Advanced Electronic Packaging
PACKAGING STANDARD
• State-of-practice relies on standard backplanes and chassis
Cold Capable Electronics
• State-of-practice relies on heaters to keep electronics within the Mil-Spec temperature range
• Operation and survival at low temperatures eliminates battery mass and power for heating of electronics
CHIP ON BOARD TECHNOLOGY
• State-of-practice relies on flat-pack surface-mount technology
• Chip on board eliminates the conventional flat-pack packages, dramatically reducing area on the printed wiring board.
• Our proposed packaging standard requires the density of chip on board technology in order to work
LOW-POWER COMPUTING
• State-of-practice relies on standard cPCI cards requiring several cards to implement command and data handling functionality
• Chip on board and system on a chip technology allow the imple-mentation of a single-board command and data handling system
Low-Power, Low-Temperature Electronics for the Europa Lander
Doug SheldonJet Propulsion Laboratory, California Institute of Technology
Don HunterJet Propulsion Laboratory, California Institute of Technology
Gary BolotinJet Propulsion Laboratory, California Institute of Technology
Objectives
The goal is to develop technologies that maxi-mize the science return from the baseline Europa Lander. These technologies will allow the lander to last longer on the surface or allow more room for additional science instruments. This goal will be achieved through:
• Backplane and chassis mass are eliminated
• External connections – 181 1A capable or 100 3A capable
• Internal connections – 300 slice to slice
• Simplified thermal design – Each slice conducts heat directly to spacecraft
Electronic Packaging
• Dramatically reduce electronics volume [factor of 9.7] and mass [factor of 3.75] through the use of advanced packaging
Low-Power Multi-Core Computing• Develop an advanced embedded processing module
that enables us to:
• Eliminate the need for the mass-intensive Compact PCI backplane and chassis mass
• Lower power by combining instrument and tele-communication interfaces within the embedded processing module. Cold Capable Electronics
• Reduce the power required for survival and opera-tional heating by allowing electronic assemblies to operate and survive at temperatures beyond the Mil-Std temperature range of -55 to +125C
National Aeronautics and Space Administration
Jet Propulsion LaboratoryCalifornia Institute of TechnologyPasadena, California
www.nasa.gov
© 2016 California Institute of Technology. Government sponsorship acknowledged.
National Aeronautics and Space Administration
Yutao HeJet Propulsion Laboratory, California Institute of Technology
MSL Rover RPAM6U Standard cPCI Chassis
Europa Lander Avionics Goal
Slice-Based Packaging Standard
Conventional Packaging Baseline
6U Card 16cm x 23cm
Proposed 10 cm x 10 cm packanging standard
10 cm x 10 cm x 1 cm Motor Control Card
2.0 cm x 2.0 cm Motor Driver Module
System on a Chip
These technologies
make a single-board
CDH possible
17 mm x 12 mm LVDS
Driver COB Package
Performance Metrics State-of-practice Proposed Electronics Goal
Non-operational Temperature Range
-55 to +125C -40 to +115C after DP margin
-100C[TBC] for CDH
-200C[TBC] outside
Operational Temperature Range
-55 to +125C -40 to +115C after DP margin
-70C[TBC] for CDH -70C outside
Advanced conductive epoxies allows for
survival of electronics down to Europa
surface temperatures
Performance Metrics State-of-practice Proposed Electronics
Goal
Volume
51,639 cc – MSL Rover
11,891 cc – Europa Clipper 8,724 cc – Europa Lander
Baseline
< 1500 cc
Mass
46.2 kg – MSL Rover1
23.7 kg– Europa Clipper2 10.5 kg – Europa Lander
Baseline < 4 kg
Power 189 W – MSL Rover
52.0 W – Europa Clipper 26 W – Europa Lander Baseline
< 13 W