Table of contents
• Motivations
• Topologies of NoC
• An example of NoC
• Emerging Interconnect technics
Motivations - Scalability
• We will follow 3 criterias:
▫ Performance:
How increasing the count of resources affect performances of the interconnect?
▫ Complexity:
How increasing the count of resources affect the complexity of the chip?
▫ Design:
How increasing the count of resources affect the interconnect design?
Motivations – Scalability
• Let’s compare with other solutions:
Fully Connected Buses Network
One Chip
Motivations – Scalability
• N: resources count
Fully Connected Buses Network
Scalability Performances
The Best Not dependent of
N
Decreasing a lot with N
In the middle
Scalability Complexity
~ N² Not depending of N
~N
Scalability Design
Easily scalable Redesign it for each N
Easily scalable
Motivations - Reuse of usual network technics
• Application of all technics already approved in hardwired network:
▫ Fault detection
▫ Channel
▫ Multicast/Broadcast, etc…
• But capability of NoC to have bigger data wires:
▫ Ethernet: 8 wires
▫ An example of NoC: 256 data wires
Motivations - Predictability
• Communication performance:
Regular geometry can potentially make communication performance more predictable.
Use of bandwidth policies like pre-schedule channels.
Motivations - Predictability
• Predictable electrical parameters:
▫ Reduced wire length
Low noise and design constraints
Reduced delays constraints
▫ Regularity
An example of NoC
• 12x12mm chip
• 0.1 μm CMOS
• 0.5 μm wires
• 16 3x3mm tiles
• Different resources:
▫ Processors, DSP, Memory, etc…
• Tiles use only Network to communicate
• Use of 2D-Taurus
An example of NoC - Interface
• Each tiles have an interface
• Input: tile => Network; Output: Network => tile
• 5 inputs/outputs per tiles: N, S, E, W and Tile.
Resource
West
East
North
South
Tile
MSB
MSB
MSB
MSB
An example of NoC - Interface
• One input buffer and state for each virtual channel
• The controller then schedule packets to the 4 outputs (N, S, E, W)
• There is one output buffer by output
• Controller schedule them to the tile node
Tile Network
Network Tile
An example of NoC - Datagram
• 256-bits data field
• 38-bits control field for input
▫ Type (2bits)
▫ Size (4 bits)
▫ Virtual channel (8 bits)
▫ Route (16 bits)
▫ Ready (8 bits)
• 22-bits control field for output (like input without route)
An example of NoC – How it’s done
• 8 wires from tile i to j need to be logically connected
• Whenever the state change, input port inject a packet of 16 bits in the network.
• 8 bits hold state of wires
• 8 bits identify it as containing logical wire
• Others applications possible: r/w memory, flow-controlled data stream, etc…
An example of NoC – Results
• Routers uses only 6.6% of the tile area
• Also use 3000 of the 6000 available wiring tracks on the top two metal layers.
• But we don’t need drivers, receivers, repeaters and wires for global signals
An example of NoC – Additional advantages
• Use fault-tolerant wiring
▫ Add one wire to a bus
▫ After test, fuses are blown to identify faulty bits
▫ Shift all bits to avoid the faulty one
• Use fault-tolerant protocol
▫ Like hardwire network: Parity bit, etc…
▫ But adding delays
An example of NoC – Additional advantages
• Pre-scheduled and dynamic traffic
▫ Enabling reservation of bandwidth
▫ Example: video stream, speech stream, etc…
Emerging Interconnect technics – Nano-
photonic Interconnection
• Advantages: ▫ High speed optical devices
and links increase the bandwidth
▫ Negligible power dissipation in optical data transport
• Drawbacks: ▫ Temperature sensitivity
of photonic components ▫ Integration of on-chip
photonic components
Emerging Interconnect technics – Wireless NoC
• Advantages:
▫ Direct point-to-point wireless links.
▫ Lower power dissipation due to multi-hop path changed by single hop.
• Drawbacks:
▫ Noisy wireless channel
▫ Need low power mm-wave transceivers
Emerging Interconnect technics – 3D
• Advantages: ▫ Higher connectivity and less hop count. ▫ Lower power dissipation due to shorter average path
length ▫ Can be combined with others
• Drawbacks: ▫ Heat issues due to high
power density ▫ Vertical via failure ▫ Heavier switch
(from 5 to 7 I/O)