Non-compliant or Suspect Counterfeit
Packaging Materials Can Lead to
ESD Hazards & Long-Term Storage Issues
and Pose Issues in Handling,
Inspection and Manufacturing
1:45 PM to 4:15 PM
Bob Vermillion, CPP/Fellow
Certified, ESD Engineer-iNARTE
RMV Technology Group, LLC
Member G-19 & G-21 Committees
NASA-AMES Research Center
Moffett Field, CA 94035
19 April 2013 Track 10
©2013 RMV Technology Group LLC
Non-compliant or Suspect Counterfeit Materials Can Lead
to ESD Hazards and Long-Term Storage Issues
Bob Vermillion, CPP/Fellow
Certified, ESD Engineer-iNARTE
RMV Technology Group, LLC
NASA-AMES Research Park
Moffett Field, CA 94035
“I have had the great pleasure of Bob Vermillion’s association for many years.
Bob is a diligent subject matter expert in the area of electrostatic discharge mitigation
and control, who brings a unique capability to the electronics industry. His unique
proficiency is based in his vast practical materials, packaging and test experience
that he applies to the applications and handling of all types of electronic hardware.
A few years ago, Bob unassumingly brought to the attention of the industry the fact
that packaging materials for ESD-sensitive items can be supplied as meeting industry
standards, but are actually non-conforming or fraudulently misrepresented. The
integrity of such materials is often overlooked by using organizations with
consequences that could result in the failure of the devices, electronic hardware
or equipment either immediately or later in application. Bob provides a service to
mitigate these problems and has been instrumental in addressing such issues for
several organizations. However, Bob’s talents go far beyond this one example.
Bob can provide an evaluation of your handling practices with respect to ESD control,
he can present and instruct on the subject and he can provide a total solution to your
packaging problems to enhance the size, weight, safety and reliability of the entire
package. I would recommend Bob and his company to any organization involved
with handling electronics and that wants to improve their assurance of providing
reliable product to their customers.”
March 27, 2012
1st Phil Zulueta, SAE G-19 Chairman
Suspect Counterfeit Inspection Methods
Courtesy of Ian Nicholson Chipcheck Consortium EU
MicroBlasting or Walnut Blasting
©2012-RMV Technology Group, LLC
Microblasting Process
©2013 RMV Technology Group LLC
Before & After Microblasting
©2012 RMV Technology Group, LLC
Portable Microscope Inspection Issues
Phil Zulueta
Chairman
SAE International
G-19 Committee
Email: [email protected]
Mobile: 661-400-4294
Bob Vermillion, CPP/Fellow
Certified, ESD Engineer-iNARTE
Member, G-19 & G-21 Committees
Email: [email protected]
Tel: 650-964-4792
www.esdrmv.com 8 ©2013-RMV Technology Group, LLC
Do USB Microscopes (Scopes) Pose ESD Issues
During Inspection?
4/28/2013 www.esdrmv.com
9 ©2013-RMV Technology Group, LLC
ESD Event Antenna
3.5” x 3.5” 10pF Charge Plate
Static Event Detector
Microscope
Plexiglas®
Adjustment Cap at 20%RH
4/28/2013 www.esdrmv.com 10
-17,300 volts 0.125 inches
©2013 RMV Technology Group LLC
Contact Voltage Charge (Method 1)
4/28/2013 www.esdrmv.com 11
Brass Contact Probe
Contact with Ground ©2013-RMV Technology Group, LLC
4/28/2013 www.esdrmv.com 12
Contact Voltage Charge (Method 1)
-476 volts on Plexiglas®
©2013-RMV Technology Group, LLC
Scope Charge at 1” From 3.5” x 3.5” 10pF Charge Plate
(Proximity Voltage - Method 2)
4/28/2013 www.esdrmv.com 13
-401 Peak Volts at 69.6%RH
©2013-RMV Technology Group, LLC
100 volt ESD Event Detector Triggered
4/28/2013 www.esdrmv.com 14
239 volts
0
50
100
150
200
250
300
124
47
70
93
116
139
162
185
208
231
254
277
300
323
346
369
392
415
438
461
484
507
530
553
576
599
622
645
668
691
714
737
760
783
806
829
852
875
898
921
944
967
990
1013
1036
1059
1082
1105
1128
1151
1174
1197
1220
1243
1266
1289
1312
vo
lts
SED Unit Fails at 100V
ESD Peak by Bringing Scope to SED Unit Using Grounded Brass Tip
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Clear (OK)
Red (Failed)
©2013-RMV Technology Group, LLC
4/28/2013 www.esdrmv.com 15
Contact Voltage Charge (Method 1)
-409 volts on Plexiglas®
©2013-RMV Technology Group, LLC
4/28/2013 www.esdrmv.com 16
-220 Peak Volts at 68.91%RH
©2013-RMV Technology Group, LLC
Scope Charge at 1” From 3.5” x 3.5” 10pF Charge Plate
(Proximity Voltage - Method 2)
100 volt ESD Event Detector Triggered
www.esdrmv.com 17
232 volts
50 volts
21 volts 0
50
100
150
200
250
1
15
29
43
57
71
85
99
113
127
141
155
169
183
197
211
225
239
253
267
281
295
309
323
337
351
365
379
393
407
421
435
449
463
477
491
505
519
533
547
561
575
589
603
617
631
645
659
673
687
701
715
729
743
757
771
785
799
813
827
841
855
vo
lts
SED will fail at 100 volts
ESD Peak between Brass Tip and Static Event Detector (SED)
Start Clear (OK) Red (Failed)
©2013-RMV Technology Group, LLC
Ground to SED
Scope under Ionization Flow
4/28/2013 www.esdrmv.com 18 ©2013-RMV Technology Group, LLC
-17 volts on Plexiglas®
w w w. e s d r m v. c o m 19
-23 volts at 63.45%RH
Scope Charge at 1” From 3.5” x 3.5” 10pF Charge Plate
(Method 2, Under Ionization)
©2013 RMV Technology Group LLC
100 volt ESD Event Detector = Clear
(Under Ionization)
w w w. e s d r m v. c o m 20
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1 4 7
10
13
16
19
22
25
28
31
34
37
40
43
46
49
52
55
58
61
64
67
70
73
76
79
82
85
88
91
94
97
100
103
106
109
112
115
118
121
124
127
130
133
136
139
142
145
148
151
154
157
160
163
vo
lts
SED Unit will Fail at 100 volts
ESD Peak when Scope is Under Ionization Flow
Ground to SED Clear (OK)
©2013 RMV Technology Group LLC
Summary of Findings
w w w. e s d r m v. c o m 21
-500
-400
-300
-200
-100
0
100
200
300
-476
-401
239
-409
-220
232
-17 -23
0
100
-100
vo
lta
ge
Note: Static Event Detector Triggers at +/-100 volts
Contact Voltage/Proximity Voltage and ESD Events
©2013 RMV Technology Group LLC
Ionizer
How Can Suspect Packaging
Cause Issues!
©2013 RMV Technology Group LLC
Packaging Engineered Package?
©2013 RMV Technology Group LLC
Downgraded Liner
to save Money?
Packaged to Insure
No Stacking Issues
Courtesy of Bob Sanders IBM
Insure Compliance!
Test Both Tray & Primary Container
Static Decay
Surface Resistance
Testing
Static Shielding
ESD
US Navy Test Plan for JDSU
Courtesy of R. Youshock
24 ©2013 RMV Technology Group LLC
Identifying Suspect
Packaging
©2013 RMV Technology Group LLC
Correct
Visual Identifiers
which Trigger
Parts Inspection
©2013 RMV Technology Group LLC
The Dip Tube
©2013 RMV Technology Group LLC
1-Point Resistance through the JEDEC on Grounded Surface
Single Trays (1-6)
6 Positions per Surface
BOGUS Trays
JEDEC Tray An Overview
28 ©2012-RMV Technology Group, LLC
Once the JEDEC trays have been unitized, while grounded, place into a
Type 1 Mil-PRF-81705E compliant aluminum Moisture Barrier Bag of the
specified caliper along with a humidity indicating strip and then seal
said package.
While grounded, place said JEDEC package into outer shipping package
utilizing a rectangular BMC for placement into a Lock Front Mailer as
illustrated in the next slide and close the outer packaging to apply the
appropriate tamper resistant tape, RFID tag and printed labels.
JEDEC Protocols
©2013 RMV Technology Group LLC
JEDEC Packaging Protocols
Despite the real issue of Suspect Counterfeit Dip Tubes and Tape & Reel, non-
conforming ESD safe JEDEC trays are being sold into the supply chain as
initially presented during the NASA Quality Leadership Forum 2010. The
articles should be referenced to understand the scope of the issues. The Dip
Tube, JEDEC and Tape & Reel issues, Interference Technology UK, by Bob
Vermillion, CPP/Fellow, November 2010 and Interference Technology, June
2010. Figure 1 illustrates the improper use of a one sided corrugated pad
placing low RH charge generating corrugated against the JEDEC tray with the
conductive side facing upwards. A suspect counterfeiter would not know that
the conductive side shall be placed against the JEDEC tray before the banding
process takes place .
Insulative “white or black” charge generating strapping tape promotes field
induced model discharges. Static dissipative strapping is available on the open
market, however, the reader must validate material for ESD performance.
©2013 RMV Technology Group LLC
31 Copyright.2012.RMV Technology Group LLC.
What Are the Consequences of
Suspect Counterfeit
Materials used in Manufacturing,
Long Term Storage and Shipping?
According to
JPL/NASA
Website,
ESD Represents a
40 billion dollar
Annual Problem!
31
Tape & Reel Package
2.0 x 1012 ohms
9.4 x 1011 ohms
Resistance Validation
©2012.RMV Technology Group, LLC
1.0E+00
1.0E+02
1.0E+04
1.0E+06
1.0E+08
1.0E+10
1.0E+12
Inside Outside Failing
oh
ms
Surface Resistance Average Of Type 1 Bag
FAILED
FAILED
FAILED
©2013 RMV Technology Group LLC
-400
-300
-200
-100
0
100
200
300
1 8 15 22 29 36 43 50 57 64 71 78
-365
300
Vo
lts
Charge Generation Pull from Bag
A Bag Can See <4%RH when Pulling a Vacuum
Peak: 300 and -365 volts
©RMV Technology Group, LLC
©2011.RMV Technology Group LLC Photo ©2012.RMV Technology Group LLC. 33
1.1 Purpose This SAE Standard standardizes practices to: a.
maximize availability of authentic materiel (made from the proper
materials using the proper processes with required testing,) b.
procure materiel from reliable sources, c. assure authenticity and
conformance of procured materiel d. control materiel identified as
counterfeit, and e. report counterfeit materiel to other potential users
and government investigative authorities. 1.2 Application This
document is intended for use in high performance/reliability or safety
of life applications. This standard is recommended for use by all
contracting organizations that procure materiel, whether such
materiel is procured directly or integrated into assemblies or
equipment. The requirements of this standard are generic and
intended to be applied/flowed down to all organizations that procure
materiel, regardless of type, size, and product provided.
G-21 Counterfeit Materiel and
Mechanical Parts Committee AS6174 - Counterfeit Material; Detection, Mitigation, and Disposition
http://www.sae.org/servlets/works/documentHome.do?comtID=TEAG21&docID=AS6174&inputPage=wIpSdOcDeTaIlS
35 4/28/2013
G19 SUB COMMITTEE DEFINITION OF COUNTERFEIT
Generally, the term counterfeit refers to instances in which the
identity or pedigree of a product is knowingly misrepresented by
individuals or companies. Counterfeiters often try to take
advantage of the established worth of the imitated product, and
the counterfeit product may not work as well as the genuine
article. The threat of counterfeit parts continues to grow as
counterfeiters have developed more sophisticated capabilities to
replicate parts and gain access to scrap materials that were
thought to have been destroyed. Counterfeiters exist across
industries and are able to respond to changes in market
conditions. Counterfeit parts can be quickly distributed in online
markets. Almost every industry can be affected by counterfeit
parts.
Contact Us
36
Bob Vermillion, CEO, Founder
Renee Mitchell, Sr. Vice President
RMV Technology Group, LLC is a Service Disabled Veteran Owned Business, SBA 8(a) & SDB Firm.