u.s. Patent 5,879,564. Mar. 9, 1999 R. Farinato, assignor to Cytec TechnoLogy Corp., Stamford, Conn. A method of dewatering a disper- sion of suspended solids, compris- ing adding to the dispersion an effective amount of a cationic, wa- ter-soluble, or water-swellable polymer to form a mixture of the dispersion and the polymer, wherein the polymer has a bulk viscosity to standard viscosity ra- tio of300 to 500, a sedimentation value of 10% or less, and contains recurring (methlacrylamide units and recurring diallyldimethylam- monium chloride, dialkylaminoal- ky1(alklacrylate, or dialkylamino- alkyHalklacrylamide units; and dewatering the mixture. MULnLAYIR PRINTED CIRCUIT BOARD FOR WIRE BONDING U.S. Patent 5,879,568. Mar. 9, 1999 N. Urasaki et aL., assignors to Hitachi Ltd., Tokyo A process for producing a multi- layer printed circuit board com- prising compounding electrically insulating ceramic whiskers in a thermosetting resin varnish, dis- persing the whiskers in the var- nish uniformly by stirring, coat- ing the resulting mixture on a roughened side of a copper foil, semicuring the resin by heating to form a thermosetting resin layer, placing this layer on an interlayer circuit board in which plated through-holes and conductor cir- cuits have been formed, and hot pressing them to form an integral laminate; forming an etching re- sist on the copper foil, and etching the copper foil portions exposed from the etching resist into the shape of holes for forming inter- stitial via holes; removing the etching resist; applying laser beams to the cured thermosetting resin layer exposed from the fine holes of the copper foil etched into the shape of holes for forming in- terstitial via holes to remove the resin layer to an extent that the circuit conductors of the inter- layer board are to be exposed, thereby forming via holes; rough- ening the cured thermosetting resin layer on the walls of said via holes by using a roughening TOTALTREAT® INDUSTRIAL WASTEWATER TREATMENT SYSTEMS USFilter's Industrial Wastewater Systems group introduces a line of standardized precipitation and neutralization systems. The TotalTreat line includes continuous precipitation, batch precipitation. and neutralization systems. Each of these systems is skid-mounted. factory assembled and tested to ensure hassle-free installation. Each includes a PLe control package for low operating costs and safery inter-locks. Contact Industrial Wastewater Sys(erns at 800.525.0658 or 724.772.0044 phont, 724.772.1360 fax. USFilte, 7illing ellrr oftht world's Wlltn: Circle 064 on reader information card December 1999 77
Transcript
u.s. Patent 5,879,564. Mar. 9, 1999R. Farinato, assignor to CytecTechnoLogy Corp., Stamford, Conn.
A method of dewatering a dispersion of suspended solids, comprising adding to the dispersion aneffective amount of a cationic, water-soluble, or water-swellablepolymer to form a mixture of thedispersion and the polymer,wherein the polymer has a bulkviscosity to standard viscosity ratio of 300 to 500, a sedimentationvalue of 10% or less, and containsrecurring (methlacrylamide unitsand recurring diallyldimethylammonium chloride, dialkylaminoalky1(alklacrylate, or dialkylaminoalkyHalklacrylamide units; anddewatering the mixture.
MULnLAYIR PRINTED CIRCUITBOARD FOR WIRE BONDINGU.S. Patent 5,879,568. Mar. 9, 1999N. Urasaki et aL., assignors toHitachi Ltd., Tokyo
A process for producing a multilayer printed circuit board comprising compounding electricallyinsulating ceramic whiskers in athermosetting resin varnish, dispersing the whiskers in the varnish uniformly by stirring, coating the resulting mixture on aroughened side of a copper foil,semicuring the resin by heating toform a thermosetting resin layer,placing this layer on an interlayercircuit board in which platedthrough-holes and conductor circuits have been formed, and hot
pressing them to form an integrallaminate; forming an etching resist on the copper foil, and etchingthe copper foil portions exposedfrom the etching resist into theshape of holes for forming interstitial via holes; removing theetching resist; applying laserbeams to the cured thermosettingresin layer exposed from the fineholes of the copper foil etched intothe shape of holes for forming interstitial via holes to remove theresin layer to an extent that thecircuit conductors of the interlayer board are to be exposed,thereby forming via holes; roughening the cured thermosettingresin layer on the walls of said viaholes by using a roughening
TOTALTREAT® INDUSTRIAL WASTEWATER
TREATMENT SYSTEMS
USFilter's Industrial Wastewater Systems group
introduces a line of standardized precipitation and
neutralization systems. The TotalTreat line includes
continuous precipitation, batch precipitation. and
neutralization systems. Each of these systems is
skid-mounted. factory assembled and tested to ensure
hassle-free installation. Each includes a PLe control
package for low operating costs and safery inter-locks.
Contact Industrial Wastewater Sys(erns at 800.525.0658
or 724.772.0044 phont, 724.772.1360 fax.
USFilte,7illing ellrr oftht world's Wlltn:
Circle 064 on reader information card
December 1999 77
agent: conducting plating' to ell'Ct rically connl'l't till' circuit cond udors of thp in tprlayl'r boa I'dand the copper f(lil: f(lrming anl'tching resist on the COppl'l' f(liland etching away the copppr f(lilportions l'xpospd from tlw l,tchingrpsist: and removing tlw l,tchingI'l'sist.
M. (;,'i,,1 ,'I al.. a""igllul''''" R:\....,'F!'od ..,, Olll! FOI'/JI'II A(;..\11111""',..
( ;''I'III11Il\'
A nH'thod f(l!' n'ducing surfan' ekfi.'cts in del'trodl'positpd films onpll'ctrically conducting substratl'scOlllpnsll1g Illlnwrslng 111 an aqll('ous l'll'ctrocoating bath cOlltain-
ing at !t'ast onl' snltlll'tic J"('sin to1)(' dl'posiu'd on a catllOdl'. surI'acp -dl' fl'd - fo I' III i n g con tam inants. and a pol.\·etl1l'r url'thanepn's('nt in an amount t'ffel'ti"e ton'ducl' dl'fl'l't formation by th('contaminant,,: connl·cting thl'"ubstratl' a" tlH' cathodl'; (,Iectrodppositing a film on thl' suh"trate: n'mm'ing tlH' substratl'from tlw l'll'ctrocoating bath: andbaking tlH' dl'posited paint film topro"idl' a coating- substantiallyfn'l' of surbn' defi.·l'ts causl'd bycontaminants.
The "Pellu" bird only catches it's prey in clean,clear, odorless water. This is the goal of Pellusystems to provide colorless, Odorless, cleanwater using one or a combination of six different Pellu chemicals, depending on theprofile and complexity of the solution. Itremoves all heavy metalS, is not pH sensitive,and is highly efficient in the presence ofinterfering agents such as ammonia, SUlfatesand EDTA. This process is extremely costeffective, and time saving.
