MSP430FR2476 LaunchPad™ Development Kit (LP … · MSP430Ware software. Code Composer Studio...

1SLAU802–March 2019Submit Documentation Feedback

Copyright © 2019, Texas Instruments Incorporated

MSP430FR2476 LaunchPad™ Development Kit (LP‑MSP430FR2476)

User's GuideSLAU802–March 2019

MSP430FR2476 LaunchPad™ Development Kit(LP‑‑MSP430FR2476)

The MSP430FR2476 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) for theMSP430FR2476 microcontroller (MCU). The kit contains everything needed to start developing on theultra-low-power MSP430FRx FRAM microcontroller platform, including onboard debug probe forprogramming, debugging, and energy measurements. The board also features onboard buttons and LEDsfor quick integration of a simple user interface, an onboard temperature sensor, and a CR2032 coin cellbattery holder.

Figure 1 shows the LP-MSP430FR2476 LaunchPad development kit.

Figure 1. LP-MSP430FR2476 LaunchPad Development Kit

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/tool/LP-MSP430FR2476http://www.ti.com/product/MSP430FR2476

www.ti.com

2 SLAU802–March 2019Submit Documentation Feedback



Contents1 Getting Started ............................................................................................................... 3

1.1 Introduction .......................................................................................................... 31.2 Key Features ........................................................................................................ 31.3 What’s Included ..................................................................................................... 31.4 First Steps: Out-of-Box Experience .............................................................................. 31.5 Next Steps: Looking Into the Provided Code ................................................................... 4

2 Hardware...................................................................................................................... 42.1 Block Diagram....................................................................................................... 52.2 Hardware Features ................................................................................................. 52.3 Power ............................................................................................................... 102.4 Measure Current Draw of the MSP430 MCU.................................................................. 112.5 Clocking ............................................................................................................ 122.6 Using the eZ-FET Debug Probe With a Different Target .................................................... 122.7 BoosterPack Plug-in Module Pinout ............................................................................ 122.8 Design Files ........................................................................................................ 142.9 Hardware Change Log............................................................................................ 14

3 Software Examples ........................................................................................................ 143.1 Out-of-Box Software Example ................................................................................... 143.2 Blink LED Example................................................................................................ 15

4 Resources ................................................................................................................... 164.1 Integrated Development Environments......................................................................... 164.2 LaunchPad Development Kit Websites......................................................................... 194.3 MSP430Ware and TI Resource Explorer ...................................................................... 194.4 FRAM Utilities...................................................................................................... 204.5 MSP430FR2476 MCU ............................................................................................ 204.6 Community Resources ........................................................................................... 20

5 FAQ .......................................................................................................................... 216 Schematics.................................................................................................................. 22

List of Figures

1 LP-MSP430FR2476 LaunchPad Development Kit ...................................................................... 12 LP-MSP430FR2476 Overview ............................................................................................. 43 LP-MSP430FR2476 Block Diagram....................................................................................... 54 MSP430FR2476 Pinout..................................................................................................... 65 eZ-FET Debug Probe ....................................................................................................... 76 eZ-FET Isolation Jumper Block Diagram ................................................................................. 97 Application Backchannel UART in Device Manager .................................................................... 98 LP-MSP430FR2476 Power Block Diagram............................................................................. 109 BoosterPack Checker Tool ............................................................................................... 1310 LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout.................................. 1311 TI Resource Explorer Cloud .............................................................................................. 1612 CCS Cloud .................................................................................................................. 1713 Directing the Project>Import Function to the Demo Project .......................................................... 1814 When CCS Has Found the Project ...................................................................................... 1815 Using TI Resource Explorer to Browse LP-MSP430FR2476 in MSP430Ware .................................... 1916 Schematics (1 of 4) ........................................................................................................ 2217 Schematics (2 of 4) ........................................................................................................ 2318 Schematics (3 of 4) ........................................................................................................ 2419 Schematics (4 of 4) ........................................................................................................ 25

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802

www.ti.com Getting Started




TrademarksLaunchPad, BoosterPack, Code Composer Studio, EnergyTrace, MSP430, E2E are trademarks of TexasInstruments.IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems.All other trademarks are the property of their respective owners.

1 Getting Started

1.1 IntroductionThe 16-MHz MSP430FR2476 MCU features 64KB of embedded ferroelectric random access memory(FRAM), a nonvolatile memory known for its ultra-low power, high endurance, and high speed writeaccess. Combined with 8KB of on-chip RAM, users have access to 64KB of memory to split between theirprogram and data as required. For example, a data logging application could require a large data memorywith relatively small program memory, so the memory can be allocated as required between program anddata memory.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a widerange of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity,graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in moduleor choose among many already available from TI and third-party developers.

Free software development tools are also available, such as TI’s Eclipse-based Code Composer Studio™IDE (CCS) and IAR Embedded Workbench® IDE. Both of these IDEs support EnergyTrace™ technologyfor real-time power profiling and debugging when paired with the MSP430FR2476 LaunchPaddevelopment kit.

1.2 Key Features• MSP430™ ultra-low-power FRAM technology based MSP430FR2476 16-bit MCU• EnergyTrace technology available for ultra-low-power debugging• 40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem• Onboard eZ-FET debug probe• 2 buttons and 2 LEDs (1 RGB LED) for user interaction• Temperature sensor for the Out-of-Box Experience demo

1.3 What’s Included

1.3.1 Kit Contents• 1 LP-MSP430FR2476 LaunchPad development kit• 1 micro USB cable• 1 quick start guide

1.3.2 Software Examples• Out-of-Box software

1.4 First Steps: Out-of-Box ExperienceAn easy way to get started with the EVM is by using its preprogrammed out-of-box code. This codedemonstrates some key features of the EVM.

1.4.1 Connecting to the ComputerConnect the LaunchPad development kit using the included USB cable to a computer. A green power LEDshould illuminate. For proper operation, drivers are needed. TI recommends that you get the drivers byinstalling an IDE such as TI's Code Composer Studio IDE or IAR Embedded Workbench IDE. Drivers arealso available at www.ti.com/MSPdrivers.

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/product/MSP430FR2476http://www.ti.com/tool/CCSTUDIO-MSP430http://www.ti.com/tool/CCSTUDIO-MSP430http://www.ti.com/tool/iar-kickstarthttp://www.ti.com/energytracehttp://www.ti.com/MSPdrivers

Getting Started www.ti.com




1.4.2 Running the Out-of-Box Experience (OOBE)The OOBE of the LP-MSP430FR2476 LaunchPad development kit demonstrates how to implement asimple thermometer by using the internal ADC of the MSP430FR2476 MCU to measure the output voltagefrom an analog temperature sensor.

When powering up the Out-of-Box demo, the board performs an initial temperature calibration andilluminates RGB LED2 in a green color. Try to heat the temperature sensor U1 by blowing hot air on it tosee if you can get LED2 to turn red or using a compressed air can to blow cold air onto the sensor to seeLED2 turn blue. LED2 indicates the relative difference between the current temperature and the calibratedmeasurement.

Press button S1 to recalibrate the temperature to the most recent measurement and send a UARTmessage (at 9600 baud) containing the new calibrated temperature through the backchannel UART. Pressbutton S2 at any time to send a UART message containing the current ambient temperature measurementin Celsius.

1.5 Next Steps: Looking Into the Provided CodeAfter the EVM features have been explored, the fun can begin. It’s time to open an integrateddevelopment environment and start editing the code examples. See Section 4 for available IDEs andwhere to download them.

The quickest way to get started using the LaunchPad development kit is to use TI’s cloud developmenttools. The cloud-based Resource Explorer provides access to all of the examples and resources inMSP430Ware software. Code Composer Studio Cloud is a simple Cloud-based IDE that enablesdeveloping and running applications on the LaunchPad development kit.

The out-of-box source code and more code examples are provided and available on the download page.Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.

Section 3 describes all functions in detail and provides a project structure to help familiarize you with thecode.

With the onboard eZ-FET debug probe, debugging and downloading new code is simple. A connectionbetween the EVM and a PC through the provided USB cable is all that is needed.

2 HardwareFigure 2 shows an overview of the LP-MSP430FR2476 hardware.

Figure 2. LP-MSP430FR2476 Overview

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://dev.ti.com/http://dev.ti.com/http://software-dl.ti.com/msp430/msp430_public_sw/mcu/msp430/LP-MSP430FR2467/latest/index_FDS.html

Target device MSP430FR2476

Crystal 32.768 kHz

Micro-B USB

3.3-V LDO TPS73533

ESD protection TPD2E001

Debug MCU MSP430F5528

LEDs red and green

Crystal 4 MHz

UART or SBW to target

User interface2 buttons, 2 LEDs

40-pin LaunchPad

standard headers

Power to target

Reset button

EnergyTrace MCU MSP430G2452

Temperature sensor TMP235

CR2032 coin cell battery holder

www.ti.com Hardware




2.1 Block DiagramFigure 3 shows the block diagram.

Figure 3. LP-MSP430FR2476 Block Diagram

2.2 Hardware Features

2.2.1 MSP430FR2476 MCUThe MSP430FR2476 is an ultra-low-power MSP430FRx FRAM-based microcontroller (MCU), which offerextended data logging and security capabilities. The MSP430FR2476 offers the small LQFP package(7 mm × 7 mm) in the FRAM microcontroller portfolio, combined with a variety of integrated peripheralsand ultra-low power consumption. FRAM is a cutting edge memory technology, combining the bestfeatures of flash and RAM into one nonvolatile memory. For more information on FRAM, visitwww.ti.com/fram.

Device features include:• 1.8-V to 3.6-V operation• 16-bit RISC architecture up to 16-MHz system clock and 8-MHz FRAM access• 64KB of program FRAM, 512 bytes of information FRAM, and 8KB of RAM• 12-channel 12-bit ADC• One enhanced comparator with integrated 6-bit DAC as reference voltage• Four 16-bit timers with three capture/compare registers (Timer_B3)• One 16-bit timer with seven capture/compare registers (Timer_B7)• One 16-bit counter-only RTC• 16-bit cyclic redundancy check (CRC)• 43 GPIOs

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/fram

DNC

29

P3.7/TA3.2

30

P4.0/TA3.1

31

P4.1/TA3.0

32

P4.2/TA3CLK

33

P2.7/UCB1STE

34

35

36

P5.4/UCB1STE/TA3CLK/A11

9

P1.0/UCB0STE/TA0CLK/A0/Veref+

10

11

12

TEST/SBWTCK

1

P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4/VREF+

2

P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A5

3

P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A6

4

P1.7/UCA0STE/SMCLK/TDO/A7

5

P4.3/UCB1SOMI/UCB1SCL/TB0.5/A8

6

P4.4/UCB1SIMO/UCB1SDA/TB0.6/A9

7

P5.3/UCB1CLK/TA3.0/A10

8

P2.3/TA2.0

P3.4/TA2CLK/COMP0OUT

P5.5

/UC

B0C

LK

/TA

2C

LK

P5.6

/UC

B0S

TE

/TA

2.0

P5.7

/TA

2.1

/CO

MP

0.2

19

P6.0

/TA

2.2

/CO

MP

0.3

20

P3.0

/TA

2.2

21

P3.3

/TA

2.1

22

23

24

P3.1/UCA1STE

25

P2.4/UCA1CLK

26

P2.5/UCA1RXD/UCA1SOMI

27

P2.6/UCA1TXD/UCA1SIMO

28

DVCC

RST/NMI/SBWTDIO

MSP430FR2476TPT

MSP430FR2475TPT

P5.0

/UC

A0C

LK

/TB

0.2

P5.1

/UC

A0R

XD

/UC

A0S

OM

I/T

B0.3

P5.2

/UC

A0T

XD

/UC

A0S

IMO

/TB

0.4

43

P2.0

/XO

UT

44

P2.1

/XIN

45

DV

SS

46

47

48

P3.5

/UC

B1C

LK

/TB

0T

RG

P3.2

/UC

B1S

IMO

/UC

B1S

DA

P3.6

/UC

B1S

OM

I/U

CB

1S

CL

37

P6.1

/TB

0C

LK

38

P6.2

/TB

0.0

39

P4.7

/UC

A0S

TE

/TB

0.1

40

41

42

P1.1

/UC

B0C

LK

/TA

0.1

/CO

MP

0.0

/A1

P1.2

/UC

B0S

IMO

/UC

B0S

DA

/TA

0.2

/A2/V

ere

f-

P1.3

/UC

B0S

OM

I/U

CB

0S

CL/M

CLK

/A3

13

14

P4.5

/UC

B0S

OM

I/U

CB

0S

CL/T

A3.2

15

P4.6

/UC

B0S

IMO

/UC

B0S

DA

/TA

3.1

16

17

18

P2.2

/AC

LK

/CO

MP

0.1

Hardware www.ti.com




Figure 4. MSP430FR2476 Pinout


www.ti.com Hardware




2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace™ TechnologyTo keep development easy and cost effective, TI’s LaunchPad development kits integrate an onboarddebug probe, which eliminates the need for expensive programmers. The LP-MSP430FR2476 has the eZ-FET debug probe (see Figure 5), which is a simple and low-cost debugger that supports all MSP430™device derivatives.

Figure 5. eZ-FET Debug Probe

The LP-MSP430FR2476 LaunchPad development kit features EnergyTrace technology but does not havesupport for EnergyTrace++ technology. The EnergyTrace technology functionality varies across the MSPportfolio (see Table 1).

Table 1. EnergyTrace Technology

Features EnergyTrace Technology EnergyTrace++ TechnologyCurrent monitoring ✔ ✔CPU state ✔Peripheral and system state ✔

Devices supported All MSP430 MCUs MSP430FR59xx and MSP430FR69xxMCUsDevelopment tool required MSP-FET or eZ-FET MSP-FET or eZ-FET

The dotted line through J101 shown in Figure 5 divides the eZ-FET debug probe from the target area. Thesignals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. For moredetails on the isolation jumper block, see Section 2.2.3.

The eZ-FET also provides a backchannel UART-over-USB connection with the host, which can be veryuseful during debugging and for easy communication with a PC. For more details on this connection, seeSection 2.2.4.

The eZ-FET hardware schematics are available in Section 6 and in the hardware design files downloadpage. For more information on the software and the debugger, visit the eZ-FET wiki.

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/lit/zip/slac788http://www.ti.com/lit/zip/slac788http://processors.wiki.ti.com/index.php/EZ-FET_lite

Hardware www.ti.com




2.2.3 Debug Probe Connection: Isolation Jumper BlockThe isolation jumper block at jumper J101 lets you connect or disconnect signals that cross from the eZ-FET domain into the MSP430FR2476 target domain. This includes eZ-FET Spy-Bi-Wire signals,application UART signals, and 3.3-V and 5-V power.

Reasons to open these connections:• To remove any and all influence from the eZ-FET debug probe for high accuracy target power

measurements• To control 3-V and 5-V power flow between the eZ-FET and target domains• To expose the target MCU pins for uses other than onboard debugging and application UART

communication• To expose the programming and UART interface of the eZ-FET to use it for devices other than the

onboard MCU• To select the CR2032 battery holder as the 3-V source

Table 2. Isolation Block Connections

Jumper DescriptionGND Ground5V 5-V VBUS from USB

3V3 3.3-V rail, derived from VBUS in the eZ-FET domain or 3V rail derived from CR2032 battery

RXD > Backchannel UART: The target FR2476 sends data through this signal. The arrows indicate the direction of thesignal.SBW RST Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).SBW TST Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.


www.ti.com Hardware




Figure 6. eZ-FET Isolation Jumper Block Diagram

2.2.4 Application (or Backchannel) UARTThe backchannel UART allows communication with the USB host that is not part of the target application’smain functionality. This is very useful during development and also provides a communication channel tothe host PC. Data from this communication channel can be used to create a graphical user interface (GUI)or other programs on the PC that communicate with the LaunchPad development kit.

Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART oneUSCI_A0.

A virtual COM port for the application backchannel UART is generated on the host when the LaunchPaddevelopment kit enumerates on the host. You can use any PC application that interfaces with COM ports,including terminal applications like Hyperterminal or Docklight, to open this port and communicate with thetarget application. You need to identify the COM port for the backchannel. On Windows PCs, DeviceManager can assist.

Figure 7. Application Backchannel UART in Device Manager


Hardware www.ti.com




The backchannel UART is the "MSP Application UART1" port. In this case, Figure 7 shows COM13, butthis port can vary from one host PC to the next. After you identify the correct COM port, configure it inyour host application according to its documentation. You can then open the port and begincommunication to it from the host.

On the target MSP430FR2476 MCU, the backchannel is connected to the eUSCI_A0 module. The eZ-FEThas a configurable baud rate, and it is important to configure the PC application with the same baud rateas the eUSCI_A0.

2.2.5 Special Features

2.2.5.1 TMP235 Temperature SensorThe MSP430FR2476 MCU LaunchPad development kit features a TMP235A2 temperature sensor that isaccurate to ±0.5°C (typical) from –40°C to +150°C. The analog output of the TMP235 is connected toanalog input A1 (P1.1) on the MSP430FR2476 through a capacitor (C7) and a pair of resistors (R12 andR13). The capacitor and resistors can be replaced if a custom RC circuit is needed. For applications thatuse the temperature sensor and a connected BoosterPack plug-in module, determine if there are any pinconflicts. The 3.3-V power rail can be disconnected from the TMP235 device by removing the shuntjumper at J9. This is useful in low-power applications that do not use the temperature sensor.

2.2.5.2 CR2032 Coin Cell BatteryOn the back of the LP-MSP430FR2476 board is a holder for a CR2032 coin cell battery (battery notincluded). A CR2032 battery can be added to demonstrate battery-powered applications. SeeSection 2.3.2 for additional details on how to power the LaunchPad development kit with the coin cellbattery.

2.3 PowerThe board accommodates various powering methods, including through the onboard eZ-FET, using theCR2032 battery, or using external or BoosterPack plug-in module power (see Figure 8).

Figure 8. LP-MSP430FR2476 Power Block Diagram

2.3.1 eZ-FET USB PowerThe most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-Vpower from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to thetarget side of the LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For3.3 V, make sure that a jumper is connected across the J101 3V3 terminal.


www.ti.com Hardware




2.3.2 CR2032 Battery PowerA CR2032 battery holder is on the back of the LP-MSP430FR2476 board to power the LaunchPaddevelopment kit from a single coin battery. To power the LaunchPad kit from the CR2032 coin cell, insertthe battery securely and in the correct orientation, and remove all of the shunt jumpers from J101 exceptthe 3V3 jumper. Place the 3V3 jumper in the lower configuration to connect the battery output to the targetside 3.3-V rail. This placement is also shown on the silkscreen on the PCB. Place a shunt jumper acrossJ10. Alternatively, place an ammeter across the pins of J10 to measure current out of the battery.

Do not use the eZ-FET emulation circuit when the LP-MSP430FR2476 is powered from the CR2032 coincell battery. Remove all of the shunt jumpers on J101 except the 3V3 (which is in the lower position) todisconnect the eZ-FET circuit from the target side of the LaunchPad development kit. The CR2032 voltagelevel will decrease with use and can cause voltage level violations on the eZ-FET portion of the design ifleft connected. To debug the target device, the LaunchPad development kit should be configured for eZ-FET USB Power as shown in Section 2.3.1

When not using the CR2032 battery to power the board, be sure the 3V3 shunt jumper on J101 is notplaced in the battery configuration. It is also useful to remove the jumper from J10 to disconnect thebattery from the rest of the power domains. This ensures there is no risk of applying an external voltagesource to the battery.

2.3.3 BoosterPack Plug-in Module and External Power SupplyHeaders J6 is present on the board to supply external power directly. It is important to comply with thedevice voltage operation specifications when supplying external power. The MSP430FR2476 has anoperating range of 1.8 V to 3.6 V. More information can be found in the MSP430FR247x Mixed-SignalMicrocontrollers data sheet.

2.4 Measure Current Draw of the MSP430 MCUTo measure the current draw of the MSP430FR2476 MCU using a multimeter, use the 3V3 jumper on theJ101 jumper isolation block. The current measured includes the target device and any current drawnthrough the BoosterPack plug-in module headers.

To measure ultra-low power, follow these steps:• Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper. Be

sure to use the correct pair of pins as outlined in Section 2.3 to select between eZ-FET power andCR2032 power.

• Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR2476 canhave on current draw. Consider disconnecting these at the isolation jumper block, or at least considertheir current sinking and sourcing capability in the final measurement.

• If using the CR2032 to supply power, remove all shunt jumpers at J101, except 3V3 in the lowerposition, and connect J10 with a shunt jumper.

• Make sure there are no floating inputs/outputs (I/Os) on the MSP430FR2476. These causeunnecessary extra current draw. Every I/O should either be driven out or, if it is an input, should bepulled or driven to a high or low level.

• Begin target execution.• Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a

stable measurement. It is easier to measure quiescent states.

EnergyTrace technology can also be used to compare various current profiles and better optimize yourenergy performance.

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/lit/pdf/SLASEO7http://www.ti.com/lit/pdf/SLASEO7

Hardware www.ti.com




2.5 ClockingThe LP-MSP430FR2476 provides an external clock in addition to the internal clocks in the device.• Q1: 32.768-kHz 12.5-pF crystal

The 32.768-kHz crystal allows for lower LPM sleep currents than do the other low-frequency clocksources. Therefore, the presence of the crystal allows the full range of low-power modes to be used.

The internal clocks in the device default to the following configuration:• MCLK: DCO at 1 MHz• SMCLK: DCO at 1 MHz• ACLK: REFO at 32.768 kHz

For more information about configuring internal clocks and using the external oscillators, see theMSP430FR4xx and MSP430FR2xx Family User's Guide.

2.6 Using the eZ-FET Debug Probe With a Different TargetThe eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 MCUs, notjust the onboard MSP430FR2476 target device.

To interface to another MCU, disconnect all jumpers in the isolation jumper block. This is necessarybecause the debug probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW)connection.

Next, make sure the target board has proper connections for SBW. To be compatible with SBW, thecapacitor on RST/SBWTDIO must be 2.2 nF or less. For documentation on designing MSP430 JTAGinterface circuitry, see the MSP430 Hardware Tools User's Guide.

Finally, wire together the following signals from the debug probe side of the isolation jumper block to thetarget hardware:• 5 V (if 5 V is needed)• 3.3 V• GND• SBWTDIO• SBWTCK• TXD (if the UART backchannel is to be used)• RXD (if the UART backchannel is to be used)

This wiring can be done either with jumper wires or by designing the board with a connector that plugs intothe isolation jumper block.

2.7 BoosterPack Plug-in Module PinoutThe LaunchPad development kit adheres to the 40-pin LaunchPad development kit pinout standard. Thisstandard was created to aid compatibility between LaunchPad development kits and BoosterPack plug-inmodules across the TI ecosystem.

While most BoosterPack plug-in modules are compliant with the standard, some are not. The LP-MSP430FR2476 LaunchPad development kit is compatible with all 40-pin BoosterPack plug-in modulesthat are compliant with the standard. If the reseller or owner of the BoosterPack plug-in module does notexplicitly indicate compatibility with the LP-MSP430FR2476 LaunchPad development kit, compare theschematic of the candidate BoosterPack plug-in module with the LaunchPad development kit to ensurecompatibility. Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR2476device pin function configuration in software.

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/lit/pdf/SLAU445http://www.ti.com/lit/pdf/SLAU278

www.ti.com Hardware




Figure 9. BoosterPack Checker Tool

To check the compatibility of a BoosterPack plug-in module with the LaunchPad development kit of yourchoice, use the BoosterPack Checker Tool. This allows you to select any LaunchPad development kit thatTI offers and determine its compatibility with any number of BoosterPack plug-in modules that we offer.You can also add your own BoosterPack plug-in module to check its compatibility as you prototype thatnext design.

Figure 10 shows the 40-pin pinout of the MSP430FR2476 LaunchPad development kit.

Note that software's configuration of the pin functions plays a role in compatibility. The LaunchPaddevelopment kit side of the dashed line shows only the applicable function for conforming to the standard.However, each pin has other functionality that can be configured by the software. See theMSP430FR2476 device data sheet for more details on individual pin functions.

Figure 10. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802https://dev.ti.com/bpchecker/#/

Hardware www.ti.com




2.8 Design Files

2.8.1 HardwareSchematics can be found in Section 6. All design files including schematics, layout, bill of materials(BOM), Gerber files, and documentation are available in the LP-MSP430FR2476 design files.

2.8.2 SoftwareAll software files including TI-TXT object-code firmware images, software example projects, anddocumentation are available on the LP-MSP430FR2476 software download page.

2.9 Hardware Change LogTable 3 lists the hardware revision history.

Table 3. Hardware Change Log

PCB Revision DescriptionRev A Initial release

3 Software ExamplesTwo software examples are included with the MSP430FR2476 LaunchPad development kit (see Table 4),which can be found in the MSP430FR2476 LaunchPad development kit download page and are alsoavailable in MSP430Ware software.

Table 4. Software Examples

Demo NameBoosterPack

Plug-in ModuleRequired

Description More Details

OutofBox_LP-MSP430FR2476 NoneThe out-of-box demo that is factory-programmed onthe LaunchPad development kit. Demonstratesfeatures of MSP430FR2476 device.

Section 3.1

BlinkLED_LP-MSP430FR2476 None Blinks an LED on the LaunchPad development kit at afixed interval. Section 3.2

To use any of the software examples with the LaunchPad development kit, you must have an integrateddevelopment environment (IDE) that supports the MSP430FR2476 device (see Table 5).

Table 5. IDE Minimum Requirements for LP-MSP430FR2476

Code Composer Studio IDE IAR Embedded Workbench for TexasInstruments MSP430 IDEv8.0 or later v7.12.1 or later

For more details on how to get started quickly and where to download the latest CCS and IAR IDEs, seeSection 4.

3.1 Out-of-Box Software ExampleThis section describes the functionality and structure of the Out-of-Box software that is preloaded in theEVM.

The Out-of-Box Experience (OOBE) of the LP-MSP430FR2476 LaunchPad development kit demonstrateshow to implement a simple thermometer by using the internal ADC of the MSP430FR2476 to measure theoutput voltage from an analog temperature sensor.

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/lit/zip/slac788http://software-dl.ti.com/msp430/msp430_public_sw/mcu/msp430/MSP-EXP430FR2476/latest/index_FDS.htmlhttp://software-dl.ti.com/msp430/msp430_public_sw/mcu/msp430/MSP-EXP430FR2433/latest/index_FDS.htmlhttp://www.ti.com/tool/msp430ware

www.ti.com Software Examples




3.1.1 Source File StructureThe project is split into multiple files (see Table 6). This makes it easier to navigate and reuse parts of itfor other projects.

Table 6. Source File and Folders

Name Descriptionmain.c Out-of-Box demo main functionLibrary: driverlib Device driver library

3.1.2 OverviewWhen powering up the Out-of-Box demo, the board performs an initial temperature calibration andilluminates RGB LED2 in a green color. Try to heat the temperature sensor U1 by blowing hot air on it tosee if you can get LED2 to turn red or using a compressed air can to blow cold air onto the sensor to seeLED2 turn blue. LED2 indicates the relative difference between the current temperature and the calibratedmeasurement.

Press button S1 to recalibrate the temperature to the most recent measurement and send a UARTmessage (at 9600 baud) containing the new calibrated temperature through the backchannel UART. Pressbutton S2 at any time to send a UART message containing the current ambient temperature measurementin Celsius.

3.2 Blink LED ExampleThis software example shows how to software toggle a GPIO to blink an LED on the LaunchPaddevelopment kit.

3.2.1 Source File StructureThe project is split into multiple files (see Table 7). This makes it easier to navigate and reuse parts of itfor other projects.

Table 7. Source File and Folders

Name Descriptionmain.c The Blink LED main functionLibrary: Driverlib Device driver library

The main code uses the MSP430 Driver Library to halt the watchdog timer and to configure and toggle theP1.0 GPIO pin connected to the LED inside a software loop.

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/tool/msp430driverlib

Resources www.ti.com




4 Resources

4.1 Integrated Development EnvironmentsAlthough the source files can be viewed with any text editor, more can be done with the projects if they’reopened with a development environment like Code Composer Studio IDE (CCS) or IAR EmbeddedWorkbench IDE.

4.1.1 TI Cloud Development ToolsTI’s Cloud-based software development tools provide instant access to MSP430Ware content and a web-based IDE.

4.1.1.1 TI Resource Explorer CloudTI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentationfound in MSP430Ware without having to download files to your local drive.

Find out more about TI Resource Explorer Cloud at dev.ti.com.

Figure 11. TI Resource Explorer Cloud

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://www.ti.com/ww/en/launchpad/software.htmlhttp://dev.ti.com/

www.ti.com Resources




4.1.1.2 Code Composer Studio CloudCode Composer Studio Cloud (CCS Cloud) is a web-based IDE that lets you quickly create, edit, build,and debug applications for a LaunchPad development kit. No need to download and install large softwarepackages, simply connect your LaunchPad development kit and begin. You can choose to select from alarge variety of examples in MSP430Ware software and Energia or develop your own application. CCSCloud supports debug features such as execution control, breakpoints and viewing variables.

For more information, see the full comparison between CCS Cloud and CCS Desktop.

Try Code Composer Studio Cloud now at dev.ti.com.

Figure 12. CCS Cloud

4.1.2 Code Composer Studio IDECode Composer Studio Desktop is a professional integrated development environment that supports TI'smicrocontroller and embedded processors portfolio. Code Composer Studio Desktop comprises a suite oftools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, sourcecode editor, project build environment, debugger, profiler, and many other features.

Learn more about CCS and download it at http://www.ti.com/tool/ccstudio.

CCS v8.0 or higher is required for this development kit. To load an existing project, launch CCS, choose aworkspace directory, and click Project>Import Existing CCS Eclipse Project. Browse to the desired demoproject directory that contains main.c (see Figure 13).

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802https://dev.ti.com/about#cloudordesktophttp://dev.ti.com/http://www.ti.com/tool/ccstudio





Figure 13. Directing the Project>Import Function to the Demo Project

Selecting the \CCS subdirectory also works. The CCS-specific files are located there.

When you click OK, CCS should recognize the project and allow you to import it. The indication that CCShas found it is that the project appears in the box shown in Figure 14, and it has a checkmark to the left ofit.

Figure 14. When CCS Has Found the Project

Sometimes CCS finds the project but does not show a checkmark; this might mean that your workspacealready has a project by that name. You can resolve this by renaming or deleting that project. (Even if youdo not see it in the CCS workspace, look in the workspace directory on the file system.)


www.ti.com Resources




4.1.3 IAR Embedded Workbench for MSP430 IDEIAR Embedded Workbench for MSP430 is another powerful integrated development environment that letsyou develop and manage complete embedded application projects. It integrates the IAR C/C++ compiler,IAR assembler, IAR ILINK linker, editor, project manager, command line build utility, and IAR C-SPY®debugger.

Learn more about IAR Embedded Workbench for MSP430 and download it at the IAR Systems website.

IAR v7.12.1 or higher is required for this development kit. To open the demo in IAR, clickFile>Open>Workspace…, and browse to the *.eww workspace file inside the \IAR subdirectory of thedesired demo. All workspace information is contained within this file.

The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace byclicking Project>Add-Existing-Project….

Although the software examples have all of the code required to run them, IAR users can download andinstall MSP430Ware, which contains MSP430 libraries and the TI Resource Explorer. These are alreadyincluded in a CCS installation (unless the user selected otherwise).

4.2 LaunchPad Development Kit WebsitesMore information about the LaunchPad development kit, supported BoosterPack plug-in modules, andavailable resources can be found at:• LP-MSP430FR2476 tool folder: resources specific to this particular LaunchPad development kit• TI’s LaunchPad development kit portal: information about all LaunchPad development kits from TI

4.3 MSP430Ware and TI Resource ExplorerTI Resource Explorer is a tool integrated into CCS that allows you to browse through available designresources. TI Resource Explorer will help you quickly find what you need inside packages includingMSP430Ware, ControlSuite, TivaWare and more. TI Resource Explorer is well organized to findeverything that you need quickly, and you can import software projects into your workspace in one click.

TI Resource Explorer Cloud is one of the TI Cloud Development tools, and is tightly integrated with CCSCloud. See Section 4.1.1 for more information.

MSP430Ware is a collection of code examples, software libraries, data sheets and other design resourcesfor all MSP430 devices delivered in a convenient package – essentially everything developers need tobecome MSP experts.

In addition to providing a complete collection of existing MSP430 design resources, MSP430Ware alsoincludes a high-level API called MSP Driver Library. This library makes it easy to talk to MSP430hardware. For more information, visit MSP430Ware for MSP Microcontrollers.

Figure 15. Using TI Resource Explorer to Browse LP-MSP430FR2476 in MSP430Ware

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802https://www.iar.com/http://www.ti.com/tool/LP-MSP430FR2467http://www.ti.com/launchpadhttp://www.ti.com/tool/mspware





In TI Resource Explorer, you can find these examples and many more and can easily import them intoCCS with one click.

4.4 FRAM UtilitiesThe Texas Instruments FRAM Utilities is a collection of embedded software utilities that leverage the ultra-low-power and virtually unlimited write endurance of FRAM. The utilities are available for MSP430FRxxFRAM microcontrollers and provide example code to help start application development.

4.4.1 Compute Through Power LossCompute Through Power Loss is a utility API set that enables ease of use with LPMx.5 low-power modesand a powerful shutdown mode that allows an application to save and restore critical system componentswhen a power loss is detected.

4.4.2 Nonvolatile Storage (NVS)The nonvolatile storage (NVS) library makes handling of nonvolatile data easy and robust againstintermittent power loss or asynchronous device resets. To keep data storage constant, the nonvolatilestorage library contains functions that store data in a way that is guaranteed to recover the last valid entrywithout data corruption.

4.5 MSP430FR2476 MCU

4.5.1 Device DocumentationAt some point, you will probably want more information about the MSP430FR2476 device. For every MSPdevice, the documentation is organized as shown in Table 8.

Table 8. How MSP Device Documentation is Organized

Document For MSP430FR2476 DescriptionDevice familyuser’s guide

MSP430FR4xx and MSP430FR2xx FamilyUser's Guide

Architectural information about the device, including all modulesand peripherals such as clocks, timers, ADC, and so on

Device-specificdata sheet

MSP430FR247x Mixed-SignalMicrocontrollers Data Sheet

Device-specific information and all parametric information for thisdevice

4.5.2 MSP430FR2476 Code ExamplesMSP430FR267x, MSP430FR247x code examples is a set of simple C examples that demonstrate how touse the entire set of peripherals on the MSP430FR2476 MCU, including serial communication, ADC10,timers, and others, through direct register access. Every MSP derivative has a set of these codeexamples. When starting a new project or adding a new peripheral, these examples serve as a greatstarting point.

4.5.3 MSP430 Application Notes and TI DesignsMany application notes can be found at www.ti.com/msp430. Also see TI reference designs for practicaldesign examples and topics.

4.6 Community Resources

4.6.1 TI E2E™ CommunitySearch the forums at e2e.ti.com. If you cannot find your answer, post your question to the community.

4.6.2 Community at LargeMany online communities focus on the LaunchPad development kit—for example, www.43oh.com. Youcan find additional tools, resources, and support from these communities.

http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU802http://software-dl.ti.com/msp430/msp430_public_sw/mcu/msp430/FRAM_Utilities/latest/exports/FRAM-Utilities-UsersGuide.pdfhttp://www.ti.com/framhttp://www.ti.com/framhttp://www.ti.com/lit/pdf/slau445http://www.ti.com/lit/pdf/slau445http://www.ti.com/lit/pdf/SLASEO7http://www.ti.com/lit/pdf/SLASEO7http://www.ti.com/lit/zip/slac781http://www.ti.com/msp430http://www.ti.com/reference-designs/index.htmlhttp://e2e.ti.com/http://www.43oh.com/

www.ti.com FAQ




5 FAQQ: I can’t get the backchannel UART to connect. What’s wrong?A: Check the following:• Do the baud rate in the host terminal application and the eUSCI settings match?• Are the appropriate jumpers in place on the isolation jumper block?• Probe on RXD and send data from the host. If you don’t see data, it might be a problem on the host

side.• Probe on TXD while sending data from the MSP430 MCU. If you don’t see data, it might be a

configuration problem with the eUSCI module.• Consider the use of the hardware flow control lines (especially for higher baud rates).

Q: The MSP430G2 LaunchPad development kit had a socket, allowing me change the target device.Why doesn’t this LaunchPad development kit use one?A: The target device on this LaunchPad development kit does not come in a dual in-line package. Socketsfor the available device package are too expensive for this kit’s target price.


1

1

2

2

3

3

4

4

5

5

6

6

7

7

8

8

D D

C C

B B

A A

1 5ez-FET: Host-MCU, USB, Power

12/19/2018

MCU045A_ezFET_Host.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of

A3 http://www.ti.comContact: http://www.ti.com/support

LP-MSP430FR2476Project Title:Designed for: Public Release

Assembly Variant: 001

Texas Instruments 2018

Drawn By:Engineer: S Kim

Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do notwarrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.

Version control disabledSVN Rev:MCU045Number: Rev: A

TID #: N/AOrderable: LP-MSP430FR2476

EZ_GND

EZFET_LED0EZFET_LED1EZFET_LED2

EZ_GND

EZFET_Vref

to DC/DC-MCU

to Target-Connector

EZ_GND

EZ_GND EZ_GND EZ_GND

EZFET_VCC

EZFET_V18

EZFET_VUSB

EZFET_Vcore

EZFET_VCC

EZ_GND

EZFET_VBUS

EZ_GND

EZFET_VCCEN1EZFET_VCCEN2

to Power switch

EZFET_DCDCPULSEto DC/DC-MCU

EZFET_UARTCTSEZFET_UARTRTS

to Target

EZFET_SBWTDIOEZFET_SBWTCK

to Target

EZFET_NC_TMSC

EZFET_A_VBUSEZFET_A_VCCOUT2ADC

to Voltage-Divider

EZFET_DCDCIO0EZFET_DCDCIO1EZFET_DCDCRSTEZFET_DCDCTEST

EZFET_TDOEZFET_TDIEZFET_TMSEZFET_TCK

EZFET_RSTEZFET_TEST

EZ_GND

EZ_GND

EZFET_VCC

Reset Circuit

Host MCU for Emulation

(not used)

(not used)

EZ_GND

EZ_GND

EZFET_VBUS

Place either R110 or R112

EZ_GND EZ_GND

EZFET_5V

EZ_GND EZ_GND

EZ_GNDEZ_GNDEZ_GND

EZFET_D_N

EZFET_PUR

EZFET_D_P

USB_D_N

USB_D_P

USB-Interface

EZFET_VBUS

EZ_GND EZ_GND EZ_GND

EZ_GND

EZ_GND

3.3V Power (EZFET_VCC)

Customer Note - Change IC U101 to adjust voltage from 2.8 to 3.6VTPS773533: 3.3V

EZFET_UARTTXD

to Host-MCU

EZ_GND

EZFET_VCCTARGETEZFET_VBUS

EZ_GND

GND

TST/SBWTCKRST/SBWTDIO

3V3

5V0

to Target

Target Connector

EZFET_TCK

EZFET_RST

EZFET_TEST

Host-MCU Debug Connector

TAG-Connector (Host Debug)

EZFET_UARTRXDP1.5_UART_RX to Target

to Host-MCUto Host-MCU

to Target

EZFET_VCC

EZ_GND

EZFET_VCC

EZ_GND

EZ_GND

EZFET_VCC

EZFET_LDOCurrent_Sense

EZFET_LDOCurrent_Sense

from Current-Sense

EZFET_VBUS

to Current Sense Ampllifier

to Host-MCU

from 3.3V Power

EZFET_LDOOUT

EZFET_LDOOUT

EZ_GND

Current Sense Amplifier

EZFET_SBWTDIO

EZ_GND

EZFET_SBWTCK

EZFET_RST

EZFET_D_P

EZFET_PUR

EZFET_D_N

EZFET_XT2INEZFET_XT2OUT

EZFET_SDAEZFET_SCL

EZFET_UARTTXDEZFET_UARTRXD

EZFET_TDO

EZFET_TDI

EZFET_TMS

1

2

3

4

5 6

7

8

9

10

J100

TC2050-IDC-NL-FP

DNP

GND2

IN+4

IN-5

REF1

V+3

OUT6

INA214AIDCKRU102

10.0R109

10.0R111

10.0R10410.0R105

10.0R107

OUT1

NR2

EN4

NC5

IN6

GND

TPS73533DRVRU101

2.2uFC103

0.2R102

VBUS1

D-2

D+3

ID4

GND5

J1021051640001 D103

B0530W-7-F

33kR117

VCC1

NC2

IO13

GND4

IO25

TPD2E001DRLR

U103

27R113

27R114

1.0MR116

1.40kR115

0

R110

0R112

DNP4.7uF

C121

RedD100

GreenD101

YellowD102

470R100

390R101

390R103

4.7uF

C111

4.7uF

C115

47kR108

P6.0/CB0/A01

P6.1/CB1/A12

P6.2/CB2/A23

P6.3/CB3/A34

P6.4/CB4/A45

P6.5/CB5/A56

P6.6/CB6/A67

P6.7/CB7/A78

P5.0/A8/VREF+/VEREF+9

P5.1/A9/VREF-/VEREF-10

AVCC111

P5.4/XIN12

P5.5/XOUT13

AVSS114

DVCC115

DVSS116

VCORE17

P1.0/TA0CLK/ACLK18

P1.1/TA0.019

P1.2/TA0.120

P1.3/TA0.221

P1.4/TA0.322

P1.5/TA0.423

P1.6/TA1CLK/CBOUT24

P1.7/TA1.025

P2.0/TA1.126

P2.1/TA1.227

P2.2/TA2CLK/SMCLK28

P2.3/TA2.029

P2.4/TA2.130

P2.5/TA2.231

P2.6/RTCCLK/DMAE032

P2.7/UCB0STE/UCA0CLK33

P3.0/UCB0SIMO/UCB0SDA34

P3.1/UCB0SOMI/UCB0SCL35

P3.2/UCB0CLK/UCA0STE36

P3.3/UCA0TXD/UCA0SIMO37

P3.4/UCA0RXD/UCA0SOMI38

DVSS239

DVCC240

P4.0/PM_UCB1STE/PM_UCA1CLK41

P4.1/PM_UCB1SIMO/PM_UCB1SDA42

P4.2/PM_UCB1SOMI/PM_UCB1SCL43

P4.3/PM_UCB1CLK/PM_UCA1STE44

P4.4/PM_UCA1TXD/PM_UCA1SIMO45

P4.5/PM_UCA1RXD/PM_UCA1SOMI46

P4.6/PM_NONE47

P4.7/PM_NONE48

VSSU49

PU.0/DP50

PUR51

PU.1/DM52

VBUS53

VUSB54

V1855

AVSS256

P5.2/XT2IN57

P5.3/XT2OUT58

TEST/SBWTCK59

PJ.0/TDO60

PJ.1/TDI/TCLK61

PJ.2/TMS62

PJ.3/TCK63

RST/NMI/SBWTDIO64

QFN PAD65

MSP430F5528IRGCT

U100

Connector

Connector

L100

150 ohm

L101

150 ohm

1 2

3 4

5 6

7 8

9 10

11 12

13 14

SBWTCKSBWTDIO

RXD>

3.3V5.0VGND

J101

PEC07DAANEZFET_VBUS

1uFC100

1uFC104

1uFC112

0.47uFC109

2

4MHzY100

10.0R106P1.4_UART_TX

0.1uFC117

0.1uFC120

0.1uFC101

0.1uFC105

0.1uFC113

0.1uFC114

0.1uFC116

0.1uFC118

0.1uFC122

0.1uFC126

0.01uFC102

0.01uFC142

0.22 FC108

0.22 FC110

0.22 FC125

10pFC119

10pFC123

10pFC124

10pFC106DNP

10pFC107DNP

Schematics www.ti.com




6 Schematics

Figure 16. Schematics (1 of 4)


1

1

2

2

3

3

4

4

5

5

6

6

7

7

8

8

D D

C C

B B

A A

2 5ez-FET: DCDC, Voltage-Divider, Power-Switch

12/19/2018

MCU045A_eZFET_DCDC.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of

A3 http://www.ti.comContact: http://www.ti.com/support








EZFET_DCDCRSTEZFET_DCDCTEST

to Voltage-Dividerto Cal-Resistorsto DCDC-Switch

to Host-MCU

to Voltage-Divider

to Host-MCUto Host-MCU

EZFET_VCC

EZ_GND

EZFET_DCDCCAL0EZFET_DCDCCAL2

to Cal-Resistors

DCDC-Calibration ResistorsEZFET_VCCOUT

DCDC-MCU

EZ_GND

EZFET_VCC

EZFET_A_VCC

EZ_GND

EZFET_VCCOUT

EZ_GND EZ_GND

EZFET_A_VCCOUT EZFET_A_VCCOUT2ADCEZFET_A_VBUSto DCDC-MCU to DCDC-MCUto Host-MCU to Host-MCU

Voltage DividersEZFET_VCCOUTEZFET_VBUS

EZ_GNDEZ_GND EZ_GND EZ_GND

EZFET_VCCOUT

EZ_GND

EZ_GND

DCDC-Switch

to DCDC-MCU

Power Switch

Energy measurement method protected under U.S. PatentApplication 13/329,073 and subsequent patent applications.

Software-controlled DCDC converter

EZFET_5V

to Host-MCU

EZ_GNDEZ_GND

EZFET_VCCTARGET

EZ_GND

EZFET_VCC

EZ_GND

EZFET_VCCOUT

to Host-MCU

EZFET_DCDCCAL0

EZFET_DCDCCAL2

EZFET_DCDCPULSEEZFET_VCCEN2 EZFET_VCCEN1

EZFET_DCDCCAL1

EZFET_A_VCCOUT

EZFET_DCDCPULSEEZFET_DCDCIO0EZFET_DCDCIO1EZFET_A_VCC

EZFET_DCDCCAL1

EZFET_SDAEZFET_SCL

4.7kR118

4.7kR119

220kR125

220kR129

2.20kR133

3.30kR134

6.81kR137

2.2uFC127

4.7uF

C128

820R121

1

2

3

D104

BAS40-05,215

470R120

1

Q100DMG1013UW-7

1.00MR122

DNP

0R124

1 Q101BC850CW,115

D105BAS40-05,215

2.2uH

L102

4.7uF

C132

0.047R123

VIN11

ON13

VBIAS4

ON25

VIN26

VOUT28

CT210

GND11

CT112

VOUT114

DAP15

VIN12

VOUT113

VIN27

VOUT29

TPS22968NDPUR

U105

47kR135

47kR136

240kR126

220kR127

220kR128

220kR132

150kR130

220kR131

P1.0/TA0CLK/ACLK/A0/CA01

TEST/SBWTCK10

P2.7/XOUT11

P2.6/XIN/TA0.112

AVSS13

DVSS14

AVCC15

DVCC16

PAD17

P1.1/TA0.0/A1/CA12

P1.2/TA0.1/A2/CA23

P1.3/ADC10CLK/CAOUT/A3/VREF-/VEREF-/CA34

P1.4/SMCLK/TA0.2/A4/VREF+/VEREF+/CA4/TCK5

P1.5/TA0.0/SCLK/A5/CA5/TMS6

P1.6/TA0.1/SDO/SCL/A6/CA6/TDI/TCLK7

P1.7/CAOUT/SDI/SDA/A7/CA7/TDO/TDI8

RST/NMI/SBWTDIO9

MSP430G2452IRSA16T

U104

EZ_GND

4.7uFC130

EZFET_VCC

1uFC1400.1uF

C129

0.1uFC141

0.1uFC131

0.1uFC133DNP

33pFC134

33pFC135

33pFC136

33pFC137

33pFC138DNP

33pFC139DNP

www.ti.com Schematics






1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

3 5Launchpad Target Device and Headers

12/19/2018

MCU045A_Target_Device.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of

B http://www.ti.comContact: http://www.ti.com/support








GND

MSP430FR2476 Target

GND

3V35V0

GND GND

BoosterPack Headers

32.768kHz

Y1

5V0

DVCC1

P2.7/UCB1STE/CAP3.036

P2.6/UCA1TXD/UCA1SIMO/CAP1.330

P5.0/UCA0CLK/TB0.243

RST/NMI/SBWTDIO2

P5.1/UCA0RXD/UCA0SOMI/TB0.344

P5.2/UCA0TXD/UCA0SIMO/TB0.445

P2.2/SYNC/ACLK/COMP0.116

P3.0/TA2.2/CAP0.023

P3.1/UCA1STE/CAP1.027

P3.2/UCB1SIMO/UCB1SDA/CAP3.238

P3.3/TA2.1/CAP0.124

P2.0/XOUT46

P2.1/XIN47

P4.0/TA3.1/CAP2.133

P4.1/TA3.0/CAP2.234

P4.2/TA3CLK/CAP2.335

P4.3/UCB1SOMI/UCB1SCL/TB0.5/A88

P4.4/UCB1SIMO/UCB1SDA/TB0.6/A99

P4.5/UCB0SOMI/UCB0SCL/TA3.217

P4.6/UCB0SIMO/UCB0SDA/TA3.118

P4.7/UCA0STE/TB0.142

P3.4/TA2CLK/COMP0OUT/CAP0.326

P3.5/UCB1CLK/TB0TRG/CAP3.137

P3.6/UCB1SOMI/UCB1SCL/CAP3.339

P3.7/TA3.2/CAP2.032

P2.3/TA2.0/CAP0.225

P2.4/UCA1CLK/CAP1.128

P1.0/UCB0STE/TA0CLK/A0/VEREF+12

P1.1/UCB0CLK/TA0.1/COMP0.0/A113

P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2/VEREF-14

P1.3/UCB0SOMI/UCB0SCL/MCLK/A315

P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4/VREF+4

P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A55

P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A66

P1.7/UCA0STE/SMCLK/TDO/A77

TEST/SBWTCK3

DVSS48

VREG31

P2.5/UCA1RXD/UCA1SOMI/CAP1.229

P5.3/UCB1CLK/TA3.0/A1010

P5.4/UCB1STE/TA3CLK/A1111

P5.5/UCB0CLK/TA2CLK19

P5.6/UCB0STE/TA2.020

P5.7/TA2.1/COMP0.221

P6.0/TA2.2/COMP0.322

P6.1/TB0CLK40

P6.2/TB0.041

MSP430FR2476TPT

MSP13V3

GND

GND

P1.0_A0_LED1

3V3

P1.6_A6P2.5_UART_RXP2.6_UART_TX

P2.2_I/OP5.4_A11

P3.5_SPICLKP4.5_I/O

P1.2_I2CSDA

P1.7_A7P4.3_A8P4.4_A9

P5.3_A10

P1.1_A1P1.0_A0_LED1

P5.7_PWMP3.7_PWM

GND

P1.3_I2CSCL

P1.1_A1P1.2_I2CSDAP1.3_I2CSCL

P1.4_UART_TXP1.5_UART_RX

P1.6_A6P1.7_A7

P3.1_I/OP3.2_SPIMOSI

P3.3_TC

P3.5_SPICLKP3.6_SPIMISO

P3.7_PWM

P5.0_PWM_LED2greenP5.1_PWM_LED2red

P5.2_PWMP5.3_A10P5.4_A11

P5.7_PWM

P2.0_XOUT

P2.1_XINP2.2_I/OP2.3_S2P2.4_I/OP2.5_UART_RXP2.6_UART_TXP2.7_SPICS

P4.0_S1P4.1_I/OP4.2_I/OP4.3_A8P4.4_A9P4.5_I/OP4.6_PWM

P4.7_PWM_LED2blue

P6.0_TCP6.1_I/O

RST/SBWTDIOTST/SBWTCK

P2.0_XOUT P2.1_XIN

P2.0_I/O

P2.1_I/O

P5.2_PWM

P4.1_I/O

P3.3_TCP6.0_TC

P3.1_I/O P2.4_I/OP2.7_SPICS

P4.2_I/O

P5.1_PWM_LED2redP5.0_PWM_LED2greenP4.7_PWM_LED2blue

P3.6_SPIMISOP3.2_SPIMOSI

RST/SBWTDIO

P4.6_PWM

GNDP2.1_I/OP2.0_I/O

P6.2_I/O

P6.2_I/OP6.1_I/O

10uF

C10

R3DNP

0

R2DNP

0

R4

0

R1

+3.3V1

Analog_In2

LP_UART_RX3

LP_UART_TX4

GPIO !5

Analog In6

SPI_CLK7

GPIO !8

I2C_SCL9

I2C_SDA10

+5V21

GND22

Analog_In23

Analog_In24

Analog_In25

Analog_In26

Analog_In/I2S_WS27

Analog_In/I2S_SCLK28

Analog_Out/I2S_SDout29

Analog_Out/I2S_SDin30

J1/J3

SSQ-110-03-T-D

GPIO !31

GPIO !32

GPIO !33

GPIO !34

Timer_Cap/GPIO !35

Timer_Cap/GPIO !36

PWM/GPIO !37

PWM/GPIO !38

PWM/GPIO !39

PWM/GPIO !40

GPIO !11

SPI_CS/GPIO !12

SPI_CS/GPIO !13

SPI_MISO14

SPI_MOSI15

RST16

GPIO17

GPIO !18

PWM/GPIO !19

GND20

J2/J4

SSQ-110-03-T-D

1

2

3

J51

2

3

J6

0.1uFC2

12pFC3

12pFC4

Schematics www.ti.com






1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

4 5LaunchPad LEDs, Switches, and Sensor

12/19/2018

MCU045A_LEDs_Switch_Sensors.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of

B http://www.ti.comContact: http://www.ti.com/support








P4.7_PWM_LED2blue

GND

GND

LEDs

P5.1_PWM_LED2redP5.0_PWM_LED2greenP1.0_A0_LED1

GND GND

General Purpose Button

GND GND GND

Reset Button

RST/SBWTDIO

Pushbuttons

P4.0_S1

GND GND

General Purpose Button

P2.3_S2

NC1

GND2

VOUT3

VDD4

NC5

TMP235A2DCK

U1

3V3

GND GND

Temperature Sensor

GND

CR2032 Holder

BT1

P1.1_A1

J9

RGB_red

RGB_blueRGB_green RGB_red

RGB_green

RGB_blue

J7

390

R5

Green

LED1

1 2

3 4

5 6

J8

24R8

110R6

16R7

14

25

36

B

R

G

LED2

19-337/R6GHBHC-A01/2T

34

12

S1

34

12

S2

47.0kR9

47.0kR10

47kR11

3 4

1 2

S3

3V3

3V3

3V3

GND

0

R12

0

R13

J10

D1RB751S40T5G

J11

0.1uFC6

1000pFC5

680pFC7

www.ti.com Schematics






IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCEDESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANYIMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRDPARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriateTI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicablestandards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants youpermission to use these resources only for development of an application that uses the TI products described in the resource. Otherreproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any thirdparty intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either onti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicablewarranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2019, Texas Instruments Incorporated

http://www.ti.com/legal/termsofsale.htmlhttp://www.ti.com

MSP430FR2476 LaunchPad™ Development Kit (LP‑MSP430FR2476) User's Guide1 Getting Started1.1 Introduction1.2 Key Features1.3 What’s Included1.3.1 Kit Contents1.3.2 Software Examples

1.4 First Steps: Out-of-Box Experience1.4.1 Connecting to the Computer1.4.2 Running the Out-of-Box Experience (OOBE)

1.5 Next Steps: Looking Into the Provided Code

2 Hardware2.1 Block Diagram2.2 Hardware Features2.2.1 MSP430FR2476 MCU2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace™ Technology2.2.3 Debug Probe Connection: Isolation Jumper Block2.2.4 Application (or Backchannel) UART2.2.5 Special Features2.2.5.1 TMP235 Temperature Sensor2.2.5.2 CR2032 Coin Cell Battery

2.3 Power2.3.1 eZ-FET USB Power2.3.2 CR2032 Battery Power2.3.3 BoosterPack Plug-in Module and External Power Supply

2.4 Measure Current Draw of the MSP430 MCU2.5 Clocking2.6 Using the eZ-FET Debug Probe With a Different Target2.7 BoosterPack Plug-in Module Pinout2.8 Design Files2.8.1 Hardware2.8.2 Software

2.9 Hardware Change Log

3 Software Examples3.1 Out-of-Box Software Example3.1.1 Source File Structure3.1.2 Overview

3.2 Blink LED Example3.2.1 Source File Structure

4 Resources4.1 Integrated Development Environments4.1.1 TI Cloud Development Tools4.1.1.1 TI Resource Explorer Cloud4.1.1.2 Code Composer Studio Cloud

4.1.2 Code Composer Studio IDE4.1.3 IAR Embedded Workbench for MSP430 IDE

4.2 LaunchPad Development Kit Websites4.3 MSP430Ware and TI Resource Explorer4.4 FRAM Utilities4.4.1 Compute Through Power Loss4.4.2 Nonvolatile Storage (NVS)

4.5 MSP430FR2476 MCU4.5.1 Device Documentation4.5.2 MSP430FR2476 Code Examples4.5.3 MSP430 Application Notes and TI Designs

4.6 Community Resources4.6.1 TI E2E Community4.6.2 Community at Large

5 FAQ6 Schematics

Important Notice

Date post:	30-Jan-2021
Category:	Documents
Upload:	others
View:	3 times
Download:	0 times

MSP430FR2476 LaunchPad™ Development Kit (LP … · MSP430Ware software. Code Composer Studio...

Documents