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1 2012-5-21 © 2011 Keithley Instruments, Inc. © 2011 Keithley Instruments, Inc. Non-Volatile Memory – Characterization and Measurement Techniques Alex Pronin Keithley Instruments, Inc.
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  • 1 2012-5-21 © 2011 Keithley Instruments, Inc.© 2011 Keithley Instruments, Inc.

    Non-Volatile Memory –Characterization and Measurement Techniques

    Alex Pronin

    Keithley Instruments, Inc.

  • 2 © 2011 Keithley Instruments, Inc.

    Why do more characterization?

    • NVM: Floating gate Flash memory– Very successful; lead to explosion in consumer

    market (tables, smart phones)– There is concern that standard Flash is “hitting the

    wall” and cannot sustain Moore’s law of storage expansion

    • Response:– Switch to 3D Flash technologies– New materials and new technologies

    • In test and measurement there is increased demand for characterization

    – Need for fast voltage and current transient measurements

    – Integration of DC and pulse measurement– Simplicity of use

  • 3 © 2011 Keithley Instruments, Inc.

    Outline

    • Review types of NVM• NVM test requirements and

    overview• Common NVM test parameters• Capabilities of Keithley’s Model

    4225-PMU Ultra-fast I-V Module for NVM characterization

    • Examples of test projects and characterization

    – Flash Memory– PRAM/PCM– FeRAM

    • Measurements optimization

  • 4 © 2011 Keithley Instruments, Inc.

    NVM types

    • FG Flash, CTF/SONOS charge trapping Flash, 3D Flash• PCM/PCRAM – Phase change memory• Resistive: ReRam/RRAM, CBRAM• MRAM – Magnetoresistive, STT-MRAM: spin transfer torque MRAM• FeRAM – Ferro electric RAM• CNT RAM – carbon-nanotube RAM

  • 5 © 2011 Keithley Instruments, Inc.

    “Ideal Memory” attributes

    • Low cost and high density with scalability road map

    • Fast read/write (similar to or faster than existing DRAM speeds)

    • High endurance (to address DRAM or SSD applications)

    • Long retention• Low power and voltage requirements• Compatible with existing logic circuits

    and semiconductor processes

  • 6 © 2011 Keithley Instruments, Inc.

    New NVM test requirement

    • Traditional requirements– Accurate DC measurements (SMU source

    measurement units) for Vt, Set/Reset Resistance, etc.– High fidelity pulses– Optimized integration of DC and pulse instruments

    • Transient characterization capability for new NVM technologies

    – Provides fundamental data on intrinsic material properties– Initial implementations:

    • Use load resistors and capacitors in combination with digitizing scopes; “one-off”, customized system, which requires high maintenance

    • Limited accuracy, difficult calibration– Development of new pulse measure instrumentation

    • Pulse generation functionality combined with measure• Simultaneous measurement of high speed voltage and

    pulses• Integration with DC and ease of use

  • 7 © 2011 Keithley Instruments, Inc.

    NVM test parameters

    • Pulse amplitude• Pulse amplitude fidelity (ringing,

    overshoot, and undershoot )• Ability to output multi-pulse waveforms• Pulse timing (rise, fall time, and pulse

    width )• Dynamic, simultaneous ultra-fast current

    and voltage measurement• Remote pulse amplifier (to decrease

    parasitic effects of interconnects)• Current compliance or current control • Switching and integration between pulse

    and DC instruments• Channel synchronization

  • 8 © 2011 Keithley Instruments, Inc.

    Models 4225-PMU and 4225-RPM

    • The Model 4225-PMU Ultra-Fast I-V Module is a single-slot instrument card for the Model 4200-SCS

    • Two channels of voltage pulse sourcing with integrated, simultaneous real-time current and voltage measure for each channel

    • Each channel can independently source ±10V or ±40V into high impedance, 80V amplitude in differential mode

    • Two A/D converters per channel that sample the voltage and current simultaneously, with 200M Sample rate

    • Timing features from 20ns to 40s, automatically synchronized to within ±2ns across channels

    • Arbitrary segment waveform (Segment ARB®) capability for multi-level or multi-pulse waveforms

  • 9 © 2011 Keithley Instruments, Inc.

    Multi-level waveforms with Segment ARB® capability

    • Multi-level pulse waveform– 4 pulses, 3 levels

    • Created by 16 linear voltage segments (grey numbers) and 4 measurements (red boxes)

    • Flash memory program and erase waveform

    – 2 pulses, 3 levels

  • 10 © 2011 Keithley Instruments, Inc.

    Model 4225-RPM (Remote Pulse Unit)

    • The Model 4225-RPM Remote Amplifier/Switch is an optional addition to the Model 4225-PMU

    • Located near the device-under-test• Allows for low current pulse

    measurement ranges (from 10mA to 100nA)

    • Decreases parasitic effects of interconnects

    • Provides switching for – Source measurement units (SMUs)– CVU signals– Pulses from PMU– No re-cabling to change instruments

  • 11 © 2011 Keithley Instruments, Inc.

    Connection setups for NVM testing

    2-terminal test device 4-terminal test device

  • 12 © 2011 Keithley Instruments, Inc.

    Flash testing

    • Program and erase conditions for Fowler-Nordheim tunneling• Test hardware

    – One Model 4225-PMU with two Model 4225-RPMs– Two SMUs

  • 13 © 2011 Keithley Instruments, Inc.

    Connection to four-terminal floating-gate Flash device

  • 14 © 2011 Keithley Instruments, Inc.

    Flash data: program and erase Vt

    Program

    Erase

  • 15 © 2011 Keithley Instruments, Inc.

    Flash program pulse

    Program Voltage and Current Waveforms

    Gat

    e V

    olta

    ge (V

    ) Gate Current (A

    )

    Time (s)

    Simultaneous gate voltage (blue) and gate current (red) measurement

    FN current

    parasitic current

  • 16 © 2011 Keithley Instruments, Inc.

    Flash endurance

  • 17 © 2011 Keithley Instruments, Inc.

    What is PRAM?

    • PCRAM – Phase Change RAM• Based on chalcogenide alloys• Amorphous phase – after “RESET”

    – High resistivity > 1MOhm– Melting of material– Fast cooling (RESET)– Fall time for PRAM materials is about 30ns or

    even faster• Crystalline phase – after “SET” operation

    – Low resistivity

  • 18 © 2011 Keithley Instruments, Inc.

    PRAM material testing

    R-load technique Connection diagram for PRAM tests

  • 19 © 2011 Keithley Instruments, Inc.

    PRAM I-V characterization

    • Blue line: voltage pulse vs. time• Red line: current response vs. time• Rise time: 10µs, can be as short

    as 20ns• Note: switching for high resistive state

    to low resistive state at 0.7 V

    • I-V curve measured by the PMU with RPMs. This test uses the same data shown to the left.

  • 20 © 2011 Keithley Instruments, Inc.

    Definition of PRAM R-I curve

    Diagram explains the R-I curve measurement sources from the RESET-measure-SET-measure waveform.

    The amplitude of SET curve is swept, while measuring RESET resistance (red M), SET current (green M), and SET resistance (blue M)

  • 21 © 2011 Keithley Instruments, Inc.

    PRAM RI curve, data

    • Voltage (blue) and current (red) waveform• RESET pulse puts DUT into a high resistance state • SET pulse sets the low resistance state• The second and last pulse measures the resistance

    of the RESET/SET state• R-I curve shows the variation of the SET resistance

    as the SET pulse amplitude is swept

  • 22 © 2011 Keithley Instruments, Inc.

    PRAM endurance

    • SET resistance is plotted as a function of total number of cycles

    • SET resistance increases as applied stresses increases

  • 23 © 2011 Keithley Instruments, Inc.

    Ferro-electric memory

    • Ferro-electric memory is based on polarization switch due in the presence of critical electrical field

    • It is NOT ferro-magnetic memory• Read-write processes are destructive

    intrinsically and require refreshing

    • Characterization tests• Hysteresis curve of polarization

    (charge) vs. field• PUND (positive-up-negative-down)

    test

    References:http://www.ramtron.com/about-us/what-is-f-ram.aspx

  • 24 © 2011 Keithley Instruments, Inc.

    FeRam test setups

    Traditional: Sawyer-Tower circuit• C0 (load cap) >> C• Vin ~ V• Vo

  • 25 © 2011 Keithley Instruments, Inc.

    FeRAM hysteresis waveform measurement

    • Voltage Up/Down/Up sweep waveform (blue line on the left graph)

    • Measure response current from low side of FeRamcap (red line)

    • Integrate current to charge and plot charge vs. voltage to get Hysteresis curve (black curve on the right graph)

    Voltage

    Current

  • 26 © 2011 Keithley Instruments, Inc.

    FeRAM PUND (positive-up-negative-down) test

    Procedure:•Force PUND pulse sequence using Segment ARB functionality of PMU/RPM (blue curve)•Measure response current (red line)•Integrate current to obtain (area under curve)

    • P, Pa• U, Ua• N, Na• D, Da• Psq, and Qsw

    •Advantage: low noise measurement

  • 27 © 2011 Keithley Instruments, Inc.

    FeRAM endurance

    Test•Psw (P-U)•Qsw (1/2(P-U+N-D))•Total endurance is about 1e8 cycles

    •Test time is in minutes

  • 28 © 2011 Keithley Instruments, Inc.

    ReRAM and CBRAM testing

    • In many cases, ReRAM and CBRAM testing is done with SMU (DC sweep)

    • DC current compliance is used –– But SMU compliance circuitry

    is not instantaneous! It takes hundreds of microseconds to milliseconds

    • We provide Segment Waveform, dynamic Voltage sweep to characterize I-V curve for any sweep test

    • DC test time is always >0.1ms• Pulse test time with PMUs can be

    as short as 40ns

    Diagram for one of the multi-pulse tests included in the NVM library

  • 29 © 2011 Keithley Instruments, Inc.

    Capacitive charging effects during pulse transitions

  • 30 © 2011 Keithley Instruments, Inc.

    Avoiding capacitive charging effects

    • Measuring the current on the LOW side of the DUT, away from the applied pulse, is the key to avoiding the charging effect

    • The side of the device connected to Channel 2 has a dV/dt that is essentially 0

    • This approach is sometimes called pulsing on the high side and measuring the current on the low side

    • There is no capacitive charging current seen during the pulse transitions. Only the current flowing through the resistor DUT is seen.

    High

    Low

    dV/dt ≈0

    No charging effects, just current flowing through the test device

  • 31 © 2011 Keithley Instruments, Inc.

    NVM Testing with the Model 4200-SCS

    • Hardware minimum requirements– Model 4200-SCS with KTEI V8.2 or higher– Two SMUs, either medium power (Model 4200-SMU)

    or high power (Model 4210-SMU). – One Model 4225-PMU with two Model 4225-RPMs– Compiler to modify the NVM test modules– Software components– KTEI V8.2 with standard suite of characterization tools– NVM library and NVM project, with example test setups

    and data for PRAM, FLASH NAND, and FeRAM• For additional information, see application note

    – #3141 Non-volatile Memory Pulse I-V Characterization Techniques at http://www.keithley.com/data?asset=56338

  • 32 © 2011 Keithley Instruments, Inc.

    Summary

    • Most of the NVM technologies have similar electrical characterization requirements

    – Multi-level pulse waveforms– Simultaneous current and voltage sampling during the test– Wide range of voltage sourcing and current measurements

    • The Model 4200-SCS with Models 4225-PMU and 4225-RPM simplifies complex NVM test requirements

    – Hardware that does not require load resistors or load capacitors– Integrated, simultaneous fast current and voltage transient measurements– Segment ARB® capability for multi-level, multi-pulse waveform creation

    • Included project contains sample tests and data for multiple NVMtechnologies

  • 33 © 2011 Keithley Instruments, Inc.

    Contact Keithley for further information

    Worldwide HeadquartersWithin the USA: 1-888-KEITHLEYOutside the USA: +1-440-248-0400

    Email: [email protected]

    Additional offices: www.keithley.com

    Europe:Germany: (+49) 89 849 307 40Great Britain: (+44) 118 929 7500

    Asia:China: (+86) 10-8447- 5556Japan: (+81) 3-5733-7555Korea: (+82) 2-574-7778Taiwan: (+886) 3-572-9077


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