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M.Tech. new1 syllabus

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Study & Evaluation Scheme o f Master of Technology (Electronics) [Applicable w.e.f. Academic Session 2010-11 till revised] TEERTHANKER MAHAVEER UNIVERSITY N.H.-24, Delhi Road, Moradabad, Uttar
Page 1: M.Tech. new1 syllabus

Study & Evaluation Scheme


Master of Technology(Electronics)

[Applicable w.e.f. Academic Session 2010-11 till revised]

TEERTHANKER MAHAVEER UNIVERSITYN.H.-24, Delhi Road, Moradabad, Uttar Pradesh-244001

Website: www .tmu.ac.i n

Page 2: M.Tech. new1 syllabus

Internal External Total25% 75% 100%





Assignment(s) OtherActivity

(including attendance)







Internal External Total50% 50% 100%

External Internal3 hrs. 1 ½ hrs


TTEEEERRTTHANHANKKEERR MMAAHHAVAVEEEERR UNUNIIVVEERRSSIITTYY(E(Esstatabblilishsheded uunndederr GGoovvt.t. ooff U.U. PP.. AActct NNoo.. 3030,, 20200088))

DelhiDelhi RoaRoadd,, BagaBagarrpur,pur, MoradabadMoradabad (U.P)(U.P)

Study & Evaluation Scheme Master of Technology


Programme : M.Tech. ( Electronics)

Duration : Two year full time (Four Semesters)

Medium : English

Minimum Required Attendance : 75 percent

Credit :

Maximum Credit :114

Minimum credit required for the degree : 108

Assessment :

Internal Evaluation (Theory Papers)

Evaluation of Practical/Dissertations & Project Reports


Duration of Examination :

To qualify the course a student is required to secure a minimum of 40 % marks in aggregate including the semester end examination and teachers continuous evaluation.(i.e. both internal and external).A candidate who secures less than of 40% of marks in a course shall be deemed to have failed in thatcourse. The student should have at least 50% marks in aggregate to clear the semester. In case a student has more than 40% in each course, but less than 50% overall in a semester , he/she shall re-appear in courses where the marks are less than 50% to achieve the required aggregate percentage of 50% in the semester.

Question Paper Structure1. The question paper shall consist of eight questions. Out of which first question shall be of short

answer type (not exceeding 50 words) and will be compulsory. Question No. 1 shall contain 8 parts representing all units of the syllabus and students shall have to answer any five (weight age 3 marks each).

2. Out of the rest seven questions, student shall be required to attempt any five questions. There will beminimum one and maximum two questions from each unit of the syllabus. The weight age of QuestionNo. 2 to 8 shall be 12 marks each.

Page 3: M.Tech. new1 syllabus

S. No.


Subject Periods Credit Evaluation SchemeL T P Internal External Total

1 MEC101 MOS Circuit Design 3 2 - 4 25 75 100

2 MEC102 VLSI Technology 3 2 - 4 25 75 100

3 MEC103 Digital Systems Design 3 2 - 4 25 75 100

4 MEC104 Solid State Device Mod-ling and Simulation

3 2 - 4 25 75 100

5 MEC105 Digital Signal Processing and Applications

3 2 - 4 25 75 100

6 MEC151 Lab ( HDL tools) - - 4 2 50 50 100

7 MEC152 Matlab (Lab) - - 4 2 50 50 1008 MEC153 Seminar - - 4 2 50 50 100

9 MEC171 Discipline & GeneralProficiency

- - - 2 100 - 100

Total 15 10 12 28 375 525 900

Study & Evaluation Scheme

Programme: M.Tech. (Electronics)

Semester 1

Semester 2

S. No.


Subject Periods Credit Evaluation SchemeL T P Internal External Total

1 MEC201 Digital Systems Testing  and Simulation with VHDL

3 2 - 4 25 75 100

2 MEC202  High Speed Analog  Design Techniques

3 2 - 4 25 75 100

3 MEC203 Optimization with Numerical Techniques

3 2 - 4 25 75 100

4 Elective 1 -Select any one MEC204 CMOS RF Circuit Design 3 2 - 4 25 75 100

MEC205  Design of Semiconductor Memories

5 Elective 2 -Select any one MEC206 Analog and low power digital

VLSI design

3 2 - 4 25 75 100

MEC207 Microcontroller and


6 MEC251  EDA-1 (Lab) - - 4 2 50 50 100

Page 4: M.Tech. new1 syllabus

7 MEC252  EDA-2 (Lab) - - 4 2 50 50 100

8 MEC253  Seminar - - 4 2 50 50 100

9 MEC271 Discipline &GeneralProficiency

- - 2 100 - 100

Total 15 10 12 28 375 525 900

Semester 3



Subject Periods Credit Evaluation SchemeL T P Internal External Total

1 MEC301 Advance Optical Communication

3 2 - 4 25 75 100

2 MEC302 Nano-Electronics 3 2 - 4 25 75 100

3 MEC303 Minor Project 3 2 - 4 25 75 1004 Elective 3 (Select any one)

MEC304 FPGA/CPLD Based Systems3 2 - 4 25 75 100

MEC305 Computer Aids for VLSI


5 Elective 4 (Select any one)MEC306 MEMS and IC Integration

3 2 - 4 25 75 100MEC307 Compound Semiconductor

Material and Devices

6 MEC351 Microcontroller (Lab) - - 4 2 50 50 100

7 MEC352 Seminar - - 4 2 50 50 1008 MEC371 Discipline & General

Proficiency- - - 2 100 - 100

Total 15 10 8 26 325 475 800

Semester 4



Subject Periods Credits Evaluation SchemeL T P Internal External Total

1 MEC401 Dissertation/Thesis - - - 30 100 100 2002 MEC471 Discipline & General Proficiency - - - 2 100 - 100

Total - - - 32 200 100 300

Note:L – Lecture T- Tutorial P- Practical C-Credits

1L = 1Hr 1T= 1Hr 1P= 1Hr 1C = 1Hr of Theory Paper=2 Hrs of Practical/Tutorial

Page 5: M.Tech. new1 syllabus


MEC101: MOS Circuit Design


Basic principle of MOS transistor, Introduction to large signal MOS models (long channel) for digital design.


Inverter principle, Depletion and enhancement load inverters, the basic CMOS inverter, transfer characteristics, logic threshold, Noise margins, and Dynamic behavior, Propagation Delay, Power Consumption.


MOS SPICE model, device characterization, Circuit characterization, interconnects simulation. MOS device layout: Transistor layout, Inverter layout, CMOS digital circuits layout & simulation, Complementary MOS, Ratioed logic, Pass Transistor logic, complex logic circuits, Dynamic logic families and performances.


Static latches, Flip flops & Registers, Dynamic Latches & Registers, CMOS Schmitt trigger, Monostable sequential Circuits, Astable Circuits. Memory Design: ROM & RAM cells design, Interconnect delays, Cross Talks, Clock Distribution. Introduction to low power design, Input and Output Interface circuits.


Introduction of BJT Structure & operation, Basic BiCMOS Circuit behavior, Switching Delay in BiCMOS Logic circuits, BiCMOS Applications

Text Books:

1. Kang & Leblebigi “CMOS Digital IC Circuit Analysis & Design”- McGraw Hill, 2003

2. Rabey, “Digital Integrated Circuits Design”, Pearson Education, Second Edition, 2003

Reference Book:

1. Weste and Eshraghian, “Principles of CMOS VLSI design” Addison-Wesley, 2002

Page 6: M.Tech. new1 syllabus

MEC102: VLSI Technology

Unit-1Electronic Grade Silicon, Czochralski crystal growing, Silicon Shaping, processing considerations, Vapor phase Epitaxy, Molecular Beam Epitaxy, Silicon on Insulators, Epitaxial Evaluation, Growth Mechanism and kinetics, Thin Oxides, Oxidation Techniques and Systems, Oxide properties, Redistribution of Dopants at interface, Oxidation of Poly Silicon, Oxidation inducted Defects.


Optical Lithography, Electron Lithography, X-Ray Lithography, Ion Lithography, Plasma properties, Feature Size control and Anisotropic Etch mechanism, reactive Plasma Etching techniques and Equipment.


Deposition process, Poly silicon, plasma assisted Deposition, Models of Diffusion in Solids, Fick's one dimensional Diffusion Equations - Atomic Diffusion Mechanism - Measurement techniques - Range theory- Implant equipment. Annealing Shallow junctions - High energy implantation - Physical vapor deposition - Patterning.


Ion implantation - Diffusion and oxidation - Epitaxy - Lithography - Etching and Deposition- NMOS IC Technology - CMOS IC Technology - MOS Memory IC technology - Bipolar IC Technology - IC Fabrication.


Analytical Beams - Beam Specimen interactions - Chemical methods - Package types - packaging design considerations - VLSI assembly technology - Package fabrication technology.


S.M.Sze, "VLSI Technology", McGraw Hill Second Edition. 1998

James D Plummer, Michael D. Deal, Peter B.Griffin, "Silicon VLSI Technology: fundamentals practice and Modeling", Prentice Hall India.2000

Wai Kai Chen, "VLSI Technology" CRC press, 2003

Page 7: M.Tech. new1 syllabus

MEC103: Digital Systems Design


Specification of combinational systems using VHDL, Introduction to VHDL, Basic language element of VHDL, Behavioral Modeling, Data flow modeling, Structural modeling, Subprograms and overloading, VHDL description of gates.


Description and design of sequential circuits using VHDL, Standard combinational modules, Design of a Serial Adder with Accumulator, State Graph for Control Network, design of a Binary Multiplier, Multiplication of a Signed Binary Number, Design of a Binary Divider.


Register- transfer level systems, Execution Graph, Organization of System, Implementation of RTL Systems, Analysis of RTL Systems, Design of RTL Systems.


Data Subsystems, Storage Modules, Functional Modules, Data paths, Control Subsystems, Micro programmed Controller, Structure of a micro programmed controller, Micro instruction Format, Micro instruction sequencing, Micro instruction Timing, Basic component of a micro system, memory subsystem. I/O subsystem, Processors, Operation of the computer and cycle time.


Encoder, Multiplexers and Demultiplexers, Floating Point Arithmetic-Representation of Floating Point Number, Floating Point Multiplication.

Text Books:

J. Bhaskar, “ A VHDL Primer”, Addison Wesley, 1999. M. Ercegovac, T. Lang and L.J. Moreno, ”Introduction to Digital Systems”, Wiley,2000 C. H. Roth, “Digital System Design using VHDL”, PWS Publishing

References Books:

J.F. Wakerly, “Digital Design-Principles and Practices”, PHL Douglas Perry, “VHDL”, MGH Michae John Sebastian Smith, “Application-Specific Integrated Circuits”, Addison-Wesley. Z. Navabi, “ VHDL-Analysis and Modeling of Digital Systems”, MGH

Page 8: M.Tech. new1 syllabus

MEC104: Solid State Device Modeling and Simulation


Quantum Mechanical Concepts, Carrier Concentration, Transport Equation, Band gap, Mobility and Resistivity, Carrier Generation and Recombination, Avalanche Process, Noise Sources.


Injection and Transport Model, Continuity Equation, Diode Small Signal and Large Signal (Change Control Model), Transistor Models: Ebber - Molls and Gummel Port Model, SPICE modeling temperature and area effects.


Introduction Interior Layer, MOS Transistor Current, Threshold Voltage, Temperature Short Channel and Narrow Width Effect, Models for Enhancement, Depletion Type MOSFET, CMOS Models in SPICE.


General Methods, Specific Bipolar Measurement, Depletion Capacitance, Series Resistances, Early Effect, Gummel Plots, MOSFET: Long and Short Channel Parameters, Statistical Modeling of Bipolar and MOS Transistors.


Static and Dynamic Models, Rate Equations, Numerical Technique, Equivalent Circuits, Modeling of LEDs, Laser Diode and Photo-detectors.

Text Books:

Philip E. Allen, Douglas R. Hoberg, "CMOS Analog Circuit Design", Second Edition, Oxford Press - 2002

S.M.Sze "Semiconductor Devices - Physics and Technology", John Wiley and sons, 1985

Kiat Seng Yeo, Samir S.Rofail, Wang-Ling Gob, "CMOS / BiCMOS ULSI - Low Voltage, low Power", Person education, Low price edition, 2003

Page 9: M.Tech. new1 syllabus

MEC105: Digital Signal Processing and Applications


Representation of signals on orthogonal basis; Sampling and Reconstruction of signals;

Z-Transform, Analysis of LSI systems, Frequency analysis, Inverse systems, Discrete Fourier Transform (DFT), Fast Fourier Transform algorithm, Implementation of Discrete time systems.


Design of FIR Digital filters: Window method, Park-McClellan’s method.


Butterworth Chebyshev and Elliptic Approximations lowpass, Bandpass, Bandstop and High pass filters.Effect of finite register length in FIR filter design Parametric and non-parametric spectra estimation. Introduction to multirate signal processing. Application of DSP to Speech and Radar signal processing.


Block diagram of real time system, Sampling of low pass & band pass signals, Uniform & non-uniform quantization and encoding , over sampling in A/D conversion, D/A conversion process, Anti imaging filtering, over sampling in D/ A conversion, limitations of real time signal processing with analog input/output signals application.


Digital audio Mixing, Speech synthesis and recognition, Compact Disk Audio system, Digital Cellular Mobile Telephone, Set-top Box for Digital Television Reception, Fetal EGC monitoring, DSP base closed loop controlled anesthesia.

Text/Reference Books:

Discrete Time signal Processing, A.V. Oppenheim and Schafer, Prentice Hall, 1989 Digital Signal Processing : Principle, Algorithms and Applications, John G. Proakis and D.G.

Manolakis, Prentice Hall, 1997 Theory and Application of Digital Signal Processing: L.R. Rabiner and B. Gold, Prentice Hall,

1992 Introduction to Digital Signal Processing: J.R. Johnson, Prentice Hall, 1992 Digital Signal Processing: D. J. DeFatta, J. G. Lucas and W. S. Hodgkiss, J Wile and sons,

Singapore, 1988.

Page 10: M.Tech. new1 syllabus

MEC151: Lab ( HDL tools)

Exposure to high-level design tools including high-level synthesis, logic synthesis and

simulation. Hardware Description Languages; Verifying behaviour prior to system construction - simulation and logic verification; Logic Synthesis - PLA based synthesis and multilevel logic synthesis; Logic optimization; Logic Simulation - Compiled and event simulators; Relative advantages and disadvantages; Modelling and design using VHDL, verilog.

MEC152: MatLab

Introduction of Matlab basics. Implement the various circuits.


Seminar presentation-cum-report should be on a recent topic in various aspects of Electronics

Page 11: M.Tech. new1 syllabus

MEC201: Digital Systems Testing and Simulation with VHDL


Testing definitions and areas within testing. Logic and Fault Modeling. Mechanics Definitions: Abstractions level, Faults and errors, Modeling, Test Evaluation, Test Generation, Diagnostics. System life, Sources of defects?Unit-2

Representation and models of digital systems across abstraction levels.Fault Models: logical versus physical; SSL model, opens and shorts, bridging faults; Basic assumptions.Unit-3

Review of minimization tools and asynchronous machines, Test Pattern Generation basics. (activate and drive.), Algebraic approaches, Fault Equivalence and Dominance.Unit-4

Algebraic Approaches and Structural Approaches, Logic Simulation. Algebraic Approaches: Boolean difference, Literal position, Effect of fan-out on circuits, Checkpoint faults. Structural Approaches to test generation. Path sensitization methods.

Unit-5compiler, event driven. Representation of value, circuit, etc. Logic and Fault Simulation: Delay models for circuit simulation, Fault Simulation Purpose of Serial and Parallel Fault Simulation, Deductive fault simulation. Concurrent Fault Simulation, Critical Path tracing, Statistical Fault Analysis.

Text/Reference Books:

1. "Digital Systems Testing and Testable Design" by Miron Abramovici, Melvin Breuer and Arthur Friedman, IEEE press, NY.

2. A Guide to VHDL'' by Stanley Mazor, Kluwer Academic Press

3. "HDL Chip Design" by Douglas Smith, Doone Publications, AL.

4. "Rapid Prototyping of Digital Systems", by J. O. Hamblen and M. Furman, Kluwer Academic Publishers.

Page 12: M.Tech. new1 syllabus

MEC202: High Speed Analog Design Techniques

Unit 1

High Speed Operational Amplifiers Folded Cascode Voltage Feedback Op-Amps, Case study of AD847, Current Feedback Op-Amps (CFB), CFB model and Bode plot, study of AD8011, Comparison of specifications of Current feedback Op-amp family AD8001,AD8002, Noise comparisons between VFB and CFB Op Amps, PSRR Characteristics.

Unit 2

High-Speed applications based on Op-amps Optimizing feedback network for maximum bandwidth fitness, Driving Capacitive load, Cable drivers and receivers, High performance video line driver, Differential line drivers and receivers, High speed clamping amplifiers.

Unit 3

High speed amplifiers for communication applications Low noise amplifiers for communication systems, Mixers, Power amplifiers, Liner drivers, Automatic gain control amplifiers

Unit 4

High speed system for video applications High speed video multiplexing with Opamps using disable function, Video programmable gain amplifier, Video multiplexers and Cross Point switches, High power line drivers and ADSL, High speed photodiode Pre amps, Case studies of AD830, AD9002.

Unit 5

High speed RF/IF Subsystems Dynamic range compression, Linear VCAs, Log/Limiting Amplifiers, Receiver overview, Multipliers, modulators and mixers, Case study of AD600 Dual Channel X-amp, AD641 monolithic log amplifier.

Reference Books:1. Intuitive Operational Amplifiers, Thomas M. Frederiksen, Mc Graw Hill, 1988.

2. B Razavi, "RF Microelectronics", Prentice Hall, 1998

3. T.H. Lee, "The Design of CMOS Radio-Frequency Integrated Circuits"Cambridge University Press, 1998.

4. High Speed Design Techniques, Manual by analog Devices, October 1996

5. Modular Low-Power, High Speed CMOS Analog-to-Digital Converter for Embedded Systems, Lin, Dr. Ing. Keh-La Kemma, Armin Hosticka, Prof. Bedrich J. Publisher, Kluwer Academic Publishers

Page 13: M.Tech. new1 syllabus

MEC203: Optimization with Numerical Techniques


Introduction: Algebraic Structures: Properties, Semi group, Monoid, Group, Abelian group, properties of group, Subgroup, Cyclic group, Cosets, Permutation groups, Homomorphism, Isomorphism and Automorphism of groups.

Solution of Algebraic and Transcendental Equation:

Bisection Method, Iteration method, Method of false position, Newton-Raphson method, Methods of finding complex roots, Muller’s method, Rate of convergence of Iterative methods, Polynomial Equations.

Unit 2

Simultaneous Linear Equations: Solutions of system of Linear equations, Gauss Elimination direct method and pivoting, Ill Conditioned system of equations, Gauss Seidal iterative method, Rate of Convergence

Solution of differential Equations: Picard’s Method, Euler’s Method, Taylor’s Method, Runge-Kutta Methods, Predictor Corrector Methods.

Unit 3

Graphs, sub-graphs, some basic properties, Walks, Path & circuits, Connected graphs, Disconnected graphs and component, Eular and Hamiltonian graphs, Various operation on graphs, Tree and fundamental circuits, Distance diameters, Radius and pendent vertices, Rooted and binary trees, Counting trees, Spanning trees, Finding all spanning trees of a graph and a weighted graph.

Unit 4

Cut-sets and cut vertices, some properties, All cut sets in a graph, Fundamental circuit and cut sets, Connectivity and seperatability, Network flows, min cut theorem, Planar graphs, Combinatorial and geometric dual, Kuratowski to graph detection of planarity, Geometric dual, Some more criterion of planarity, Thickness and Crossings, Vector space of a graph and vectors, basis vectors, cut set vector, circuit vector, circuit and cut set verses sub spaces, orthogonal vector and sub space.

Unit 5

Network Models: Network definitions, CPM and PERT, Game Theory, Decision Making, Simulation: The Essence of Simulation, Some Common Types of Applications of Simulation, Generation of Random Numbers, Performing Simulations, Optimal solution of two persons zero sum games, Solution of mixed strategy games.


1. Optimization Theory and Application : S.S.Rao.2. Operations Research – S.D.Sarma.TEXT BOOK

Page 14: M.Tech. new1 syllabus

1.Introduction to operation Research TMHFREDERICK S. HILLIER,Stanford University GERALD J.


MEC204: CMOS RF Circuit Design


Design and Applications, Complexity and Choice of Technology. Basic concepts in RF design: Nonlinearly and Time Variance, Intersymbol interference, random processes and noise. Sensitivity and dynamic range, conversion of gains and distortion.


Analog and digital modulation of RF circuits, Comparison of various techniques for power efficiency, Coherent and non-coherent detection, Mobile RF communication and basics of Multiple Access techniques. Receiver and Transmitter architectures. Direct conversion and two step transmitters.


RF testing for heterodyne, Homodyne, Image reject, Direct IF and sub sampled receivers.

BJT and MOSFET behavior at RF frequencies, Modeling of the transistors and SPICE model, Noise performance and limitations of devices, integrated parasitic elements at high frequencies and their monolithic implementation


Overview of RF Filter design, Active RF components & modeling, Matching and Biasing

Networks. Basic blocks in RF systems and their VLSI implementation, Low noise Amplifier design in various technologies, Design of Mixers at GHz frequency range, Various mixersworking and implementation. Oscillators- Basic topologies VCO and definition of phase noise, Noise power and trade off. Resonator VCO designs, Quadrature and single sideband generators.


Radio frequency Synthesizers- PLLS, Various RF synthesizer architectures and frequency dividers, Power Amplifier design, Liberalization techniques, Design issues in integrated RF filters.

Text Book:

1. Thomas H. Lee “Design of CMOS RF Integrated Circuits” Cambridge University press


References Book:

1. B. Razavi “RF Microelectronics” PHI 1998

2. R. Jacob Baker, H.W. Li, D.E. Boyce “ CMOS Circiut Design, layout and Simulation”

PHI 1998

Page 15: M.Tech. new1 syllabus

3.Y.P. Tsividis “Mixed Analog and Digital Devices and Technology” TMH 1996

MEC205: Design of Semiconductor Memories

Unit-1SRAM Cell Structures-MOS SRAM Architecture-MOS SRAM Cell and Peripheral Circuit Operation-Bipolar SRAM Technologies-Silicon On Insulator (SOl) Technology-Advanced SRAM Architectures and Technologies-Application Specific SRAMs.


DRAM Technology Development-CMOS DRAMs - DRAMs Cell Theory and Advanced Cell Strucutures - BiCMOS, DRAMs - Soft Error Failures in DRAMs - Advanced DRAM Designs and Architecture-Application Specific DRAMs.


Masked Read-Only Memories (ROMs)-High Density ROMs-Programmable Read-Only Memories (PROMs)-Bipolar PROMs-CMOS PROMs-Erasable (UV) - Programmable Road-Only Memories (EPROMs)-Floating-Gate EPROM Cell-One-Time Programmable (OTP) Eproms-Electrically Erasable PROMs (EEPROMs)-EEPROM Technology And Architecture-Nonvolatile SRAM-Flash Memories (EPROMs or EEPROM)-AdvancedFlash Memory Architecture.


RAM Fault Modelling, Electrical Testing, Peusdo Random Testing-Megabit DRAM Testing-Non-volatile Memory Modelling and Testing-IDDQ Fault Modelling and Testing-Application Specific Memory Testing


General Reliability Issues-RAM Failure Modes and Mechanism-Non-volatile Memory Reliability-Reliability Modelling and Failure Rate Prediction-Design for Reliability-Reliability Test Structures-Reliability Screening and Qualification. RAM Fault Modelling, Electrical Testing, Pseudo Random Testing-Megabit DRAM Testing-Non-volatile Memory Modelling and Testing-IDDQ Fault Modelling and Testing-Application Specific Memory Testing.

Text/Reference Books:

Ashok K. Sharma, "Semiconductor Memories", Two-Volume Set, Wiley-IEEE Press, 2003

Brent Keeth, R. Jacob Baker, "DRAM Circuit Design: A Tutorial", Wiley-IEEE Press, 2000

Betty Prince, "High Performance Memories: New Architecture DRAMs and SRAMs - Evolution and

Function", Wiley, 1999

Page 16: M.Tech. new1 syllabus

MEC206: Analog and low power digital VLSI design

Unit 1

Low Power Design and Physics of Power Consumption, Power Estimation and Synthesis for low power, Design and test of low voltage CMOS circuits

Unit 2

Low power Static RAM architecture, Low power computing with energy recovery, Digital low power deign using hazard filters and balanced parities

Unit 3

Software design for low power, Case studies of Gilbert Cell Design with layout for low power

Unit 4

Case study of PLL design with layout for low power, Case study of A/D and D/A Converters for low power applications

Unit 5

Low power design for woreless circuits, Integrated radio frequency CMOS design

Text/Reference Books:1. Introduction to Low-Power VLSI Design (G Yeap & A Wild)2. Low Power Design of Off-Chip Drivers and Transmission Lines: A Branch andBound Approach (R Gupta et al.)3. A New CMOS Driver Model for Transient Analysis and Power DissipationAnalysis (H Liao et al.)4. On the Optimal Drivers of High-Speed Low Power ICs (D Zhou & X Y Liu)5. Floorplan Design with Low Power Considerations (K-Y Chao & D F Wong)

Page 17: M.Tech. new1 syllabus

MEC207: Microcontroller and Applications


Single Chip Controllers, Design and testing of software for Micro-controllers, Architectural features of different types of architectures used in Micro-controllers, like Van Neuman, Harward, CISC, RISC, SISC architectures. Special features like watchdog timer, digital signal processors, clock monitor, resident program, loader, monitor, General applications of Micro-controllers.


Comparison of Intel MCS 51/251 and MCS 96 Microcontroller Families, Overview and features of MCS 96(HSIO) family, Intel 80C196 CHMOS 16 bit Microcontroller, Pin configuration, Architectural block diagram, Signal descriptions, memory and address space, registers, buses, and data transfers, different modes of operation.


Instruction set : different types of instructions, instruction significance and execution, Addressing modes, effective address, simple programs, loop programs, subroutines and examples, Memory Management, Programming the Microcontroller for different applications, Synchronous Serial Port, Serial port wave forms (shift register mode), Interrupts handling and priority, External Memory Interfacing.


Serial and parallel ports and software control of ports, port I/O registers, synchronization in data transfer and handshaking, interrupt management, interrupt service routines, and interrupt examples keeping time and parallel port transfers, A/D control and status registers and applications.


Interfacing of LEDs, Switches and 7- segment displays, keyboard interfacing, RS-232 interfacing, DC motor interfacing, Stepper motor interfacing, DAC, Data acquisition system, real world interfacing.

References:1. The 8051 Microcontroller, 3rd Ed., Scott MacKenzie,1999, Prentice Hall.2. The 80251 Microcontroller, Kenneth Ayala, 2000 Prentice Hall.3. The 8051 Microcontroller: Hardware, Software, and Interfacing, 2nd Ed, James Stewart andKai Miao, 1999, Prentice Hall.4. The art of programming embedded systems by Jack G. Ganssle.5. Design with Microcontrollers by John B. Peatman.6. Microcontroller: Architecture, implementation and Programming by Kenneth Hintz and

Page 18: M.Tech. new1 syllabus

Daniel Tabak, Tata McGraw Hill.

MEC251: Lab (EDA Tool-1 Lab)

1. To measure the resistivty using four probe method

2. To measure the sheet resistance of a given sample

3. To measure the IV characteristics of the given diode

4. To measure the C-V characteristics of the given diode

5. To measure the IV characteristics of the transistor

6. To measure the carrier concentration at the surface by C-V measurement

7. To measure the carrier concentration by Hall Effect

8. To measure the physical parameters of the layout of the chip

9. To measure the sub threshold voltage of the given transistor

10. To measure the short channel effect of the MOS device

MEC252: Lab (EDA Tool-2 Lab)

It is circuit level design tool to implement the various BJT, FET, CMOS, and BiCMOS circuits.

Page 19: M.Tech. new1 syllabus

MEC301: Advance Optical Communication


Need of optical transmission, Fibre optics communication system, basic blocks , Evolution of Fibre Optic

Systems, Advantage of OFC. Basic opticals laws and transmission parameters, optical fibre structure,

mode theory for optical propogaton, modes in a planar wave, phase and group velocity, phase shift on

TER and evanescent field, cylindrical wave-guides, step index and graded index, planar and dielectric

wave guides.


Attenuation, material absorption, scattering loss, bending loss, inter modal dispurtion, intra modal

dispersion, overall fibre dispersion, dispersion modified SMF, polarization. Light emitting diode (LEDs),

LASER, and its characterstics fibre laser(edge emitting and vertical cavity surface emitting lasers),

optical transmitters.


Optical detection principles and devices, detection response time, avalanche multiplication noise,

structure for InGaAs APDs, comparision of detectors, splices and connectors, optical receivers.

Semiconductor optical amplifier, EDFA (Erbium Doped fiber amplifier), planner amplifiers, Raman

amplifiers and repeaters fiber amplifiers and related components.


Attenuation measurement, dispersion measurement, OTDR & its field applications, eye pattern.

PHD, data pulse stream on- array Moarkov source, convulationary coded modulation, CPM, scalar and

vector communication over memory less channels, optical receivers, metrix generation, colored GN

whitening approach, in phase and quadrature, phase modem, non coherent receivers, performance of non

coherent receiver in random phase channel.

Page 20: M.Tech. new1 syllabus


Basic networks, SONET/ SDH networks, broadcast and select VDM networks, wavelength routed

networks, non linear effects on N/w performance, performance of WDM & EDFA systems, LAN,

solitions, optical CDMA, high frequency capacity network. Pulse propagation and solitons, integrated

optics and photonic switching.


1. Optical Fiber Communication by Senior JM

2. Optical Fiber Communication by Gerd Keiser

3. Introduction to Optical Fiber by Allien H Chairin

4. Optical Fibers by Taknan Orosh

MEC302: Nano-Electronics

Unit-1Physics of solid state Structure - Energy band - Quantum mechanics.


Technology Film deposition methods - Lithography.


Analysis Electron microcopies - Scanning probe microcopies.


Logic devices Limitation of MOSFETS - Single electron devices - Quantum transport devices - Carbon nano tubes - Molecular devices.


Spintronics Principle - Applications, Quantum computing, nano sensors.

Text/References Books:

W. Roy VCH, "Nano Electronics and Information Technology", Rainen waser 2nd Edition 2005

Chonles P.Pook Jr., Frank. J. Owens, "Introduction to Nano technology", Wiley Interscience, 1 st Ed 2003

T. Pradeep, "Nano: The essentials", Tata McGraw Hill, 1 st Ed,2007Mark Ratne, Danill Ratne, "Nano Technology", Pearson education, 1 st edition, 2006

MEC303: Minor Project

The student will submit a synopsis at the beginning of the semester for the approval to the project committee in a specified format. The student will have to present the progress of the work through seminars and presentation. A report must be submitted to the dept. for evaluation purpose at the end of

Page 21: M.Tech. new1 syllabus

the semester in a specified format

MEC304: FPGA/CPLD Based Systems

Unit 1Introduction. Basic Concepts. Digital Design and FPGAs. FPGA-Based System Design. Summary. Problems.

Unit 2VLSI Technology behind FPGA/CPLD, Manufacturing Processes. CMOS Logic Gates. Wires, Registers and RAM, Packages and Pads.

Unit 3FPGA Fabrics. FPGA Architectures. SRAM-Based FPGAs. Permanently ProgrammedFPGAs. Chip I/O. Circuit Design of FPGA Fabrics. Architecture of FPGA Fabrics.

Unit 4Combinational Logic, The Logic Design Process. Hardware Description Languages.Combinational Network Delay. Power and Energy Optimization. Arithmetic Logic.Logic Implementation for FPGAs. Physical Design for FPGAs. The Logic DesignProcess Revisited. Summary. Problems.

Unit 5Sequential Machines, The Sequential Machine Design Process. Sequential DesignStyles. Rules for Clocking. Performance Analysis. Power Optimization, Architecture, Behavioral Design. Design Methodologies.

Text/References Books:1. FPGA-Based System Design Wayne Wolf, Verlag: Prentice Hall PTR2. Modern VLSI Design: System-on-Chip Design (3rd Edition) (3RD) Wayne Wolf

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MEC305: Computer Aids for VLSI Design

Unit-1Introduction to VLSI Design methodologies - Review of Data structures and algorithms - Review of VLSI Design automation tools - Algorithmic Graph Theory and Computational Complexity - Tractable and Intractable problems - general PURPOSE methods for combinatorial optimization.


Layout Compaction - Design rules - problem formulation - algorithms for constraint graph compaction - placement and partitioning - Circuit representation - Placement algorithms - partitioning


Floor planning concepts - shape functions and floorplan sizing - Types of local routing problems - Area routing - channel routing - global routing - algorithms for global routing.


Simulation - Gate-level modeling and simulation - Switch-level modeling and simulation - Combinational Logic Synthesis - Binary Decision Diagrams - Two Level Logic Synthesis- High level Synthesis.


Hardware models - Internal representation - Allocation -assignment and scheduling - Simple scheduling algorithm - Assignment problem - High level transformations.

Text/References Books;

S.H. Gerez, "Algorithms for VLSI Design Automation", John Wiley & Sons,2002

N.A. Sherwani, "Algorithms for VLSI Physical Design Automation", Kluwar Academic Publishers, 2002

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MEC306: MEMS and IC Integration


Overview of CMOS process in IC fabrication


MEMS system-level design methodology


Equivalent Circuit representation of MEMS, signal-conditioning circuits, and sensor noise calculation.


Pressure sensors with embedded electronics(Analog/Mixed signal).


Accelerometer with transducer,Gyroscope,RF MEMS switch with electronics,Bolo meter design. RF MEMS, and Optical MEMS.

Text/References Books:

Gregory T.A. Kovacs, Micromachined Transducers Sourecbook, The McGraw-Hill, Inc.1998 Stephen D. Senturia, Microsystem Design, Kluar Publishers, 2001 Nadim Maluf, An Introduction to Microelectromechanical Systems Engineering, Artech House,

2000. M.H. Bao, Micro Mechanical Transducers, Volume 8, Handbook of Sensors and Actuators, Elsevier, 2000.

Masood Tabib-Azar, Microactuators, Kluwer, 1998. Ljubisa Ristic, Editor, Sensor Technology and Devices, Artech House, 1994

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MEC307: Compound Semiconductor Material and Devices


III-V and II-VI compound semiconductor materials and their applications in electronics

and optoelectronic devices, crystal structures and their band structures, variation of band

gap with the contents of compound metals, refractive index variation with respect to the

contents of compound metals.


Liquid Phase Epitaxy, Molecular Beam Epitaxy, and Metal Organic Chemical Vapor

Deposition techniques for crystal growth.


HBT, DHBT, Heterostructure laser, waveguides and optical modulators and switches,

SLAPDS, and other Heterostructure p-i-n diodes.


Photoluminescence Techniques, X-Ray diffraction, SIMS, SEM, TEM, measurement of

waveguides, modulator and optical detector.

Text/References Books:

Stephen A. Campell. “The science and engineering of microelectronics fabrication”, Oxford University Press. 1996.

Donald L. Smith. “Thin Film Deposition”. McGraw Hill. 1995. H. C. Cassey and M. B. Panish. “Heterostructure Laser”. Academic Press M. J. Kelly. “Low Dimensional Semiconductor Materials, Physics Technology, Devices”. Oxford Science Publication. 1995.

John L. Vossen and Werner Kern. “Thin Film Processes II”. Academic Press Inc.

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MEC351: Lab (Microcontroller Lab)

Introduction of various front-end and back-end techniques.

MEC401: Dissertation

This includes the analysis, design of hardware/software construction of an apparatus/Instrument and testing and evaluation of its performance. Usually, the project work is based on a scientific/engineering problem of current interest. Every student has to complete the work in the specified period.

The student will submit a synopsis at the beginning of the semester for the approval of Dissertation topic, from the department project committee in a specified format. Synopsis must be submitted within two weeks after registration. The student will have to present a seminar on the literature survey, past work etc. in their area of work through seminars and progress reports at the interval of four weeks.

The first defense, for the dissertation work, should be held during mid-semester. Dissertation Report must be submitted in a specified format to the department for evaluation purpose before the final defense.

Syllabus Designed byMr. Vijay Kumar Sharma

ECE Deptt. COE, TMU Moradabad (U.P.)

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