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1 BSC010N04LSI Rev. 2.5, 2020-05-15 Final Data Sheet 1 2 3 4 5 6 7 8 4 3 2 1 5 6 7 8 TDSON-8 FL (enlarged source interconnection) 8D 7D 6D 5D S1 S2 S3 G4 MOSFET OptiMOS TM Power-MOSFET, 40 V Features • Optimized for synchronous rectification • Integrated monolithic Schottky-like diode • Very low on-resistance RDS(on) • 100% avalanche tested • N-channel, logic level • Qualified according to JEDEC 1) for target applications • Pb-free lead plating; RoHS compliant • Halogen-free according to IEC61249-2-21 • Higher solder joint reliability due to enlarged source interconnection Table 1 Key Performance Parameters Parameter Value Unit VDS 40 V RDS(on),max 1.05 mID 275 A QOSS 83 nC QG(0V..10V) 87 nC Type / Ordering Code Package Marking Related Links BSC010N04LSI TDSON-8 FL 010N04LI - 1) J-STD20 and JESD22
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Page 1: MOSFET - Infineon Technologies

1

BSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

12

34

56

78

43

21

56

78

TDSON-8FL(enlargedsourceinterconnection)

8 D

7 D

6 D

5 D

S 1

S 2

S 3

G 4

MOSFETOptiMOSTMPower-MOSFET,40V

Features•Optimizedforsynchronousrectification•IntegratedmonolithicSchottky-likediode•Verylowon-resistanceRDS(on)•100%avalanchetested•N-channel,logiclevel•QualifiedaccordingtoJEDEC1)fortargetapplications•Pb-freeleadplating;RoHScompliant•Halogen-freeaccordingtoIEC61249-2-21•Highersolderjointreliabilityduetoenlargedsourceinterconnection

Table1KeyPerformanceParametersParameter Value UnitVDS 40 V

RDS(on),max 1.05 mΩ

ID 275 A

QOSS 83 nC

QG(0V..10V) 87 nC

Type/OrderingCode Package Marking RelatedLinksBSC010N04LSI TDSON-8 FL 010N04LI -

1) J-STD20 and JESD22

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

TableofContentsDescription . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

1MaximumratingsatTA=25°C,unlessotherwisespecified

Table2MaximumratingsValues

Min. Typ. Max.Parameter Symbol Unit Note/TestCondition

Continuous drain current1) ID

-----

-----

27517423815037

A

VGS=10V,TC=25°CVGS=10V,TC=100°CVGS=4.5V,TC=25°CVGS=4.5V,TC=100°CVGS=10V,TA=25°C,RthJA=50K/W2)

Pulsed drain current3) ID,pulse - - 1100 A TC=25°CAvalanche current, single pulse4) IAS - - 50 A TC=25°CAvalanche energy, single pulse EAS - - 230 mJ ID=50A,RGS=25ΩGate source voltage VGS -20 - 20 V -

Power dissipation Ptot--

--

1392.5 W TC=25°C

TA=25°C,RthJA=50K/W2)

Operating and storage temperature Tj,Tstg -55 - 150 °C IEC climatic category;DIN IEC 68-1: 55/150/56

2Thermalcharacteristics

Table3ThermalcharacteristicsValues

Min. Typ. Max.Parameter Symbol Unit Note/TestCondition

Thermal resistance, junction - case,bottom RthJC - 0.5 0.9 K/W -

Thermal resistance, junction - case,top RthJC - - 20 K/W -

Device on PCB,6 cm2 cooling area2) RthJA - - 50 K/W -

1) Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperatureat 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actualenvironmental conditions.2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drainconnection. PCB is vertical in still air.3) See Diagram 3 for more detailed information4) See Diagram 13 for more detailed information

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

3ElectricalcharacteristicsatTj=25°C,unlessotherwisespecified

Table4StaticcharacteristicsValues

Min. Typ. Max.Parameter Symbol Unit Note/TestCondition

Drain-source breakdown voltage V(BR)DSS 40 - - V VGS=0V,ID=10mA

Breakdown voltage temperaturecoefficient dV(BR)DSS/dTj - 30 - mV/K ID=10mA,referencedto25°C

Gate threshold voltage VGS(th) 1.2 - 2 V VDS=VGS,ID=250µA

Zero gate voltage drain current IDSS --

-3

0.5- mA VDS=32V,VGS=0V,Tj=25°C

VDS=32V,VGS=0V,Tj=125°C

Gate-source leakage current IGSS - 10 100 nA VGS=20V,VDS=0V

Drain-source on-state resistance RDS(on)--

1.10.9

1.41.05 mΩ VGS=4.5V,ID=50A

VGS=10V,ID=50A

Gate resistance1) RG - 0.8 1.6 Ω -

Transconductance gfs 130 260 - S |VDS|>2|ID|RDS(on)max,ID=50A

Table5DynamiccharacteristicsValues

Min. Typ. Max.Parameter Symbol Unit Note/TestCondition

Input capacitance1) Ciss - 6200 8680 pF VGS=0V,VDS=20V,f=1MHzOutput capacitance1) Coss - 1900 2660 pF VGS=0V,VDS=20V,f=1MHzReverse transfer capacitance1) Crss - 140 280 pF VGS=0V,VDS=20V,f=1MHz

Turn-on delay time td(on) - 9 - ns VDD=20V,VGS=10V,ID=30A,RG,ext=1.6Ω

Rise time tr - 4 - ns VDD=20V,VGS=10V,ID=30A,RG,ext=1.6Ω

Turn-off delay time td(off) - 33 - ns VDD=20V,VGS=10V,ID=30A,RG,ext=1.6Ω

Fall time tf - 7 - ns VDD=20V,VGS=10V,ID=30A,RG,ext=1.6Ω

1) Defined by design. Not subject to production test

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

Table6Gatechargecharacteristics1)Values

Min. Typ. Max.Parameter Symbol Unit Note/TestCondition

Gate to source charge Qgs - 15 - nC VDD=20V,ID=50A,VGS=0to10VGate charge at threshold Qg(th) - 9.9 - nC VDD=20V,ID=50A,VGS=0to10VGate to drain charge2) Qgd - 14 20 nC VDD=20V,ID=50A,VGS=0to10VSwitching charge Qsw - 19 - nC VDD=20V,ID=50A,VGS=0to10VGate charge total2) Qg - 87 122 nC VDD=20V,ID=50A,VGS=0to10VGate plateau voltage Vplateau - 2.4 - V VDD=20V,ID=50A,VGS=0to10VGate charge total2) Qg - 45 63 nC VDD=20V,ID=50A,VGS=0to4.5VGate charge total, sync. FET Qg(sync) - 76 - nC VDS=0.1V,VGS=0to10VOutput charge2) Qoss - 83 116 nC VDD=20V,VGS=0V

Table7ReversediodeValues

Min. Typ. Max.Parameter Symbol Unit Note/TestCondition

Diode continuous forward current IS - - 139 A TC=25°CDiode pulse current IS,pulse - - 1100 A TC=25°CDiode forward voltage VSD - 0.57 0.7 V VGS=0V,IF=20A,Tj=25°CReverse recovery charge Qrr - 20 - nC VR=20V,IF=20A,diF/dt=400A/µs

1) See ″Gate charge waveforms″ for parameter definition2) Defined by design. Not subject to production test

Page 6: MOSFET - Infineon Technologies

6

OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

4Electricalcharacteristicsdiagrams

Diagram1:Powerdissipation

TC[°C]

Ptot[W

]

0 40 80 120 1600

20

40

60

80

100

120

140

160

Ptot=f(TC)

Diagram2:Draincurrent

TC[°C]

ID[A

]

0 20 40 60 80 100 120 140 1600

50

100

150

200

250

300

ID=f(TC);VGS≥10V

Diagram3:Safeoperatingarea

VDS[V]

ID[A

]

10-1 100 101 10210-2

10-1

100

101

102

103

104

1 µs

10 µs100 µs

1 ms

10 ms

DC

ID=f(VDS);TC=25°C;D=0;parameter:tp

Diagram4:Max.transientthermalimpedance

tp[s]

ZthJC[K

/W]

10-6 10-5 10-4 10-3 10-2 10-1 10010-3

10-2

10-1

100

101

0.5

0.2

0.1

0.05

0.02

0.01

single pulse

ZthJC=f(tp);parameter:D=tp/T

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

Diagram5:Typ.outputcharacteristics

VDS[V]

ID[A

]

0 1 2 30

100

200

300

400

500

600

700

800

4 V

4.5 V5 V

10 V

3.5 V

3.2 V

3 V

2.8 V

ID=f(VDS);Tj=25°C;parameter:VGS

Diagram6:Typ.drain-sourceonresistance

ID[A]

RDS(on

) [m

Ω]

0 20 40 60 80 1000.0

0.5

1.0

1.5

2.0

3.2 V

3.5 V

4 V4.5 V5 V

6 V8 V

10 V

RDS(on)=f(ID);Tj=25°C;parameter:VGS

Diagram7:Typ.transfercharacteristics

VGS[V]

ID[A

]

0 1 2 3 4 50

80

160

240

320

400

150 °C 25 °C

ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj

Diagram8:Typ.forwardtransconductance

ID[A]

gfs [S]

0 25 50 75 1000

80

160

240

320

400

gfs=f(ID);Tj=25°C

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

Diagram9:Drain-sourceon-stateresistance

Tj[°C]

RDS(on

) [m

Ω]

-60 -20 20 60 100 140 1800.0

0.5

1.0

1.5

2.0

max

typ

RDS(on)=f(Tj);ID=50A;VGS=10V

Diagram10:Typ.gatethresholdvoltage

Tj[°C]

VGS(th) [V]

-60 -20 20 60 100 140 1800.0

0.5

1.0

1.5

2.0

2.5

VGS(th)=f(Tj);VGS=VDS;IDS=10mA

Diagram11:Typ.capacitances

VDS[V]

C[p

F]

0 10 20 30 40101

102

103

104Ciss

Coss

Crss

C=f(VDS);VGS=0V;f=1MHz

Diagram12:Forwardcharacteristicsofreversediode

VSD[V]

IF [A]

0.00 0.25 0.50 0.75 1.00 1.25 1.50101

102

103

104

-55 °C25 °C125 °C150 °C

IF=f(VSD);parameter:Tj

Page 9: MOSFET - Infineon Technologies

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

Diagram13:Avalanchecharacteristics

tAV[µs]

IAV [A]

100 101 102 103100

101

102

25 °C

100 °C

125 °C

IAS=f(tAV);RGS=25Ω;parameter:Tj(start)

Diagram14:Typ.gatecharge

Qgate[nC]

VGS [V]

0 20 40 60 80 1000

2

4

6

8

10

12

32 V

20 V8 V

VGS=f(Qgate);ID=50Apulsed;parameter:VDD

Diagram15:Typ.drain-sourceleakagecurrent

VSD[V]

IDSS[A

]

0 5 10 15 20 25 30 3510-6

10-5

10-4

10-3

10-2

125 °C

100 °C

75 °C

25 °C

IDSS=f(VDS);VGS=0V;parameter:Tj

Diagram Gate charge waveforms

Page 10: MOSFET - Infineon Technologies

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

5PackageOutlines

1

10:1

Z8B000193699

REVISION

ISSUE DATE

EUROPEAN PROJECTION

03

19.06.2019

0 3mm

DOCUMENT NO.

1.27

MILLIMETERSDIMENSION

0.90 1.20

D1

A

b

D

D2

E

E1

E2

e

L

0.26 0.54

0.02 0.23

3.88 4.42

0.69 0.90

MIN. MAX. SCALE

2

M 0.45 0.69

0.15 0.35A1

3.70 4.40

4.80 5.35

5.70 6.10

5.90 6.42

Figure1OutlineTDSON-8FL,dimensionsinmm

Page 11: MOSFET - Infineon Technologies

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OptiMOSTMPower-MOSFET,40VBSC010N04LSI

Rev.2.5,2020-05-15Final Data Sheet

PG-TDSON-8­FL: Recommended Boardpads & Apertures

Figure 2 Outline Boardpads (TDSON-8 FL)

Page 12: MOSFET - Infineon Technologies

12

OptiMOS TM Power-MOSFET , 40 VBSC010N04LSI

Rev. 2.5, 2020-05-15Final Data Sheet

Figure 3 Outline Tape (TDSON-8 FL )

Page 13: MOSFET - Infineon Technologies

13

OptiMOS TM Power-MOSFET , 40 VBSC010N04LSI

Rev. 2.5, 2020-05-15Final Data Sheet

Revision HistoryBSC010N04LSI

Revision: 2020-05-15, Rev. 2.5

Previous Revision

Revision Date Subjects (major changes since last revision)

2.2 2016-05-04 Update footnotes and insert max values

2.3 2018-08-17 Update timing parameters

2.4 2019-09-27 Update package drawings

2.5 2020-05-15 Update current rating

TrademarksAll referenced product or service names and trademarks are the property of their respective owners.

We Listen to Your CommentsAny information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuouslyimprove the quality of this document. Please send your proposal (including a reference to this document) to:[email protected]

Published byInfineon Technologies AG81726 München, Germany© 2020 Infineon Technologies AGAll Rights Reserved.

Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) .

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of theproduct, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitationwarranties of non-infringement of intellectual property rights of any third party.In addition, any information given in this document is subject to customer’s compliance with its obligations stated in thisdocument and any applicable legal requirements, norms and standards concerning customer’s products and any use of theproduct of Infineon Technologies in customer’s applications.The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’stechnical departments to evaluate the suitability of the product for the intended application and the completeness of the productinformation given in this document with respect to such application.

InformationFor further information on technology, delivery terms and conditions and prices please contact your nearest InfineonTechnologies Office (www.infineon.com).

WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question,please contact the nearest Infineon Technologies Office.The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/orautomotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if afailure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation andaerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems areintended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it isreasonable to assume that the health of the user or other persons may be endangered.


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