Herbert Reichl, Anton Heuberger (Editors)
MICRO SYSTEMTechnologies 965th International Conferenceon Micro Electro, Opto,Mechanical Systems and Components
Potsdam, September 17 - 19, 1996
UNIVERSITATSBIBLIOTHEKHANNOVER
TECHN1SCHEINFORMATIONSBIBLIOTHEK
VDE-VERLAG GMBH • Berlin • Offenbach
Table of Contents
Opening Plenary Talks
Chairman: Herbert Reichl, Fraunhofer Institute Reliability and Microintegration, Berlin, Germany
Japanese Activities of Micromachines and its Future Prospects 23T. Hirano, Micromachine Center, Tokyo, Japan
Silicon micromachining technology for heated gas sensor elements 29G. Sberveglieri, C. Perego, A. Taroni, University of Brescia, Italy;W. Hellmich, C. Bosch-v. Braunmuhl, A. Krenkow, G. Mueller,Daimler Bern AG, Munich, Germany
A Historical Perspective of Semiconductor Packaging Technologies and Markets 853S. Khadpe, Semiconductor Technology Center, Neffs, USA
Plenary Session
Chairmen: Herbert Reichl, Fraunhofer Institute Reliability and Microintegration, Berlin, GermanyTakayuki Hirano, Micromachine Center, Tokyo, Japan
Microsystems for Automotive Application - Semiconductor Aspects 39B. Cambou, Motorola Semiconductor Products Sector, Tempe, AZ, USA
Packaging Technologies and System Integration for Automotive Applications 45E. Schmidt, BMW AG, Munich, Germany
Materials and Technologies (I)
Chairmen: Robert Mertens, IMEC, BelgiumJiri Marek, Robert Bosch GmbH, Reutlingen, Germany
Deposition of Textured and Heteroepitaxial Diamond Layers on Single-Crystal Silicon . 55M. Marinelli, A. Paoletti, A. Tucciarone, INFM, University of Rome Tor Vergata, Italy
Excimer Laser Patterning Properties of Amorphous Diamond 61G. Messina, S. Santangelo, C. Pontorieri, University ofReggio Calabria, Italy;S. Martellucci, A. Paoletti, G. Petrocelli, A. Tebano, A. Tucciarone, INFM,University of Rome Tor Vergata, Italy
Characterisation of Silicon Carbide JFETs with Respect toMicrosystems for High Temperature Applications 67S. Zappe, M. Leone, F. Yang, E. Obermeier, Technical University of Berlin, Germany
The Rubberelastic Polymer PolyDiMethylSiloxane Applied asSpring Material in MkxoMechanical Sensors 73J. hotters, W. Olthuis, P. Veltink, P. Bergveld, University ofTwente, Enschede, The Netherlands
Developing a Mould for Fundamental Research in Injection Moulding of Mkrostructures 79A. Rogalla, W. Michaeli, Ins titut fur Kunststoffverarbeitung, RWTH Aachen, Germany
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Interconnection
Chairmen: William Beckenbaugh, Motorola, Tempe, USAElisabeth Reese, W. C. Heraeus, Hanau, Germany
A New Solution For Solder Application To FCA, BGA And CSP Challenges 85P. Kasulke, PacTech - Packaging Technologies GmbH, Falkensee, Germany;G. Azdasht, E. Zakel, H. Reichl, Fraunhofer Institute for Reliability andMicrointegration, Berlin, Germany
Fluxless Flip-Chip Bonding for the Photonic Assembly:Comparison between Evaporated SnPb (60/40) and AuSn (80/20) Solder 91/. Kuhmann, P. Harde, D. Pech, Heinrich-Hertz-lnstitutfur Nachrichtentechnik, Berlin, Germany;W. Pittroff, Ferdinand Braun Institutfiir Hochstfrequenztechnik, Berlin, Germany;A. Preufi, B. Adolphi, Technical University of Dresden, Germany;T. Wirth, W. Osterle, Bundesansta.lt fur Materialforschung und -prufung, Berlin, Germany
Alternative Solder Deposition Using Transfer Technique 99J. Wolf, H. Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany;M. Topper, Technical University of Berlin, Germany
A New Approach To A Chip Size Package Using Tape Technology 105E. Jung, G. Azdasht, E. Zakel, H. Reichl, Fraunhofer Institute forReliability and Microintegration, Berlin, Germany;D. Lin, K. Becker, Technical University of Berlin, Germany;P. Kasulke, PacTech Packaging Technologies GmbH, Falkensee, Germany
Failure mechanisms in underfill materials used forflip chip assembly on organic PCB I l lH. Jiang, Robert Bosch GmbH, Stuttgart, Germany;E. Jung, E. Zakel, H. Reichl, Fraunhofer Institute forReliability and Microintegration, Berlin, Germany;D. Lin, Technical University Berlin, Germany
Fabrication of High Power Multi Chip Modules byPlanar Embedding Technique and Active Cooling 119R. Hahn, V. Glow, K. Buschick, J. Wolf, Fraunhofer Institute ofReliability and Microintegration, Berlin, Germany;O. Ehrmann, J. Hoehne, M. Schmidt, H. Reichl, M. Topper,Technical University of Berlin, Germany
System Design (I)
Chairmen: Walter Kroy, DASA AG, Munich, GermanyHiroki Kuwano, NTT Corp., Tokyo, Japan
Low Cost Access to MST: Manufacturing Techniques and Related CAD Tools 127/ . M. Karam, B. Courtois, J. M. Paret, H. Boutamine, Tima-CMP, Grenoble, France
Theoretical Foundations of the Model Transformation Approach 133/ . Bielefeld, G. Pelz, Gerhard-Mercator-University-GH-Duisburg, Germany;
Simulation and Design Optimization Based onStandard Simulation Tools and Adaptive Search Techniques 139A. Quinte, S. Meinzer, W. Jakob, W. Sufi, M. Gorges-Schleuter, H. Eggert,Forschungszentrum Karlsruhe, Germany
Coupled Finite Element and Network Simulation for Microsystem Components 145P.-C. Eccardt, Siemens AG, Munich, Germany;M. Knoth, G. Ebest, Technical University Chemnitz-Zwickau, Germany;C. Claufi, S. Wunsche, Fraunhofer Institute for Integrated Circuits, Dresden, Germany;H. Landes, University ofLinz, Austria
Multi-Sensor Controller with CAN Bus Interface 151St. Bender, W.-J. Fischer, H. Gratz, A. Heinig, C. Kohler, S. Rietz, B. Schneider,Fraunhofer Institute of Microelectronic Circuits and Systems (IMS), Dresden, Germany
Micro System Applications
Chairmen: Helmut Seidel, DAS A AG, Munich, GermanyFranco Mori, Magneti Marelli, Pavia, Italy
An Online Vibration-Control System forRotating Machinery Based on Smart Sensors Fabricated by Si MST 157D. Scholz, E. Peiner, A. Schlachetzki, Technical University of Braunschweig, Germany;H. Fritsch, R. Mikuta, P. Hauptmann, Otto-von-Guericke-University, Magdeburg, Germany
Tool Monitoring of an Automated Lathe with Microsystem Technology 163K. Feldmann, J. Gohringer, F. Pitter, University of Erlangen-Nuremberg, Germany
Automotive Microsensor for Control of the Brake System and Monitoring ofthe Long-term Degradation of Different Types and Brands of Brake Fluids 169J. Binder, F. Henning, T. Hofinann, T. Kalinowski, University of Bremen, Germany;J. Zacheja, College for Advanced Technology Bochum, Germany;M. Bon, T. Lampe, Volkswagen AG, Wolfsburg, Germany
Analysis of Multicomponent Fluids byElectrochemical Impedance Measurements for Automotive Applications 175F. Beckmann, T. Hofinann, R. Laur, University of Bremen, Germany
Miniaturised Air Analyser 181A. Meckes, J. Behrens, M. Hausner, W. Benecke, University of Bremen, Germany;M. Gebhard, Robert Bosch GmbH, Reutlingen, Germany
A Micro Mechanical System for Liquid Dosage and Nebulization 187S. Kluge, P. Woias, Fraunhofer Institute for Solid State Technology, Munich, Germany;G. Temmel, T. Hermes, Fraunhofer Institute of Integrated Circuits, Erlangen, Germany;R. Paneva, University of Erlangen-Nuremberg, Erlangen, Germany
Materials and Technologies (II)
Chairmen: Janusz Bryzek, Intelligent MicroSensor Technology, Fremont, USALubomir Cergel, Motorola Semiconductors, Geneva, Switzerland
Injection Molding of Microstructures Using Filled and Unfilled Thermoplastics 193V. Plotter, J. Haufielt, J. Konys, R. Ruprecht, Forschungszentrum Karlsruhe, Germany
Low Cost Additive Electroless Copper Metallization on BCB for MCM-D 199M. Topper, T. Stolle, M. Franzke, Technical University of Berlin, Germany;H. Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
Silicon Fusion Bonding of Rough Surface with Polishing Technique 205C. Gui, J. Gardeniers, M. Elwenspoek, H. Albers, P. Lambeck,University ofTwente, Enschede, The Netherlands
Bulk Micromachining of Borosilicate Glass by Ultrasonic Drilling and Sand Blasting.... 211Th. Diepold, E. Obermeier, Technical University of Berlin, Germany
Lateral Pyrex Thin Film Anodic Bonding and KOH Deep Etching ofSilicon Substrates for Micro Fluid Applications 217St. Nehlsen, V. Relling, F. Kraus, J. Lubke, J. Muller,Technical University of Hamburg-Harburg, Germany
Novel Processing Technique for Thin Diaphragms 223A. Chin, J. M. Lai, K. Lee, Y.-C. Huang, W. H. Chieng, Y.-S. Lin, W. Hsu,National Chiao Tung University, Hsinchu, Taiwan
Characterization and Testing
Chairmen: Bernd Michel, FhG-IZM, Berlin, GermanyArno Steckenborn, Siemens AG, Berlin, Germany
Tensile Testing of Microfabricated Thin Films 229H. Ogawa, Y. Ishikawa, T. Kitahara, Dep. of Advanced Machinery, AIST, Mm, Tsukuba, Japan;S. Kaneko, Olympus Optical Co. Ltd., Hachioji, Japan
Microsample Tensile Test: Experiments and Theory for the MechanicalCharacterisation of Single Crystal Silicon Microstructures 235E. Mazza, J. Dual, Institute of Mechanics, ETH Zurich, Switzerland
Thermo-mechanical Reliability of Chip Cards 241A. Schubert, D. Vogel, R. Dudek, B. Michel, Fraunhofer Institute forReliability and Microintegration, Berlin, Germany
Micro Deformation Measurements of a Miniaturized Relay Combined withFEM-Calculations and Thermal Measurements 249J. Villain, FH Augsburg, GermanyM. Hanke, Siemens AG, BerlinW. Faust, Ch. Bombach, B. Michel, Fraunhofer Institute forReliability and Microintegration, Chemnitz, Germany
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Contactless Function Test of Integrated Circuits on The Wafer - General Survey 255H. Berger, J. Sturm, F. Esfahani, A. Benedix, Technical University of Berlin, Germany;K.-O. Hofacker, D. McClymont, Thesys GmbH, Erfurt, Germany;D. Bartelt, M. Pohland, SMI GmbH, Frankfurtl Oder, Germany;H. Bergner, Polytechnic Jena, Germany;K. Hempel, G. Sargsjan, Friedrich-Schiller-University Jena, Germany;J. Degenhardt, Raith GmbH, Dortmund, Germany;C. Dietrich, D. Runge, Karl Suss Dresden GmbH, Sacka, Germany;C. Swiatkowski, Phoenicon GmbH, Stahnsdorf, Germany
Small torque measurements using micromachined silicon cross-spring structure 261A. Vujanic, H. Detter, F. Franek, W. Brenner, G. Popovic, N. Delic,Inst. for Precision Engineering, Technical University of Vienna, Austria;N. Simicic, I HTM, University of Belgrade, Serbia
The Measurement of Minimotors and Micromotors Torque-Characteristic UsingMiniaturised Cable Brake 267W. Brenner, H. Detter, G. Popovic, A. Vujanic, G. Haddad, N. Delic,Technical University of Vienna, Austria
Integrated Test Support for Micro-Electro-Mechanical-Systems (MEMS) 273Th. Olbrich, A. Richardson, Lancaster University, United Kingdom;W. Vermeiren, B. Straube, Fraunhofer Institutfur Integrierte Schaltungen, Erlangen, Germany
System Design (II)
Chairmen: Walter Kroy, DASA AG, Munich, GermanyHiroki Kuwano, NTT Corp., Tokyo, Japan
Wireless Power Transmission System for Micromachines Using Microwave 281T. Kurahashi, T. Shibata, Y. Aoki, K. Sasaki, T. Idogaki, T. Hattori,Nippondenso Co. Ltd., Nisshin City, Aichi, Japan
Calculation and Measurement ofMonolithic Integrated Micro Coils for Energy Transmission 287K.-L. Krieger, R. Laur, R. Catanescu, University of Bremen, Germany
Modelling of Micromechanical Devices Using Hardware Description Language 293Z. Mrlarica, N. Delic, H. Detter, Technical University of Vienna, Austria;V. Litovski, University ofNiS, Serbia
System Modelling of Microsystems Containing Mechanical Bending Plates Usingan Advanced Network Description Method 299A. Klein, G. Gerlach, Dresden University of Technology, Germany
Specification Oriented Capacitive Sensor Modeling 305F. Rudolf, M.-A. Schaer,CSEM Centre Suisse d' Electronique et de Microtechnique SA, Neuchdtel, Switzerland
A Tool for Fabrication Related Design of Microstructures 313K. P. Scherer, P. Buchberger, H. Eggert, P. Stiller, Forschungszentrum Karlsruhe, Germany
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Microsystem Packaging
Chairmen: Wolfgang Menz, Albert-Ludwigs-Universitdt Freiburg, GermanyCees van Kessel, Philips, Eindhoven, The Netherlands
Silicon Wafer Direct Bonding at Room Temperature bythe Surface Activation Method 319H. Takagi, R. Maeda, Mechanical Engineering Laboratory, AIST., MTTI, Ibaraki, Japan;T. Chung, T. Suga, University of Tokyo, Japan
Packaging of Moveable Structures by Low Temperature Silicon - Silicon - Bonding 325St. Schulze, M. Nqffke, J. Noetzel, T. Tonnesen, W. Benecke, University of Bremen, Germany
Reduction of the Influence of the Anodic Bonding Process onthe Behavior of Pressure Sensors by Using New Glass Substrates 331K. Hilgendorf, P. Krause, E. Obermeier, Technical University of Berlin, Germany
Selective Sealing and Bonding of Silicon-Glass Compounds andLIGA-Components by Laser Beam Welding 337A. Gillner, F. Legewie, Fraunhofer Institute for Laser Technology, Aachen, Germany
Manufacturing and performance of metallized, heat resistant,thermoplastic packaging for Microsystems 343W. Moller, TEMIC Microsystems, Kirchheim, Germany;R. Ostwald, Daimler-Benz Research Center, Ulm, Germany
3D-Packaging Technology for Microsystems 349B. Waidhas, M. Boettcher, E. Meusel, Technical University of Dresden, Germany
Sensors
Chairmen: Ernst Obermeier, TU Berlin, Germany,Nico de Rooij, Universtiy ofNeuchdtel, Switzerland
Micromachined Piezoelectric Force Sensors Based on PZT and PNNZT Thin Films 357Ch. Lee, T. Itoh, T. Suga, The University of Tokyo, Japan;R. Maeda, MITI, AIST, Ibaraki, Japan
Development of Force Sensor for Microhandling Purposes 363N. Delic, H. Detter, W. Brenner, G. Popovic, A. Vujanic, W. Hannenheim,Technical University of Vienna, Austria
Integration of Capacitive Pressure Sensors in a Standard CMOS Process Flow 369R. Catanescu, L. Elbrecht, J. Binder, University of Bremen, GermanyJ. Zacheja, College for Advanced Technology Bochum, Germany
Fabrication and Characterization of Acceleration Switches 375T. Tonnesen, G. Frischmuth, J. Noetzel, S. Schulze, J. Binder,IMSAS, University of Bremen, Germany;G. Mader, Siemens AG, Regensburg, Germany
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Microcoil Speed and Position Sensor for Automotive Applications 379Y. de Coulon, C. Bourgeois, H. de Lambilly, J. Bergqvist, F. Rudolf,CSEM, NeucMtel, Switzerland;P. Roz6, P. Biton, L'Electricfil Industrie, Miribel, France
An X-shaped Tuning Fork Type Resonant Gyroscope bySilicon Micromachine Technology 385M. Yamashita, Matsushita Electric Industrial Co., Osaka, JapanK. Minami, M. Esashi, Tohoku University, Sendai, Japan
Feasibility and Limits of FEM-Simulation ofPVDF Ultrasonic Transducers in Fluids 391L. Thieme, W. Manthey, T. Molle, Technical University of Chemnitz-Zwickau, Germany
InP-Based Micromachined Mach-Zehnder Interferometer Stress Sensors 397C. Seassal, J. L. Leclercq, P. Viktorovitch, M. Gendry, J. P. Laini, F. Sidoroff,Ecole Centrale de Lyon, Ecully, France;Y. Bertie, A. Trouillet, A. Cachard, University de Saint-Etienne, France;P. Benech, LEMO, Grenoble, France
Miniaturized optical spectrometer for UV/VIS-Spectroscopy 403D. Sander, O. Blume, J. Muller, Technical University of Hamburg-Harburg, Germany
Design and Fabrication of HSGFET Gas Sensors 409A. Fuchs, T. Doll, M. Bogner, I. Eisele, Universitdt der Bundeswehr Munich, Germany
Multiple Element Membrane/Sensor Microsystems withEnhanced Selectivity for Complex Gaseous Atmospheres Analysis 415St. Nehlsen, O. Gorbig, F. Kraus, G. Petzold, J. Muller,Technical University of Hamburg-Harburg, Germany
Two-Dimensional Technology- and Device-Simulation of ISFET's 421C. Steiniger, M. Hofinann, T. Gefiner, Technical University of Chemnitz-Zwickau, Germany
Plenary Session
Chairman: S. Khadpe, Semiconductor Technology Center, Neffs, USA
Development and Production of Microsystems for Telecom Applications 427K. Gustafsson, Ericsson Components AB, Stockholm, Sweden
Efficient Design/Simulation Algorithms for SSN in Leadframe Packages 433Ch. Huang, Vanguard International Semiconductor Corp., Taiwan;L. Lin, J. Prince, University of Arizona, Tucson, AZ, USA
Actuators (I)
Chairman: Hiroyuki Fujita, Tokyo University, JapanThomas Gefiner, TU Chemnitz-Zwickau, Germany
A Microvalve Matrix Using Piezoelectric Actuators 4397". Watanabe, H. Kuwano, Nippon Telegraph and Telephone Corp., Tokyo, Japan
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Fundamentals of Dynamic Flux Rectification asthe Basis of Valveless Dynamic Micropumps 445T. Gerlach, H. Wurmus, Technical University ofllmenau, Germany
Magnetostrictive Thin Film Microflow Devices 451E. Quandt, K. Seemann, Forschungszentrum Karlsruhe, Germany
Micromachined Magnetostrictive Actuators 457B. Halstrup, Institutfur Technische Physik, Kassel, Germany;J. Betz, K. Mackay, J.-C. Peuzin, Laboratoire de Magnitisme Louis Neel, Grenoble, France;N. Lhermet, Cedrat Recherche, Meylan, France
Silicon-Microrelay with Electrostatic Moving Wedge Actuator -New Functions and Miniaturisation by Micromechanics 463H. Schlaak, F. Arndt, M. Hanke, Siemens AG, Berlin, Germany;J. Schimkat, Technical University of Berlin, Germany
Moving Silicon Plates Actuated by Conducting Polymer Films 469M. Kallenbach, Technical University ofllmenau, Germany;E. Smela, Linkoping University, Sweden
Materials and Technologies (HI)
Chairmen: Antonio Paoletti, University of Rome, ItalyTadamoto Suga, University of Tokyo, Japan
Simulation of the Self-Limitation Process During the Chemical Etching ofBoron-Doped Silicon for the Achievement of the Thin Silicon Membranes 475F. Gaiseanu, Research Institute for Electronic Components, Bucharest, Romania
The Anisotropic Etching Behaviour of so-called Isotropic Etchants 481N. Schwesinger, Technical University ofllmenau, Germany
Investigation of the Etching of Single Crystalline Silicon Depending onthe Silicon Concentration of the Aqueous KOH Etch Solution 487O. Dorsch, E. Obermeier, Technical University of Berlin, Germany
Structurized Poling of Polyvinylidene Fluoride Films byan Electron Beam Writing System 493M. Pinnow, R. Danz, A. Wedel, Fraunhofer InstitutfurAngewandte Polymerforschung, Teltow, Germany
Novel Fast Atom Beam (FAB) processes forFunctional Nanostructures on 3-D Microstructures 499M. Hatakeyama, K. Ichiki, Y. Toma, Center for Advanced Technology,Ebara Research Co., Fujisawa-shi, Japan;S. Tanaka, M. Nakao, Y. Hatamura, University of Tokyo, Japan
RIE versus Excimerlaser Etching of Aramid PCB Materials 505G. Schammler, A. Dehn, K. Scherpinski, H. Reichl, Technical University of Berlin, Germany;V. Glow, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
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Microoptical Components (I)
Chairmen: Hjalmar Hesselbom, Ericsson Components AB, Stockholm, SwedenFelix Rudolf, CSEM, Neuchatel, Switzerland
Development of a Design Tool for Holographic Images 513W. Stork, L. Reiche, K.-D. Muller-Glaser, Institutfur Technik der Informationsverarbeitung,University of Karlsruhe, Germany;H. Bartelt, H. Roth, IPHT, Jena, Germany;W. Reinhart, Leonhard Kurz GmbH, Fiirth, Germany
A Modular Fabrication Concept for Photonic Devices Using the LIGA Process 519A. Muller, J. Gotten, M. Kohl, M. Marth, J. Mohr, Forschungszentrum Karlsruhe, Germany;U. Gengenbach, Institutfur Angewandte Informatik, Germany
New Results of Adhesion Technology for Assembly of Microoptical Components 525R. Eberhardt, G. Tittelbach, V. Guyenot, Fraunhofer Institution forApplied Optics and Precision Mechanics, Jena, Germany
Polymer Technology for Low Cost Integrated Optical Waveguide Devices 531N. Keil, H. Yao, C. Zawadzki,Heinrich-Hertz-Institutfur Nachrichtentechnik Berlin GmbH, Germany
Thin Film Technologies for Single-Mode Polymer Waveguides 537M. Topper, D. Krabe, H. Reichl, G. Fischbeck, R. Moosburger, K. Petermann,Technical University of Berlin, Germany
Integrated Thermo-Optical Switch Based on Polymer Rib Waveguides 543R. Moosburger, G. Fischbeck, C. Kostrzewa, M. Topper, K. Petermann,Technical University of Berlin, Germany
M-Fab Project
Chairman: H. Kergel, VDI/VDE-IT, Teltow, Germany
Microfabrication techniques for Microsystems -uFab - and first practical experience 549V. Grosser,V. Hillmann, H. Reichl, Fraunhofer Institute for Reliability and Microintegration,
Berlin, Germany;R. Grimme, FhG-IPA, Stuttgart, Germany
Development Trends and Clean room Concepts inthe Industrial Production of Microelectromechanical Systems 555R. Grimme, M. Schuenemann, J. Schliesser, T. Kaufmann, W. Schaefer, Fraunhofer-Institutefor Manufacturing Engineering and Automation, Stuttgart, Germany
Sensor/Actuators of the functional ceramics based onSol-Gel technique for microsystems 561P. Otschik, H.-J. Gesemann, A. Schonecker, Fraunhofer Institute forCeramic Technologies and Sintering Materials, Dresden, Germany;A. Kluge, Fraunhofer Institute for Integrated Circuits, Erlangen, Germany;R. Grimme, Fraunhofer Institute forManufacturing Engineering and Automation, Stuttgart, Germany;A. Schumacher, Fraunhofer Institute for Micro- and Information Technology,Villingen-Schwenningen, Germany 15
A Versatile Spray-Spin-Tool for Wet Chemistry Processes in a Microfabrication Line.... 567A. Kluge, Fraunhofer-Institute for Integrated Circuits, Erlangen, Germany;R. Grimme, Fraunhofer-Institute for Manufacturing Engineering andAutomation, Stuttgart, Germany
An Assembly and Alignment Module for Microsystem Technology 573H. Wurmus, F. Wauro, TU Ilmenau, Ilmenau, Germany
Fabrication of optical sub-systems for hybrid integration in microsystems 579T. Possner, G. Tittelbach, B. Messerschmidt, B. Hoefer, G. Leibeling,Fraunhofer Institutfur Angewandte Optik und Feinmechanik, Jena, Germany
Modular System for Laser Microfabrication 585A. Schumacher, M. Alavi, B. Schmidt, H. Sandmaier,Institute for Micro- and Information Technology, Villingen-Schwenningen, Germany;R. Grimme, FhG-IPA, Stuttgart, Germany;V. Hillmann, FhG-IZM, Berlin, Germany;M. Jiirss, FhG-ISiT, Itzehoe, Germany;P. Otschik, FhG-IKTS, Dresden, Germany;T. Pofiner, FhG-IOF, Jena, Germany
Actuators (II)
Chairmen: Masahiro Hatakeyama, Microtechnology Laboratory, JapanBernd Wagner, FhG-ISIT, Berlin, Germany
A New Type of a Linear Actuator in Surface Micromachining Technology 591M. Baltzer, Th. Kraus, E. Obermeier, Technical University of Berlin, Germany
A Micromachined Tactile Gripper System 597G. Greitmann, R. Buser, Eidgenossische Technische Hochschule Zurich, Switzerland
Design and Fabrication of Enlarged Surface Micromachined Micromotors forApplications in the Millimeter Range 603Th. Kraus, M. Baltzer, E. Obermeier, Technical University of Berlin, Germany
Fluidic Driven Linear Motor Fabricated by the LIGA-Process 609P. Ruther, U. Gebhard, R. Giinther, E. Just, Forschungszentrum Karlsruhe, Germany
Micromechanical Multi-Tip Scanning Tunneling Sensor Device forOverlapping Scanning Ranges - First Step Towards aMicrofabricated Nanotechnology-Workstation 615F. Muller, A.-D. Muller, M. Hietschold, G. Pfeifer, B. Lobner,Technical University of Chemnitz-Zwickau, Germany
Nanorobotics in an Optical Microscope 621J. Dual, R. Buser, G. Greitmann, E. Mazza, G. Schiltges, R. Biichi, A. Codourey, I. Pappas,R. Siegwart, W. Zesch, M. Muller, H. von Kanel, B. Vogeli, G. Schiltges,ETH Zurich, Switzerland
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Materials and Technologies (IV)
Chairmen: Antonio Paoletti, University of Rome, ItalyTadamoto Suga, University of Tokyo, Japan
Fabrication of 3D Metallic Microparts by Laser Etching in Liquids 627R. Nowak, K. Meteva, S. Metev, Bremen Institute of Applied Beam Technology,Bremen, Germany
3D Microstructures in Silicon Using Laser Induced Dry Etching 633A. Schumacher, M. Alavi, B. Schmidt, H. Sandmaier, InstitutfurMikro- und Informationstechnik, Villingen-Schwenningen, Germany
Technologies for the Manufactoring of Micro- and Miniactuators Based onUsage of Microstructurable Glass Materials 639V. Zoppig, D. Riemer, A. Albrecht, E. Kallenbach, D. Hulsenberg, A. Harnisch,Technical University ofllmenau, Germany
Resist Layer Deposition and Sacrificial Layer Technique inUV Depth Lithography and Galvanoforming 645G. Engelmann, R. Leutenbauer, E. Renger, H. Reichl, Technical University of Berlin, Germany;L. Dietrich, S. Gentzsch, H. Reichl, Fraunhofer Institute for Reliability and Microintegration,Berlin, Germany
An Improved Method to Align Etchmasks to the <110> Crystal Orientation 651H. Schroder, O. Dorsch, E. Obermeier, Technical University of Berlin, Germany
Microoptical Components (II)
Chairmen: Hjalmar Hesselbom, Ericsson Components AB, Stockholm, SwedenEdgar Voges, University of Dortmund, Germany
Design, Technology and Characterization ofa Mirror-Array in Silicon-Micromechanics 657Th. Gefiner, W. Dotzel, D. Billep, R. Hahn, C. Kaufmann, S. Kunh,Technical University, Chemnitz-Zwickau, Germany
Low Cost Technologies for Optical Tx/Rx-modules; 663H. Elderstig, O. Larsson, L. Backlin, S. Lindgren, H. Ahlfeldt, IMC, Kista, Sweden;G. Palmskog, J. Hammar, Ericsson Components, Kista, Sweden;O. dhman, C. Lindell, A. Billman, Toolex Alpha, Sundbyberg, Sweden
Semiconductor Lasers on InP with Integrated Spot-Size Expander andExternal Fibre Grating for Low-Cost Optical Transmitter Modules 669R. Zengerle, H. Burkhard, R. Ries, C. Grius, E. Kuphal, Technologiezentnim,Deutsche Telekom AG, Darmstadt, Germany;B. Hubner, Technical Physics, University ofWiirzburg, Germany
Image Sensor with Per-Pixel Programmable Sensitivity in TFA Technology 675T. LuU, H. Fischer, S. Benthien, H. Keller, M. Sommer, J. Schulte, P. Rieve, M. Bohm,University ofSiegen, Germany
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Biomedical Based Applications
Chairman: F. Scheller, Max-Delbruck-Zentrumfur Molekulare Medizin, Berlin, Germany,Danilo De Rossi, University of Pisa, Italy
Detection of Cellular Behaviour byImpedance Measurements on Interdigitated Electrode Structures (IDES)using the PhysioControl-Microsystem (PCM) 681R. Ehret, A. Schwinde, W. Bawnann, M. Brischwein, B. Wolf,University of Freiburg, Germany
Fabrication and Investigation of Nanometer SizedDielectric Interdigitated Transducers for the Detection of Biomolecular Binding 687M. Paeschke, L. Buchmann, R. Seitz, R. Hintsche,Fraunhofer Institutfur Siliziumtechnologie, Berlin, Germany
Chip Elements for Combinatorial Chemistry, Fluid Processing and PCR 693/ . M. Kohler, G. Mayer, S. Poser, T. Schulz,Institutfur Physikalische Hochtechnologie Jena, Germany;A. Schober, Institutfur Molekulare Biotechnologie Jena, Germany
Sensor Array for Multi-Analyte Biochemical Sensing 699F. van Steenkiste, L. Claesen, K. Baert, IMEC, Leuven, Belgium;D. Debruyker, M. Decooman, ESAT, Katholieke University Leuven, Belgium;V. Spiering, University ofTwente, The Netherlands;B. van der School, P. Arquint, University ofNeuchdtel, Switzerland;R. Born, Dornier, Daimler-Benz, Friedrichshafen, Germany;K. Schumann, Hans-Knoll-Institut, Jena, Germany
Systemintegration of Microsystems/Chip Elements in Miniaturized Automata forHigh-Throughput Synthesis and Screening in Biology, Biochemistry and Chemistry 705A. Schober, G. Schlingloff, A. Thamm, D. Vetter, D. Tomandl, M. Gebinoga, H. J. Kiel,Institute of Molecular Biotechnology, Jena, Germany;C. Scheffler, Hochschule fur Technik und Wirtschaft Zwickau, Germany;M. Dohring, Microdrop, Norderstedt, Germany;J. Kohler, G. Mayer, Institute of Physical High Technology, Jena, Germany
Amagnetic Catheter and Method for Biomagnetically Guided Endocardial Mappingand Ablation of Cardiac Arrhythmias 711R. Fenici, P. Fenici, Clinical Physiology - Cardiovascular Biomagnetism Center,Catholic University ofS. Heart, Rome, Italy;J. M.vanBosheide, Biomagnetic Centre, University ofTwente, Enschede, The Netherlands
An Implantable Microsystem for Biomedical Applications 717R. Catanescu, J. Binder, University of Bremen,Institute for Microsensors, -actuators, and -systems, Germany;J. Zacheja, College for Advanced Technology Bochwn, Germany
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Posters
Contactless Function Test of Integrated Circuits on the Wafer -Output Signal Detection 723H. Bergner, B. Altmann, Polytechnic Jena, Germany;K. Hempel, G. Sargsjan, Friedrich-Schiller-University Jena, Germany;J. Degenhardt, Raith GmbH, Dortmund, Germany;K.-O. Hofacker, Thesys GmbH, Erfurt, Germany
Interface Phenomena after Laser-Beam Treatment ofMetallized Transparent Substrats 726L. Dorn, S. Jafari, D. Purbst, Technical University of Berlin, Germany
MicroDAC Analysis Applied to Microcomponents 729/ . Auersperg, Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany;B. Michel, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany;RolfKuhnen, K. Trankner, K&T Mefisysteme GbR im TCC, Chemnitz, Germany
Adaptive Finite Element Simulation of Damage and Failure in MST Applications 732J. Auersperg, E. Kaulfersch, Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany;R. Dudek, B. Michel, Fraunhofer Institute for Reliability and Microintegration,Berlin, Germany
Characterization of Thermal and Mechanical Properties of Components andMicro Systems by means of Correlation Analysis of Grey Scale Patterns 735E. Kieselstein, Verein zur Forderung der Applikativen Mechnikforschung e.V,Chemnitz, Germany;M. Dost, Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany;C. Bombach, B. Michel, Fraunhofer Institute for Reliability and Microintegration,Berlin, Germany;T. Voges, Technische Universitdt Berlin, Germany
CALIMA - A Computer-Controlled LIGA Mask Alignment System 738B. Kohler, Forschungszentrum Karlsruhe GmbH, Germany
Dynamic Test of Microstructures byLaseroptical Modalanalysis and Holographical Interferometry 741N. Rummler, D. Kulosik, M. Dost, Chemnitzer Werkstoffmechanik GmbH,Chemnitz, Germany;B. Michel, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
Local Deformation Measurement in Packaging Components 744D. Vogel, A. Schubert, P. Sommer, B. Michel, Fraunhofer Institute forReliability and Microintegration, Berlin, Germany
3 - Dimensional Simulation of the Orientation Dependent Etching 747/ . Fruhauf, Technical University of Chemnitz-Zwickau, Germany;D. Zielke, Gesellschaft fur Mikroelektronikanwendung Chemnitz mbH, Germany
Design of a Bicmos Integrated Circuit UsingMulti Ultra Sonic Sensors for Obstacles Detection - An Application for Blind People.... 750Ph. Dondon, J. Clemens, IXL, Talence, France;R. Laplace, Institut Regional de Jeunes Sourds et Aveugles, Ambares, France
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Simulation and Optimization of a Magnetic Levitated Disk with Multiphase Drive 7535. Michael, G. Scheinert, A. Albrecht, Technical University ofllmenau, Germany
A Novel Degree of Freedom Separation Technique for Two-Axis Tilt Sensors 756N. Hey, A. Schumacher, W. Lang, H. Sandmaier, Institutfur Mikro- undInformationstechnikder Hahn-Schickard-Gesellschaftfur angewandte Forschung e.V,Villingen-Schwenningen, Germany
Manufacturing of Fluid Mechanical Microstructures in silicon by Nd:YAG Laser Ablation 759/. Ederer, S. Scherdel, W. Schullerus, C. Tille, Technical University of Munich, Germany
Techniques for Substrate Bonding 762S. van der Groen, K. Baert, L. Deferm, P. Jansen, M. Rosmeulen, IMEC, Leuven, Belgium
Fluxless Laser-Beam Soldering by Using Microcrystalline RS Solders - a Summary 765F. Herbert, L. Dorn, S. Jafari, Technical University of Berlin, Germany
The Impact of the ^ C Isotope Content and Grain Size onthe Thermal Conductivity of Polycrystalline Diamond Films 768J. Bonhaus, M. Zaitsev, A. Denisenko, R. Job, W. Fahrner, University ofHagen, Germany;A. Podoba, Institute of Superhard Materials, Kiev, Ukraine;M. Werner, VDI/VDE-IT, Teltow, Germany
Laser-Based Fabrication of Micro System Components 772/ . Staud, A. Menschig, Deutsche Forschungsanstaltfur Luft-undRaumfahrt, Stuttgart, Germany;A. Raiber, T. Abeln, University of Stuttgart, Germany
Edge Contacts for Liquid-Crystal Displays by Means of Laser Technology 775D. Krabe, H. Reichl, Technical University of Berlin, Germany
Microcutting for a Flexible Manufacturing of Micromechanical Shapes 778/ . Gabler, H.-W. Hoffmeister, Technical University of Braunschweig, Germany
CMOS-Compatible Deposition ofHigh Phosphorus Doped Polysilicon Films with Tensile Stress 781L. Elbrecht, R. Catanescu, J. Zacheja, J. Binder, University of Bremen, Germany
Characterization of Different AIN-Cu-Joints 784E. Auerswald, D. Vogel, W. Faust, B. Kampfe, B. Michel, Fraunhofer Institute forReliability and Microintegration, Berlin, Germany
Electromagnetically Actuated Membrane Pump 787A. Feustel, O. Krusemark, J. Muller, Technical University of Hamburg-Harburg, Germany
On-Chip Coils for Telemetry Applications Usinga CMOS-Compatible Manufacturing Process 790R. Catanescu, K.-L. Krieger, R. Law, J. Binder, University of Bremen, Germany;J. Zacheja, College for Advanced Technology Bochum, Germany
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Thin-Film Microlens Arrays on Flexible Polymer Substrates 793R. Grunwald, R. Ehlert, S. Woggon, Gesellschaft zur Forderung angewandter Optik,Optoelektronik, Quantenelektronik und Spektroskopie, Berlin, Germany;H.-H. Witzmann, Gesellschaft zur Forderung angewandter Informatik, Berlin, Germany
An Artificial Neural Net Based Rise Time Reduction for Chemical Sensors 796H.-E. Endres, W. Gottler, R. Hartinger, S. M. Drost, Fraunhofer InstitutfurFestkorpenechnologie, Munich, Germany
A Bistable Microfabricated Magnetic Cantilever Microactuatorwith a Permanent Magnet 799H. Ren, E. Gerhard, Gerhard-Mercator-University of Duisburg, Germany
High Accuracy Positioning of Robots 802G. Quick, P. C. Midler, University ofWuppertal, Germany
Development of Multifunctional BioFETs on an Si-SiOrSi Structure forBiomedical Micro-Analyzing Systems 805V. Mkrttchian, A. Poghosian, A. Eranosian,Armenian State University of Engineering, Yerevan, Armenia
Micromachined High Sensitivity Thermal Gas Flow Sensor Based onHighly Efficient Thermoelectric Materials 808E. Kessler, U. Dillner, S. Poser, V. Baier, J. Muller, InstitutfurPhysikalische Hochtechnologie, Jena, Germany
Fabrication and Thermal Analysis of a Gas-Liquid Phase-Change Micro-Actuator 811Sh. Kato, S. Hosoi, Nippon Institute of Technology, Saitama, Japan
Selectivity Enhancement of Resistive Gas Sensors bya Novel Measurement Technique 814M. Hausner, J. Binder, University of Bremen, Germany;J. Zacheja, College for Advanced Technology Bochum, Germany
Calculation of III-V Semiconductors Elastooptical Properties:Application to an Interferometric Stress Sensor 817G. Fierling, X. Letartre, J. Laine", F. Sidoroff, P. Viktorovitch, Ecole Centrale de Lyon, France;C. Lugand, T. Benyattou, Institut Nationale des Sciences Appliquies, Villeurbanne, France
Micropumps and -Valves with Electromagnetic Actuation 820/ . Behrens, A. Meckes, W. Benecke, University of Bremen, Germany;M. Gebhard, Robert Bosch GmbH, Reutlingen, Germany
An MCM for Neural Network and similar Applications 823J.-P. Wyss, E. Hirt, C. Habiger, G. Troster,Eidgenossische Technische Hochschule Zurich, Switzerland
An Intelligent Micromanipulation Cell for Industrial andBiomedical Applications Based on Piezoelectric Microrobots 826S. Fatikow, R. Munassypov, University of Karlsruhe, Germany
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Sonar with Digital Signal Processing 829/. Arro, AHERO Ltd., Tallinn, Estonia
2 m3 Large-Chamber SEM and its Applications forMicrosystem Production Techniques 832M. Week, J. Hummler, Fraunhofer Institutfur Produktionstechnologie, Aachen, Germany
Design for Environment: Environmental Assessments of Electronics During Layout 835N. J. Nissen, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
A New Bumping Technique Using Ball and Wedge Bumping forManufacturing of Hard Core Solder Bumps 837J. Nave, C. Kallmayer, D. Lin, Technical University of Berlin, Germany;E. Jung, E. Zakel, H. Reichl, Fraunhofer Institute forReliability and Microintegration, Berlin, Germany;P. Kasulke, PacTech Packaging Technologies GmbH, Falkensee, Germany
Characterization of a Solder Bumping Process using Electroplating 841L. Dietrich, E. Jung, J. Kloeser, E. Zakel, H. Reichl, Fraunhofer Institute forReliability and Microintegration, Berlin, Germany
Reliability of COB Technology: A Comparison of Chipand Wire and Flip-Chip Assembly 845F. Ansorge, E. Jung, J. Kloeser, E. Zakel, H. Reichl, Fraunhofer Institute forReliability and Microintegration, Berlin, Germany;H. Badrighavifekr, Technical University Berlin, Germany
Reliable Metallization Systems for Solder Flip-Chip Contacts 849E. Measel, S. Thierbach, Technical University of Dresden, Germany
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