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S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Micro Electro Mechanical SystemsMEMS - Small Devices for Large Jobs
S. MeenatchisundaramFaculty
ICE, MIT, Manipal
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S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Lecture #01
Micro Electro Mechanical Systems
– An Overview
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S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Reference Books & Materials
� Tai Ran Hsu, MEMS and Microsystems Design and Manufacture, Tata McGraw Hill, 2002.
� Chang Liu, Foundations of MEMS, 2 ed., Prentice Hall, 2012.
� M. Bao, Analysis and Design Principles of MEMS Devices, 1 ed., Elsevier,2005.
� S. Beebey, G. Ensell and N. White, MEMS Mechanical Sensors,Boston: Artech House, 2004.
� Stephen Senturia, Microsystem Design, Springer, 2001.
� An Introduction to MEMS, Prime Faraday Technology Watch – January 2002
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S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Contents
1. What is MEMS?
2. Evolution of MEMS
3. Moore’s law and beyond
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� Micro-Electro-Mechanical Systems (MEMS) is the integration ofmechanical elements, sensors, actuators, and electronics on a commonsilicon substrate through micro fabrication technology.
� A technology to create any integrated devices or systems that combinemechanical and electrical components. These devices have the ability tosense, control and actuate on a micro scale and generate effects on macroscale.
� A device that consists of micro machines and microelectronics where micromachines are controlled by microelectronics.
� A system or a device that has static and movable components with somedimension on the scale of micron.
� By combining IC’s with mechanical parts, MEMS are complete systems ona chip.
What is MEMS?
5S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
What is MEMS?
6S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
� In the most general form, MEMS consist of mechanicalmicrostructures, microsensors, microactuators and microelectronics, allintegrated onto the same silicon chip.
What is MEMS?
7S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
What is MEMS?
8S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
What is MEMS?
9S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Evolution of MEMS
10S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
1950’s
• 1958 Silicon strain gauges commercially available
• 1959 “There’s Plenty of Room at the Bottom” – Richard Feynman gives amilestone presentation at California Institute of Technology. Issues a publicchallenge by offering $1000 to the first person to create an electrical motor smallerthan 1/64th of an inch.
1960’s
• 1961 First silicon pressure sensor demonstrated
• 1967 Invention of surface micromachining. Westinghouse creates the Resonant Gate Field Effect Transistor, (RGT). Description of use of sacrificial material to free micromechanical devices from the silicon substrate.
1970’s
• 1970 First silicon accelerometer demonstrated
• 1979 First micro machined inkjet nozzle
History of MEMS
11S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
1980’s
• Early 1980’s first experiments in surface micro machined silicon. Late 1980’s micromachining leverages microelectronics industry and widespread experimentation and documentation increases public interest.
• 1982 Disposable blood pressure transducer
• 1982 “Silicon as a Mechanical Material”. Instrumental paper to entice the scientific community – reference for material properties and etching data for silicon.
• 1982 LIGA Process
• 1988 First MEMS Conference
1990’s
• Methods of micromachining aimed toward improving sensors.
• 1992 MCNC starts the Multi-User MEMS Process (MUMPS) sponsored by Defense Advanced Research Projects Agency (DARPA)
• 1992 First micro machined hinge
• 1993 First surface micro machined accelerometer sold (Analog Devices, ADXL50)
• 1994 Deep Reactive Ion Etching is patented
• 1995 BioMEMS rapidly develop
• 2000 MEMS Optical-networking components become big business
History of MEMS
12S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
History of MEMS
13S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Moore’s Law
Gordon Moore (Co-founder of Intel) predicted in 1965 that the transistor density ofsemiconductor chips would double roughly every 18 months.
14S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal
Beyond Moore’s Law
MOSFETs using new materials must be fabricated on Si substrates in order to fullyutilize Si CMOS platform, meaning the necessity of the co-integration of III-V/Ge on Si.
15S.Meenatchisundaram, Department of Instrumentation & Control Engineering, MIT, Manipal