ASE Group
Multi-Die Integration Strategies and System Partitions in Mobile WWAN Devices
Multi-Die Integration Strategies and System Partitions in Mobile WWAN Devices
Presented by: Dr. Harrison Chang, USI, ASE Group
Date: Nov 14, 2012
Ver.:0.9
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Outline
• Strategic Thinking
• Smartphone Partition and Challenges
• Tear Down: iPhone5 and iPad3 4G
• Miniaturization Approach
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Package vs. Module; Design Rule vs. Design Case
• Generic Package
– For IC of a Wide Range of Industries
– Each Industry May Have Different System Requirement: Power,
Voltage, Frequency, EMI/EMC, Timing, Thermal, Mechanical,
Temperature Ranges, …
– May Need to Qualify for the Conjunction of All Applicable
Requirement
– Comprehensive Design Rule to Accommodate Versatile Applications
• Specialized Module
– For IC of Specific Industries
– These Industries Often Have Similar System Requirement
– Just Need to Qualify for the Intended Application Requirement
– Single Point Design Case for Specific Application
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From Multi-Die Integration to
System in Package
Design for
Manufacture &
Performance!!Stress & Reliability Design
ThermalDesign
RF Passive Circuit Design
Package-Module Co-Design
Layout Design
Main BoardDesign
RF Communication Integration
SW Development
Product QualificationFull
Type Approval
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Multi-Die Integration: Cost Up or Down
• Cost-up Factors
– New CAPEX
– Cost of Yield: ∏(1-xn) or 1-∑(xn) or in Between
– Volume: Customized vs. Standard
– Fluctuation of Commodity Pricing
• Cost-down Factors
– Less Package and Testing
– Less Material
– Design Cycle: Rule Based to Case Based
– Less Overall System Cost
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Who Owns the Multi-Die Integration
• Die Vender #1? Die Vender #2? …
• Module Maker? Device Owner?
• What about GM?
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Typical Partitions in Smartphone
PMU
Antenna Switch
Front End Components
RFTransceiver
CommunicationProcessor
ApplicationProcessor
Codec
PMU
POP MemoryWi-FiGPS
Memory
BT Sensors
Out Side of
CMOS Node
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Challenges at 3G/4G Modem
EDGE EVOLUTION
3G2G 3.5G 3.9G 4G
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3G and 4G BandsEU US LTE Name Uplink Downlink MO LTE Band Name Allocation (MHz) MO
# (MHz) (MHz) Number (MHz)
1 2.1GHz 1920 - 1980 2110 - 2170NTT Docomo
Softbank (TBD)33 TDD2000 Lower 1900 - 1920
2 PCS1900 1850 - 1910 1930 - 1990 34 TDD2000 Upper 2010 - 2025
V 3 1800MHz 1710 - 1785 1805 -1880
KT, SKT(2013)
3-IT (2013)
VF-IT (2013)
EE-UK (TBD)
All Ausie MO (Telstra,
Optus, VF)
35 TDD1900 Lower 1850 - 1910
V 4 AWS 1710 - 1755 2110 - 2155AT&T
TMO-US(TBD2013)36 TDD1900 Upper 1930 - 1990
5 850MHz 824 - 849 869 - 894 LGU, SKT 37 PCS Center Gap 1910 - 1930
6 850 (Japan) 830 - 840 875 - 885 KDDI 38 IMT EXT Gap 2570 - 2620
V 7 2.6GHz (IMT Ext) 2500 - 2570 2620 - 2690
Orange-FR (TBD2012)
SFR
Telefornica-DE
VF-DE
DT-DE
E-Plus-DE
3-IT (2013)
VF-IT (2013)
All Dutch MO(KPN,
VF,TMO)
All Spanish MO in (VF,
Telefornica, Orange)
O2-UK (2013)
3-UK (TBD)
Yota-RUS
39 China TDD 1880 - 1920
8 900Mhz 880 - 915 925 - 960 40 2300MHz 2300 - 2400
9 1700Mhz (Japan#2) 1749.9 - 1784.9 1844.9 - 1879.9 KDDI 41 US 2600 2496-2690
10 Ext1.7/2.1 1710 - 1770 2110 - 2170 42 3500MHz 3400 - 3600
111500 Lower
(Japan#3)1427.9 - 1452.9 1475.9 - 1500.9 43 3700 MHz 3600-3800
12 Lower 700MHz 698 - 716 728 - 746
V 13 Upper C 700MHz 777 - 787 746 - 756 Verizon
14Upper D 700MHz
Public Safety788 - 798 758 - 768 public safety
V 17 Lower B 700MHz 704 - 716 734 - 746 AT&T
18 850 (Japan#4) 815 - 830 860 - 875
19 850 (Japan#5) 830 - 845 875 - 890
V 20 CEPT800 832 - 862 791 - 821
Vodafone
Orange-FR(TBD2012)
SFR
TMO-DE
Telefornica-DE
VF-DE
DT-DE
VF-IT (2013)
All Spanish MO (VF,
Telefornica, Orange
2014)
EE-UK (TBD)
3-UK (TBD)21 1500 (Japan#6) 1447.9 - 1462.9 1495.5 - 1510.9
24 US L Band 1625-1660 1525-1559
V 25 US PCS + G Block 1850 - 1915 1930 - 1995 Sprint
V 26 800MHz iDEN 859-894 814-849 Sprint (2014)
TDDFDD
Operating
Band
Frequency
Band
Common
Name
UL Frequencies UE
transmit (MHz)
DL Frequencies
UE receive
Channel Number
(UARFCN) UL
Channel Number (UARFCN)
DLRegion
I 2100 IMT 1920 - 1980 2110 - 2170 9612 - 9888 10562 - 10838
Europe, Asia, Africa, Oceania (Telstra,
Optus, Vodafone AU & NZ, Three Mobile
AU, 2° and Telecom NZ), Brazil
II 1900 PCS 1850 - 1910 1930 - 1990
9262 - 9538 additional 12,
37, 62, 87, 112, 137, 162,
187, 212, 237, 262, 287
9662 - 9938 additional 412,
437, 462, 487, 512, 537, 562,
587, 612, 637, 662, 687
Americas (AT&T, Bell Mobility, Telcel, Telus,
Rogers)
III 1800 DCS 1710 - 1785 1805 - 1880 937 - 1288 1162 - 1513 Europe, Asia, Oceania
IV 1700 AWS 1710 - 1755 2110 - 2155
1312 - 1513 additional 1662,
1687, 1712, 1737, 1762,
1787, 1812, 1837, 1862
1537 - 1738 additional 1887,
1912, 1937, 1962, 1987, 2012,
2037, 2062, 2087
USA (T-Mobile, Cincinnati Bell Wireless),
Canada (WIND Mobile, Mobilicity,
Videotron), Chile (VTR, Nextel)
V 850 CLR 824 - 849 869 - 8944132 - 4233 additional 782,
787, 807, 812, 837, 862
4357 - 4458 additional 1007,
1012, 1032, 1037, 1062, 1087
Americas (AT&T, Bell Mobility, Telcel, Telus,
Rogers), Oceania (Telstra, Telecom NZ,
Vodafone AU)VI 800 830 - 840 875 - 885 4162 - 4188 additional 812, 4387 - 4413 additional 1037, Japan (NTT DoCoMo)
VII 2600 IMT-E 2500 - 2570 2620 - 2690
2012 - 2338 additional 2362,
2387, 2412, 2437, 2462,
2487, 2512, 2537, 2562,
2587, 2612, 2637, 2662,
2237 - 2563 additional 2587,
2612, 2637, 2662, 2687, 2712,
2737, 2762, 2787, 2812, 2837,
2862, 2887, 2912
Europe (future)
VIII 900 GSM 880 - 915 925 - 960 2712 - 2863 2937 - 3088
Europe[1], Asia, Oceania (Optus, Vodafone
AU, Vodafone NZ), Dominican Republic
(Orange), Venezuela (Digitel GSM)IX 1700 1749.9 - 1784.9 1844.9 - 1879.9 8762 - 8912 9237 - 9387 Japan (E Mobile, NTT DoCoMo)
X 1700 1710 - 1770 2110 - 2170
2887 - 3163 additional 3187,
3212, 3237, 3262, 3287,
3312, 3337, 3362, 3387,
3412, 3437, 3462
3112 - 3388 additional 3412,
3437, 3462, 3487, 3512, 3537,
3562, 3587, 3612, 3637, 3662,
3687XI 1500 1427.9 - 1447.9 1475.9 - 1495.9 3487 - 3562 3712 - 3787 Japan (Softbank)
XII 700 SMH 698 - 716 728 - 7463612–3678 additional 3702,
3707, 3732, 3737, 3762,
3837–3903 additional 3927,
3932, 3957, 3962, 3987, 3992USA (future) (lower SMH blocks A/B/C)
XIII 700 SMH 777 - 787 746 - 7563792–3818 additional 3842,
3867
4017–4043 additional 4067,
4092USA (future) (upper SMH block C)
XIV 700 SMH 788 - 798 758 - 7683892–3918 additional 3942,
3967
4117–4143 additional 4167,
4192USA (upper SMH block D) (VZW)
More Are
Coming!
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Challenges at the Connectivity
• Connectivity 2.4GHz, 5GHz, 60GHz
• WiFi, BT, GPS, FM, NFC, …
• Co-existence with LTE
• Mobile and WiFi Digital Integration
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Challenge on PCB Area
Side View (from Bottom)
PCB
Metal Shield
Battery 2.3mm
1.5mm
0.7mm
3.75mm
4.5mm
W = 56mm
PCB
Metal Shield
Battery
Metal Shield
33.3 mm 19.5 mm
Phone T: 7.1mm vs. 7.6mm
Moto Droid Razr Apple iPhone5Moto Droid Razr(4G LTE) iPhone4s(3G) iPhone5(4G LTE)LCD 4.3" 3.5" 4"L(mm) 130.7 115.2 123.8W(mm) 68.9 58.6 60.1T(mm) 7.1 9.3 7.6Area(mm^2) 9005.2 6750.7 7442.2Capacity(Whr) 1780mAh3.7V/5.3Whr
(1420mAh)3.8V/5.45WhrL(mm) 94.5 82.0 87.5W(mm) 56.0 33.3 33.3T(mm) 2.3 4.0 3.75Size (mm^3) 12171.6 10922.4 10922.4L 94.5 92.0 79.1W 56.0 18.0 19.5T 2.2 4.0 3.75Area(mm^2) 5292.0 3312.0 3084.4
Phone SizeBatteryPCBA
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iPhone5 Example
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iPhone5 Example (Continue)
• Skyworks 77352-15 GSM/GPRS/EDGE power amplifier module
• SWUA 147 228 RF antenna switch module
• Triquint 666083-1229 WCDMA / HSUPA PA/ duplexer module for UMTS bands
• Avago AFEM-7813 dual-band LTE B1/B3 PA+FBAR duplexer module
• Skyworks 77491-158 CDMA power amplifier module
• Avago A5613 ACPM-5613 LTE band 13 power amplifier
• Qualcomm PM8018 RF power management IC
• Hynix H2JTDG2MBR 128 Gb (16 GB) NAND flash
• Apple 338S1131 dialog power management IC*
• Apple 338S1117 Cirrus Logic device (second image)
• STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis
• Murata/USI 339S0171 Wi-Fi module
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iPhone5 Example (Continue)
• STMicroelectronics LIS331DLH (2233/DSH/GFGHA) ultra low-power, high performance, three-axis linear accelerometer
• Texas Instruments 27C245I touch screen SoC
• Broadcom BCM5976 touchscreencontroller
• Apple A6 application processor• Qualcomm MDM9615M LTE modem• Qualcomm RTR8600 Multi-band/mode RF
transceiver
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iPAD3 4G Example
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iPAD3 4G Example (Continue)
• Texas Instruments CD3240 driver device• Broadcom BCM4330 802.11a/b/g/n
MAC/baseband/radio with integrated Bluetooth 4.0+HS and FM transceiver
• 2 x 4Gb Elpida LP DDR2 = 1 GB DRAM in separate packages in a 64-bit configuration
• Fairchild FDMC 6683• Broadcom BCM5973 I/O controller• Broadcom BCM5974 microprocessor• Apple 338S0987 (Cirrus Logic audio
codec)
• Apple A5X processor• Apple 343S0561 - This IC looks like an
updated version of the 343S052 that we found in the iPad 2, and is used for power management.
• The NAND, part number THGVX1G7D2GLA08 is a 16 GB 24 nm MLC Flash from Toshiba
• Qualcomm MDM9600 - 3G and 4G wireless modem
• Skyworks 77469• Avago A7792
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Miniaturization Technology RoadmapUSI ASE USI/ASE Third Party
High
Density
SMT
dPhase 2,
d=6
Phase 3,
d=4Phase 4,
d=3
2011 20142012 2013 20162015
Compartment
Shielding
X Y
17
IPD
IPD for RF IPDHi-Cap + Hi-Q IND
XY Reduction
Shielding
Z Reduction/3D Stacking
Conformal
Shielding Molding &
Shielding
Selective/Irregular
Molding/Coating
Composite
Molding/Coating
MUF (CFS)
MoM
3D
Module
FO WLP
TVM
3D FO WLP
Development
Research
FO-TVM
Version #
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Q & A
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191919
