To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010 April 1st, 2010 Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry
1
GET-BE-1002Ver.5.0: May,2006
NEC Electronics CorporationCompound Semiconductor Devices Division
Lead (Pb)-free Semiconductor Products
2
GET-BE-1002Ver.5.0: May,2006
Lead (Lead (PbPb))--free Semiconductor Products of free Semiconductor Products of OptoOpto--Electronics, Electronics, and RF and Microwave Devicesand RF and Microwave Devices
• As a so-called "green vendor", NEC Electronics contributes to global environmental protection by actively promoting the introduction of Lead (Pb)-free products as part of our ongoing efforts to develop and supply environmentally sound products.
• We have completed development of Lead (Pb)-free technology for all of our opto-electronics, RF, and microwave products*1 and are accepting orders for Lead (Pb)-free products.
• MoreOver, our future products will all be Lead (Pb)-free.
• In consideration of the environment, we are aiming to completelyeliminate the use of lead*2 in all of our opto-electronics, RF, and microwave products*1 by the end of September 2006 and have been progressing with the gradual switchOver*3 since October 2005.
*1:Products made by the former NEC Compound Semiconductor Devices, Ltd.*2:RoHS compliant (Some products will still have internal parts with material containing lead.) Contact a sales
representative for details.*3:Except for maintenance products being phased out.
Lead (Lead (PbPb))--free Policiesfree Policies
3
GET-BE-1002Ver.5.0: May,2006
Measures for Lead (Pb)-free Implementation1. Areas Requiring Lead (Pb)-free Mount materials such as soldering
paste and soft solder.(Modules and some power devices)
Solder Plating of Outer Leads(Plastic packages)
2. Method of Lead (Pb)-free Implementation
*Solder Dip(radial transistors):Sn-Ag-Cu Dip
(1) Solder Plating for Outer Leads
(2) Pb reduction inside the packages such as the mount materialshas already met the RoHS Directive requirements. (The complete Pb free technologies are currently under development. Its actualimplementation date is TBD).
C o n v e n t io n a lP ro d u c t s
Le a d ( P b ) - f re e P ro d u c t s
Sn-Pb Sn-Bi
Au Au
*
4
GET-BE-1002Ver.5.0: May,2006Specification for Lead (Pb)-free
Package Soldering of Outer Leads Mount Materials Pb Usage in Others
SOP Type
DIP Type
MM Type
Power Mold
Ceramic Type
Module Type(MCM)
(Laser Di)
Sn-Bi Plating
Sn-Bi Plating
Sn-Bi Plating
Sn-Ag-Cu Dip
Au Plating (Same as at present)
Au Plating (Same as at present)
Pb Not Used
Pb Not Used
Pb Not Used
Pb Not Used
Complied with the RoHSComplete Lead (Pb)-free
Implementation underway(Sn-Pb soft solder used )
Pb Not UsedPb Not Used
Pb Not Used
Pb Not Used
Pb Not UsedRadial Type(Transistor)
Sn-Bi Plating
Pb Not Used Pb Not Used
QFNType Sn-Bi Plating Pb Not Used Pb Not Used
Soldering of outer leads became Lead (Pb)-free in October, 2001. The Pb contained inside the packages met the RoHS Directive requirements in December, 2002.
Complied with the RoHSComplete Lead (Pb)-free
Implementation underway(Lead glass and Ceramic
Parts, etc.)
Sn-Ag-Cu Paste
5
GET-BE-1002Ver.5.0: May,2006Lead (Pb)-free plating comparison (1)
=Why Sn-Bi is the best solution=
Sn-Pb(Conventional) Sn-Bi Sn-CuSn-Ag Matte-Sn Ni/Pd/Au
Composition (wt%)
Melting point (˚C)Solid-liquid phase temperature
Alloy characteristics
Packagingreliability
Wettability
Soldering temperature
Joint strength
Productivity
Cost
Notes
Whisker resistance
Surface solder plating
Pb:10 Bi:2 Cu:1.5Ag:3.5 Sn:100 -
183-215 223-231 227-296221(eutectic) 232 Soluble plating
x
Cannot be applied to the lead frame containing Fe.
Interferes with resin adhesion.
Excellent Good Poor x NG
6
GET-BE-1002Ver.5.0: May,2006
232
50→%Sn
100Sn
SnSn--CuCu
227 99.3
Liquidus
Liquid↑
↓Solid
Tem
pera
ture→
0Cu
1083
Solidus
1.5Cu
Lead (Pb)-free plating comparison (2)=Why Sn-Bi is the best solution=
The solid phase (solidification) temperature of Sn-Bi solder is influenced by the variation in composition, while thevariation in the liquid phase (melting) temperature remainssmall. These characteristics are similar to those of Sn-Pb.
Note: The figures shown are images and may be slightly different from actual data.
50→%Sn
100Sn
0Pb
327
61.9183
SnSn--PbPb
10Pb
Solidus
LiquidusLiquid↑
↓Solid
↓Semi-solid
↑
50→%Sn
100Sn
0Bi
271
42 139
SnSn--BiBi2Bi
Liquidus
Solidus
Liquid↑
↓Solid
↓Semi-solid
↑
↓Semi-solid
↑
221 96.5
960.5
SnSn--AgAg
50→%Sn
100Sn
0Ag
3.5Ag
Liquidus
Solidus
Liquid↑
↓Solid
↓Semi-solid
↑
7
GET-BE-1002Ver.5.0: May,2006
Pb
BiSnWt%Sn
Wt%
Sn
Eutectic point:About 100 degree C
100 80 60 40 20 0
80
60
40
20
100
0
Sn-Bi plating on Sn-Pb Solder paste
Sn-Pb-Bi Melting Characteristics(image)
Over 200 degree
There are few Bi to Sn, and Pb.Mounting by Sn-Pb solder paste is also possible.
Sn-37Pb paste(183 degree C : eutectic)
Sn-2Bi plating(Solid : 223 degree C
- Liquid : 231 degree C)
Low temperature zone(Under 150 degree C)
Lead (Pb)-free plating comparison (3)=Why Sn-Bi is the best solution=
Over 200 degree C
Over 200 degree C
Over 175 degree C
8
GET-BE-1002Ver.5.0: May,2006Identification of Lead (Pb)-free Products*
Identification by “Marking on the Product”:Lead (Pb)-free products will be marked with Dot-mark orAlternative mark except for products using small packages such as minimold package.
Dot-mark for Product
Identification by “Marking on the Package Label”Package labels for all Lead (Pb)-free products will be marked witheither “Pb-Free T.”.Taping reel label will also be marked in the same manner fortaping at shipment time.
*Note that this marking system applies only to products changed Over to Lead (Pb)-free. Conventional products not containing Pb will not be marked.
9
GET-BE-1002Ver.5.0: May,2006
Example Marking on the Product
Display surface is marked with Dot-mark or underline.
C X X X X
(Ex.) QFN
Example Markingon the Label
Packing label is marked with logo.
Lead (Lead (PbPb))--free Products Marking Methodfree Products Marking Method= Compounds / Si Microwave Devices == Compounds / Si Microwave Devices =
X X X XN
(Ex.) 8pSOP
For the details, please contact NEC Electronics Corporation.
*No marking for 175mil 8p SSOP.
Package Marking on the Label
SOP Type Dot-mark Lead (Pb)-free marking (Logo)on the Label SSOP Type Dot-mark *
(See the examples below.)QFNType Underline
DIP Type Dot-mark
TSSOP/HTSSOP No Marking
TSON Type No Marking
Mini Mold Type No Marking
Power Mold No Marking
TO-92 No Marking
Marking on the Product
“Pb-Free T.”
*
10
GET-BE-1002Ver.5.0: May,2006Lead (Pb)-free Products Marking Method
N E C2 5 X X
X XXX
DIP (4,6,8PIN)
Specified by the English-letter indicator in the 2nd digit of the Internal Code.
N E C2 7 X XX XXX
l
SOP (4pin:Laser Printing)
Marked with the vertical lineon the bottom-right corner.
1 XXX
SSOP 4PIN
Stamped with Mark.
Example Marking on the Product
== NEPOC Products (NEPOC Products (PhotocouplersPhotocouplers ·· OCMOS (OpticalOCMOS (Optical--coupled MOS)) =coupled MOS)) =
Lead (Pb)-free marking (Logo) on the inside label and outside label.
Marking on the Product Marking on the LabelInternal Code
Laser Printing Vertical LineInk Printing Italicized Product Name
Mark
Laser Printing Internal CodeInk Printing Italicized Product Name
Vertical LineFlat Lead
SSOP 4PIN
Package
SOP 4PIN
SSOP16PIN
DIP (4,6,8 PIN)
OC MOS SOP 8PIN
For the details, please contact NEC Electronics Corporation.
Internal Code “Pb-Free T.”
11
GET-BE-1002Ver.5.0: May,2006
Recommended Soldering Conditions of Lead (Pb)-free Products
1. Surface Mount Type (SMD)•IR reflow with the peak temperature 260°C,•Wave soldering with the molten solder in the 260°C
soldering bath and•Partial lead heating through the 350°C solder iron tip
can be performed.
2. Through Hole Type (THD)• Wave soldering with the molten solder in the 260°C
soldering bath and• Partial lead heating through the 350°C solder iron tip
can be performed.
3. Hand Soldering Type •Partial lead heating through the 350°C solder iron tip
can be performed.- Specific conditions apply to some products. Please contact our sales representatives for details. -
12
GET-BE-1002Ver.5.0: May,2006
• Max. Temperature (Package Surface Temperature): 260°C• Soldering Time at Max. Temperature : Within 10 seconds• Soldering Time at Over 220°C : Within 60 seconds• Preheating Time at 120°C - 180°C : 120 ± 30 seconds • Max. number of Reflows : 3 times• Chlorine Composition of Rosin Flux (%) : 0.2% (wt.) or less
(Heating)- 10s
Time (sec.)
- 60s
120 ± 30s(Preheating)
Pack
age
Surf
ace
Tem
pera
ture
(ºC
)
260°C MAX.220°C
120°C180°C
Recommended Soldering Conditions of Lead (Pb)-free Products(IR Reflow)
- Specific conditions apply to some products. Please contact our sales representatives for details. -
13
GET-BE-1002Ver.5.0: May,2006
Recommended Soldering Conditions of Lead (Pb)-free Products(Wave Soldering/Partial Lead Heating)
• Max. Temperature (Molten Solder Temperature): 260°C• Flow Time : Within 10 seconds• Preheat Temperature (Package Surface Temperature):Below 120°C • Number of Flows : 1 time• Chlorine Composition of Rosin Flux: 0.2% (wt.) or less
• Max. Temperature (Outer Lead Temperature): 260°C • Time (per side of a device* or per lead*) : Within 3 seconds• Chlorine Composition of Rosin Flux :0.2% (wt.) or less
(*:Time is defined per side for SMD and per lead for THD)
Wave Soldering
Partial Lead Heating (Hand Soldering)
- Specific conditions apply to some products. Please contact our sales representatives for details. -
14
GET-BE-1002Ver.5.0: May,2006
Lead (Pb)-free Product Samples and Mass Production
We are already accepting orders for Lead (Pb)-free optical, radio-frequency, and microwave products.Please contact one of our sales representatives for samples, products and the delivery date.
Samples for Evaluation are available as below:Please contact our sales representatives for delivery date.
Package Samples Product Samples(Part number: (Part number:
Not specified) Specified)
15
GET-BE-1002Ver.5.0: May,2006Contact for Inquiries
NEC Electronics Corporation. Compound Semiconductor Devices Division.Home Page:Please visit our web site for information of Compound Semiconductor Devices Division.
URL (Address) http://www.ncsd.necel.com/
Request for Documents/Brochures:Sales Planning Group of Sales Division or our exclusive distributors
Business Information:Sales Planning Group of Sales Division Tel : 044-435-1838
E-mail : [email protected]
16
GET-BE-1002Ver.5.0: May,2006
Reference
17
GET-BE-1002Ver.5.0: May,2006Plating Wettability Test Results
= Mini Mold Package =Test Method: M eniscograph
Standard: ≤ 3 sec
0
1
2
3
210 215 220 225 230 235 240 245 250
Zero
-cro
ss T
ime
(Sec
)
Inner Composition of EvaluatedPlating Solder Material in the Bath
Sn-2.5Bi Sn-PbSn-2.5Bi Sn-3Ag-0.5CuSn-Pb Sn-PbSn-Pb Sn-3Ag-0.5Cu
Lead (Pb)-free (Sn-Bi) plating exhibits wettability equivalent to the current Sn-Pb plating.
Disposal pre-conditions :150deg C HT 48H
Terminal material: Cu
RMA-Type Flux R-Type Flux
Test Method: MeniscographStandard: ≤ 3 sec
Evaluation Bath Temperature (deg C)
18
GET-BE-1002Ver.5.0: May,2006
Sn - 40Pb Sn-3Ag-0.5CuMount Solder PasteOuter Solder Plating Sn-10Pb Sn-2.5Bi Sn-10Pb Sn-2.5Bi6pTSMM
(Cu)
6pTUSMM(Cu)
3pTUSMM(Cu)
3pL2MM(Cu)
VerticalDirection
VerticalDirection
VerticalDirection
VerticalDirection
HorizontalDirection
HorizontalDirection
HorizontalDirection
HorizontalDirection
37 35 37 3528 31 32 3333 31 41 3913 14 15 1416 17 19 209 9 9 910 11 13 12
19 19 21 18
(unit : N)
Vertical Direction
HorizontalDirection
Vertical Direction
HorizontalDirection
Vertical Direction
HorizontalDirection
6pTSMM 6pTUSMM 3pTUSMM
Vertical Direction
HorizontalDirection
3pL2MM
Equivalent Shear Strength of the Mount Solder Paste and the Outer Solder Plating was Evaluated for Each of 4 Package Types
Mount Condition : One-time IR Reflow (with a peak temperature of 260degC)
Mini Mold PackageMini Mold Package Solder Mount Shear Strength Standard: ≥ 5 N
Lead (Pb)-free Plating Solder Joint Strength Evaluation Results
19
GET-BE-1002Ver.5.0: May,2006
(unit : N)Solder Mount Pull Strength: Standard: ≥ 5 N
All combinations of solder paste and solder plating show equivalent mount pull strength
Mount Condition : One-time IR Reflow with a peak temperature of 260 °C.Number of samples: 3 packages each.
Sn - 40Pb Sn-3Ag-0.5CuMount Solder PasteOuter Solder Plating Sn-10Pb Sn-2.5Bi Sn-10Pb Sn-2.5Bi
4pin DIP(Cu)
4pin SOP(42 Alloy) 27 28 28 28
>100 >100 >100 >100
4pin SSOP(42 Alloy)
27 28 28 28
PhotocouplersPhotocouplers
Solder Joint Strength
20
GET-BE-1002Ver.5.0: May,2006
Outer Lead SolderTest Conditions Temperature CycleTemperature Cycle
Storage at aConstant
Storage at aConstant
Temperature CycleStorage at a
Constant(-65to150C) (-65to150C) (85C,85%) (85C,85%) (-65to150C) (85C,85%)
IR ReflowNot Performed
IR ReflowPerformed
IR ReflowNot Performed
IR ReflowPerformed
IR ReflowNot Performed
IR ReflowNot Performed
L/F* Material 2000 Cycle 2000 Cycle 2000H 2000H 2000 Cycle 2000H
Cu L/F * WhiskerNot Occurred
WhiskerNot Occurred
WhiskerNot Occurred
WhiskerNot Occurred
WhiskerNot Occurred
WhiskerNot Occurred
Fe-Ni L/F * WhiskerNot Occurred
WhiskerNot Occurred
WhiskerNot Occurred
WhiskerNot Occurred - -
Fe L/F * WhiskerNot Occurred**
WhiskerNot Occurred**
WhiskerNot Occurred
WhiskerNot Occurred - -
Sn-Bi Plating Sn-Ag-Cu Dip
*L/F=Lead Frame **(-55 to 150 degree C, 1000Cycle)Judgment : ≤ 50 um
* No Problems were Observed During Long-Period Storage In Either Case, Whether Thermal Stress to the Board Mount is Applied or Not
Fe-Ni L/F(225milSOP)TC2000 Cycle
Cu L/F (Minimold)TC2000 Cycle
Fe-Ni L/F (225milSOP)HHT2000H*
Cu L/F (Minimold)HHT2000H*
*:Rough surface is caused by metal rusts.
Lead (Pb)-free Plating Whisker Test Results
Check
SEM:IR Reflow Not Performed
21
GET-BE-1002Ver.5.0: May,2006
*L/F=Lead FrameJudgment : ≤ 40 um (complied iNEMI)
Outer Lead SolderTest Conditions Temperature Cycle Storage at a Constant Temperature & Humidity
IR Reflow Not Performed
L/F* Material 1000 Cycle 3000H
Cu L/F* Whisker Not Occurred
Fe-Ni L/F*
Fe L/F*
Sn-BiPlating
Check
Results of Whisker Test (complied JEDEC standard)
(-40 to 85 degree C) (60 degree C,90%)
IR Reflow Not Performed
Whisker Not Occurred
Whisker Not Occurred
Whisker Not Occurred
Whisker Not Occurred
Whisker Not Occurred
* No Problems were Observed in JEDEC standerd condition too.