1
Multilayer Ceramic Technologies for Dielectric Barrier Discharge Plasma
2
- PC / Server System
- Quartz Resonator- MEMS
- Satellite- High-end Computer
- CMOS / CCD - Cellular Phone- Mobile Handset
- Automotive
Ceramic Multilayer Technology
1. Kyocera’s Experience - Examples
3
Multilayer Ceramic Substrate
For High Reliability Circuits(Concept Example, Cut Model)
Top Layer (Components Mounting)
2nd/3rd Layer(Internal Signal Pattern)
4th Layer (Power/Ground Pattern)
Internal Via Connection
Via
< Cross Section View >
Ceramics
Pattern
Top Layer
2nd Layer3rd Layer4th Layer
Ceramic Multilayer Technology
2. Multilayer Architecture
4
Ceramic Multilayer Technology
3. Process Flow
5
Potential applications of DBD plasmas
Surface TreatmentChemical
ReformingLighting
Biological
ReactionCleaning Coating Etching Change surface
Properties
Industrial
Material
Processing
Metal
Plastic
Glass/Ceramics
Textile
Non-woven
Materials
Paper
Paint & glue
Fibers
Powders
Display & Lighting
Medical
Environmental
Management
Water
Air
Flue gas
Textiles
•DTU‘s DeNox project
Candidate applications by Industry and Process
6
Line Width/Gap:1.0mm
Dielectric Thickness
on Electrode
:0.15 (mm)
Line Width/Gap:0.5mm
Line Width/Gap:1.0mm Line Width/Gap:0.5mm
Discharge Power:56.0 (W)
Discharge Power:48.1 (W)
Substrate: 76×60(mm)
Dielectric Thickness
on Electrode
:0.15 (mm)
Substrate: 76×60(mm)
Design Options for Plasma Generation
1. Comb Pattern
Ceramic Barrier Layer
7
Hole Diameter: φ0.6mm
Hole-Hole Pitch:2.1(mm)
Hole-Metal Gap:0.3(mm)
Metal-Metal Gap:0.5(mm)
Top Inner 1 Inner 2
Hole Diameter: φ0.8mm
Top Inner 1 Inner 2
Substrate: 30×30(mm)
Substrate: 30×30(mm)
Hole-Hole Pitch:2.3(mm)
Hole-Metal Gap:0.3(mm)
Metal-Metal Gap:0.5(mm)
Discharge Power:11.1 (W)
Discharge Power:14.4 (W)
Hole Diameter: φ0.6mm Hole Diameter: φ0.8mm
2. Honeycomb Pattern (Substrate with Open Holes)
Ceramic Barrier Layer
Design Options for Plasma Generation
8
Discharge Power:153.3(W)
Dielectric Thickness 0.5mmSubstrate: 120×40(mm)
Gap:1(mm)
Dielectric Thickness 0.5mm
Substrate: 120×40(mm)
Gap:1(mm)
Dielectric Thickness 1.0mm
Dielectric Thickness 1.0mm
Discharge Power:66.5 (W)
3. Parallel Flat Substrates Type
Ceramic Barrier Layer
Design Options for Plasma Generation
9
■ Material Advantages
Thermal
・ High Heat Durability
・ High Heat Dissipation
Electrical
・ High Insulation Resistance
・ Low Dielectric Loss
Chemical
・ Good Chemical Stability
Mechanical
・ High Mechanical Strength
■ Multilayer Structural Advantages
Buried Electrode
(Metal-Ceramic Co-fire Technology)
・ No Oxidation of Electrode
Design Flexibility
・ Variety of Dielectric Layer Thickness
and Number of Layers
・ Multilayer Internal Conductor
with Flexible (3D) Interconnection
Added Electrode Function
・ Electro-Static Dust Collection
・ Surface Cleaning by Non Thermal
Plasma and Buried Heater
High Reliability Metal Parts Brazing
to Ceramics
Advantages of Kyocera’s Technology
1. Material & Multilayer Structure
10
Pin Lead
Ball Pipe
PIN (Fe-Ni-Co) Ceramic Lead (Fe-Ni-Co) Ceramic
Ball (Fe-Ni-Co,Cu) Pipe (Fe-Ni-Co,Cu)Ceramic Ceramic
Advantages of Kyocera’s Technology
2. Metal to Ceramic Brazing Technology
11
Kyocera Multilayer Ceramic Package Material Properties
1MHz 2 GHz 1MHz 2 GHz
A473 9.1 8.5 5 10 6.9 18 400 270 W, Mo
A440 9.8 – 24 – 7.1 14 400 310 W, Mo
A443 9.6 – 5 – 6.9 18 460 310 W, Mo
AO600 9.0 8.8 10 21 7.2 15 400 260 CuW
AO700 9.4 9.2 6 6 7.2 21 620 315 Mo
AlN
AN242 8.7 8.6 1 170 4.7 150 400 320 W
GL940 – 18.7 – 2.5 10.7 3.5 220 188 Ag
GL950 – 9.4 – 14 8.5 4.1 400 173 Ag
GL330 7.8 7.7 4 5 8.2 4.3 400 178 Cu
GL570 5.6 5.7 3 7 3.4 2.8 200 128 Cu
GL771 5.3 5.2 8 36 12.3 2.0 170 74 Cu
CERAMIC
MATERIAL
OPTIONS
CONDUCTOR
MATERIAL
Young's
Modulus of
Elasticity
(GPa)
Thermal
Conductivity
(W/mK)
ELECTRICAL
Dielectric Constant CTE (ppm/K)
(RT-400oC)
LT
CC
Alu
min
a (
Al2
O3
)
MECHANICALTHERMAL
Dissipation Factor
(x10E-4)Flexural
Strength
(MPa)
Note: Material characteristics mentioned above are typical values.
These values may change upon further improvement or modification of these materials and processes.
: Material for Plasma Application
Appendix -