground/powerplane
• Slim5mmbodywidth
• 0,8mmpitch
• RuggedEdgeRate™contactsoptimizedforSignalIntegrityperformance
• Choiceofstandardstackheightsfrom7mmand10mm
• Robustwhen“zippered” duringunmating
• Estimatedperformanceto 9.5GHzSEand8.5GHzDPat3dBinsertionlossfor 7mmstackheight
• Dualgroundplanedesignbeing performancetestednow
• QRM8/QRF8Series
QMS/QFSSeries
Integralground/powerplaneratedforupto8.9A@80°C
50Ωsingle-endedstandardandapplicationspecific100ΩdifferentialpairPerpendicular(90°)andhorizontal(180°)coplanarapplications
Optionallockingscrews/holes andguideposts/holes
0,635mmpitch
QTS/QssSeries
50Ωsingle-endedstandardandapplicationspecific 100ΩdifferentialpairPerpendicular(90˚)andhorizontal(180˚)coplanarapplications
Optionallockingscrews/holesandguideposts/holes
0,635mmpitch
8
HigH speeD HIgH IsOLAtION sYstEMsIsolated Signal, Right Angle
Isolated Signal Isolated Edge Rate™
Board Stacking SolutionsIsoRate® Cable Solution
Single or double row
50Ω or 75Ω isolated signal
Right angle and vertical
Rugged weld tab
1 Meter (50Ω) Cable Assembly Frequency
InsertionLoss=3dB 9.5GHzReturnLoss=15dB 2.2GHzVSWR=1.4 2.1GHzIsolation=60dB 3.1GHz
10mm Mezzanine stackers (50Ω) Frequency
InsertionLoss=3dB 10.5GHzReturnLoss=15dB 5.5GHzVSWR=1.4 5.4GHzIsolation=60dB 8.8GHzIsolation=70dB 7.6GHzIsolation=80dB 1.3GHz
• IsoRate®isolatedtransmissionlinesolutions
• 50Ωand75Ωboard-to-boardmicrobackplanesystems
• 90%performanceoftraditionalRFat50%ofthecost
• Ruggedpositivelatching
• 4,0mm(.1575")pitch
• IJ5/IP5-RAand IJ7/IP7-RASeries
• 50Ω cablesolutionsalso available(IJ5C,IJ5HSeries)
IJ5C Series50Ω,4mm(.1575")pitchcableEdgeRate™contacts
Positivelatching
Singleordoubleended
RG316or26AWGSamteccable
50Ωand75Ωsystems10mmstackheighton4mm(.1575")pitch
Singleanddoublerow
1,2,4,6,8positions,50Ω(IJ5/IP5Series)1,2,4,6,8,12,16positions,75Ω(IJ7/IP7Series)Rightangleavailable
9
3g sDi BROAdCAst VIdEOSolve 3G SDI Challenges
ParallelPerpendicular Coplanar
3G SDI Demonstration KitHigh Density BNC
Downloade-brochureat www.samtec.com
• True75™BNCconnectorsarecertified75ohm±3ΩforStraightand±4ΩforRightAngle.
• Samtecmicrobackplaneandhighspeedstackinginterconnectsmeetorexceedrequirementsfor3GSDIrearpanelI/Ocardinterfaces.
• Demonstrationkitsthatareexceptionallyaccurateatmeasuring3GSDIsignalqualityintheconnectorbreakoutregionsareavailable. [email protected] formoreinformation.
• Samtec’ssignalintegrityexpertise,andhighspeedinterconnectsolutions,are idealformanyofthephysicalandelectricalroutingchallengesfacingthe broadcastvideoindustry.
HD-BNC™True75™75ΩsystemHighestlevelofarraydensity
HDarraysarefourtimesdenser thantraditionalBNCs!
Highbandwidth,ruggedhigh reliabilitysolution
HD-BNC™isatrademarkofAmphenol.
Allowsaccuratemeasuringof3GSDI signalqualityintheconnector breakoutregions
SimulationoftheentiretransmissionlinepathsfromBNCs throughhighspeed interconnectandtheequalizers andcabledriversonthe activeboard
10
ERM8/ERF8
QRM8/QRF8
QMS/QFS
ERDL2ERF8
HSEC8
ECDP
TFMDL
SATAC
SATA-007
SEAM/SEAF
ERM8
BEC5
TFM
INTERCONNECTSOLUTIONSFOR dAtA & stORAgE• Varietyofrugged,highspeedbackplaneinterconnects
• Arrays,edgecardsockets,rightangleandedgemountstrips
• Highspeedpanel&I/O,flexcircuit,discretewireandribboncablesolutions
• HighspeedSerialATA
• Supportwithchiptesting andverification
• Supportwithdevelopmentboarddesignandreferencedesign
High Speed Solutions
Bypass Rack-to-Rack Backplanes
Achieve I/O Flexibility
Maximize Panel Density
SFPE
RF316
QSFPO
EPLSP
ERC/ERI8
QSFPC/QSFP8
IJ5H
IP5
SFPC/MECT
HDI6/HDC
HDLSP
FCS8/FCC8
ERDL2
• Millionsofdesignpermuta-tionsforacompletelycustomassemblywithastandardleadtimeandprice
• Anycablelengthandconnectorgender,anyorientation,andanynumberofpositions
• Mostordersshipinaweek
• NoartworkorNonrecurringEngineeringCharges(NREs)
• FlexCircuitandHighSpeedCableSolutionator® nowavailable!
• AccliMate™,RFandDiscreteWireSolutionator®comingsoon!
Online Custom Cable Assemblies
11
Onlinesupportandreferencetoolsfortheselection,development,simulationandtestingofhighspeedsystems.• Highspeedconnector simulations,models,reports, drawingsandsearches. See www.samtec.com/signalintegrity
• HighSpeedCharacterizationReports
• Timeandfrequencydomain testdata
• BandwidthPerformanceSelector
• HighSpeedConnectorProductSelector
• Engineeringprints,productspecificationsandfootprints
• ApplicationNotes,WhitePapers,presentationsandarticles
• FinalInch®PCBdesigntools
• TestDatacomparisonprogram
• Real-timeperformancesimulationsforassembliescreatedinSamtec’sHighSpeedFlexandCableSolutionator® applications
• Integratesandblendsdatafromseparatemodelstoprojectinsertionloss,returnloss,NEXTandFEXTalongwithsupportingeyepatterns
• Stand-aloneprogramforadditionalstandard highspeedconnectorsandcablescomingsoon!
PersonalsupportviaSamtec’s highlyqualified,in-housestaffof SignalIntegrityengineers.
• Interprettestdataand performanceresults
• PCBlayout,traceand routingassistance
• Connectorground pinassignmentandassistance
• Extensivemodeling,simulation andtestingcapabilities
• De-embeddingcapabilities
• On-requesttestdata, includingeyepatternsfor FinalInch®circuitsusing AgilentPLTS50GHzCharacterizationSystem
Applicationspecificdesign,modeling andtestingofcircuits,subsystems orcompletesystems.
• Choosethedepthofinvolvement andthebreadthofservice
• Layoutandcomponentstrategies duringtheconceptphase
• Customizedsimulationmodelsto betteroptimizeperformanceandenhancesignalintegrityduring thedesignphase
• Testingandverificationduringthefinaldevelopmentstages
• Electricalengineeringservicestailored tospecificneeds andproducts
• PCBdesignsupport formoreadvanceddesignneeds
Signal Integrity Center Online Cable Performance Calculator
Signal Integrity Group Custom Signal Integrity Services
SIGNALINTEGRITY sERVICEs
UNITED STATES • SILICON VALLEY • SOUTHERN CALIFORNIA • AMERICA LATINA COMERCIO EXTERIOR • UNITED KINGDOM • GERMANY • FRANCE • ITALY NORDIC/BALTIC • BENELUX • ISRAEL • INDIA • ASIA PACIFIC • JAPAN • CHINA • TAIWAN • HONG KONG • KOREA • AUSTRALIA / NEW ZEALAND
