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Project Readiness Package Rev 7/22/11 ADMINISTRATIVE INFORMATION: Project Name (tentative): Swappable Sensor Bay and Standard Sensor Suite Development Project Number, if known: Preferred Start/End Quarter in Senior Design: Faculty Champion: (technical mentor: supports proposal development, anticipated technical mentor during project execution; may also be Sponsor) Name Dept. Email Phone For assistance identifying a Champion: B. Debartolo (ME), G. Slack (EE), J. Kaemmerlen (ISE), R. Melton (CE) Other Support, if known: (faculty or others willing to provide expertise in areas outside the domain of the Faculty Champion) Name Dept. Email Phone John D. Wellin ME [email protected] 585-475-5223 Project “Guide” if known: (project mentor: guides team through Senior Design process and grades students; may also be Faculty Champion) Primary Customer, if known (name, phone, email): (actual or representative user of project output; articulates needs/requirements) Kevin Meredith, (714) 418-6744, [email protected] Dr. Edward Hensel, (585) 475-7684, [email protected] Sponsor(s): (provider(s) of financial support) Name/Organization Contact Info. Type & Amount of Support Committed Boeing kevin.i.meredith@boeing .com TBD Page 1 of 13 Fall/Sprin g Spring/Fal l
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Project Readiness Package Rev 7/22/11

ADMINISTRATIVE INFORMATION:

Project Name (tentative): Swappable Sensor Bay and Standard Sensor Suite Development Project Number, if known:

Preferred Start/End Quarter in Senior Design:

Faculty Champion: (technical mentor: supports proposal development, anticipated technical mentor during project execution; may also be Sponsor)

Name Dept. Email Phone

For assistance identifying a Champion: B. Debartolo (ME), G. Slack (EE), J. Kaemmerlen (ISE), R. Melton (CE)

Other Support, if known: (faculty or others willing to provide expertise in areas outside the domain of the Faculty Champion)

Name Dept. Email PhoneJohn D. Wellin ME [email protected] 585-475-5223

Project “Guide” if known: (project mentor: guides team through Senior Design process and grades students; may also be Faculty Champion)

Primary Customer, if known (name, phone, email): (actual or representative user of project output; articulates needs/requirements)

Kevin Meredith, (714) 418-6744, [email protected]. Edward Hensel, (585) 475-7684, [email protected]

Sponsor(s): (provider(s) of financial support)

Name/Organization Contact Info. Type & Amount of Support Committed

Boeing [email protected] TBD

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Fall/Spring Spring/Fall

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Project Readiness Package Rev 7/22/11

PROJECT OVERVIEW:

Within the past year, Boeing’s maritime division contacted RIT with the hopes of creating a lasting relationship with the programs here at RIT. Through this relationship, Boeing hopes to fund RIT research and development in underwater robotic technology in order to develop new technology that will give them the opportunity to improve their position in the market segment. Under the broad scope of underwater robotic technology, Boeing has come to RIT with five areas of specific interest to them which include communication, navigation, energy, autonomy, and payload and sensor systems. In each of these areas, Boeing is searching RIT for expertise that will benefit their products in the future.

Boeing is looking to further improve the payload and sensor systems that are currently on their submersible robotics. Many of Boeing’s customers have different needs and Boeing would like to incorporate customizable payload and sensor suites to offer to their customers. A large portion of their customer’s applications have to do with oil and gas detection, marine life monitoring, and ocean floor mapping so they are looking for a system of sensor suites which can be interchangeable so Boeing can modify it to fit the customer’s needs and requirements.

This project will research, design, and develop a swappable sensor bay that can be fitted into the chassis of submersible robots. The swappable bays will act as a compartment to safely house the suite of sensors and electrical components. The bays will be easily replaced so different sensor suites can be swapped out quickly and easily. In addition to the swappable bay system, the team will be responsible for creating the standard sensor suite which will incorporate all needed sensors to allow for basic operation of the vessel into the swappable bay package size.

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Project Readiness Package Rev 7/22/11

DETAILED PROJECT DESCRIPTION:

Customer Needs and Objectives:

Customer Needs and Objectives

CategoryNumbe

r Description

Sensors

1.1 Measure temperature1.2 Measure position1.3 Measure velocity1.4 Measure acceleration1.5 Measure pressure1.6 Measure power

Chassis

2.1 Swappable2.2 Easy to access2.3 Locks in place2.4 Durable/rugged2.5 Requires infrequent maintenance2.6 Compatible with underwater platform2.7 Fits required systems

Underwater Performance

3.1 Waterproof3.2 Corrosion-resistant3.3 Operate at high pressure3.4 Minimal weight

Interface

4.1 Receive power4.2 Transmit data4.3 Receive data4.4 Store data

Cost5.1 Fits within budget/grant5.2 Low cost repairs5.3 Low cost replacement parts

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Project Readiness Package Rev 7/22/11

Functional Decomposition:

Potential Concepts:

Swappable External Bay Quick and easy to change by the OEM (Original Equipment Manufacturer) and the end

user Easily accessible from the exterior of the robot

Fixed External Bay Can only be changed by the OEM Easily accessible from the exterior of the robot

Fixed Internal Bay Can only be changed by the OEM Located inside the pressurized systems compartments

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Project Readiness Package Rev 7/22/11

Specifications (or Engineering/Functional Requirements):

FunctionsMetrics Specifications

Measure of Performance Preferred Direction

Nominal Value

Marginal Value

Monitor Environment

Measure temperature Error (± °C) Down 1 5Measure position Error (± ft) Down 1 5Measure velocity Error (± ft/s) Down 1 5Measure acceleration Error (± ft/s2) Down 1 5Measure pressure Error (± psi) Down 1 5Measure power Error (± volt) Down 1 5

Interface with robot

Transmit DataTransmit Range (in) Up 120 80Transmit Rate (kbps) Up 1000 250

Receive DataTransmit Range (in) Up 120 80Transmit Rate (kbps) Up 1000 250

Power Input Input Voltage (Volts) Target 12 6

Store dataSize (GB) Target 2000 320Time to save 10 GB file (minutes) Down 5 15

ChassisDurable Drop Height (ft) Up 15 5Waterproof Hydrotest (psi) Up 5000 4000

Constraints: Design must be suitable for underwater use Design must be able to withstand pressures of up to 10,000 ft Design must fit into the vessel’s chassis Design must allow enough room to contain system components

Project Deliverables:

Due at the completion of MSD I (6 months) Detailed design of swappable bay Detailed design of standard sensor suite FEA of components Bill of materials

Due at the completion of MSD II Working swappable bay package Working standard sensor suite Entry into Imagine RIT

Budget Estimate:

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Project Readiness Package Rev 7/22/11

No final design has been selected so it is impossible to create an accurate costing model. The budget estimate below reflects possible materials that would need to be purchased to complete this project.

Item Name Supplier Notes QtyPrice (ea.)

Extended Cost

3871K823 ThermocoupleMcMaster-Carr 4 $32.40 $129.60

ACC101 Accelerometer Omega General Purpose 4 $265.00 $1,060.00

PX309Pressure Transducer Omega 2 $225.00 $450.00

PHE-1311 Ph electrode Omega General Purpose 2 $76.00 $152.00OM-SQ2040-2F16 Data Logger Omega

16 or 32 Universal Inputs 1

$3,550.00 $3,550.00

WD2002FAEX 2tb HDD Newegg 2 $159.99 $319.985083 Aluminum Alloy

McMaster-Carr 1/2"x24"x24" sheet 6 $244.64 $1,467.84

7587K931 WireMcMaster-Carr

22ga. Stranded wire - 100' 4 $10.77 $43.08

Misc. Misc. Components Various $500.00Total $7,672.50

Intellectual Property (IP) considerations:

Any technical developments will be the intellectual property of Boeing and RIT and should not be shared to any outside parties.

Other Information:

Maximum Underwater Pressure:Density of saltwater: 1025 kg/m3

Max depth: 3000 metersGravitational constant: 9.81 m/s2

Hydrostatic pressure of a liquid: P = h * ρ * g = 30 MPa = 4.3 ksi

STUDENT STAFFING:

Skills Checklist: Page 6 of 9

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Project Readiness Package Rev 7/22/11

For each discipline, skills or knowledge that will be needed by students working on the associated project are listed and ranked 1-3 in order of importance (1=highest priority, 3=lowest priority).

Mechanical Engineering

2 3D CAD Aerodynamics2 MATLAB programming CFD2 Machining (basic) Biomaterials1 Stress analysis (2D) Vibrations1 Statics/dynamic analysis (2D) Combustion engines

Thermodynamics 3 GD&T (geometic dimensioning & tolerancing)

Fluid dynamics (CV) Linear controls2 LabView (data acquisition, etc.) Composites

Statistics 3 DFMRobotics (motion control)

3 FEA CompositesHeat transfer Other:Modeling of electromechanical & fluid systems

Other:

2 Fatigue & static failure criteria (DME) Other:Specifying machine elements

Reviewed by (ME faculty):

Electrical Engineering

1 Circuit design: AC/DC converters, regulators, Digital filter design and

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Project Readiness Package Rev 7/22/11

amplifier ckts, analog filter design, FPGA Logic design, sensor bias/support circuitry

implementation, DSP

3 Power systems: selection, analysis, power budget determination

Microcontroller selection/application

System analysis: frequency analysis (Fourier, Laplace), stability, PID controllers, modulation schemes, VCO’s & mixers, ADC selection

Wireless protocol, component selection

1 Circuit build, test, debug (scopes, DMM, function generators)

Antenna selection (simple design)

2 Board layout Communication system front end design

2 MATLAB Algorithm design/simulationPSpice Embedded software design/

implementation3 Programming: C, Assembly Other:

Electromagnetics (shielding, interference) Other:Other:

Reviewed by (EE faculty):

Computer Engineering

2 Digital design (including HDL and FPGA) Wireless networksSoftware for microcontrollers (including Linux and Windows)

Robotics (guidance, navigation, vision, machine learning, and control)

2 Device programming: Assembly language, C Concurrent and embedded software2 Programming: Java, C++ 2 Embedded and real-time systems

Analog design Digital image processingNetworking and network protocols Computer visionScientific computing (including C and MATLAB) Network security

1 Signal processing Other:Interfacing transducers and actuators to microcontrollers

Other:

Other:

Reviewed by (CE faculty):

Anticipated Staffing Levels by Discipline:

Discipline How Anticipated Skills Needed (concise descriptions) Page 8 of 9

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Project Readiness Package Rev 7/22/11

Many?

EE 3 Basic analog circuit design to include voltage and current sense circuitry, power budget analysis, regulation circuitry, and selection of sensors.

ME2 Design and development of mechanical components, static and dynamic

system analysis, fluid dynamic analysis, finite element analysis (FEA), testing, material selection, and machining.

CE 1 Digital Signal Processor/Microcontroller Unit selection, programming, algorithm implementation, memory allocation, and board layout.

ISE 0

Other

OTHER RESOURCES ANTICIPATED:Describe resources needed to support successful development, implementation, and utilization of the project. This could include specific faculty expertise, laboratory space and equipment, outside services, customer facilities, etc. Indicate if resources are available, to your knowledge.

Category Description Resource Available?

Faculty

Environment

Equipment

Materials

Other

Prepared by: Jared Warren Date: 5/8/2013

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