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MicroTCA for Medical Applications
This whitepaper will discuss:
» Trends in medical imaging» The benefits of designing with MicroTCA» Multicore powered AMCs and Integrated Platforms from Kontron for medical imaging
MicroTCA for Medical Applications
Multi-core processors bring significant benefits to medical image processing. Compared to single server solutions, Embedded Computer Technology provides a compact, future-safe and power efficient approach to medical image processing. Industry standards, such as MicroTCA, enable packing multiple processor boards, tightly coupled over a backplane, into a single box. The building blocks of MicroTCA systems are commercial-off-the-shelf (COTS) components known as Advanced Mezzanine Cards (AMCs). This paper describes use of the technology in flexible and scalable system designs with high functional density, high throughput and minimum latency.
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MicroTCA for Medical Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Trends in Medical Imaging. . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . 3
Benefits of MicroTCA for Image Processing. . . . . . . . . . . . . . . . . . . . . . . . . 3
System Components and Standards. . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . 4
AMC Form Factors and Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
AMC-System Designs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
About Kontron . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . 6
ConTenTS
www.kontron.com
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Trends in Medical Imaging Images are an increasingly popular source of informationin medical screening, diagnostics, and therapy. Familiar procedures like the X-Ray pulmonary screening or X-Ray fluoroscopy went digital a long time ago. Computer Tomography provides three dimensional (3D) images based on X-Rays, Ultrasound, PET or MR. The next level is live pictures for real-time use in therapy or moving 3D images.Future applications may see mass screening for skin cancer by spectroscopy in combination with image processing. While some applications can be handled off-line by batch processing, in many cases the images are needed soon after the exposure or even in real time. But the need for processing power does not end there.
Processing can also provide assistance in the analysis of images and related patient information in screening and diagnostics. Among those tasks are pattern recognition, rendering of organs, volumetric analysis, the comparison
of multiple image types, and the processing of related patient information from data bases. If devices for mobile (outpatient) and stationary patient monitoring are increasing in the future, they also provide valuable sources of information to be used in combination with images.
In some cases modern multi-core processors allow the implementation of new methods which have been out of scope before for lack of computing power. For example the latest Intel® processors and chipsets represent major advancements in multicore technology. Image processing frequently requires many cores, usually on multiple processor blades; either tightly coupled over high-speed busses (e.g. SRIO) or loosely coupled over network protocols (10GbE, GbE). Image rendering requires high-performancegraphics boards, which interconnect over high-speed PCI-Express lanes. Figure 1 shows an example of an image processing systems as used for computer tomography.
The reconstruction of this image is the main task of image processing. In the first step the sensor data is digitized in an I/O module in the first box of the “Image Processing” block in Figure 1. The I/O modules then hand the raw image data to multiple processor boards over a high-speed connection using a standard protocol (such as SRIO or Ethernet). The preprocessing step then reconstructs the 3D image from the raw image data. Pre-processing also typically includes cleaning out sensor artifacts, calibration and geometrical alignments. The subsequent post-processing step allows interpreting the 3D information in different ways (volume rendering, surface rendering or use of image segmentation to show concealed structures like vessels hidden by bones). Finally, the image is displayed and archived. Other components of the system are control of thepatient table and image source, as well as the operator position.
Benefits ofMicroTCA for Image ProcessingAn image processing system as shown in Figure 1 can be implemented by a stack of servers, or by industry standard server blades. In comparison to stacks of isolated servers, systems based on server blades provide the benefit of higher computing density and the tight coupling of processors over the backplane. In MicroTCA, the Ethernet network infrastructure is built into the system. Figure 1: Image Processing System
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Figure 2: AMCs as system components in ATCA and MicroTCA
Other benefits of embedded processor technology are lowerpower consumption and active power management. Expect energy saving solutions to get much more attention in the future.
Standards -based MicroTCA COTS products from a multitude of suppliers allow significantly shorter time-to-market and save development costs. Originated by PICMG, MicroTCA provides built in regulatory compliance and alignment with further computer technology standards and trends.
In comparison with traditional parallel bus architectures,MicroTCA supports a serial backplane and a variety of high-speed busses (such as SRIO, 1GbE, 10 GbE, PCI-Express), which also may be operated in parallel. This makes MicroTCA
very well suited for tightly coupled multi-processor systems. At the same time, MicroTCA provides the smallest form factor on the market with a wide range of scalability from entry level configurations to high-end systems while maintaining the same systems architecture and management.
System Components and StandardsAMCs derive from AdvancedTCA (ATCA), an industrial standard of PICMG. From a technical point of view, AdvancedTCA uses serial interfaces on the backplane (instead of the traditional parallel bus architectures), and systematically builds in a
management concept for all hardware components of an IPMI-based (Intelligent Platform Management Interface) system. Multiple serial busses may be used at the same time within a chassis. The compatibility of boards on the bus is checked by an electronic keying, which is part of the built-in system management. Other management functions are power management and the provisioning of external interfaces for monitoring and control.
The major building blocks of chassis are different form factors, ATCA blades and AMCs, as shown in Figure 2. The chassis contain one or two shelf managers that maintain the proper operation of the hardware and manage the power and fans. ATCA provides a high functional density by: (1) ATCA boards with a power budget of 200 Watts (2) the specification of AMCs as smallest field replaceable units.
The MicroTCA standard enables building systems from AMCs directly on a back plane. The base specification MicroTCA.0 was released in July 2006 and describes systems with up to 12 AMCs including the functions of system management, power management, Ethernet switching and other transport systems.
AMC Form Factors and InterfacesFull-Size, Mid-Size and Compact AMC form factors are described in Figure 3. For example the design of the Kontron AM4011 shown is based on the Intel® Core™2 Duo processor with 64 kB L1 and 4 MB L2 cache in a 479 FCBGA package combined with the Intel® 3100 server-class chipset providing a front side bus (FSB) of 667 MHz. While the “Single” form factor still reflects the origin of AMCs as modules, the “Double” form factor rakes AMCs into a different class of performance in MicroTCA by allowing a power budget of 80 Watts per module.
Figure 3: AdvancedMC Form Factors
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Figure 4: Example – Kontron's AM4010 featuring the Intel® Core2 Duo combined with the Intel® 3100 server-class chipset
Figure 3 also highlights the AM5010 based on the Intel® Core™2 Duo processor. Supporting the PICMG sub-specifications AMC.1/.2 the AM5010 ensures a comprehensive set of interconnecting capabilities. A x4 PCI Express lane (supporting 4 x1 PCI Express as well) according to AMC.1 guarantees high throughput for I/O intensive applications such as those found in medical. Given the growing performance per Watt of multi-core designs and the extra kick in power efficiency of Embedded Computing, AMC is very well suited for multi-processor systems with an extremely high density of processing.
As a practical case, Figure 4 shows Kontron's AM4010. The Intel® Core™ 2 Duo processor represents substantial processing power and maximum MIPS per Watt. This advanced processor – in tandem with the Intel 3100 server-class chipset – features the 64 bit EM64T technology based on a 65nm manufacturing process, and takes full advantage of processor performance and high-speed FSB. The Intel 3100 chipset is a space-saving, two-in-one solution that combines both the Intel Memory Controller (E7320/E7520) and the Intel I/O Hub Controller (6300ESB).
Each AMC holds a separate management entity, represented by a small micro controller that feeds from a separate power supply and runs management interfaces into the system (IPMI). This separation allows the system manager to check and monitor the configuration, whether the boards are active or not. At the same time, system management enables AMC replacement on a running system (hotswap capability).
AMCs include card board connectors (similar to regular PCI-Express cards for PCs) on one or both sides of the board.
In total, an AMC supports 21 serial ports (each port representing one signal pair as receiver and one pair for transmission).
Operating currently at clock speeds of 3.125 GHz and with 8/10 bit coding, each port can handle bidirectional data rates of 2.5 Gigabits per second over the backplane.
MicroTCA Integrated PlatformsWhen implementing AMC based systems based on MicroTCA, the design needs to reflect the fundamental requirements. Figure 5 shows a summary of present
designs. The system on top represents a 2U server for 19” racks for 8 AMCs. This system is completely redundant (each function and component is duplicated). The systems on the right are compact designs for 4-6 AMCs (Single) and 6-12 AMCs (Single and Double). For benchmarking and prototypes, Kontron provides ready-to-run platforms, which are fully configured and tested. In terms of systems architecture, they represent a multi-processor system with integrated network. Entry level platforms such as the OM6040 are available with a variety of transport system such as PCI-Express, Serial Rapid I/O and 10 GbE. The platforms include a choice of processor AMCs.
By use of standard components-off-the-shelf AMCs and MicroTCA allow to reduce total cost of ownership. Thus is especially suited for the medical environment. Embedded Computer Technologies provide power efficiency, compactness, low noise and low latency while assuring long term availability. Kontron provides a choice of entry level systems and is ready to support prototyping and deployment of MicroTCA systems in a wide variety.
Figure 5: MicroTCA Integrated Platforms for Medical
About Kontron
Kontron designs and manufactures standard-based and custom embedded and communications solutions for OEMs, systems integrators, and application providers in a variety of markets. Kontron engineering and manufacturing facilities, located throughout Europe, North America, and Asia-Pacific, work together with streamlined global sales and support services to help customers reduce their time-to-market and gain a competitive advantage. Kontron’s diverse product portfolio includes: boards and mezzanines, Computer-on-Modules, HMIs and displays, systems, and custom capabilities.
Kontron is a Premier member of the Intel® Embedded and Communications Alliance.
The company is a recent three-time VDC Platinum vendor for Embedded Computer Boards. Kontron is listed on the German TecDAX stock exchange under the symbol „KBC“.
For more information, please visit: www.kontron.com
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