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Mobility and Miniaturization 3D WLI Microscopes Address Key Metrology Needs
Mobility and Miniaturization 3D WLI Microscopes Address Key Metrology Needs
Outline
6/4/2014 2 Bruker Confidential
• Introductions
• Brief Overview of 3D Microscopes based on WLI • General technology description • Benefits and general applications
• Semiconductor Related Examples • Semiconductor metrology (process monitoring, failure analysis,
dimensional metrology)
• Summary
Introductions Bruker Nano Surfaces Division
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• 3D Optical
Microscopy • Stylus Profilometry
• Tribology and Mechanical Testing
• Fluorescence
Microscopy
• Scanning Probe Microscopy
Introductions Bruker Stylus and Optical Metrology
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• Technology Leadership • 60+ Patents • 3 R&D 100 Awards • 6 Photonics Circle of
Excellence Awards
• Manufacturing Excellence
• Lean, six sigma-based process • >100 systems/quarter
capacity • Rapid production ramp
capability
Bruker NSD SOM is a division of Bruker
Introductions Speaker
Matt Novak, Ph.D. Director, Technology and Applications Stylus and Optical Metrology [email protected]
• Joined Bruker 2011 (3+ years)
• Industry experience (17 years) optical engineering, fabrication and metrology
• Earned Ph.D. working in private sector metrology capital equipment (instrument design/assembly/test)
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• People interested in fast, non-contact methods for imaging metrology in semiconductor related applications
• Those looking for metrology to monitor changes in surface topography from nm to µm scales with accuracy and repeatability
• Those unfamiliar with 3D microscopes based on
WLI will gain understanding of this technique for quantitative surface measurements and imaging capabilities
• Those already familiar with 3D microscopes based on WLI –introduced to some example applications where the technique may be new
Who Will Benefit? Intended Webinar Audience
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• Microscopes with special objectives used to provide sample height data • Optics scanned vertically so sample is passed through focus • Height data computed from this focus scan information
Bruker 3D Optical Microscopes Produce Highly Accurate 3D Image of Areas of Interest
BRUKER CONFIDENTIAL
3D Optical Microscopes What is a 3D microscope, anyway??
• Microscope with special objectives, scanned perpendicular to sample – reflected interference signal processed to produce accurate height map
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Coherent light interference builds height map
VSI
3D Microscope (Vertical Scanning, VSI) Image Acquisition
Feature of
Interest
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Live Video View
Motivation for Accurate 3D Metrology Internet of Things, Mobility
Internet of Things…
By 2020, up to 50,000,000,000 connections
Mobility Means…
Smaller, Lighter, Thinner
Miniaturization Means…
Increased vertical integration
Manufacturing challenges
Increased demand for metrology
Vertical Integration Interposers Advance 2.5D and 3D Packaging
Build up Substrates 3D stacked Die
Si and TSV
Glass, TGV (high frequency, RF, isolation)
Wires limit connections, Power consumption
TSV direct connections, power consumption lower
Packaging Advances + Challenges Management of Obstacles…
Thermal (dissipation, stress) Electrical
Mechanical (stability, reliability, TSV) Fabrication Dimensional Accuracy
and Failure Analysis Fraunhofer IZM
Packaging Advances + Challenges Failure analysis increasingly important
Define Scope of Problem
Collect + Analyze Data
IR Imaging, thermal imaging
SEM inspection
Optical, X-Ray, SPM, profiler
3D Microscopes Based on WLI
Meets variety of metrology needs ASM International, 2011
3D Microscopes Based on WLI Excellent for Surface Imaging, FA
FA, imaging – traditional stacked die, wirebonding
FA, IMC exploration – advanced packaging will
have other needs…
3D Microscopes Based on WLI Failure Analysis - Surface Imaging
SEM, XRM used for advanced packaging
internal analysis
Fast, easy inspection of surfaces afforded by 3D
WLI Microscopes
3D Microscopes in Many Formats Panel Build Up Substrate Metrology
MultiTrace Surface Anchor
Pad Clearance
Auto Alignment & CD
Overlay
Complex Via
Circle Connect
Trace
Larger panel format 3D systems to enable metrology for 600 mm x 600 mm panels – deploy
for HDI-MCM substrate metrology
3D Microscopes Address Many Needs Trace CD, Heights
3D Microscopes Address Many Needs Via Protrusion, Recess
3D Microscopes Address Many Needs Cu Pillars, CD, Heights
Larger UBM
Microbumps
3D WLI Microscope
3D Microscope (Vertical Scanning, VSI) TSV/Etch Measurements
3D Microscopes Address Many Needs Trench Etch Depths and Widths, Others
WLI 3D microscopes correlate to SEM sections for high aspect trenches
Work to improve/enhance
applications as needs evolve
Summary
Drive to Miniaturize Promotes advances in 3D packaging
Miniaturization WLCSP, 2.5D and 3D IC
High demand for MCM/HDI substrates, good metrology
Work ongoing, many ways by many organizations
Thinner, lighter, faster – less space, tolerances increase
Increased Demand for Metrology
3D Microscopes based on WLI address multiple needs
FA, development, CDs, heights, yield monitoring (IC substrates now, others …in the future)
6/4/2014 Bruker Confidential
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