MIO-2261 Sales kitMI/O-Ultra (Pico-ITX SBC) Intel ATOM N2600/N2800

MIO-2261 Sales kitMI/O-Ultra (Pico-ITX SBC) Intel ATOM N2600/N2800

Embedded Stackable Board Computer

PM Victor.Huang

Victor.huang@advantech.com.tw

May, 30, 2012

MIO-2261 Compelling FeaturesMIO-2261 Compelling FeaturesIntel® Atom N2600/N2800 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Half-size Mini-PCIe/ 2COM/ 1 mSATA/ 4 USB2.0/MIOeIntel® Atom N2600/N2800 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Half-size Mini-PCIe/ 2COM/ 1 mSATA/ 4 USB2.0/MIOe

Intel N2600/N2800+ NM10, DDR3 1066 SO-DIMMN2600 1.66G / N2800 1.86G DC

Dual Core Processor with All Fan-less Design

Intel N2600/N2800+ NM10, DDR3 1066 SO-DIMMN2600 1.66G / N2800 1.86G DC

Dual Core Processor with All Fan-less Design

Support SUSI Access Supports Embedded Software API and Utility

WinCE7.0, XP, XPE, Win7,WES7,QNX,Vxwork Support

Support SUSI Access Supports Embedded Software API and Utility

WinCE7.0, XP, XPE, Win7,WES7,QNX,Vxwork Support

12V DC Power input ,Support DC power hot plug15KV Air ESD protection COM port designTVS design for power ESD/EFT protection

12V DC Power input ,Support DC power hot plug15KV Air ESD protection COM port designTVS design for power ESD/EFT protection

1GbE-Intel LAN/ HD Audio2 COM/ 4 USB2.0/ 1 mSATA/ 8-bit GPIO/ SMBus/I2C/

MIOe Extension / Half-size Mini PCIe

1GbE-Intel LAN/ HD Audio2 COM/ 4 USB2.0/ 1 mSATA/ 8-bit GPIO/ SMBus/I2C/

MIOe Extension / Half-size Mini PCIe

2018/Q4 Longevity2018/Q4 Longevity

Smallest SBC w/ 100x72mm size (same as 2.5” HDD)with MIOe extension flexibility

Smallest SBC w/ 100x72mm size (same as 2.5” HDD)with MIOe extension flexibility

Low Power Consumption (Kit TDP: 5~8W)DirectX 9, MPEG2 (H/W acceleration)

H.264/ VC1/ WMV9 (H/W Decode/Acceleration)

Low Power Consumption (Kit TDP: 5~8W)DirectX 9, MPEG2 (H/W acceleration)

H.264/ VC1/ WMV9 (H/W Decode/Acceleration)

Lockable DC Jack

Lockable DC Jack

Power connector

Power connector

MIO-2261 spec MIO-2261 spec

MIO-2261 Block DiagramMIO-2261 Block Diagram

Board Layout-Top Board Layout-Top

18/24-bit LVDS

DDR3 SO-DIMM Socket

2x RS-232

HD Audio

(Line-in, Line-out)

Power button

/HDD LED

/Power LED

VGA

Board Layout-Bottom Board Layout-Bottom

mSATA

MIOe

(SMbus, 2 x USB2.0, 2 x PCIe, line-out, LPC, 5Vsb/12Vsb)

SATA

1 GbE LAN2xUSB2.0VGA12V DC input

Inverter

SMBus

GPIO Half-size Mini PCIe2xUSB2.0

LCD Power Selection

/Auto Power On

MIO-2261 MIOe supported interfaceMIO-2261 MIOe supported interfaceConsidering most demands from customer and future chipset trends (~2013Y new platforms)Considering most demands from customer and future chipset trends (~2013Y new platforms)

Interface Number MIO-2261 Supports

Functions can be

Display port 1 Yes HDMI, LVDS, DVI, CRT or eDP display interface…

GP PCIE 4 Yes (2 x PCIex1)

Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion…

USB 3.0USB 2.0

12

N/AYes

Super speed storage, capture card, HD Webcam & display interface…

LPC 1 Yes Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O…

HD Audio(Line-Out)

1 Yes Line out, keep flexibility with selected amplifier…

SMBus 1 Yes Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication…

Power Control 3 Yes

Reserved Yes

VCC +12VSB Yes 2A for MIOe module

VCC +5VSB Yes 3A for CPU board and MIOe module totally

GND Yes

Order InformationOrder Information

Packing ListPacking List Embedded OS/APIEmbedded OS/API

Coast Line (Rear IO)Coast Line (Rear IO)

Model Rear I/O Photo

MIO-2261N-S6A1E

MIO-2261N-S8A1E

LAN + 2USB + VGA 　

MIO-2261

(by request)

LAN+ 2USB + VGA + DC Power Jack　

Thermal Solution Thermal Solution Model MIO-2261N-S6A1E / MIO-2261N-S8A1E

Photo

Description CPU Heatsink Dimension: 99.5(L)* 70.5(W)*15.7(H)mmTotal height including CPU board + heatsink is 33.48(H)mm

Model

Photo

Description

Standard Thermal Solution

Optional Thermal Solution

Heat Spreader Dimension: 99.5(L)* 70.5(W)*11.2(H)mm Total height including CPU board + heat spreader is 29(H)mm

MIO-2261 Advanced TechnologyMIO-2261 Advanced Technology Intel Atom Cedar Trail Ultra Low Power Solution

Ultra Low Power Consumption, all comes with Dual Core processors: N2600 1.66G Dual Core: TDP of Intel bundle kit is 5 Watts N2800 1.86G Dual Core: TDP of Intel bundle kit is 8 WattsFan-less Design: All Fan-less low profile heatsink design

Multiple Display Support & H/W Decode Dual independent display : VGA + 18/24-bit LVDS Support additional 48-bit LVDS, HDMI , or DisplayPort through MIOe eDPGraphic Engine and H/W Decode: DirectX 9 and OpenGL3.0 support Hardware decode H/W acceleration: MPEG2 H/W Decode/Acceleration: H.264/ VC1/ WMV9

DC Power Hot Plug Protection Design Good to protect board in case direct power in and damage the board and system.

COM Port 15KV ESD Protection Design TVS (Transient Voltage Suppressor)design for power ESD/EFT

protection

Design for Ruggedize Solution--- Advantech MIO-2261Design for Ruggedize Solution--- Advantech MIO-2261• MIO-2261 is designed with 100% Solid Capacitors (固態電容 )

Wide temperature design and test criteria: Power/ Clock generator/ Sequence PCB Type: TG-150 as PCB type, much reliable in high temperature environments.

• Rugged Design on Selected Components

Higher tolerance for high frequencies & high temperature With better MTBF compared with Electrolytic Capacitors No more exploding capacitors More reliable solution if using Solid capacitors than Electrolytic capacitors

• High ESD Protection for RS-232 I/O Pins to ±15kV

IEC61000-4-2 Air Gap Discharge: ±15kV IEC61000-4-2 Contact Discharge : ±8kV Human Body Model: ±15 kV

Reliable Power DesignReliable Power Design

The power tolerance range is 12V +/-10% MIO-2261 is designed with Power Hot Plug protection IC

design– To avoid pulse current to damage the board when DC power hotplug

directly

MIO-2261 DC Power adapter

Performance benchmark (CPU Arithmetic Benchmark-ALU, FPU)Performance benchmark (CPU Arithmetic Benchmark-ALU, FPU)

MIO-2261(N2800 1.86GHz)

MIO-2261(N2600 1.66GHz)

PCM-3362 (N450 1.6G)

Sliverthrone XL (Z530 1.6G)

Intel Tunnel (E660 1.3G)

+ 16%

+ 96%

+ 104%

Performance benchmark (Processor MultiMedia - Integer, Float Point)Performance benchmark (Processor MultiMedia - Integer, Float Point)

MIO-2261(N2800 1.86GHz)

MIO-2261(N2600 1.66GHz)

PCM-3362 (N450 1.6G)

Sliverthrone XL (Z530 1.6G)

Intel Tunnel (E660 1.3G)

+ 17%

+ 94%

+ 102%

0

2

4

6

8

10

12

MIO-2260 (N455 1.66GHz)

MIO-2261(N2800 1.86GHz)

MIO-2261(N2600 1.66GHz)

Typical(Win. Idle Mode)

Max (Test in HCT1.2)

Power consumptionPower consumption

10.32 Watts9.6 Watts

9.12 Watts

7.68 Watts

5.5 Watts

4.2 Watts

MIO-2260(N455 1.66GHz)

MIO-2261(N2800 1.86GHz)

MIO-2261(N2600 1.66GHz)

Graphic Performance- 3DMark 2006 Graphic Performance- 3DMark 2006

N455 to N2600130% increase

N455 to N2800244% increase

MIO-2261(N2800 1.86GHz)

MIO-2261(N2600 1.66GHz)

MIO-2260(N455 1.66GHz)

Pico-ITX Competitor ComparisonPico-ITX Competitor Comparison

MIO-Ultra Target ApplicationsMIO-Ultra Target Applications

Machine Automation

POS/ KIOSK

HMI (Human Machine Interface)

Ultra Low Power Demand

Measurement Instrument

Portable Device

Medical

Home Automation

New Form factor MI/O-Ultra Introduction

New Form factor MI/O-Ultra Introduction

The SPEC on standard SBC can’t be fulfilled if need additional I/O change

The SPEC on standard SBC can’t be fulfilled if need additional I/O change

Resource: Need redesign PCB to fulfill the SPEC requirement

Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE.

Resource: Need redesign PCB to fulfill the SPEC requirement

Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE.

The customer needs a board easier for system integration

The customer needs a board easier for system integration

The customer hopes to keep domain knowhow through easier way

The customer hopes to keep domain knowhow through easier way

Time to MarketTime to Profit

Time to MarketTime to Profit

Less cabling: less problems and cost on assembling.Concentrated thermal design: make thermal design

be easier in customer’s system integration.

Less cabling: less problems and cost on assembling.Concentrated thermal design: make thermal design

be easier in customer’s system integration.

Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC.

Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC.

Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.

Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.

Why a New Form Factor – MI/O Extension- Takes New Position between SBC and COM

Positioning on Different SolutionsMI/O Extension Single Board Computer Computer On Module

Readiness 100%(I/O module only by demand)

100% 60~80%(Need bundle carrier board )

Flexibility Middle Low High

RD Resource Low ~ Middle(design I/O module if needed)

Low High(design carrier board)

Pricing Middle Middle High

Develop Schedule

Short ~ Middle Short Long

Dimension 146*102mm100*72mm

146*102mm Q7, ETX, COM-Express, COM-Ultra...

Keep domain knowhow

Yes(design I/O module)

No Yes(design carrier board)

Target customer

Only lack few I/O interfacesSensitive on pricing

Tight development scheduleWith RD ability who can

design I/O module.

Need single board solutionNeed wide-range choices

Time to Market

Complicated SPEC demandWith exists COM carrier boardWith senior RD ability who

can design power sequence and I/O functions.

MI/O Extension FeaturesMI/O Extension Features

Product Line PositioningProduct Line Positioning

MI/O-Ultra Market PositionMI/O-Ultra Market Position

Ultra Small Size (100x72mm)Flexibility from M/O Extension Competitive price with simple I/OUltra Low Power (<8W)Easy for System Integration 20% size reduction of PC/104

Ultra Small Size (100x72mm)Flexibility from M/O Extension Competitive price with simple I/OUltra Low Power (<8W)Easy for System Integration 20% size reduction of PC/104

Portable DeviceSmall HMI/PPCEmbedded Instrument In- vehicle Home Automation

Portable DeviceSmall HMI/PPCEmbedded Instrument In- vehicle Home Automation

Smallest Size SBC with Maximum Flexibility Smallest Size SBC with Maximum Flexibility

MI/O Extension-Ultra (Pico-ITX) MI/O Extension-Ultra (Pico-ITX)

Install MIOe moduleFlexibility and unified multiple

interfaces

Heat-generated parts on TOPEasy to make thermal solution

Right angle connectorEasy system integration and cabling

Install Heat Spreaderconduct heat to chassis cover for

better thermal solution

Easy system integrationUltra small from factor w/ 100x72mm sizeHeat-generated parts on TOPRear IO and connector on BOTUnified rear IO with less cablingOptional heat spreader

Flexibility from MIOe extensionSecure core knowledge on MIOe modulesMIOe extension design guide for referenceUnified multiple interfaces Less design effort

,

Heat Spreader

Right angle connector

Unified rear IO

MIOe extension

RAM Module

Heat-generated parts

Comparison with other SBCsComparison with other SBCs

Items

MI/O Extension-Ultra series(PICO-ITX)

PC/104 Series 3.5" Small form factor

Dimension100*72mm

(20% reduction of PC/104 size)96*90mm 146*102mm

Coast Line Yes No Yes

System Integration Simple Complex Medium

Pricing LowHigh

(PC/104 connectors are expensive)Medium

Flexibility High Low Medium

Anti-Vibration MiddleHigh

(Good with salf-stacking long pin andmounting holes)

Medium

Extended Temperature No Yes Yes

Ruggedized Support Low High Medium

Power Consumption Ultra Low power (<8W) Ultra Low power/ Low power (<10W) Low power (<15W)

Expansion

MIOe(PCIe,

DP,USB2.0/3.0,SMBus,LPC,Audio,S3/S5, Power,reset)

Lagacy PC/104 or PCI-104Lagacy PC/104, PCI-104, or

MIO/160(PCI/USB2.0/PCIe/LPC/SDVO/Smbus/Power)

iManager Support No Lite version Yes (support after PCM-9364 and 9389)

Power Type AT 12V+/- 10% AT 5V+/- 5% AT 12V+/- 10% or 5V+/- 5%

ApplicationsPortable device

Small HMI/Instrument/PPCFlight or car entertainment

TransportationFactory AutomationOutdoor applications

TransportationFactory Automation

MedicalDigital Signage/ PPC

Flexibility PossibilitiesFlexibility Possibilities

MI/O B

MIOe Module A

MIOe Module B

MI/O Extension SBC+ MIOe Expansion Module = Vertical Applications

Your own MIOe design !

MIOe Module C

MI/O A

Unified MIOe for MIO Extension SBCUnified MIOe for MIO Extension SBC

Interface Number Functions can beDisplayPort 1 HDMI, LVDS, DVI, CRT or eDP display interface…

PCIe x 1 4 Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion…

USB 3.0USB 2.0

1 01 2

Super speed storage, capture card, HD Webcam & display interface…

LPC 1 Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O…

HD Audio (Line-Out) 1 Line out, keep flexibility with selected amplifier…

SMBus 1 Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication…

VCC (Power) +12VSB

VCC (Power) +5VSB

GND

Interfaces are considered including most demands from customer and future chipset trends Interfaces are considered including most demands from customer and future chipset trends

or

MIO PositioningMIO PositioningEasy

System Integration

Minimum Design Effort

Secure CoreKnowledge

Compact Chassis Design

Flexibility/Vertical Market

Cost Effective

MIOMIO

SUSIAccessSmart Access To Embedded Devices

SUSIAccessSmart Access To Embedded Devices

DeviceMonitoring

SystemRecovery

RemoteConfiguration

22

11

33

Integrated Device Monitoring, Configuration & System Recovery

Core FeaturesCore Features Centralized Device Monitoring

– Collects all embedded device data – Displays data in a customized dashboard – Auto notifies errors via warning popups and e-mail alerts

Integrated Remote Configuration – Remotely adjust embedded device settings – Transfer files to a remote device for firmware or application updates – Remote diagnostics via screen captures, hardware log analysis, and

windows XP event log files One-Click System Recovery

– Back-up complete system and files any time – Restore a system – Smart back-up saves images to offsite FTP

Centralized Device MonitoringCentralized Device Monitoring

On CPU/SYS Temp, Fan Speed, Voltage & Modules

Integrated Remote ConfigurationIntegrated Remote Configuration

For Power On/Off, Display, Volume & File Transfer

Advantech Peripheral Modules SolutionAdvantech Peripheral Modules Solution

Peripheral HighlightsPeripheral Highlights

• PATA/SATA/USB• Full Range• Wide Temp.

• Wide Temp.• 30u Plating• Fix Die• Thermal Sensor

• 7 years Longevity• Wide Temp.

• Wide Temp.• High Brightness• Various Interface

SQFlash SQRAM Wireless Touch/Display

SQFlash – Smart & Quality Flash ModuleSQFlash – Smart & Quality Flash Module

Leading Technology• Fragment Writing – better endurance, performance• GuaranteedFlush – robust mDDR cache• Power Failure Protection • OS Mutual – High random access

Full Range Interface/Form Factor• PATA, SATA, CF, CFast, USB, mPCIe, SD• Wide Temp. modules for both SLC & MLC• Flexible firmware and software customization• Security features

SQRAM – Smart & Quality Memory ModuleSQRAM – Smart & Quality Memory Module

Rugged Specification• Fixed Die with Samsung memory chip• Extra-thick 30u" gold-plated contact pins• Stable operation in extreme temp. (-40° to 85ºC)• Industrial grade capacitors ensure voltage stability• Thermal Sensor & software package

Sorting Mechanism• 10G vibration• Low temp. (-40 ℃) & high temp. (+85 ℃) burning• Thermal shock stress test• VDD, Frequency Margin test• Power Cycling, application test

Embedded Wireless ModuleEmbedded Wireless Module

Industrial WiFi Module• 7 years longevity • Stable operation in extreme temp. ( -40° to 85ºC) • Cisco CCX 4.0 certified• Seamless roaming between respective APs• Support Intel Active Management Technology 7.0• Industrial leading power consumption• Multiple OS support

Full Range Solution/ Interface/ Form Factor• Frequency band: 2.4GHz and 5/2.4GHz• Data Rates: 802.11n 1T1R, 2T2R and 3T3R• Form Factor: Full-size and Half-size mini PCIe, mini PCI and USB• Signal Protocol: PCIe, PCI and USB• Solution type: WiFi module and WiFi + Bluetooth module

Industrial Display add-in Touch SolutionIndustrial Display add-in Touch Solution

Rugged Display Solution • Full range of size support from 5.7” to 42” • Wide operation temp from -20~ 70 degree C• IP54 rating for water and dust proof (ITM series)• Backlight MTBF support of 50K hours

Touch enhancement • 5 years longevity• Widely Input flexibility • Various interface for each application

Thank You

Contact product manager for any further information Victor.Huang@advantech.com.tw

Thank You

Contact product manager for any further information Victor.Huang@advantech.com.tw