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MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs...

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MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division [email protected] [email protected]
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Page 1: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

MICROELECTRONICS ACTIVITY

V B CHANDRATRE

Head Micro Electonics Sectionand

Project Manager CMEMs ECIL Electronics Division

[email protected]

[email protected]

Page 2: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Activities

• ASIC DESIGN FULL CUSTOM /MIXED

• TECHNOLOGY DESIGN (PROCESS/DEVICE/SENSOR)

• HYBRID MICROCIRCUITS

• DATA ACCQUSITION (CORE STRENGTH HW/SW)

• MEMS DESIGN

• DEVICE MODELLING AND PDK DESIGN KIT DEVLOPMENT

Page 3: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Facilities

CAD TOOLS : ASIC /HMC /MEMS DESIGN

TCAD TOOLS : TECHNOLOGY DEVELOPMENTPACKAGING TOOLS SEMICONDUCTOR PARAMETRIC MEASURMENT MODELLING ATE IC TESTING: CUSTOM BUILD

Page 4: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

EDA CENTRE

10 SUN WORK-STATIONS 3 fast IBM PC lic serverMentor Graphics HDL flow FPGA/ASIC flow (ModelSim,

Leonardo)Full Mixed mode HDL/analog/glue logic simulation support.Full custom/ std cell ASIC backend layout tool SCL C1S/D design kit in Mentor Graphics Tanner Tools , 0.7/0.35/0.5SiGe , SITAR design KIT. ECIL CUSTOMER ID

NEW ADDITIONS : COMPUTING CLUSTER 16GB RAM 1. SUNFIRE V440 QUAD CPU SUN WORKSTATION : 2nos 2. QUAD XEON PROCESSOR WORK STATION : 2Nos 3. HP IBM PC workstations 2NOS CADENCE, MENTOR, COVENTRE, SOFTWARE

Page 5: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

SUNFIREV440 Sparc Solaris 8Each QUAD processor 16Gb

QUAD XEON preprocessor16 GB MEM LINUX /Win

Mentor Graphics & cadence License servers WIN XP /Scientific Linux 3

10/100 LAN

COMPUTING SETUP

SUN ULTRA 10 [4] / BLADE [6] Solaris 8

~~ thin clients in new setup for lowering power consumption minimization & laptops for personal use

Page 6: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Packaging Lab at CMEMS

Facilities:• Manual Epoxy / Eutectic die bonder• Semi-automatic Wire bonder• Flip chip bonder• Wire pull tester• Plasma cleaner• Curing furnace

Upcoming Facility

Page 7: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

CMEMS TCAD Lab Facilities:

•A versatile structure editor for specifying device geometries.

•Semiconductor process simulation tool, having support for Si, SiGe, strained Si, SiC, GaAs and SOI technologies.

•Semiconductor device simulation tool, having support for BJT, CMOS, BiCMOS, HBT, APD, FinFET, power devices, CCDs, solar cells etc.

•An efficient framework for seamless integration of data across the above mentioned tools

Upcoming Facility

Page 8: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Detector & technology development

Page 9: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

SILICON DETECTORS

Silicon strip detectorsPIN diode detectorsPhotodiodesSilicon Drift Detectors

Applications: Radiation monitoring, Nuclear Physics & High Energy Physics experiments

Page 10: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

CMS Preshower Detector

End caps of CMSdetector will have 4300 silicon strip detectorscovering area ofabout 17 m2 BARC is

delivering 1000 detector modules forthe CMS preshowerWeight -12500 T

Dia- 15mLength – 21.5mMagnetic field – 4 Tesla

Page 11: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Strip Detectors for CMS Experiment at LHC, CERN

Silicon detectors produced by BARC will cover an area of 39,000 cm2 in the CMS detector of LHC

Wafers designed and fabricated during various stages of development

1 2 3

Detector module

Page 12: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Strip Detector Specifications

Electrical

High breakdown voltage Breakdown voltage for all strips >= 300V/500VLow leakage:Total current of all strips <= 10 μA at 300VUniformity of all strips: Maximum 1 strip with leakagecurrent> 5 μA at 300V

Geometrical

Tight control over dimensionsLength 63.0 +- 0.1 mmWidth 63.0 +0.0, -0.1 mm

Page 13: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Silicon Drift Detectors (SDD) Expected Resolution ~100 eV (PIN diodes: ~2keV)

Low anode capacitance without reducing detector size SDD device and process development and integration of JFET on the detector completed Under fabrication in BEL

Page 14: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Layout of SDD on Wafer

SDDs

JFETsSDD Array

Page 15: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

ASIC AND HYBRIDS

Page 16: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Critical for Total Channel Noise ~ 100 e- @ 6us shaping time

A novel scheme (Adaptive Bias) for Large

Linear Feedback Resistance, ~3G

to reduce noise Sizing optimization

allows low noise Radiation hard design to be implemented

Front end for SDD ASIC new concepts…

Linear resistor w/l < 0.1 ~ 0.01

Page 17: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

DETECTOR(S) FROM BEL

Mixed full custom CMOS ASIC MPW: SCL process C1D 1.2u

OCTAL Charge PreampOCTPREM

8 CHANNEL SILICON STRIP PULSE PROCESSOR. SPAIR

FRONT END DOSIMETER ASIC. CODA

8 CHANNEL CURRENT PULSE PREAMPLIFIER MICON

High dynamic rangeFOR fission Fragmentscharge particle array

NUCLEARINSTRUMENTS

X-RAY/GAMMA RAY IMAGING MEDIUM DYNAMIC RANGE

RADIATION MONITORINGINSTRUMENTS

Page 18: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Octal Pre-amplifier ASIC

Die Area: 2.4 x 1.8 mm2

CHARGE GAIN 1-0.5 V/cC FALL TIME 100/50 uS LINEARITY 1 –0.5% NOISE 400e- SUPPLY 2.5V DRIVE 50 OHMSPOWER DISSIPATION 0.9mW OPEN LOOP GAIN 73dBPHASE MARGIN 60UNITY-GAIN-BANDWIDTH 45MHz

Page 19: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

CODACo-chip for Dosimeter Application

Page 20: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

SPAIR

Page 21: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

MICON

Error amp

ref

in

I to V & SHAPER/

Buffer

out

bias

FICON

KEY FEATURESLEAKAGE CURRENT COMPENSATION

IDEAL FOR PROPORTIONAL CHAMBERS,GEM, PMTS

50 NS PEAKING TIME1800 e RMS noise

8 CHANNELS WITH SERIAL ANALOG READOUT

Page 22: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Indiplex and Singleplex ASICS Sub-micron 0.7u CMOS process

INDIPLEX: 16 channel pulse processing ASIC comprising CSA, PZ-block & Semi

Gaussian shaper.

SINGLEPLEX: Single pulse processing channel ASIC similar to INDIPLEX

SINGLEPLEX

High Dynamic Range (+/- 600fC) Low Noise with Low Noise Slope (600e @0pf , 7e/pf Noise slope)Output Signal Swing +/-2V Active DC pedestal cancellation.Optimized for Proportional pad detectors made BY VECC for ALICE experiment at CERN.

Page 23: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Block Diagram-Single Channel

CSA DCON SHAPER

DC-CAN

T&H+

-

Input

Charge SensitivePre-amplifier

De-convolution

Active Pedestal Cancellation

Track & Hold

Page 24: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Anu-Shikhar ASIC : CMOS Peak Detect & Hold Circuit With SOC Output Logic

Salient Features :* Single shaper & amplifier stage at the input with adjustable gain.* Minimized Pedestal due to Base Line Restoration.* Reduced Charge Injection by using Rectifying Current Mirror in place of diode in Peak Detector, also providing complete compatibility with standard CMOS process.•Built in Linear Gate for pulse pile-up rejection.

• Dynamic Pedestal correction ,

• check new concept

OTA Buffer

RCM

VSS

VDD

Shaper &Amplifier

Base Line Restorer

IN

Peak Detector

Dump Current

WindowComparator& Control

Logic

SOC

Anu-Shikhar ASIC

LLD ULD

Page 25: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Anu-Shikhar ASIC ( Pulse peak detector )

Peak Detect & Hold Circuit with “Start Of Convert” generation Logic for Nuclear ADC. Specifications

Dynamic Range -300mV to -1.8V Power supply +/- 2.5VPower Consumption 36mWDroop Rate 0.13V/s (Simulated)Die Size & Package 3.3 X 3.3 mm2 ; 44-pin CLCC

Anu-Shikhar:21/02/06

y = 1.0146x - 0.0082

-2.5

-2

-1.5

-1

-0.5

0

-2.5 -2 -1.5 -1 -0.5 0

in pulse

PD

_o

ut

Series1

Linear (Series1)

Page 26: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Nuclear CMOS ADC for Portable Spectrometer NuCAPS) ASIC

Design Specification :• Adjustable Resolution 8/10/12-bit

• Frequency of Operation External : 50MHz, Effective : 100MHz

• Conversion Time 2.56/10.24/40.96us

• Power Consumption 32mW

• Input Dynamic Range 20mV-2V(100/1)

• DNL 1% of LSB

• Die Size 3.5mmX3.5mm

GTD_CLK

Pedestal Adjust & BLH

Linear DischargeSource

Window Comp &

Control Logic

Gray Counter

Shift Register

I/P

D0-D11

SROUT

CLK

SOCDischargeCurrent

Peak Detect & Hold Ckt

OTA Buffer

RCM

VSS

VDD

SR CLK

Page 27: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Transient Analog Waveform memory @ 500MS

High-Speed Analog Waveform Sampler128-cell analog waveform sampler with sampling rate of 500MHz.Facilitates High resolution digitization at High

Sampling Rates.

Digital DELAY LOCK LOOP BASED

2 GHz design in progress

Page 28: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

IN PIPELINE ………..

• TDC DLL (digital delay lock loop) based

Fast Comparator (Td & Tr)• Si PMT & APD • Radiation Hard Electronics (design & process ??)Waiting for the facility to be

UP

ASICS in 0.35 /.5 SiGe submicron

Extended & closed gate radiation hard MOSFET

Page 29: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

HYBRIDS …. Production mode

CHARGE SENSITIVE AMPLIFIER BMC15211V/PC GAIN 2 keV NOISE FET EXTERNAL

  O/P VOLTAGE SENSE AND LOAD CURRENT MEASUREMENT CIRCUITRY

 ERROR AMPLIFIER OVERLOAD / OVER VOLTAGE PROTECTION CIRCUITRY AND SHUT DOWN LOGIC

HIGH VOLTAGE HYBRIDS for Grace Experiments

INVERTER DRIVER AND SHUT DOWN CIRCUITRY

 VOLTAGE MULTIPLIER

Use in CAMAC/NIM Modules

TIME TO AMPLITUDE T.A.CHYBRIDS FS 500NS-10U FS 5V RESOLUTION 75PS @ 500NS FS

FAST PULSE AMPLIFIER Tr/Tf < 2NS@2V 50 OHMS GAIN 10 O/P DC STABILIZED (HIGH COUNT RATE)

Peak stretcher for 8K Nuclear ADC

Page 30: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

Hybrids & ASIC ….

Indian neutrino Observatory Gas RPC Fast Preamp family tr 1.5 ns… 27,000 Qty requirement

Low power pulse channels for portables designs.

“Singleplex” ASIC in HybridFor Neutron Monitors

Trans-impendence Preamp current pulse applications

ASIC IN HYBRIDS !

Many Hybrids have High Production VolumesUsers NSC, TIFR, VECC, CAT BARC, etc~ 5 cr account

Page 31: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

THANK YOU

Email : [email protected]

Ack: Menka Tewani, Anubha Tewari, Vangnayee Sharma Nidhi Gupta , Sudheer M , R S Sastrakar, Viashali S

& P K Mukhopadhayay

Page 32: MICROELECTRONICS ACTIVITY V B CHANDRATRE Head Micro Electonics Section and Project Manager CMEMs ECIL Electronics Division v.b.chandratre@gmail.com eld03@rediffmail.com.

New facility :CMEMS

GROUND FLOOR• Device Characterization, modeling & ATE • Packaging laboratory

FRIST FLOOR• IC design Software for VLSI (VLSI EDA LAB)• TCAD Lab • Embedded development & testing System LAB• Auxiliary facilities


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