INVENTEC, 26, avenue du Petit Parc - 94683 Vincennes Cedex - FranceTél : +33 (0) 1 43 98 75 00 - Fax : +33 (0) 1 43 98 21 51

Microelectronics and Semiconductorpackaging materials

INVENTEC semiconductor packaging ma-terials include soldering and cleaning solutions to be used at processes such as die attach, flip chip, CSP and defluxing for the manufacturing of power semiconductors, BGAs, micromodules, System in Package and hybrid assemblies

Die Attach Soldering materials

ECORELTM solder pastes • Halogen free below 100 ppm• ROL0 class according to J-STD-004

Flip Chip: BGA, COB, COF, CSP

ECOFRECTM tacky fluxes

• Halogen Free• ROL0• Clear and colourless residues• Pass Bono corrosion test to meet chemical reliability of

residues• Different viscosities, starting low viscosity at 5 Pa. Sec at 20°C

AMTECHTM tacky fluxes

• Water washable

EcorelTM Free 305-16

EcorelTM Free 405Y

EcorelTM Free HT245-16

EcorelTM Free 808.1

EcorelTM HT 296S

Alloy Sn96.5Ag3.0Cu0.5 SnAg4.15Cu0.5Ni+ dopants SnSb8.5 Sn96.5Ag3.5 Pb92.5Sn5Ag2.5

Melting Point 217°C 217°C 241° to 248°C 221°C 287° to 296° C

Main Features Very good wettingLow voiding

High reliability for high operating temperatures Thermal cycling resistance

Suitable for hybrid or stacking as-sembly

For dispensing application

High temperature die attach

www.inventec.dehon.com

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Package on Package

ECORELTM Free PoP 10 solder paste

• Halogen Free• Applied by dipping or dispensing• Reduction of warpage defects

ECOFRECTM PoP 50 tacky flux

• Halogen Free• Applied by dipping or dispensing• Available in black colour for better automated optical

inspection

Jet Printing solder paste

ECORELTM Free JP20

Jet printing lead free solder paste for soldering of complex boards designs, difficult packaging and prototyping.

• Large process window• Achieves minimum dot diameter of 0.33 mm• ROL0 Flux class • T5 particle size (15-25 µm)

• Halogen Free

Defluxing

INVENTEC has different solutions to suit the packaging cleaning, rinsing and drying needs, especially when packaging is done using solder paste or tacky fluxes (flip chip, die attach process)

Soldering materials for Package on Package and Chip Scale Package assembly.Compatible with Siplace LDU X and Fuji dipping modules

Aqueous Cleaning PromocleanTM Disper detergents

Solvent Cleaning

Co-solvent cleaning process

TopkleanTM EL 20 series.

Azeotropic process

PromosolvTM 70ES.