• Thank you Suzuki-san and JAXA for your invitation. It’s always a pleasure to visit Tsukuba.
• Our congratulations to JAXA on the 27th anniversary of the MEWS Workshop!
• JAXA is our valued partner in NASA Electronic Parts Assurance Group (NEPAG) activities.
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Introduction (Contd.)
• This talk is about NASA’s approach to space parts miniaturization, which results in lower power, higher performance, more functionality, smaller packages, and acceptable radiation tolerances for space missions.
• Over the years, NASA has adopted progressively more miniaturization in parts as technology advanced, and examples are provided.
• Through the NEPAG, NASA works with the space community and its electronic parts supply chain to strengthen its standardized parts infrastructure. o An update on one such initiative, Class Y, is provided.o NEPAG is continually working with the community to develop standards for
the next devices.o An update is given for NASA’s effort on the evaluation of automotive parts for
use on CubeSats and small missions.
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Example 1. Flagship Mission (Voyager Twins 1977) • Status
o The Voyagers are still exploring (picture below)
• Procurement overviewo Large procurement (CD4000 series CMOS logic family used)o Substantial budgeto Screening & quality conformance inspection (QCI) done to JPL-specified space flows
• Technology Nodeo ~ 5 micron
Mission ObjectiveThe mission objective of the Voyager Interstellar Mission (VIM) is to extend the NASA exploration of the Solar System beyond the neighborhood of the outer planets to the outer limits of the Sun's sphere of influence, and possibly beyond. This extended mission is continuing to characterize the outer Solar System environment and search for the heliopause boundary, the outer limits of the Sun's magnetic field and outward flow of the solar wind. Penetration of the heliopause boundary between the solar wind and the interstellar medium will allow measurements to be made of the interstellar fields, particles and waves unaffected by the solar wind.
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Example 2. Need for Lower Voltage Parts (2000)
• Would 5V High-speed rad hard CMOS parts work at 3.3V?• Technology node ~ 1 micron• In-house testing showed they would
o Plots of dynamic supply current at 1 MHz as a function of supply voltage over temperature
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Example 3. Using a Commercial 16-bit A/D (2005)
• Evaluated a commercial 16-bit analog-to-digital (A/D) converter for use on flight
• Did constructive analysis (CA), single-event latchup (SEL), and total ionizing dose (TID) tests. Results were acceptable.
• Upscreened plastic encapsulated microcircuit (PEM) version available directly from the manufacturer.
• Technology Node: < 500 nm
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Example 4. Enhancing QMLV Products Portfolio (2011)
• Part number RTAX2000, 2 Million gate rad-tolerant field-programmable gate array (FPGA)
• Technology node: 130nm• Now available as Qualified Manufacturers Listing V (QMLV)
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Infusion of New Technology into MIL StandardsThe “Class Y” Initiative
• Advances in packaging and device technology are happening rapidly.
• How do we enable space flight projects to benefit from the newly developed devices?
• NASA led a G12 committee initiative, called Class Y, for infusing one new type of complex devices into military/space standards.
• Such an effort must be coordinated with the suppliers and users.
• Need to address all aspects of packaging configuration.
• New test methods must be created and the existing standards updated as necessary.
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Infusion of New Technology into MIL StandardsAdding Class Y to Microcircuits Specification
• Microcircuits specification, MIL-PRF-38535
o Revision K was released December 20, 2013o Introduces Class Y
• Acknowledgements
o Special thanks to DLA-VAo Thanks to everyone including task group (TG)
members and advisors
• Class Y Status
o See the next sheet
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G-12 Class Y
Task GroupNon-Hermetics in
Space
Manufacturers Primes
JC-13.2 Flip-chip Package BGA /
CGA** Requirements
Newly Formed Task Groups with Class Y Interest
JC-13.2 Electronic Parameters &
B.I. Standardization
JC-13/G-12/ G-11 BMEs(base metal electrodes)
Task Group Activities Task Group Inputs
Government
Infusion of New Technology into the QML System G12 Class Y Effort at a Glance
Users to procure QML-Y flight parts from certified/qualified suppliers
Manufacturer Certification to QML-Y (DLA-VQ)
Coordination Meeting at DLALand & Maritime (April 2012)
Aeroflex (October 2011)
Xilinx (February 2012)
Honeywell (May 2012)
Supplier PIDTP* Presentation
Minnowbrook ConferenceOct. 2013, New York
Conference
BAE (October 2012)
CMSE (Feb. 2013), LA
e2v (January 2013)
DLA-VA to update 38535 with Class Y requirements and release the draft version (rev. K) for comments
DLA-VQ to begin preparation for auditing Class Y suppliers
DLA-VA to date 38535K
DLA-VQ to begin audit of suppliers to Class Y requirements
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38535K Coordination Meeting
Infusion of New Technology into MIL StandardsClass Y
Qualifying New Packaging Technology
• Issueo How to address the manufacturability, test, quality, and
reliability issues unique to specific non-traditional assembly/package technologies intended for space applications?
• Change in Paradigmo Move away from rigid requirements; provide flexibility to
manufacturers.
• Proposalo Each manufacturer shall develop a Package Integrity
Demonstration Test Plan (PIDTP) that shall be approved by the qualifying activity after consultation with the space community. Ref: MIL-PRF-38535K, Para B.3.11.
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Infusion of New Technology into MIL Standards Class Y
Applicability of the PIDTP
• The Packaging Integrity Demonstration Test Plan (PIDTP) requirement shall apply to:
o Non-hermetic packages (e.g., Class Y)o Flip-chip assemblyo Solder terminations
• Microcircuits employing more than one of above technologies shall include elements for each in the PIDTP (See 38535K, Para H.3.4.4.1).
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Xilinx New (CN) Package Qualification Update
• Assembly qualification
o In progress at Kyocerao Virtex-5 is the qualification vehicle (65nm technology node)o Periodic updates with DLA and the space community.
• New Changes for CN Packages
o CN package was initially going to be Land Grid Array (LGA)o Based on customer feedback, Xilinx decided to add solder columnso Solder column attachment will be done by Six Sigma.
• Supply Chain Approval progress
o Kyocera and Six Sigma already are DLA approved facilitieso Audits of the rest of the supply chain are planned.
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Other Class Y Activity
• Six Sigma
o Received QMLY certification
• Aeroflex Colorado Springs
o QMLY Plan in review
• e2V Grenoble
o QMLY Plan expected in a few months
The Hubble Space Telescope (HST) is a 2.4-m (7.9-ft) aperture space telescope. It was carried into low Earth orbit by a Space Shuttle in 1990, and it remains in operation.
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Small Missions and CubeSats
• Small Missions
o Second NASA Small Missions Workshop held last montho Venue: Goddard Space Flight Center, Greenbelt, MDo Good attendance (via in person and WebEx)o Papers posted on NEPP Website: nepp.nasa.gov
• CubeSats
o Most use matured technology partso Reported failure rate: 50% (Too high!)
The COVE (CubeSat Onboard processing Validation Experiment) Payload Processor
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• The main drivers are size, weight, and price of electronic components
o Commercial electronic parts usually offer varied functions o How do automotive parts compare to catalog commercial?
• Commercial Parts Options
o Manufacturers make parts to meet the needs of their chosen market(s)o Automotive parts are designed to meet the needs of sub-system suppliers
to automobile manufacturers
• Space
o Parts from manufacturers that are qualified to the AEC Q specifications seem to offer advantages for the smallsat user
o NASA is doing a limited evaluation of automotive electronic parts
Evaluating Automotive Electronic Parts
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AEC Q specifications are Qualification Requirements Only, Focused on:
• A One-Time INITIAL QUALIFICATION of a Device Familyo “Device Family” is Common Materials, Processes, Designs, Manufacturing
Location, etc.o “Generic Data” may be used provided relevance of data can be
demonstrated
• Requirements for REQUALIFICATIONo Provides recommendations as needed
• Requirements for process change notification (PCN) to automotive customers
• THEY DO NOT PROHIBIT PURE TIN – Whisker mitigation recommended
What do AEC Q Specifications Contain?
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The Last Page
• Space parts miniaturization is a multi-facetted challenge
o Powero Functional Complexityo Packaging o Radiationo Per unit costo Standardization o Mission Assurance
• NASA has responded to an ever changing environment over the years
o Our parts needs span a wide spectrum of applications – from the CubeSats to the Europa missions
o We have adopted progressively more miniaturization in parts as technology advanced
• The JAXA Microelectronics Workshop (MEWS) is an extremely useful resource
Thank you!18
http://nepp.nasa.gov
ACKNOWLEDGMENTSThe research described in this publication was carried out, in part, at the Jet Propulsion Laboratory,California Institute of Technology, under a contract with the National Aeronautics and Space Administration.Help is gratefully acknowledged from Dr. Charles Barnes, Roger Carlson, Joon Park, and Michael Sampson. Copyright 2014 California Institute of Technology. Government sponsorship acknowledged.
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Exploring Mars
NASA’s Curiosity rover may be getting a little brother. NASA is proposing to fly a mission called Mars 2020 that would have a high heritage of hardware and technology from Curiosity.
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JPL’s main facility, at the foot of Southern California’s
San Gabriel Mountains.
–Backup Slides
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It has been reported that as the feature sizes get smaller, the product useful life gets shorter. Should be further investigated if considering use of COTS with small features, particularly below 45nm (e.g., 35nm, 28nm, 20nm, 14nm).
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Bathtub Curve and Feature Sizes
Monolithic vs. Hybrid Microcircuits and Related IssuesStandard
Yes, but not tested to 3.15(Xilinx V-4/V-5 FPGAs, Class Y candidates)
Evaluate BMEs(NASA, Aerospace,Suppliers, ESA, JAXA)Double Derating?
Hybrids
Multiple
MIL-PRF-38534
Single DieHybrids
Manufacturers buildingsingle die hybrids
Encouraging suppliers to alsoget 38535 Certification(M.S. Kennedy has already received it.)
Yes, but meet existing elementevaluation requirement which arenot as stringent as for 38535.
Stop use until evaluation done.(Ref: G12 letter to DLA)
Changes in Last Few Years: The boundary between monolithics and hybrids has become blurred.
A New Issue: No MIL capacitors to satisfy the needs of new high-speed, low voltage designs. They are using Commercial BME (Base Metal Electrode) capacitors with unproven space heritage. This affects Class Y.
