Module Secondary SMT

User Guide

LCC Module Series

Rev. Module_Secondary_SMT_User_Guide_V2.0

Date: 2013-08-26

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About the Document

History

Revision Date Author Description

1.0 2012-08-28 Gavin HOU Initial

2.0 2013-08-26 Gavin HOU Added the description of stencil-making in

Chapter 4.2.

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Content

About the Document ................................................................................................................................... 2

Content ......................................................................................................................................................... 3

Figure Index ................................................................................................................................................. 4

1 Introduction .......................................................................................................................................... 5

2 Information about Modules ................................................................................................................. 6

2.1. Package Type .............................................................................................................................. 6

2.2. Packing Methods .......................................................................................................................... 6

3 Requirements on Chip Mounter ......................................................................................................... 7

3.1． Mounter ........................................................................................................................................ 7

3.2. Soldering Equipments .................................................................................................................. 7

4 Attentions for Manufacturing ............................................................................................................. 8

4.1. MSL and Moisture-proof Requirement ......................................................................................... 8

4.2. Stencil Design Requirement ......................................................................................................... 9

4.3. Mounting Process ...................................................................................................................... 10

4.3.1. Load Material.................................................................................................................. 10

4.3.2. Automatic Placement ..................................................................................................... 10

4.4. Reflow ........................................................................................................................................ 12

5 Disassembly ....................................................................................................................................... 13

6 Appendix Reference .......................................................................................................................... 15

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Figure Index

FIGURE 1: TRAY PACKING AND REEL PACKING ........................................................................................... 6

FIGURE 2: HUMIDITY INDICATOR .................................................................................................................... 8

FIGURE 3: SHRUNKEN INWARD AND MOVED OUTWARD ............................................................................ 9

FIGURE 4: STEP-UP STENCIL AREA .............................................................................................................. 10

FIGURE 5: AUTOMATIC PLACEMENT ............................................................................................................. 11

FIGURE 6: MOUNTED PICTURE ...................................................................................................................... 11

FIGURE 7: RAMP-SOAK-SPIKE REFLOW PROFILE ...................................................................................... 12

FIGURE 8: REMOVE MODULE ........................................................................................................................ 13

FIGURE 9: MODULE SOLDERING .................................................................................................................. 14

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1 Introduction

This document describes the process of Quectel modules’ secondary SMT and disassembly. It is

applied for all Quectel modules in LCC package.

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2 Information about Modules

2.1. Package Type

LCC type

2.2. Packing Methods

Quectel provides the following packing types:

Tray Packing

Reel Packing

Figure 1: Tray Packing and Reel Packing

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3 Requirements on Chip Mounter

3.1．Mounter

Component feeder: Support auto-tray feeder and auto-reel feeder

Image processing： Optical plummet centering

Diameter of nozzle： Select the suitable nozzle according to the module size

The recommended diameter of nozzle should be not less than 40% of the module’s shorter side. Such as

module size: 25mm × 20mm. Nozzle diameter should be more than 8mm.

3.2. Soldering Equipments

Support Hot-air soldering

NOTE

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4 Attentions for Manufacturing

4.1. MSL and Moisture-proof Requirement

Quectel SMD module is sensitive to moisture absorption. According to IPC-JEDEC standard, the MSL of

Quectel SMD modules are defined as “4”.

To prevent SMD module from permanent damage, baking before reflow is required in following cases：

Humidity indicator card: At least one circular indicator is no longer blue.

The seal is opened and the module is exposed to air for more than 72 hours.

Normal Not blue

Figure 2: Humidity Indicator

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1. If the color of the indication card is turned to pink, bake the module for 48 hours under 125℃.

2. Take out the module from the package and put it on the high temperature fixture. All modules must be

mounted within 24 hours after finishing baking or put in the dry box.

4.2. Stencil Design Requirement

To ensure the solder paste is enough and soldering reliability, the stencil should be partly stepped-up on

the top surface. The differences are shown in the table below.

Module Stencil-making Requirements

M10/M12/M72/M75/M80/M85/M95

UC20

The stencil, where module is placed, should be

stepped-up to 0.2mm.

The hole of the stencil is shrunken inward by 0.1mm

and moved outward by 0.2-0.3mm.

L10/L16/L20/L26/L30/L50/L70/L76/L80

The stencil, where module is placed, should be

stepped-up to 0.13mm.

The hole of the stencil is shrunken inward by 0.1mm

and moved outward by 0.3-0.5mm.

h1: The hole of the stencil is shrunken inward by 0.1mm.

h2: The hole of the stencil is moved outward by 0.2-0.3mm or 0.3-0.5mm according to different module

type.

Figure 3: Shrunken Inward and Moved Outward

NOTES

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Figure 4: Step-up Stencil Area

1. The hole of stencil’s components, which has a distance about 5mm away from the edge of the

module, should be shrunken by 10%~30% of the actual hole size.

2. You can optimize stencil-making depending on the actual situation.

4.3. Mounting Process

4.3.1. Load Materials

For tray packing, to ensue mounting accuracy, dedicated tray fixture is recommended when placing the

module.

4.3.2. Automatic Placement

Select the suitable nozzle according to the module size. To keep module’s stability, please ensure that the

nozzle is placed in the center of gravity center when mounting the module. Module’s pad should be put on

the solder paste of motherboard PCB’s pad after module is mounted.

NOTES

Step-up Stencil Area

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Figure 5: Automatic Placement

Figure 6: Mounted Picture

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4.4. Reflow

Refer to the recommended ramp-soak-spike reflow profile in the Figure 7.

Time(s)

5010

015

0

20

0

25

0

30

0

50

10

0

15

0

20

0

25

0

160℃

200℃

217

0

70s~120s

40s~60s

Between 1~3℃/S

Preheat Heating Cooling℃

s

Liquids Temperature

Figure 7: Ramp-soak-spike Reflow Profile

You can optimize ramp-soak-spike reflow profile based on the actual situation.

NOTE

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5 Disassembly

Please use the SMD Rework Station to heat the pads of the module in the host board. The temperature of

the SMD Rework Station should be about 350℃ in order to release enough heat. The wind speed should

be adjusted according to actual situation.

When the host board is heated, the distance between the host board and the wind outlet should be from

1cm to 3.5cm. Move the wind outlet along the edge of the module in uniform rotation. When all of the

solder are melted, take off the module along the diagonal direction with tweezers. The time of the whole

process should be no more than 250 seconds.

Figure 8: Remove Module

After disassembly, wait a moment until the module and the host board cool down. When the module has

been removed, please guarantee that the solder paste on the host board must be smooth and there is no

short circuit between two pins.

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Figure 9: Module Soldering

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6 Appendix Reference

Table 1: Terms and Abbreviations

Abbreviation Description

LCC Leadless Chip Carriers

SMT Surface Mount Technology

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