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Nptel cad2-06 capcitances

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CAD for VLSI Design - II Lecture 6 V. Kamakoti and Shankar Balachandran
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Page 1: Nptel cad2-06 capcitances

CAD for VLSI Design - II

Lecture 6

V. Kamakoti and Shankar Balachandran

Page 2: Nptel cad2-06 capcitances

Overview of this Lecture

• CMOS Transistor Theory– Delay Issues (Cont’d)

• Types and effects of Capacitances on delay

Page 3: Nptel cad2-06 capcitances

Parasitic Capacitance• Switching speeds of MOS systems strongly depend on

the parasitic capacitances associated with MOSFETs and interconnections

• Total Cload on the output of a CMOS gate is the sum of:– Gate capacitance (Cg)– Junction capacitance due to the source and drain

regions and their surroundings (Csb and Cdb)– Interconnect (or routing) capacitance (Cw)

• Gate oxide capacitance per unit area,ε ε

= 0 oxox

ox

Ct

Page 4: Nptel cad2-06 capcitances

MOSFET Capacitances

xd xd

xd

Page 5: Nptel cad2-06 capcitances

Gate Capacitance

• Gate capacitance, Cg = Cox WL• Total gate capacitance Cg can be

decomposed in two elements:1. Overlap capacitance: due to the topological

structure of the MOSFET.2. Gate-to-Channel capacitance: due to the

interaction between gate voltage and channel charge.

Page 6: Nptel cad2-06 capcitances

Gate Overlap Capacitance• In reality , actual channel length, Leff < drawn length, L

(mask length), due to the extension of the source and drain regions somewhat below the oxide by an amount xd, called the lateral diffusion, i.e., Leff = L – 2.xd

• xd gives rise to overlap capacitance which is linear and has a fixed value.

Co is overlap capacitance per unit transistor width (fF/μm)

= = =gso gdo ox d oC C C x W C W

Page 7: Nptel cad2-06 capcitances

Gate-to-Channel Capacitance• It has thee components: Cgs, Cgd and Cgb

Dr. V. Kamakoti
Note
This also has a component based on frequency. As frequency increases, the channel charge changes rapidly => capacitance changes.
Page 8: Nptel cad2-06 capcitances

Average Gate Capacitance

Region Cgb Cgs Cgd Cg

Cutoff CoxWLeff

0 0

CoxWLeff/2

0

CoxWLeff+2CoW

Linear 0 CoxWLeff/2 CoxWLeff+2CoW

Saturation (2/3)CoxWLeff

(2/3)CoxWLeff+2CoW

Page 9: Nptel cad2-06 capcitances

Area and Side-wall Capacitance• Area Capacitance (Carea) due to the bottom-plate

junction formed by the source (drain) region with doping ND and substrate with doping NA (bottom area 5).

• Side-wall (perimeter) Capacitance (Csw) formed by junctions 2, 3, and 4. These are surrounded by the p+ channel-stop implant with doping level NA+ which is usually larger than that of the substrate larger capacitance per unit area.

= ,area j s jC C WL Cwhere is junction capacitanceperunitarea

( )

( )where is junction side-wall capacitanceperunit

length

= + ⋅

′=

2

,sw jsw s

j sw

jsw jsw j

C C W L

C

C C x

Page 10: Nptel cad2-06 capcitances

MOSFET Capacitance Model

=

= +

=

+

+

+

GS

GS gs gso

GD

GD g

g

gdo

bg

d

C C

C

C C

C C

C C C

Page 11: Nptel cad2-06 capcitances

Wire (Routing) Capacitance

( )ε ε πε

≈ +

≈ +⋅ 2

log

pp

o o

fri

x

nge

o

w

x

C

wl

h

CC

ht

Dr. V. Kamakoti
Note
Fringing fields tend to increase effective area and hence the capacitance. As w becomes comparable to t, fringing capacitance can no longer be ignored
Page 12: Nptel cad2-06 capcitances

Parallel-plate and Fringing Capacitance

Total Cap.

w/t

wth

t/h=1t/h=0.5Cpp

Dr. V. Kamakoti
Note
For large values of w/t the total capacitance approaches parallel-plate capacitance. For w/t < 1.5 fringing field cap. becomes dominating.
Page 13: Nptel cad2-06 capcitances

Modern Interconnect

• Inter-layer capacitance increases with decreasing feature sizes.

• Multi-layer capacitive interactions result in unwanted coupling among neighboring signals cross talk

Page 14: Nptel cad2-06 capcitances

Impact of Inter-layer Capacitance

Page 15: Nptel cad2-06 capcitances

Capacitances for a 0.25μm Process

CapacitanceArea Cap(fF/μm2)

Perim. Cap(fF/μm)

Poly - substrate 0.0880.0410.015

n+ diff - substrate 1.660 0.399

n+ overlap cap. -- 0.562p+ overlap cap. -- 0.630Cox 5.951Metal1 - poly 0.017 0.041

1.832

0.038

0.054Metal1 - substrate 0.047Metal2 - substrate 0.027

p+ diff - substrate 0.323

Metal2 – metal1 0.054

Page 16: Nptel cad2-06 capcitances

0.25μm Interconnect Hierarchy• Optimize interconnect structure at

each layer.– for local wires, density and low

C are important – use dense and thin wiring grid

– for global wires in order to reduce delays, use fat, widely spaced wires.

• Improve wire delays by using better material (Cu) and low-K dielectrics for insulators.

IntracellIntercell

Intermodule

Global

Page 17: Nptel cad2-06 capcitances

Electrical Wire Models• Ideal Wire - it is simply a line with no attached

parameters or parasitics it has no impact on electrical behavior.

• Lumped Model – simplified model simple and fast computation, e.g., lumped C, lumped RC or lumped RLC

• Distributed Model - Parasitics of a wire are distributedalong its length and are not lumped into a single position, distributed C, distributed RC, or distributed RLC

Clumped = lwire.cwire

Page 18: Nptel cad2-06 capcitances

Elmore Delay Formula

• For an n stage RC chain, the first order time constant is given by,

• If Ri = Rj and Ci = Cj for all i and j , (1≤ i, j ≤ n) then,

( ) ( )

n i

n i ji j

n nC R C R R C R

C R

R R= =

τ

= + + + + + + +

= ∑ ∑

1 1 2 1 2 1 2

1 1

... ...

( )+τ =

12n

n nRC

Page 19: Nptel cad2-06 capcitances

Distributed RC Model for a Wire

Using Elmore delay formula we can determine the dominant time constantof the wire, i.e., it is a first-order approximation.

Dr. V. Kamakoti
Note
A wire of length l can be partitioned into n identical segments, unit resistance r ohms/um, unit cap c fF/um, Δl is segment length
Page 20: Nptel cad2-06 capcitances

Questions and Answers

Thank You


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