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No. 6 Gaussian Versus Flat-top Beam Processing€¦ · Gaussian Versus Flat-top Beam Processing...

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Industrial Laser Applications Lab No. 6 Application Focus Application Focus Gaussian Versus Flat-top Beam Processing Laser processes have proven to be a major contributor in reducing manufacturing cost while increasing the efficiency of solar cells. Laser scribing of various thin film materials is a key process in manufacturing thin film solar cells. From a manufacturing perspective, there is a need for a robust integrated laser scribing system to accommodate 1–3 mm depth variations of large size glass solar panels while maintaining the quality of scribes. In recent years, diode-pumped solid state (DPSS) Q-switched lasers are the most widely used lasers for P1, P2, and P3 scribe processes. This article highlights the results from our recent study about the effects of laser beam shape (Gaussian versus flat-top) on process depth of focus. In this study, the scribe process involves micromachining of ~70 μm wide scribes on ~300 nm thick Molybdenum thin film deposited on a glass substrate at various defocus planes. With the Spectra-Physics Pulseo ® 532-34 laser system operated at 100 kHz, we achieved using a Gaussian beam shape, ~70 μm wide scribes at a scribe speed of 6 m/sec, and using a flat-top beam shape ~68 μm wide scribes at 5.6 m/sec. We characterized the process depth of focus in terms of quality and electrical resistance of the scribes. High quality scribes were achieved within ±17 mm defocus range using Gaussian beam machining whereas only <±1 mm defocus range was observed while flat-top beam machining was used. Electrical resistance of scribes at various defocus planes was measured to determine electrical isolation of scribes. In case of Gaussian beam machining, all the scribes within ±17 mm defocus range showed good electrical isolation whereas in case of flat-top machining, scribes only within <0.5 mm defocus range were electrically isolating. 500 mm plano-convex lens DOE Object plane 80 mm f-theta lens Image plane 3.5 mm beam Input beam (2 mm) Flat-top object (1.6 mm) Flat-top image (68 μm) Schematic illustration of flat-top experimental optical setup and intensity distribution Gaussian machining (top) and flat-top machining (bottom) microscope image and 3D depth profile trace
Transcript
Page 1: No. 6 Gaussian Versus Flat-top Beam Processing€¦ · Gaussian Versus Flat-top Beam Processing Laser processes have proven to be a major contributor in reducing manufacturing cost

Industrial LaserApplications Lab

No. 6

Application FocusApplication Focus

Gaussian VersusFlat-top Beam Processing

Laser processes have proven to be a major contributor in reducingmanufacturing cost while increasing the efficiency of solar cells. Laserscribing of various thin film materials is a key process in manufacturing thinfilm solar cells. From a manufacturing perspective, there is a need for arobust integrated laser scribing system to accommodate 1–3 mm depthvariations of large size glass solar panels while maintaining the quality ofscribes.

In recent years, diode-pumped solid state (DPSS) Q-switched lasers are themost widely used lasers for P1, P2, and P3 scribe processes. This articlehighlights the results from our recent study about the effects of laser beamshape (Gaussian versus flat-top) on process depth of focus. In this study, thescribe process involves micromachining of ~70 µm wide scribes on~300 nm thick Molybdenum thin film deposited on a glass substrate atvarious defocus planes.

With the Spectra-Physics Pulseo® 532-34 laser system operated at100 kHz, we achieved using a Gaussian beam shape, ~70 µm widescribes at a scribe speed of 6 m/sec, and using a flat-top beam shape~68 µm wide scribes at 5.6 m/sec.

We characterized the process depth of focus in terms of quality andelectrical resistance of the scribes. High quality scribes were achievedwithin ±17 mm defocus range using Gaussian beam machining whereasonly <±1 mm defocus range was observed while flat-top beam machiningwas used. Electrical resistance of scribes at various defocus planes wasmeasured to determine electrical isolation of scribes. In case of Gaussianbeam machining, all the scribes within ±17 mm defocus range showedgood electrical isolation whereas in case of flat-top machining, scribesonly within <0.5 mm defocus range were electrically isolating.

500 mmplano-convex

lens

DOE Object plane

80 mmf-theta lens

Imageplane

3.5 mmbeam

Inputbeam

(2 mm)

Flat-topobject

(1.6 mm)

Flat-topimage

(68 µm)

Schematic illustration of flat-top experimental optical setup and intensitydistribution

Gaussian machining (top) and flat-top machining (bottom) microscopeimage and 3D depth profile trace

Page 2: No. 6 Gaussian Versus Flat-top Beam Processing€¦ · Gaussian Versus Flat-top Beam Processing Laser processes have proven to be a major contributor in reducing manufacturing cost

Gaussian Versus Flat-top Beam Processing

q06DS-031105

Spectra-Physics® Lasers Sales1-800-775-5273 [email protected]/spectra-physics

While both Gaussian and flat-top laser beam shapes can produce highquality electrically isolating scribes, a very limited process depth of focustolerance exists for flat-top beam scribing process. This is undesirablefrom a system design perspective since systems are commonly required toaccommodate up to 1–3 mm variations associated with processing oflarge glass panels with thickness variations and other system tolerances.With Gaussian DPSS laser beams, once acceptable process parametersare defined, the process window is large and can accommodate largeprocess defocus variations for high yield, low cost laser scribing.

Electrical resistance measurement of scribes processed at various defocuspositions

P r o d u c t : S p e c t r a - P h y s i c s D P S S Q - S w i t c h e d L a s e r s

Spectra-Physics is a leading supplier of DPSS Q-switchedlasers. Our lasers deliver superior reliability and are proven indemanding 24/7 industrial applications. With one of thebroadest portfolios of Q-switched lasers in the industry and adeep applications expertise, we can help you find the right lasersolution for your industrial applications.

-20 -15 -10 -5 00

5

10

15

20

25

30

35

5 10 15 20

Z-axis de-focus, mm

Resi

tanc

e, M

ohm

Scribe Resistance vs. Optical De-focus Distance

Gaussian beamFlat-top beam

Microscope pictures of Gaussian beam scribes at different defocus positions(ΔZ) w.r.t focal plane showing quality of scribes

Microscope pictures of flat-top beam scribes at different defocus positions(ΔZ) w.r.t flat-top plane showing quality of scribes

ΔZ=-17 ΔZ=-8 ΔZ=0 mm ΔZ=8 ΔZ=17

ΔZ=-0.6 ΔZ=-0.4 ΔZ=0 mm ΔZ=0.4 ΔZ=1

Power 1064 nm 532 nm 355 nm/349 nm 266 nm0.5 W

Explorer

Explorer

1 W

TristarNavigator

2 W HIPPO

3 WExplorer XPNavigator4 W

5 W

Navigator

HIPPO

6 W

Navigator

7 W

8 W

9 W

10 W Pulseo

11 W Mosaic, HIPPO

12 W

15 W HIPPO

17 W HIPPO

20 W Pulseo

27 W HIPPO

34 W Pulseo

© 2011 Newport Corporation. All rights reserved. Explorer, Pulseo, Spectra-Physics, the Spectra-Physics logo and the Newport logo areregistered trademarks of Newport Corporation. HIPPO, Mosaic, Navigator and Tristar are trademarks of Newport Corporation.


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