Company confidential/proprietary www.aacmicrotec.com
Page 1
Miniaturized and Durable Electronics for Extreme Temperature Shifts ASTRA 2015 - 11 May ESTEC - Noordwijk Mattias Lindgren [email protected]
Company confidential/proprietary www.aacmicrotec.com
Page 2
Presentation overview
• Me, Mattias Lindgren • ÅAC Microtec company • What ÅAC do • Miniaturization • How to do it • TASST – Thermosonic Assisted Solder Sphere Transfer • Summary and a cool picture
Company confidential/proprietary www.aacmicrotec.com
Page 3
The speaker
• Mattias Lindgren • M.Sc in material
chemistry Uppsala University
• Project Manager, ESA, SNSB, B2G, B2B – Environmental Test Campaign on ÅAC products
• Thermal cycling, Radiation (TID, SEE), etc. – PSU for the MREP PLDPU with RUAG
• Development Engineer – UBM, Top Layer Routing, Solder Sphere Transfer
Photo by NASA
Company confidential/proprietary www.aacmicrotec.com
Page 4
ÅAC Microtec develops and supplies complete satellites and sub-systems to the small satellite market
Spin-off company from Uppsala University, The Ångström Laboratory, Sweden in 2005 Locations
• Head Quarters: Uppsala Science Park, Uppsala, Sweden
• AAC Microtec North America Inc., NASA Ames CA
• Partners: HTL (JP), Soletop (Kr)
ÅAC at a glance
Company confidential/proprietary www.aacmicrotec.com
Page 5
30 Employees
4M€ Revenue, 2014
Main owners
• Fouriertransform AB • RP Ventures AB • Kalogi Holding AB • Uppsala University Holding AB
ÅAC at a glance
Company confidential/proprietary www.aacmicrotec.com
Page 6
Satellite Avionics Components Satellite Systems
EGSE and training products
MATS
SPARC-1
µRTU nanoRTU OBC Lite
DPCU Mass Memory MPDU
RIA – “Rapid Integration Architecture”
VSI FSDK JTAG Debugger
NGP – “Advanced Rapid Integration Architecture”
OBC-S, RTU-S, TCM-S, SpW Router, PSU Architecture
DHS, EPS
Satellite prime Systems Engineering,
DHS, EPS, AIT, etc.
µPOL
Power conditioning
MCC
Motor Control
Inertial Sensing
IMU
Company confidential/proprietary www.aacmicrotec.com
Page 7
µPOL • Integrated power converter, with current limiter
and over voltage protection • Input VDC: 8 - 13 V, Output VDC: 1.5 - 5 V @ up
to 5A • 100 kRad MCC Motion Control Chip • Controls up to three brushed or one brushless
motors in torque, position, velocity and open-loop control mode
• Miniaturized design IMU • Integrated MEMS based accelerometer and rate
sensor. • Outputs the combined measurements from four
single axis accelerometers and four rate sensors. • Rover IMU, SINPLEX
Power Conditioning, Motor Control and Inertial Sensing
Company confidential/proprietary www.aacmicrotec.com
Page 8
Space, Ground, Launch Vehicle
Satellite SPARC-1 TechEdSat-1
DHS, Power, AIT
MATS: DHS, POW SPARC-1: DHS, POW, AIT RISESAT: DHS, POW
OBC, RTU, MM, PCDU
RIA: OBC Lite NGP: OBC-S, TCM-S, RTU-S, PSU, µPOL
Miniaturization, Electric and data interfaces, Form Factor
Flip Chip, Bare Die Proc., CCSDS, 3D package, LTCC, SpaceWire, SPA, CubeSat
Products, Projects and Tech
Mission
Satellite
Subsystem
Components
Technologies, Standards
Example categories
ÅAC Products, projects and technologies
Company confidential/proprietary www.aacmicrotec.com
Page 9
Si-interposer platform
Bare die processing
LTCC 3D-stacking
Hermetic sealing
Wire bonding
Mechanical integration
Electrical integration
Hybrid Multi Chip Modul (MCM) packaging
Company confidential/proprietary www.aacmicrotec.com
Page 10
Miniaturization technology
• Hybrid technology incl. several mounting techniques and circuit board materials (PCB, Ceramic)
• Highly robust systems with extreme tolerance towards large temperature cycles
• Designed for highly demanding missions and placement outside of temperature controlled environment for increased performance.
Company confidential/proprietary www.aacmicrotec.com
Page 11
Temp testing
• Multi wafer hybrid Integration Roover IMU (ESA) – Thermal cycling survival -135 to +85C (8 cycles -145 to +95C) including
electrical screening every second cycle
• Motor Control Chip (ESA) – Thermal cycling -135C to +55C pressure 8 mbar CO2, number of cycles
92. Checkup 3 times / 24h
• Assessment of ÅAC System-in-Package (SiP) technology (ESA)
– Thermal cycling -55C to +125C, number of cycles 100
Company confidential/proprietary www.aacmicrotec.com
Page 13
Making it possible
UBM Flipchip
LTCC Top layer routing
SMD
Wirebonding
AssemblyAssembly
DieDie
BoardBoard
Solder Sphere Transfer
Company confidential/proprietary www.aacmicrotec.com
Page 15
Assembly
Wire-bond I/F
Flip-Chip & underfill
SMD
Company confidential/proprietary www.aacmicrotec.com
Page 16
Making it possible
• Systems require a lot of functions • Expensive to get customized components
SRAM UT8Q512E
ADC RHF1401
Comparator LM339
Hex inverter 54AC04
Op-amp LM324
CAN Transceiver TLE6250C
LVDS / Spacewire DS90LV019
Company confidential/proprietary www.aacmicrotec.com
Page 17
Making it possible
UBM Solder Sphere Tranfer Flipchip
LTCC Top layer routing
SMD
Wirebonding
AssemblyAssembly
DieDie
BoardBoard
Company confidential/proprietary www.aacmicrotec.com
Page 18
TASST
• Thermosonic Assisted Solder Sphere Transfer
Solder Sphere
Die with UBM pad
Placing tool
Heat
Force
Ultrasonic Hz
Company confidential/proprietary www.aacmicrotec.com
Page 20
TASST Shear test JESD22-B117A Chip type Method Avg. max.
shear force (g)
Std. Dev (g)
LM324 Solder jetting 27,9 4,8 LM324 TASST 27,8 2,0 LM339 Solder jetting 25,6 4,6 LM339 TASST 28,2 2,1
DS90LV019 Solder jetting 36,0 2,9 DS90LV019 TASST 30,8 4,0 TLE6250C Solder jetting 32,4 4,3 TLE6250C TASST 34,4 2,9 54AC04 Solder jetting 30,2 2,5 54AC04 TASST 28,7 1,8
UT8Q512E Solder jetting 28,2 6,0 UT8Q512E TASST 30,5 4,7
Company confidential/proprietary www.aacmicrotec.com
Page 21
Summary and future work
• TASST method has promising results • TASST makes prototype system builds feasible • TASST needs to be evaluated further
• ÅACs long term goal is to miniaturize all avionics
components
Company confidential/proprietary www.aacmicrotec.com
Page 22
Summary and future work
• By making systems durable and smaller they can be moved out of the heated body of the robot or vehicle
• Lowering the need for power • Creating more room for payloads • Increased functionality of the robot or vehicle
Company confidential/proprietary www.aacmicrotec.com
Page 24
Thank you for listening Mattias Lindgren [email protected]