EV- 505 Semiconductor Device Models for Circuit Simulation (3-1-0) 4
EV- 507 Programming and Data Structure (3-1-0) 4
EV- 551 VLSI Lab I (0-0-4) 2
EV- 581 Seminar (0-2-0) 2
05 14 07 04 25 20
II
EV- 502 Analog VLSI Design (3-1-0) 4
EV- 504 Digital Systems Design (3-1-0) 4
EV- 506 CAD for VLSI (3-1-0) 4
EV- 521 Elective I (3-1-0) 4
EV- 552 VLSI Lab II (0-0-4) 2
EV- 582 Seminar (0-2-0) 2
04 12 06 04 26 20
III
EV- 601 VLSI Testability & Testing (3-1-0) 4
EV- 603 VLSI Physical Design I (3-1-0) 4
EV- 623 Elective II (3-1-0) 4
EV- 625 Elective III (3-1-0) 4
EV- 671 Minor Project (0-0-8) 4
04 12 04 08 24 20
IV
EV- 692 Dissertation (0-0-28) 14
28 28 14
Teaching & Evaluation Scheme
Note: Evaluation scheme as described in Ordinance for M.Tech. programmes.
Total Credits: 74
SEMICONDUCTOR DEVICES (AUDIT COURSE)
EV-500 Cr L T P
0 2 1 0
Semiconductor materials, Crystal structures, Semiconductor , Quantum Mechanics and Band Theory, Carrier Properties State and Carrier Distributions Equilibrium carrier concentrations, Drift Diffusion Generation/Recombination, Generation/Recombination Equations of State Minority Carrier Diffusion Equation Introduction to p-n junctions, p-n Junction Electrostatics Ideal Diode, p-n Junction Small Signal Model p-n Junction Large Signal Model and distortion, Diode Applications Non-Idealities in pn Junctions AC & Transients in pn Junctions Heterojunctions Compound Semiconductor Diodes Schottky barrier diodes, Metal-Semiconductor Contacts, Semiconductor Fabrication, LEDs: Basic Operation, LEDs: Key Design Parameters, LEDs: Device Structures, Lasers: Basic Operation, Lasers: Basic Operation, Lasers: Key Design Parameters, Lasers: Laser Structures, Solar Cells: Basic Operation, Solar Cells: Design, Photodetectors: Basic Operation, Photodetectors: Devices and Uses, Introduction to Bipolar Junction Transistors, BJT Physics, HBT Physics and applications, Metal Oxide Semiconductor Capacitor, MOSFET Basics, MOSFET Device , MESFET, JFET, Polarization Based Devices (III-Nitrides and Ferroelectrics), Other Devices: CCD, Microwave transistors, power transistors, organic semiconductors. Text/ Reference Books: 1. A.S. Grove, ”Physics and Technology of Semiconductor Devices”, John Wiley & Sons 2．S.M. Sze, “Semiconductor Devices, 2nd Ed.”, John Wiley & Sons Inc.
VLSI TECHNOLOGY
EV-501 Cr L T P
4 3 1 0
Crystal growth & wafer preparation. Processing considerations: Chemical cleaning, getting the thermal Stress factors etc.
Epitaxy: Vapors phase Epitaxy Basic Transport processes & reaction kinetics, doping & auto doping, equipments, & safety considerations, buried layers, epitaxial defects, molecular beam epitaxy, equipment used, film characteristics, SOI structure.
Oxidation: Growth mechanism & kinetics, Silicon oxidation model, interface considerations, orientation dependence of oxidation rates thin oxides. Oxides. Oxidation technique & systems dry & wet oxidation. Masking properties of SiO2.
Diffusion: Diffusion from a chemical source in vapor form at high temperature, diffusion from doped oxide source, diffusion from an ion implanted layer.
Lithography: Optical Lithography: optical resists, contact & proximity printing, projection printing, electron lithography: resists, mask generation. Electron optics: roster scans & vector scans, variable beam shape. X-ray lithography: resists & printing, X ray sources & masks. Ion lithography.
Etching: Reactive plasma etching, AC & DC plasma excitation, plasma properties, chemistry & surface interactions, feature size control & apostrophic etching, ion enhanced & induced etching, properties of etch processing. Reactive Ion Beam etching, Specific etches processes: poly/polycide. Trench etching,
Text/ Reference Books: 1. Simon Sze, “VLSI Technology” McGraw-Hill Science/Engineering/Math; 2 edition 2. C. Y. Chang, “ULSI Technology” McGraw-Hill Higher Education; International Ed edition 3. Wai-Kai Chen, “VLSI Technology (Principles and Applications in Engineering, 8)” CRC; 1 edition
DIGITAL VLSI DESIGN
EV-503 Cr L T P
4 3 1 0
Introduction: Basic principle of MOS transistor, Introduction to large signal MOS models (long channel) for digital design.
The MOS Inverter: Inverter principle, Depletion and enhancement load inverters, the basic CMOS inverter, transfer characteristics, logic threshold, Noise margins, and Dynamic behavior, Propagation Delay, Power Consumption.
MOS Circuit Layout & Simulation: MOS SPICE model, device characterization, Circuit characterization, interconnects simulation. MOS device layout: Transistor layout, Inverter layout, CMOS digital circuits layout & simulation
SEMICONDUCTOR DEVICE MODELS FOR CIRCUIT SIMULATION
EV-505 Cr L T P
4 3 1 0
Principle of circuit simulation and its objectives.
Introduction to SPICE: AC, DC, Transient, noise, temperature extra analysis.
Junction Diodes: DC, small signal, large signal, high frequency and noise models of diodes. Measurement of diode model-parameters.
BJT: DC, small signal, high frequency and noise models of bipolar junction transistors. Extraction of BJT model parameters.
MOSFETs: DC, small signal, high frequency and noise models of MOSFETs. MOS Capacitors.
Device SCALING: short and narrow channel MOSFETs. MOSFET channel mobility model, DIBL, charge sharing and other non-linear effects.
MOS Models: Level-1 and level-2 large signal MOSFET models. Introduction to BSIM models. Extraction of MOSFET model parameters.
JFET & MESFETs: modeling of JFET & MESFET and extraction of parameters.
HBTs: Principles of hetrojunction devices, HBTs, HEMT Component model for ICs: Design rule checks, timing verification, worst case delay simulation, setup and hold times for clocked devices, Behavior modeling, structural modeling, simulation with the physical model, Hardware Description Language
Text/ Reference books
1. S.M. Kang & Y. Leblibici, “CMOS Digital Integrated Circuits-Analysis & Design”, TMH, Ed. 2003 2. S.M. Sze, “Physics of semiconductor devices”, Wiley Pub. 3. Rashid, “SPICE”. 4. Sedra, Smith, “SPICE”. 5. Bar Lev, “Basic Electronics”. 6. BG Streetman, “Solid state Electronic Devices”, PHI.
PROGRAMMING AND DATA STRUCTURE
EV-507 Cr L T P
4 3 1 0
Programming: C program structures, Variables, Data Types, Declarations, Operators (Arithmetic, Relational, Logical), increment and decrement operators, Assignment operators and expressions, Arithmetic expressions, statements, symbolic constants, conditional expressions, Bitwise operators, precedence and order of evaluations, input-output functions.
Statements and Blocks, branching statements (if, switch), Loops (while, for, do-while, repeat-until), Break and continue, go to and labels.
Pointers and addresses, pointers and function arguments, pointer and arrays, address arithmetic, character pointers and functions, pointer arrays, multidimensional arrays, initialization of pointer arrays, pointers and multidimensional arrays, command line arguments, memory management.
Structures: Defining and processing, passing to a function, Unions.
Files: Standard input and output, formatted output, formatted input, file access, miscellaneous functions.
Data Structures:
Arrays : representation and basic operations.
Linked list : Singly, Doubly, Circular and Doubly circular, definition, representation and their basic operations.
Stacks and queues : insertion, deletion.
Trees : insertion, deletion, traversal (inorder, preorder and postorder), binary trees, AVL trees, B-trees, B+-trees.
Text/ References books:
1. Using Information Technology, 5th Edi, Brian K Williams & Stacey C. Sawyer, 2003, TMH 2. Fundamentals of computers and programming with C, A. K. Sharma, Dhanpat Rai Publications,
Daryaganj New Delhi 3. The C Programming Language by Dennis M Ritchie, Brian W. Kernigham, 1988, PHI. 4. Horowitz, E. and Sahni, S., “Fundamentals of Data Structures”, Galgotia Publications. 5. Rajaraman, V., “Computer programming in C”, PHI.
2ND SEMESTER
ANALOG VLSI DESIGN
EV-502 Cr L T P
4 3 1 0
Introduction: Small Signal & large signal Models of MOS & BJT transistor. Analog MOS Process (Double Poly Process). Single transistor Amplifiers stages, Multiple Transistor Amplifier stages: Cascode configuration, Active Cascode. Differential Amplifiers: Differential pair & DC transfer characteristics. Current Mirrors, Active Loads & References
Current Mirrors: Simple current mirror, Cascode current mirrors Widlar current mirror, Wilson Current mirror, etc. Active loads, Voltage & current references. Analysis of Differential Amplifier with active load, supply and temperature independent biasing techniques, Frequency Response.
Operational Amplifier: Design of two stage MOS Operational Amplifier, two stage MOS operational Amplifier with cascodes, MOS telescopic-cascode operational amplifiers, MOS Folded-cascode operational amplifiers, Bipolar operational amplifiers. Frequency response & compensation, OTAs.
Nonlinear Analog Circuits: Four quadrant and variable Tran conductance multiplier, Voltage controlled oscillator, Comparators, Analog Buffers, Source Follower and Other Structures. Phase Locked Techniques; Phase Locked Loops (PLL), closed loop analysis of PLL. Digital-to-Analog (D/A) and Analog-to-Digital (A/D) Converters
Switched Capacitor filters: OTA Amplifiers. Switched Capacitor Circuits and Switched Capacitor Filters, Current conveyors, Current feedback amplifier
Text/ References books:
1. Phillip E. Allen and Douglas R. Holberg, “CMOS Analog Circuit Design”, Second Edition, Oxford University Press.
2. Behzad Razavi, “Design of Analog CMOS ICs”, 2000. John Wiley
3. Paul B Gray and R.G Meyer, “Analysis & Design of Analog Integrated Circuits”.
4. D. A. Johns and Martin, Analog Integrated Circuit Design, John Wiley, 1997.
5. R Gregorian and G C Temes, Analog MOS Integrated Circuits for Signal
Processing, John Wiley, 1986.
6. R L Geiger, P E Allen and N R Strader, VLSI Design Techniques for Analog & Digital Circuits, McGraw Hill, 1990.
8. Kenneth R. Laker, Willy M.C. Sensen, “ Design of Analog Integrated circuits and systems”, McGraw Hill, 1994.
DIGITAL SYSTEMS DESIGN
EV-504 Cr L T P
4 3 1 0
Discrete time signals & systems, Z transforms, structures for digital filters, Design procedure for FIR and IIR filters. Frequency transformations, Linear phase design, Introduction to DFT. Methods for fast computation of DFT including FFT, NTT and WTFA. Noise analysis of digital filters. Power spectrum estimation. Multi-rate digital filtering: Introduction to multidimensional DSP. Examples of applications of DSP in communications.
Text/ References books:
1. Digital Signal Processing by William D. Stanley. 2. Discrete-Time Signal Processing by A. V. Oppenheim and R. W. Schafer. 3. Digital Signal Processing: Principles, Algorithms, and Applications by J. G. Proakis and D. G.
Manolakis. 4. Digital Signal Processing in Communication Systems by Marvin E. Frerking. 5. Multirate Digital Signal Processing by R. E. Crochiere and L. R. Rabiner.
CAD FOR VLSI
EV-506 Cr L T P
4 3 1 0
Introduction: Evolution and trends in VLSI CAD. Design process, representations, flow and methodology. Dealing with complexity CAD Tool types. Example of a methodology: synchronous design and RTL modeling.
Digital hardware modeling: Structure modeling: Logic networks, connectivity & netlists, Hypergraphs. Connectivity data structures. Introduction to logic simulation.
Routing, compaction, layout verification: Global and detailed routing. Steiner trees, Channel routing; area routing; Wire length Estimators. 1-D layout compaction. Principles of layout verification. Static timing: Principles of static timing analysis; Delay graphs for combinational logic blocks; Arrival times, required times, slack, Basic algorithms for path analysis in combinational logic. False paths; Flip-flops, latches and delay constraints; Clocking methods; Verifying timing of sequential logic; Delay modeling of gates, interconnect and devices.
Timing & power driven synthesis: Timing-driven logic synthesis; Timing-driven layout synthesis; Clock skew optimization; Approaches to the timing convergence problem.
Text/Reference Books:
1. Stephen M. Trimberger, “Introduction to CAD for VLSI”, Kluwer Academic Publishers 2. Samir Palnitkar, ‘Verilog HDL (2nd Edition)” Prentice Hall Publications, 2003
ISBN : 0130449113 3. Douglas J Smith, “HDL Chip Design : A Practical Guide for Designing, Synthesizing and Simulating
ASICs and FPGAs Using VHDL or Verilog” Doone Publications, 1998, ISBN : 0965193438
3RD SEMESTER
VLSI TESTABILITY AND TESTING
EV-601 Cr L T P
4 3 1 0
Test principles, Functionality Testing, Manufacturing Tests. Fault models, Stuch-at-faults, Short-circuited faults, Open-circuited faults. Automatic Test pattern generation, Fault grading, Fault simulation, Statistical fault analysis. Design strategies for test, Scan based test techniques, Layout for improved testability, Case studies, Functional Verification and testing.
Linear feedback shift register. Fault tolerant design techniques.
Text/Reference Books:
1. M. Abramovici, M. A. Breuer, A. D. Friedman, “Digital Systems Testing and Testable Design” Piscataway, New Jersey: IEEE Press
2. M. L. Bushnell, V. D. Agrawal, “Essentials of Electronic Testing for Digital, Memory & Mixed-Signal VLSI Circuits” Boston: Kluwer Academic Publishers
3. Wang, Laung-Terng; Wu, Cheng-Wen; Wen, Xiaoqing “VLSI Test Principles and Architectures: Design for Testability” Published By: Elsevier; Edition: 1
Delay models, Minimization, Time driven routing, Cell generation and Programmable structiures, Transistor chaining, Gate Matrix Layout, CMOS layout.
Compaction, I.D. compaction, one and two dimensional compaction graph based techniques, Wire length minimization, Grid constraints, Power minimization, Power delay optimization.
Subsystem design, Architecture design, Chip design, CAD systems and Algorithms.
Text/Reference Books:
1. Majid Sarrafzadeh, C. K. Wong, “An Introduction To VLSI Physical Design” Mcgraw-Hill College 2. Sherwani, Naveed A., “Algorithms for VLSI Physical Design Automation
3rd ed., 1999, 608 p., ISBN: 978-0-7923-8393-2
Electives:
EMBEDDED SYSTEM DESIGN (3-1-0)
Introduction to Embedded Systems: Growing importance of Embedded systems, Requirements, Models, State charts, General Language characterstics, synchronization and communication, SDL, Petrinets, UML, VHDL. Embedded Systems Hardware: Input Devices, Communication, processing of units, Memories, Output Devices. Embedded Operating Systems; Hardware/ Software codesign; Validation, Fault Simulation, Formal Verification.
Text/ Reference Books:
1. Embedded System Design by Peter Marwedel, Kluwer Academic Pub.
2. Embedded Systems by Raj Kamal, TMH
3. Embedded System Design by Frank Vahid, Tony Givargis,”, John Wiley & Sons, Inc
4. Heath, Steve, " Embedded Systems Design ", Newnes 1997
5. An Embedded Software Primer by David E. Simon, Pearson Education
6. Designing Embedded Hardware by John Catsoulis, O’reilly
7. Real-time systems & software by Alan C. Shaw, John Wiley & sons, Inc.
8. Fundamental of Embedded software by Daniel W. Lewis, PHI
9. John B Peat man " Design with Microcontroller ", Pearson education Asia, 1998
SEMICONDUCTOR MATERIALS AND DEVICE CHARACTERIZATION (3-1-0)
Resistivity and four-point probe method; Carrier and doping concentration from C-V and Hall measurements; Specific contact resistivity and Schottky barrier height from I-V and C-V measurements; Series resistance of p-n junction diodes, solar cells and bipolar junction transistors; Channel length and threshold voltage of various FET structures; Majority and minority carrier mobilities; MOSFET mobility from Hall effect; Magnetic resistance and time of flight experiments; Oxide interface charge from C-V measurements; Deep-level concentration, cross-section and other parameters from various capacitance techniques and generation recombination techniques; Electrical, optical and pressure effects and measurement techniques for carrier life-time; Luminescence technologies for semiconductor characterization.
Text/ Reference Books:
1. Dieter K. Schroder , “Semiconductor Material and Device Characterization” John Wiley & Sons.
NANO TECHNOLOGY (3-1-0)
Introduction : Logistics, R. P. Feynmann, There’s plenty of room at the bottom and others,
History, Definitions, Economics, Implications for Students, Nanotech Policies.
NanoScale Imaging: Electron microscopy; Scanning tunneling microscopy; Atomic force microscopy
Traditional Nanotechnology: Top Down Lithography, Interference Lithography, Ebeam Lithography, STR Needs & Next Generation Advanced Lithography
Material Deposition/Growth Techniques (spin coating, drop coating, evaporation, supersaturation, condensation, CVD, PVD, MBE Crystal Growth, Knudsen Cell, Introduction to Nanomaterials, concept of glow discharge/ plasma)
Nano-imprint, Soft Lithography using Elastomers – printing, stamping, molding
Nanoparticle electronics, Synthesis of Nanowires; Nanowire Synthesis and Nanowire Application,
Metallic and semiconducting nanotubes FET transistors and their demonstrated performance, potential applications of nanotubes in IC intereconnects, circuits, LEDs and field emission displays. Nanowires and single electron transistors, crossbar switches and applications to computing, Sensors, Field emission, Thermoelectric devices.
Nanosystems manufacturing: Heterogeneous Integration and Self-Assembly
Text/ Reference Books:
1. M. Iwamoto, K. Kaneto, S. Mashiko, “Nanotechnology and Nano-Interface Controlled Electronic Devices” Publisher: Elsevier Science & Technology Books; ISBN-13: 9780444510914
2. Michael Kohler, Wolfgang Fritzsche, “Nanotechnology: An Introduction to Nanostructuring Techniques” Publisher: Wiley, John & Sons, ISBN-13: 9783527307500
HARDWARE-SOFTWARE CO-DESIGN (3-1-0)
Codesign Overview; Models and Methodology of Embedded System codesign; Hardware Software partitioning and Scheduling; Cosimulation, High level Synthesis (HW) and functional verification; Architecture Mapping, Hardware/Software Interfaces, re-configurable logic and devices; System on Chip (SoC) and IP cores; Hardware/Software codesign for application specific processor; Codesign tools and case studies
Text/ Reference Books:
1. J. Staunstrup and W. Wolf, editors, Hardware/Software Co-Design: Principles and Practice, Kluwer Academic Publishers, 1997.
MEMORY DESIGN AND TESTING (3-1-0)
Random Access Memory Technologies
Static Random Access Memories (SRAMs):
SRAM cell structure- MOS SRAM architecture – MOS SRAM cell and peripheral circuit operation – bipolar SRAM technologies – silicon on insulator (SOI) technology – advanced SRAM architectures and technologies, application specific SRAMs.
Dynamic Random Access Memories (DRAMs): DRAM technology development – CMOS CRAMs – DRAMs cell theory and advanced cell structures- BiCMOS DRAMs-soft error failure in DRAMs – Advanced DRAM designs and architecture – application specific DRAMs.
Nonvolatile Memories: Masked Read – only memories (ROMs): High density ROMs – programmable read-only memories (PROMs)- bipolar PROMs – CMOS PROMs – erasable (UV)- Programmble read-only memories (EPROMs)- Floating Gate EPROM cell- one – time progammable (OTP) Eproms – Electrically Erasable PROMs (EEPROMs) – EEPROM technology and architecture –nonvolatile SRAM-Flash memories (EPROMs or EEPROM) – Advanced flash memory architecture.
Memory fault modeling, testing and memory design for Testability and fault tolerance, RAM fault modeling, electrical testing, Peusdo random testing – megabit DRAM testing – nonvolatile memory modeling and testing – IDDQ fault modeling and testing – application specific memory testing.
Semiconductor memory reliability and radiation effects
General Reliability issues – RAM failure modes and mechanism – nonvolatile memory reliability – reliability modeling and failure rate prediction – design for reliability – reliability test structures – reliability screening and qualification. Radiation effects – single event phenomenon (SEP)- radiation hardening techniques – radiation hardening process and design issues – radiation hardened memory characteristics – radiation hardness assurance and testing – radiation dosimetry – water level radiation testing and test structures. Advanced memory technologies and high-density memory packaging technologies
Ferroelectric Random Access Memories (FRAMs) – Gallium Arsenide (GaAs) FRAMs – Analog memories magnetoresistive random access memories (MRAMs) – Experimental memory devices. Memory hybrids and MCMs (2D) – Memory stacks and MCMs (3D) – Memory MCM testing and reliability issues- memory cards- high density memory packaging future directions.
Text/ Reference Books:
1. Ashok K.Sharma, “Semiconductor Memories Technology, testing and reliability”, Prentice hall of India Private Limited, New Delhi 1997.
ALGORITHMS FOR VLSI DESIGN AUTOMATION (3-1-0)
VLSI Physical Design Automation. Design and fabrication of VLSI chips. Basic data structures & algorithms. Partitioning. Placement and floorplanning. Global routing. Detailed routing. Specialized routing. Floorplanning, placement and routing for analog and mixed-signal designs. Two-level combinational logic optimization. Exact optimization algorithms. Heuristic optimization algorithms.
Cell-library binding. Current research problems in logic-level CAD.
Text/ Reference Books:
1. N. Sherwani, ``Algorithms for VLSI Physical Design Automation'', Kluwer Academic Publishers, 1999.
2. S. Sait, H. Youssef, ``VLSI Physical Design Automation. Theory and practice'', McGraw-Hill Book Company, 1995.
3. M. Sarrafzadeh, C. K. Wong, ``An Introduction to VLSI Physical Design'', McGraw-Hill Book Company, 1996.
4. G. De Micheli, ``Synthesis and Optimization of Digital Circuits'', McGraw-Hill Inc, 1994.
MEMS AND IC INTEGRATION (3-1-0)
Overview of CMOS process in IC fabrication, MEMS system-level design methodology, Equivalent Circuit representation of MEMS, signal-conditioning circuits, and sensor noise calculation.
Pressure sensors with embedded electronics(Analog/Mixed signal): Accelerometer with transducer,Gyroscope,RF MEMS switch with electronics,Bolo meter design.
RF MEMS, and Optical MEMS
Text/ Reference Books:
1. Gregory T.A. Kovacs, Micromachined Transducers Sourecbook, The McGraw-Hill, Inc. 1998 2. Stephen D. Senturia, Microsystem Design, Kluar Publishers, 2001 3. Nadim Maluf, An Introduction to Microelectromechanical Systems Engineering, Artech House, 2000. 4. M.H. Bao, Micro Mechanical Transducers, Volume 8, Handbook of Sensors and Actuators, Elsevier,
2000.
MICROWAVE & OPTOELECTRONIC DEVICES (3-1-0)
Microwave frequencies, microwave transistor, microwave field effect transistor, tunnel diode, backward diode, and MIS tunnel diode, Transferred electron devices-Gunn Diode, Avalanche Transit Time Devices: IMPATT Diode, BARRITT Diode, DOVETT Diode, and TRAPATT Diode
Microwave Integrated Circuit: Introduction, Circuit Forms, Transmission lines for MICs,
Lumped Elements for MICs, Material for MICs: Substrate, Conductor, dielectric and resistive Materials, Fabrication techniques, Typical example of fabrication, Hybrid fabrication.
Microwave tubes: Klystron, Reflex Klystron and Magnetron, Traveling wave tubes, microwave detection diodes, application of microwave
Introduction of optoelectronic devices: Photovoltaic devices, Solar Radiation, PN Homojunction solar cells, Antireflection coatings, Ideal conversion efficiency, Spectral response, I-V Characteristics, Temperature and radiation effects, Heterojunction solar cells, Schottky barrier solar cell, Thin film and amorphous silicon solar cell, Solar arrays
Display devices: Characterization of displays, drawbacks of cathode ray tube, Flat panel
Electron-chromic display and electro-phoretic display
Text/ Reference Books:
1. Physics of Semiconductor Devices by S M Sze, Willy Eastern Pub.
2. Microwave Devices and Circuits by S. Y. Liao, PHI
3. Microwave Engineering and application by O.P. Gandhi, Maxwell Macmillan Pub.
4. Topic in applied physics – Vol 40 by J.I. Pankove, Springer Verlag
5. Microelectronic Devices by E. S . Yang, MGH
6. Semiconductor Devices and Integrated Electronics by A. G. Milness, CBS Pub.
7. Optoelectronics : An introduction by J. Wilson & JFB Hawkers, PHI
DESIGN OF ANALOG/MIXED MODE VLSI CIRCUITS (3-1-0)
Introduction to CMOS analog circuits, MOS transistor DC and AC small signal parameters from large signal model, Common source amplifier with resistive load, diode load and current source load, Source follower, Common gate amplifier, Cascode amplifier, Folded Cascode, Frequency response of amplifiers, Current source/sink/mirror, Matching, Wilson current source and Regulated Cascode current source, Band gap reference, Differential amplifier, Gilbert cell, Op-Amp, Design of 2 stage Op-Amp, DC and AC response, Frequency compensation, slew rate, Offset effects, PSRR, Noise, Comparator, Sense Amplifier, Data Converter Fundamentals, Analog Versus Discrete Time signals, Converting analog signals to Digital signals, Sample and Hold Characteristics, Data Architectures, DAC and ADC specifications. Mixed Signal Layout Issues, DAC Architectures,R-2R Ladder Networks, Current steering, Pipeline DAC. ADC Architectures, Flash, The Two step Flash ADC, The Successive Approximation ADC, RF amplifier, Oscillator, PLL, Mixer.
Text/ Reference Books:
1. Phillip. E. Allen, Douglas R. Holberg, “CMOS Analog circuit Design” Oxford University Press, 2002
