1
BSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
12
34
56
78
43
21
56
78
TDSON-8FL(enlargedsourceinterconnection)
8 D
7 D
6 D
5 D
S 1
S 2
S 3
G 4
MOSFETOptiMOSTMPower-MOSFET,40V
Features•Optimizedforsynchronousrectification•IntegratedmonolithicSchottky-likediode•Verylowon-resistanceRDS(on)•100%avalanchetested•N-channel,logiclevel•QualifiedaccordingtoJEDEC1)fortargetapplications•Pb-freeleadplating;RoHScompliant•Halogen-freeaccordingtoIEC61249-2-21•Highersolderjointreliabilityduetoenlargedsourceinterconnection
Table1KeyPerformanceParametersParameter Value UnitVDS 40 V
RDS(on),max 1.05 mΩ
ID 275 A
QOSS 83 nC
QG(0V..10V) 87 nC
Type/OrderingCode Package Marking RelatedLinksBSC010N04LSI TDSON-8 FL 010N04LI -
1) J-STD20 and JESD22
2
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
TableofContentsDescription . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
1MaximumratingsatTA=25°C,unlessotherwisespecified
Table2MaximumratingsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Continuous drain current1) ID
-----
-----
27517423815037
A
VGS=10V,TC=25°CVGS=10V,TC=100°CVGS=4.5V,TC=25°CVGS=4.5V,TC=100°CVGS=10V,TA=25°C,RthJA=50K/W2)
Pulsed drain current3) ID,pulse - - 1100 A TC=25°CAvalanche current, single pulse4) IAS - - 50 A TC=25°CAvalanche energy, single pulse EAS - - 230 mJ ID=50A,RGS=25ΩGate source voltage VGS -20 - 20 V -
Power dissipation Ptot--
--
1392.5 W TC=25°C
TA=25°C,RthJA=50K/W2)
Operating and storage temperature Tj,Tstg -55 - 150 °C IEC climatic category;DIN IEC 68-1: 55/150/56
2Thermalcharacteristics
Table3ThermalcharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Thermal resistance, junction - case,bottom RthJC - 0.5 0.9 K/W -
Thermal resistance, junction - case,top RthJC - - 20 K/W -
Device on PCB,6 cm2 cooling area2) RthJA - - 50 K/W -
1) Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperatureat 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actualenvironmental conditions.2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drainconnection. PCB is vertical in still air.3) See Diagram 3 for more detailed information4) See Diagram 13 for more detailed information
4
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
3ElectricalcharacteristicsatTj=25°C,unlessotherwisespecified
Table4StaticcharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Drain-source breakdown voltage V(BR)DSS 40 - - V VGS=0V,ID=10mA
Breakdown voltage temperaturecoefficient dV(BR)DSS/dTj - 30 - mV/K ID=10mA,referencedto25°C
Gate threshold voltage VGS(th) 1.2 - 2 V VDS=VGS,ID=250µA
Zero gate voltage drain current IDSS --
-3
0.5- mA VDS=32V,VGS=0V,Tj=25°C
VDS=32V,VGS=0V,Tj=125°C
Gate-source leakage current IGSS - 10 100 nA VGS=20V,VDS=0V
Drain-source on-state resistance RDS(on)--
1.10.9
1.41.05 mΩ VGS=4.5V,ID=50A
VGS=10V,ID=50A
Gate resistance1) RG - 0.8 1.6 Ω -
Transconductance gfs 130 260 - S |VDS|>2|ID|RDS(on)max,ID=50A
Table5DynamiccharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Input capacitance1) Ciss - 6200 8680 pF VGS=0V,VDS=20V,f=1MHzOutput capacitance1) Coss - 1900 2660 pF VGS=0V,VDS=20V,f=1MHzReverse transfer capacitance1) Crss - 140 280 pF VGS=0V,VDS=20V,f=1MHz
Turn-on delay time td(on) - 9 - ns VDD=20V,VGS=10V,ID=30A,RG,ext=1.6Ω
Rise time tr - 4 - ns VDD=20V,VGS=10V,ID=30A,RG,ext=1.6Ω
Turn-off delay time td(off) - 33 - ns VDD=20V,VGS=10V,ID=30A,RG,ext=1.6Ω
Fall time tf - 7 - ns VDD=20V,VGS=10V,ID=30A,RG,ext=1.6Ω
1) Defined by design. Not subject to production test
5
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
Table6Gatechargecharacteristics1)Values
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Gate to source charge Qgs - 15 - nC VDD=20V,ID=50A,VGS=0to10VGate charge at threshold Qg(th) - 9.9 - nC VDD=20V,ID=50A,VGS=0to10VGate to drain charge2) Qgd - 14 20 nC VDD=20V,ID=50A,VGS=0to10VSwitching charge Qsw - 19 - nC VDD=20V,ID=50A,VGS=0to10VGate charge total2) Qg - 87 122 nC VDD=20V,ID=50A,VGS=0to10VGate plateau voltage Vplateau - 2.4 - V VDD=20V,ID=50A,VGS=0to10VGate charge total2) Qg - 45 63 nC VDD=20V,ID=50A,VGS=0to4.5VGate charge total, sync. FET Qg(sync) - 76 - nC VDS=0.1V,VGS=0to10VOutput charge2) Qoss - 83 116 nC VDD=20V,VGS=0V
Table7ReversediodeValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Diode continuous forward current IS - - 139 A TC=25°CDiode pulse current IS,pulse - - 1100 A TC=25°CDiode forward voltage VSD - 0.57 0.7 V VGS=0V,IF=20A,Tj=25°CReverse recovery charge Qrr - 20 - nC VR=20V,IF=20A,diF/dt=400A/µs
1) See ″Gate charge waveforms″ for parameter definition2) Defined by design. Not subject to production test
6
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
4Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
TC[°C]
Ptot[W
]
0 40 80 120 1600
20
40
60
80
100
120
140
160
Ptot=f(TC)
Diagram2:Draincurrent
TC[°C]
ID[A
]
0 20 40 60 80 100 120 140 1600
50
100
150
200
250
300
ID=f(TC);VGS≥10V
Diagram3:Safeoperatingarea
VDS[V]
ID[A
]
10-1 100 101 10210-2
10-1
100
101
102
103
104
1 µs
10 µs100 µs
1 ms
10 ms
DC
ID=f(VDS);TC=25°C;D=0;parameter:tp
Diagram4:Max.transientthermalimpedance
tp[s]
ZthJC[K
/W]
10-6 10-5 10-4 10-3 10-2 10-1 10010-3
10-2
10-1
100
101
0.5
0.2
0.1
0.05
0.02
0.01
single pulse
ZthJC=f(tp);parameter:D=tp/T
7
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
Diagram5:Typ.outputcharacteristics
VDS[V]
ID[A
]
0 1 2 30
100
200
300
400
500
600
700
800
4 V
4.5 V5 V
10 V
3.5 V
3.2 V
3 V
2.8 V
ID=f(VDS);Tj=25°C;parameter:VGS
Diagram6:Typ.drain-sourceonresistance
ID[A]
RDS(on
) [m
Ω]
0 20 40 60 80 1000.0
0.5
1.0
1.5
2.0
3.2 V
3.5 V
4 V4.5 V5 V
6 V8 V
10 V
RDS(on)=f(ID);Tj=25°C;parameter:VGS
Diagram7:Typ.transfercharacteristics
VGS[V]
ID[A
]
0 1 2 3 4 50
80
160
240
320
400
150 °C 25 °C
ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj
Diagram8:Typ.forwardtransconductance
ID[A]
gfs [S]
0 25 50 75 1000
80
160
240
320
400
gfs=f(ID);Tj=25°C
8
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
Diagram9:Drain-sourceon-stateresistance
Tj[°C]
RDS(on
) [m
Ω]
-60 -20 20 60 100 140 1800.0
0.5
1.0
1.5
2.0
max
typ
RDS(on)=f(Tj);ID=50A;VGS=10V
Diagram10:Typ.gatethresholdvoltage
Tj[°C]
VGS(th) [V]
-60 -20 20 60 100 140 1800.0
0.5
1.0
1.5
2.0
2.5
VGS(th)=f(Tj);VGS=VDS;IDS=10mA
Diagram11:Typ.capacitances
VDS[V]
C[p
F]
0 10 20 30 40101
102
103
104Ciss
Coss
Crss
C=f(VDS);VGS=0V;f=1MHz
Diagram12:Forwardcharacteristicsofreversediode
VSD[V]
IF [A]
0.00 0.25 0.50 0.75 1.00 1.25 1.50101
102
103
104
-55 °C25 °C125 °C150 °C
IF=f(VSD);parameter:Tj
9
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
Diagram13:Avalanchecharacteristics
tAV[µs]
IAV [A]
100 101 102 103100
101
102
25 °C
100 °C
125 °C
IAS=f(tAV);RGS=25Ω;parameter:Tj(start)
Diagram14:Typ.gatecharge
Qgate[nC]
VGS [V]
0 20 40 60 80 1000
2
4
6
8
10
12
32 V
20 V8 V
VGS=f(Qgate);ID=50Apulsed;parameter:VDD
Diagram15:Typ.drain-sourceleakagecurrent
VSD[V]
IDSS[A
]
0 5 10 15 20 25 30 3510-6
10-5
10-4
10-3
10-2
125 °C
100 °C
75 °C
25 °C
IDSS=f(VDS);VGS=0V;parameter:Tj
Diagram Gate charge waveforms
10
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
5PackageOutlines
1
10:1
Z8B000193699
REVISION
ISSUE DATE
EUROPEAN PROJECTION
03
19.06.2019
0 3mm
DOCUMENT NO.
1.27
MILLIMETERSDIMENSION
0.90 1.20
D1
A
b
D
D2
E
E1
E2
e
L
0.26 0.54
0.02 0.23
3.88 4.42
0.69 0.90
MIN. MAX. SCALE
2
M 0.45 0.69
0.15 0.35A1
3.70 4.40
4.80 5.35
5.70 6.10
5.90 6.42
Figure1OutlineTDSON-8FL,dimensionsinmm
11
OptiMOSTMPower-MOSFET,40VBSC010N04LSI
Rev.2.5,2020-05-15Final Data Sheet
PG-TDSON-8FL: Recommended Boardpads & Apertures
Figure 2 Outline Boardpads (TDSON-8 FL)
12
OptiMOS TM Power-MOSFET , 40 VBSC010N04LSI
Rev. 2.5, 2020-05-15Final Data Sheet
Figure 3 Outline Tape (TDSON-8 FL )
13
OptiMOS TM Power-MOSFET , 40 VBSC010N04LSI
Rev. 2.5, 2020-05-15Final Data Sheet
Revision HistoryBSC010N04LSI
Revision: 2020-05-15, Rev. 2.5
Previous Revision
Revision Date Subjects (major changes since last revision)
2.2 2016-05-04 Update footnotes and insert max values
2.3 2018-08-17 Update timing parameters
2.4 2019-09-27 Update package drawings
2.5 2020-05-15 Update current rating
TrademarksAll referenced product or service names and trademarks are the property of their respective owners.
We Listen to Your CommentsAny information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuouslyimprove the quality of this document. Please send your proposal (including a reference to this document) to:[email protected]
Published byInfineon Technologies AG81726 München, Germany© 2020 Infineon Technologies AGAll Rights Reserved.
Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) .
With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of theproduct, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitationwarranties of non-infringement of intellectual property rights of any third party.In addition, any information given in this document is subject to customer’s compliance with its obligations stated in thisdocument and any applicable legal requirements, norms and standards concerning customer’s products and any use of theproduct of Infineon Technologies in customer’s applications.The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’stechnical departments to evaluate the suitability of the product for the intended application and the completeness of the productinformation given in this document with respect to such application.
InformationFor further information on technology, delivery terms and conditions and prices please contact your nearest InfineonTechnologies Office (www.infineon.com).
WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question,please contact the nearest Infineon Technologies Office.The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/orautomotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if afailure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation andaerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems areintended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it isreasonable to assume that the health of the user or other persons may be endangered.