ni.com/awr

NI AWR SoftwareProduct Portfolio

Powerful, Innovative UI

An intuitive yet powerful design

environment unleashes engineering

productivity, allowing designers to

address the emerging communication

and radar systems driving today’s RF/

microwave hardware developments and

integration technology. System-aware

simulation helps these technologists

investigate and understand the

connection between component and

system performance. From exploring

new, spectrally effi cient architectures for

better performance to specifying and

verifying individual component

requirements within next-generation

systems, today’s high-frequency

electronics must be developed with

simulation and test tools that provide

whole system results.

Robust Simulation Technologies

Advanced simulation technologies

provide fast, accurate results with fully

integrated system, circuit, and EM

analyses that accurately predict and

optimize component performance

before prototype manufacturing and

test, saving development time and

costs. For high-frequency components,

designers must be able to analyze the

design details that will impact electrical

behavior, including transistor

nonlinearities, sensitivity to terminal

impedance mismatch, dispersion,

parasitic coupling, and a host of other

high-frequency phenomena. Simulation

technology must support detailed device

modeling and the same performance

measurements used to specify the

device requirements.

Automation and User Productivity

Design fl ow automation connects

simulation models, third-party tools and

layout geometries to manufacturing

processes. As designs move from early

concept through engineering sign-off,

design details increase and emphasis

switches from electrical performance to

yield and design for manufacturing

concerns, including design rule checking

and layout versus schematic. Design

fl ows are specifi c to PCB, MMIC, RFIC,

and multi-chip module fabrication

processes, requiring specialized support

through process design kits and support

for import/export of layout data such as

GDSII and DXF or fi le formats such as

IPC-2581 or ODB++ for interoperability

with enterprise layout tools.

NI AWR SoftwareWireless Design: Trends and ChallengesNext-generation wireless devices, communications infrastructure, and aerospace/defense electronic systems are creating new

opportunities for engineers to design and develop RF/microwave products. These opportunities are contingent on delivering devices

that achieve high performance goals for bandwidth, linearity, and effi ciency while meeting market requirements for smaller, lighter,

more reliable, and less costly devices. Furthermore, these challenges are compounded by business concerns such as escalating

development costs, limited engineering resources, and time-to-market pressures.

To fulfi ll product requirements, new semiconductor, PCB, and module technologies must achieve unprecedented integration and

functionality within an increasingly smaller form factor. Therefore, engineers are demanding EDA tools that can:

■ Accurately predict electrical performance as it relates to physical design

■ Correctly account for excitations from complex waveforms used in communication and radar systems

■ Offer a seamless flow-to-manufacturing process

To address these trends and challenges, NI AWR Design Environment provides engineers with an integrated, open platform offering

system, circuit, and EM simulation to accelerate the development of high-performance products.

EDA Software: AWR Advantages

Learn more at ni.com/awrAWR

“With intense time-to-market pressures, our designers need proven design fl ows that work seamlessly.NI AWR Design Environment fi lls this need.”

Dr. Simon Mahon, MACOM

Analyst-MP

AntSyn

Ad

ditio

nal P

rod

ucts

NI AWR Design EnvironmentMicrowave Offi ce

Visual System Simulator

Analog Offi ce

AXIEM

Analyst

Ad

d-O

n P

rod

ucts

AWR Connected

iFilter

iMatch

RDR

RFP

TestWave

W5G

Wireless Communications Semiconductor Aerospace/Defense Consumer Electronics Biomedical Automotive Academia

Microwave Offi ceRF and Microwave Circuit Design Software

Advantages Accelerate Design Starts

Powerful design assistance tools such as fi lter, mixer, passive component,

transmission line, and matching network synthesis, along with industry-leading

load-pull analysis for power amplifi er design, provide critical support for all

phases of product development.

Key Analyses

Fast and accurate simulation technology offers robust circuit analysis and

design insight, providing the linear/nonlinear time- and frequency-domain

measurements required to properly characterize and optimize high-frequency

electronics.

Simulation-Ready Models

Comprehensive libraries of high-frequency distributed transmission models, surface-mount vendor components, and process design

kits from leading MMIC/RFIC foundries let engineers accurately simulate designs as they will be manufactured for greater success.

Capabilities

Products Products

Smarter Design Entry

The unifi ed layout editor and schematic

capture with RF-aware model libraries

link electrical design and physical layout,

ensuring greater simulation accuracy

while allowing designers to visualize

products before manufacture.

Parametric control and circuit hierarchy

support development of complex

structures from user-generated building

blocks, as well as design optimization

and re-use.

Insightful Simulation

Analyze key performance metrics of RF

and microwave circuits with frequency-

domain linear simulation for RF/

microwave passive component and

signal integrity applications and the

APLAC harmonic balance/transient

circuit simulation engine for nonlinear

and digitally-modulated circuits such as

power amplifi ers, mixers, and oscillators.

Design for Manufacturing

A leading front-to-back MMIC design

fl ow that enhances engineering

productivity and ensures fi rst-pass

success is provided within a hierarchical

framework that accurately captures the

combined electrical performance

of diverse IC and PCB process

technologies, complex multi-

layer interconnects, embedded passives,

and surface-mounted devices found in

today’s multi-chip RF modules.

Features at a Glance ■ Schematic/Layout – Design entry with industry-leading tuning

■ APLAC – Linear and nonlinear circuit simulation

■ EM Analysis – Fully integrated EM with AXIEM and Analyst

■ Load-Pull – State-of-the-art load-pull analysis

■ Stability – Includes both linear and nonlinear stability analysis

■ DRC/LVS – Design rule checking/layout vs. schematic

■ TX-LINE – Interactive calculator for transmission line analysis

NI AWR Design EnvironmentIntegrated, Open Platform for RF/Microwave Product Development

AdvantagesIntegrated Design

Achieve successful high-frequency circuit and system product development

from initial concept through fi nal verifi cation with powerful electrical/layout

design capture and fully integrated system, circuit, and EM co-simulation.

Intuitive

Software developed by people who understand how RF/microwave products

are designed and built offers an environment that simplifi es complex tasks,

reduces manual design entry, and supports state-of-the-art design fl ows.

Open Platform

Design fl ow automation and interoperability with third-party tools enable

product development to proceed unabated with less hassle and greater

fi rst-pass success. The software’s COM API and scripting allow design teams

to further automate and customize new capabilities within the platform.

CapabilitiesUnifi ed Design Capture

Provides front-to-back design fl ow for

MMIC, RFIC, PCB, and module process

technologies, enhancing productivity and

fi rst pass success with an innovative

user interface and dynamically-linked

electrical and layout design entry.

Superior Design Management

Integrates circuit, system, and EM

simulation technologies within a

comprehensive platform

offering physical layout linked to

simulation-ready schematic capture,

supporting complex hierarchical projects

and virtual test benches.

Design Flow Automation

Supports third-party interoperability with

industry-standard tools, allowing

seamless exchange of design data for

schematic/netlist import, bi-directional

EM co-simulation, ERC/DRC/LVS, and

production-ready GDSII export.

NI AWR Design Environment Platform ■ Microwave Office – RF and Microwave Circuit Design

■ Visual System Simulator – RF Communication and Radar System-Level Design

■ Analog Office – Analog/RFIC Circuit Design

■ AXIEM – 3D Planar EM Analysis

■ Analyst – Full 3D FEM EM Analysis

AWR

“The power and speed of NI AWR Design Environment software made it possible to accurately and effi ciently simulate the entire structure of this very complex NDPA MMIC.”

Dr. Chuck Campbell, Qorvo

Layout

CircuitDesign

SystemDesign

Simulation& Analysis

DRC/LVS

EM/Extraction

AWR

n RF Devices (Amplifi ers, Filters, Passives, Control)

n MMICs (III-V Compound Semiconductors)

n RF and High-Speed PCBs

n Multi-C hip Modules

Applications

Analog Offi ceAnalog/RFIC Circuit Design Software

AdvantagesRF Focused

A powerful yet cost-effective RFIC design platform that enables fast and

accurate entry of design concepts, supporting design management with

parasitic-aware component models, analyses, and design assistance that helps

engineers study and understand the interdependencies of analog, RF, and

mixed-signal design.

RFIC Extraction

Analog Offi ce works with iNet and ACE to perform interconnect modeling and

parasitic extraction of IC structures created with the integrated layout editor or

imported GDS II layouts from 3rd party IC layout tools.

IC Design Ecosystems

Analog Offi ce is fully integrated within the NI AWR Design Environment open platform, allowing designers to exchange design data

between third-party IC layout and EM simulation tools. The Open Access import/export wizard transfers design schematic data

between Analog Offi ce and Cadence Virtuoso, supporting the transfer of IP between tools.

Capabilities

Products Products

RFIC Design Flow

Provides comprehensive simulation

of RFIC technologies from system to

fi nal tapeout. The RF/microwave-aware

active and passive device models, silicon

foundry PDKs, and support for

Spectre netlist simulation accurately

capture the behavior of RF front-end

blocks within an RFIC design, either as a

stand-alone tool or as supplemental

simulation software within a Cadence

Virtuoso design fl ow.

High Frequency Simulation

Provides frequency-domain, harmonic

balance, and transient simulations for

small-scale RFICs and RF front-end

blocks within large-scale RFICs to

effi ciently predict the performance of

high dynamic range RF circuits operating

at RF, microwave, and millimeter-wave

frequencies for wireless communication

and radar applications.

Silicon PDKs

PDKs for leading silicon foundries are

developed for the open NI AWR Design

Environment from foundry-supplied

technology fi les, device models, and

design rules. These PDKs are subjected

to extensive validation at both cell and

circuit level to ensure quality and

conformance to best-in-class design

methodologies for high-frequency RFIC

designs, accelerating silicon tapeouts

and enabling fi rst-pass success.

Visual System SimulatorRF Communication and Radar System-Level Design Software

AdvantagesConceptualize Faster

Rapidly construct communication and radar systems using RF/microwave and

signal processing blocks based on measured, simulated, or projected behavior

to investigate new architectures and study overall system performance.

Account for Details

Visual System Simulator™ (VSS) co-simulates with Microwave Offi ce and

Analog Offi ce for RF/microwave and analog/RFIC design, as well as AXIEM

planar and Analyst™ arbitrary 3D EM solvers, to support communication

measurements for individual components and accurate system performance

verifi cation.

Hardware in the Loop

NI LabVIEW, MATLAB, and C++ co- simulation have “plug-n-play” support within VSS to expand capabilities, making custom

models, scripts, and signal processing algorithms readily available. Additionally, for test and measurement compatibility,

TestWave™ links test and measurement equipment such as network and spectrum analyzers into VSS.

CapabilitiesDigitally-Modulated Systems

Design system architectures and

components with IP libraries for wireless

communication standards, including

LTE-A, 5G, Narrowband IoT, and more.

Pre-confi gured test benches support

transmitter conformance testing and

receiver sensitivity analysis, as well as

circuit co-simulation, for linearity

measurements such as ACPR and BER

of power amplifi ers operating under high

PAPR operations. 

Link Budgets

Perform RF-cascaded measurements

such as gain, noise fi gure, and third-

order intercept while accounting for

impedance mismatch throughout the

signal path, identifying the source of

spurious products and intermodulation,

and simulating system metrics such as

EVM. Design commercial and military

transmitters and receivers by exploring

different system architectures and

optimizing component specifi cations for

best overall performance.

Phased-Array Systems

Simulate critical antenna performance

for phased arrays with a re-confi gurable

model supporting thousands of

radiating elements based on measured

or simulated antenna data for the

development of beam-forming

algorithms, evaluation of hardware

impairments, and RF link analysis. The

model, which also accounts for mutual

coupling between radiating elements for

greater accuracy, can be confi gured as a

MIMO antenna assembly.

Features at a Glance ■ RF Chain Impairment Analysis

■ RFA System-Level Planning Tool

■ Co-Simulates With Microwave Office

■ EVM, ACPR, and Phase Noise Measurements

■ Wireless Communication Test Benches

Features at a Glance ■ Schematic/Layout – Design entry with industry-leading tuning

■ APLAC – Linear and nonlinear circuit simulation

■ Parasitic Extraction – Fully integrated EM

■ DRC/LVS – Design rule checking/layout vs. schematic

■ PDKs – Process design kits (PDKs) for silicon foundries

n Component Specifi cations

n Communication Algorithm and Modulated Waveforms

n End-to-End Systems (Baseband Through RF and OTA)

n Wireless Conformance Tests (5G, LTE, and more )

n Aerospace/Defense Systems (EW, ECM, ESM)

Applications

n Small-Scale CMOS RFICs

n RF Front-End Sections of Large-Scale RFICs

n SiGe RFICs

n Multi-Chip Modules

n Analog Circuits

Applications

AnalystFull 3D Finite Element Method EM Analysis Software

AdvantagesDiagnostics and Design

Electromagnetic simulation can detect design problems that cause

products to fail performance requirements. With

3D EM simulation easily available within an RF/microwave design fl ow,

engineers can identify and eliminate potential design failures.

Parametric Cells

Libraries of parameterized EM cells for common and custom

3D interconnects and passive PCB and IC components allow designers to

incorporate with a simple drag and place true electrical responses in real time

during the design process.

Robust Solver

A full 3D FEM solver technology with adaptive volumetric tetrahedral meshing, direct and iterative solvers, and discrete and fast-

frequency sweeps to accurately characterize interconnect structures, dense circuitry, and antenna structures.

Capabilities

Products Products

3D Modeling

Proprietary FEM solver technology

supports simulation of arbitrary 3D

structures, including thin and thick

metals, fi nite dielectrics, and surface

roughness, addressing structures such

as MMIC, RFIC, PCB, and module-

based designs and related interconnects

such as wire-bonds and ball grid arrays,

as well as waveguides, coaxial

connectors, and hybrid circuit housings.

Design Exploration

Improve performance and mitigate

design problems from unforeseen

resonances and coupling between

structures automatically with 3D EM

parametric studies, supporting

optimization, tuning, and yield analysis.

Domain and spectral decomposition

combine with remote computing to

expedite simulation run times and

provide answers faster.

Antenna Analysis

Analyze 3D and 2D antennas, including

patch antennas/arrays on fi nite

dielectrics, plotted near- and far- fi eld

radiation patterns, gain plots, return

loss, and surface currents. Designs can

be created with the 2D and/or 3D

editors, converted from an AXIEM

structure, or imported from ACIS, Step,

and IGES fi les.

AXIEM3D Planar EM Analysis Software

AdvantagesFast and Accurate

Fast, adaptive hybrid meshing technology supports thick-metal structures and

vias, automatically fracturing structures into triangular and rectangular elements

for maximum accuracy and robust broadband results, from DC to daylight.

Unparalleled Integration

AXIEM is seamlessly tied to circuit and system simulation, layout, and

verifi cation through the proprietary AWR unifi ed data model (UDM), enabling

direct EM extraction without having to perform explicit layout and EM simulation

setup steps and directly incorporating results into circuit and/or system

simulations.

Versatile

Extensive sources/ports, including auto-calibrated internal ports and de-embedding options, provide greater fl exibility and accuracy for

structures with embedded circuit-based, lumped-element components and active devices such as transistors.

CapabilitiesPassive Modeling

Provides 3D planar EM simulation of

transmission lines and arbitrary

structures on single and multi-layer

circuits using method-of-moments

(MoM) technology with advance

meshing to accurately compute S-, Y-,

and Z-parameters, as well as current

densities of multilayer RFICs, MMICs,

PCBs, hybrids, and MCMs.

Planar Antenna Design

Perform analysis and post-processing

of planar antennas and planar arrays.

The fast N*Log(N) solver technology

addresses large, complex arrays that

were previously impractical to simulate

in their entirety. Post-processing

includes the ability to show currents on

antennas and 2D/3D far-fi eld antenna

pattern measurements for linear, circular,

and elliptical polarizations.

Optimization and Yield

Perform accurate design diagnostics

such yield analysis and optimization for

passive components and complex

interconnects, capturing true coupling

and parasitic effects of circuit topologies

that are specifi ed parametrically and/or

defi ned through rules-based shape

modifi ers/de-featuring.

Features at a Glance ■ Layout/Drawing Editor – 2D and 3D views

■ Proprietary Method-of-Moments Technology

■ Meshing Technology – Automatic adaptive meshing

■ Numerous Sources and Excitations

■ Visualization and Results Post-Processing

■ Parametric Studies – Optimization, tuning, and yield analysis

■ HPC – Multi-core configurations and asynchronous simulation

Features at a Glance ■ Layout/Drawing Editor – 2D/ 3D construction and views

■ Proprietary FEM Full-Wave Technology

■ Meshing Technology – Automatic and adaptive meshing

■ Numerous Sources and Excitations for Ports

■ Visualization and Results Post-Processing

■ Parametric Studies – Optimization, tuning, and yield analysis

■ HPC – Multi-core configurations and asynchronous simulation

“We chose AXIEM because of its speed, capacity, and accuracy. It helped us deliver a higher performing product in less time.”Shinichi Goto, Toshiba

n On-Chip and Off-Chip Passives

n IC, PCB, and Module Interconnects

n Extraction of Critical Transmission Lines (Nets)

n Design Verifi cation of Layout

n Antenna Design and Analysis

Applications

n On-Chip and Off-Chip Passives

n 3D IC, PCB, and Module Interconnects

n Hierarchical Interconnect, Common to SoC, SiP

n Design Verifi cation of Layout, Including Finite Dielectrics

n 3D Antenna Design and Analysis

Applications

Add-On Products

AWR Connected – A collection of plug-and-play modules that integrates NI AWR software with third-party software/hardware

products to provide a range of solutions for the design of high-frequency products. AWR Connected includes design synthesis, PCB

layout/verifi cation, and EM/thermal analysis, as well as test and measurement connectivity.

Synthesis ■ AMCAD

■ AMPSA

■ Nuhertz

■ Optenni Lab

PCB ■ Cadence

■ DWT

■ Intercept

■ Mentor Graphics

■ Zuken

EM/Thermal ■ ANSYS

■ CapeSym

■ CST

■ Sonnet Software

■ WIPL-D

T&M ■ National Instruments

■ Anritsu

■ Focus Microwaves

■ Maury Microwave

■ Rohde & Schwarz

1994 1998 1999 2000 2001 2002 2003 2005 2006 2007 2008 2010 2011 2012 2013 2015 2016 2017

AWR Founded Unified Data Model (UDM)

VSS Circuit/ System Co-Simulation

X-Models

XML Libraries

EM Socket

APLAC

Multi-Technology Support

ACE

RFA

AXIEM

Memory Effects

TDNN

NI Acquires AWR

Circuit Envelope

Analyst

Load-Pull

AntSyn

Measurement-Driven Simulation

Real-Time Tuning

RFP System-Level Load Pull

MRHB

iFilter™ – An NI AWR Design Environment integrated fi lter synthesis module that runs seamlessly as a wizard within Microwave Offi ce

software. It enables fi lter designers to accelerate design starts with powerful synthesis of lumped and distributed fi lter types, with a

ready transition of the resulting circuit topologies into Microwave Offi ce for further refi nement, optimization, EM verifi cation, and

physical design.

iMatch™ – An integrated impedance- matching module (and sub-component of iFilter) that runs seamlessly as a wizard within

Microwave Offi ce software. It quickly and easily takes the user through the process of evaluating different matching topologies and

selecting the optimal solution based on certain user-specifi ed requirements.

RDR – A radar test bench and phased-array library module that works seamlessly with VSS software to support radar applications,

including military, medical, weather, and automotive. RDR offers radar signal generation, radar-specifi c target and propagation

modeling, and radar signal processing capabilities.

RFP – A radio-frequency planner wizard that works seamlessly with VSS software as an essential utility for designers of radio

communications systems, cellular, or military radio links, allowing them to effortlessly and effi ciently determine spurious-free

bandwidths.

W5G – A 5G modulation waveforms library that includes test benches and phased-array features. It works seamlessly with VSS

software and gives VSS users access to current 5G candidate signals, each of which can then be implemented as a fully-

parameterizable block with source subcircuits .

Additional Products

AntSyn™ – Web-based antenna synthesis technology for automated antenna design that takes antenna engineering requirements as

input and produces antenna designs as output.

Applications ■ High Efficiency

■ Wire and Planar

■ Phased Arrays

■ Single, Dual, and Multi-Band

■ Broadband and UWB (>100:1)

Features at a Glance ■ Browser-Based Interface

■ Cloud-Based Execution

■ Proprietary Evolutionary Algorithm

■ Diverse Range Of Antenna Types

■ Export to EM Solvers and CAD Tools

“We chose NI AWR software because of the proven success of AntSyn and Analyst. The resulting designs worked from the start and removed the iteration and experimentation usually required in antenna design efforts.”

Mark Ross, Striiv

Analyst-MP – Analyst multi-physics (MP) is an expanded technology suite of Analyst 3D FEM EM focused on big, multi-physics

applications like particle accelerators, waveguides, and complex resonators.

Features at a Glance ■ Layout/Drawing Editor

■ Automatic and Adaptive Meshing

■ Full-Wave, Quasi-Static

■ Multi-Physics Solvers

■ Domain/Spectral Decomposition

■ Visualization/Results Post-Processing

Applications ■ Particle Accelerators

■ Waveguides

■ Cavities

■ Microwave Tubes/Plumbing

■ Resonators

AWR Innovations

PTFL-2017.04.28

©2017 National Instruments. All rights reserved. Analog Offi ce, AWR, AWR Design Environment, AXIEM, Microwave Offi ce, National Instruments, NI, and ni.com are trademarks of National Instruments. Other product and company names listed are trademarks or trade names of their respective companies.

Try AWR Today

Get started at awrcorp.com/try ■ Download NI AWR Design Environment

■ Watch video tutorials

■ Explore example projects

■ Read getting started guides

AWR Contact InformationTel:+1 310 726 3000 | Web: ni.com/awr | Email: awr.info@ni.com