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Numerical signal processing for LVDT reading based on rad tol components
Salvatore DanzecaPh.D. STUDENT
(CERN EN/STI/ECE )
Students’ coffee meeting1/3/2012
1
Radiation field in the tunnel of LHCThe radiation field in the LHC is mainly due to:•Beam collision in the experiment points (ATLAS, LHCb, CMS, ALICE)•Beam collision with residual gas in the pipe•Beam collision with collimator, beam dump, etc..
Not Shielded Areas
2
Shielded Areas
Effect of radiation on the electronic devices
Cumulative effects
Single Event Effects (SEE)
Total Ionizing Dose (TID)Potentially all components
Displacement damageBipolar technologiesOptocouplersOptical sourcesOptical detectors (photodiodes)
Permanent SEEsSEL
CMOS technologiesSEB
Power MOSFETs, BJT and diodesSEGR
Power MOSFETs
Static SEEsSEU
Digital ICs
Transient SEEsCombinational logicOperational amplifiers
3
Conditioning and acquisition system architecture
ADC 16bitMAX11046
FPGA Actel ProAsic3
/
Profibus Module
/
UART to USB
External MemoryFlash or EEPROM
Instr. Amplifier
LVDT Sensors
Secondaries
DAC 20 bitPCM1702
LVDT SensorsPrimaries
/
Jumper wire
USB
4
Objectives / Targets
• Acquisition and processing in REAL TIME with a sampling rate of 250 kSps
• Uncertainty on position 1.0 μm • Position survey frequency 100 Hz• Possibility of multiple sensor readings in parallel• Numeric Resolution of 0.5 μm• Being radiation tolerant up to 100 Gy of Total Ionizing
Dose; low number of SEU for a given fluence of 1011pp/cm2
5
LVDT and position reading)2cos()( 0tfAtp
)2cos(101
tfA )2cos(202
tfA
21
21
AAAAr
rkP
1iy 2iy
11
1ir
s
c yDAA
2
2
2ir
s
c yDAA
21
211 sc AAA 2
2222 sc AAA
Sine Fit
)2()2cos(
)2()2cos(
00
1010
NN tfsentf
tfsentf
0D
T0
10
T0 DDDD
r
Ratiometric
6
Acquisition and processing: CPU vs FPGA
ADC
LVDT
Buffer CPU POSITION SURVEY
Acquisition of 2000 samples with a sampling rate of 250 KSps takes 8ms
Time to compute the position = 2ms
LVDT
LVDT
ADC FPGA POSITION SURVEY
Acquisition of 2000 samples with a sampling rate of 250 KSps takes 8ms
Time to compute the position < 2ms
LVDT
LVDT
LVDT 7
noise
signal
noise
signaldB A
APP
SNR log20log10
Is it possible to go faster?
8
-5 -4 -3 -2 -1 0 1 2 3 4 5x 10
4
0.5
1
1.5
2
2.5
3
3.5
4
Position [um]
Sta
ndar
d de
viat
ion
[um
]
N=2000N= 1500N= 1000N= 500N= 300N= 100
SNR = 60 dB
1.0 μm TARGET
9
Numerical algorithm
• FPGA implies the fixed point algorithm• Why?• Floating point would not assure the required
performance in terms of calculation time and area occupancy
• Fixed point is simpler; thus less prone to SEU effects
10
∑ x x
+
∑ x x
-
+
2121AAAA
∑ x x
+
∑ x x
Yi1
Yi2
Dr(:,2)
Dr(:,1)
Dr(:,2)
Dr(:,1) Q-9,24
Q-9,24
Q-9,24
Q0,15
Q0,15
Q-8,39
Q1,39
Q1,39
Q1,39
Q1,39
Q3,78
Q3,78
Q4,78
Q4,78
Q2,39
Q2,39
Q3,39Q0,42
Fixed Point Algorithm
16 bit 41 bit 82 bit 42 bit 43 bit
Low and Medium resolution algorithm
∑ x x
+
∑ x x
∑ x x
+
∑ x x
Yi1
Yi2
Dr(:,2)
Dr(:,1)
Dr(:,2)
Dr(:,1) Q-9,24
Q-9,24
Q-9,24
Q0,15
Q0,15
Q-8,39
Q1,39
Q1,39
Q1,39
Q1,3941bit->16bit
41bit->16bit
41bit->18bit
41bit->18bit
Implementation Area Occupancy Clock Frequency
Low resolution Core Cells:35197 of 24576 (143%) 2.3 MHz - 434.570 ns
Medium resolution
Core Cells:41780 of 24576 (170%) 1.7 MHz -588.235 ns
Low res
Medium res
16 bit 41 bit 18 bit
16 bit 32 bit
36 bit
11
CORDIC
Ac
As
A1-A2
A1+A2
Vectoring Mode
Circular Rotation
“Linear” Rotation
Vectoring Mode
22scnn AAAx
21
21
AAAAzn
12
A
r
Cordic = High resolution algorithm
∑ x
∑ x
Yi1
Dr(:,2)
Dr(:,1)
CORDIC
∑ x
∑ x
Yi1
Dr(:,2)
Dr(:,1)
CORDIC+
-CORDIC
2121AAAA
221 scn AAAA
222 scn AAAA
41 bit 41 bit 42 bit
Implementation Area Allocation Clock Frequency
High resolution (A3PE1000) Core Cells: 11881 of 24576 (48%) 25.6 MHz-39.031 ns
High resolution with TMR Core Cells: 14572 of 24576 (59%) 24.7 MHz-40.427 ns
High resolution on A3PE3000 Core Cells: 11465 of 75264 (15%) 23.9 MHz- 41.796
1
CLRCLK
D
Q
Triple Modular Redudancy
13
14
How to evaluate the algorithm
• Simulation– Emulation of the secondary voltages in Matlab– Emulation of a 0.5 μm movement– Comparison of the Low- Medium- High- resolution
algorithms(all fixed point) VS floating point algorithm • Experimental data from LHC collimator
– Analysis on a 5 μm movement at different absolute positions
– Comparison of the Low- Medium- High- resolution algorithms(all fixed point) VS floating point algorithm
Simulation results 0,5 μm with Low resolution algorithm
15
16
Simulation results 0,5 μm with Medium resolution algorithm
17
Simulation results 0,5 μm with High resolution algorithm
0 5 10 15 20 25 300.45
0.5
0.55
0.6
0.65
Number of repetition
Pos
ition
[um
]
Position Floating PointPosition High ResolutionPosition High Resolution on 32bit
0 5 10 15 20 25 300
0.5
1 x 10-4
Number of repetition
Err
or [u
m]
Difference Floating point - High resolution 32bit
Experimental ResultsLow resolution Medium resolution
Low ResMax error
[µm]
Medium ResMax error
[µm]
High Resolution with 32 bitMax error
[µm]
Position 9730µm 7,7499 0,7878 9,57E-05Position 9715µm 8,4810 0,5588 1,20E-04Position 9710µm 4,1310 1,0275 1,99E-04Position 9715µm 7,2870 0,8173 6,94E-05
Total max error 8,4810 1,0275 1,99E-04 18
Radiation Test Results
MAX TID[Gy]
Fluencepp/cm2
FPGA Actel ProAsic3 [1] [2]
390 1e13
Paul Scherrer Institut230 MeV Proton Beam
MAX TID[Gy]
Fluencepp/cm2
ADC MAX11046 [3] 210 3.9e11
Cross SectionSEU estimated per channel (fluence 1e11) 0.95SEU estimated per device (fluence 1e11) 7.6
Cross Section [3] 2.30e-10 cm2
Cross Section [1] 1e-13 cm2
Proton Beam
DUT
[1] NanoFIP Large Scale Radiation Tests, 2012, E. Gousiou 19[2] nanoFIP Preliminary Radiation Tests - Test Report, 2011, E. Gousiou
[3] ADC MAX11046 test 03.06.2011 at PSI Institute –Test Report , 2011, G. Spiezia, P. Perronard, S. Danzeca
][ 2cmN
ConclusionsHigh resolution algorithm – CORDIC based – complies to the specifications of 0,5 μm ofnumeric resolution
Possibility of using a single FPGA (A3PE1000) for readings of 2 LVDTs in parallel
Application of a redundancy scheme formitigate the effects of radiation
ADC and FPGA can be considered radiationtolerant in an environment characterized by a TID of 100 Gy and a fluence of 1e11cm-2
20
21
BACKUP SLIDES
• DAC PCM RADIATION TEST SETUP AND RESULTS
• SEU SIMULATION ON LVDT VOLTAGE ACQUISITION.
• WHAT HAPPENS TO THE POSITION?
22
DAC PCM1702 Radiation test setup
DUT DAC 1
Anti-latchup board
Ch1
Ch3
Ch2
Ch4
TESTER
GPIB
HP34970
Agilent E3648A
GPIB
DUT DAC 2
DUT DAC 3
Current Monitor +I -I
Power Supply +5V -5V
FPGAACTEL
USB-SERIAL
4
Ref DAC
DUT IN-BEAM
Temperature
23
PSI Beam conditionsRun DUT Flux
pp/cm2/sFluencepp/cm2
Cumulative Fluence
Dose rate (rad/s)
Cumulative TID [Gy]
45 DAC_Board 1 1,44E+08 1,98E+11 1,98E+11 4,58 105
46 DAC_Board 1 1,44E+08 1,60E+11 3,58E+11 4,64 191
47 DAC_Board 1 1,44E+08 9,80E+10 4,56E+11 4,58 243
48 DAC_Board 1 1,44E+08 2,20E+11 6,76E+11 4,63 361
49 DAC_Board 2 1,44E+08 2,00E+11 2,00E+11 4,20 100
50 DAC_Board 2 1,44E+08 4,10E+11 6,10E+11 4,51 320
Taken in consideration only for the current drift because of some problem at the anti-latch up circuit
Taken in consideration for the SEU after removing the anti-latch up board
OUTPUT ANALYSIS ON RUN 50
24NO SEU
25
Current supply (+5V) analysis in the runs 45-48
NO DRIFT
26
Current supply (-5V) analysis in the runs 45-48
DRIFT START AT 100 Gy
OUT OF SPEC ~ 200 Gy
27
SEU SIMULATION ON LVDT OUTPUTIf we want to simulate an SEU two parameter have to be considered:
1. SEU POSITION IN THE 16 BIT ADC REGISTER2. SEU POSITION IN THE ACQUIRED SINE WAVE
Wait until SEU on bit = 8 to see the SEU effects on the most significant BIT
Play ANIMATION
28
Maximum Error due to SEU on position evaluation