OPA2333-HT

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1

2

3

4

8

7

6

5

JD OR HKJ PACKAGE

(TOPVIEW)

OUT A

-IN A

+IN A

V- +IN B

-IN B

OUT B

V+

O P A 2 3 3 3 - H T

www.ti.com SBOS483B JULY 2009REVISED NOVEMBER 2009

1 . 8 -V M I C R O P O W E R C M O S O P E R A T I O N A L A M P L I F I E R

Z E R O -D R IF T S E R I E SCheck for Samples: OPA2333-HT

1FEATURES SUPPORTS EXTREME TEMPERATUREAPPLICATIONS Low Offset Voltage: 26 V (Max) Controlled Baseline 0.01-Hz to 10-Hz Noise: 1.5 VPP One Assembly/Test Site Quiescent Current: 50 A One Fabrication Site

Single-Supply Operation Available in Extreme (55C/210C)

Supply Voltage: 1.8 V to 5.5 V Temperature Range (1)

Rail-to-Rail Input/Output Extended Product Life Cycle

Extended Product-Change NotificationAPPLICATIONS

Product Traceability Down-Hole Drilling

Texas Instruments' high temperature products High Temperature Environments

utilize highly optimized silicon (die) solutionswith design and process enhancements tomaximize performance over extendedtemperatures.

(1) Custom temperature ranges available

DESCRIPTION/ORDERING INFORMATION(2)

The OPA2333 series of CMOS operational amplifiers uses a proprietary auto-calibration technique tosimultaneously provide very low offset voltage and near-zero drift over time and temperature. These miniature,high-precision, low-quiescent-current amplifiers offer high-impedance inputs that have a common-mode range100 mV beyond the rails, and rail-to-rail output that swings within 150 mV of the rails. Single or dual supplies aslow as 1.8 V (0.9 V) and up to 5.5 V (2.75 V) may be used. They are optimized for low-voltage single-supplyoperation.

The OPA2333 family offers excellent common-mode rejection ratio (CMRR) without the crossover associatedwith traditional complementary input stages. This design results in superior performance for drivinganalog-to-digital converters (ADCs) without degradation of differential linearity.

(2) Refer to Electrical Characteristics for performance degradation over temperature.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Copyright 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does not

necessarily include testing of all parameters.
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a

b

c

d

Origin

O P A 2 3 3 3 - H T

SBOS483B JULY 2009REVISED NOVEMBER 2009 www.ti.com

Table 1. ORDERING INFORMATION(1)

TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING

KGD OPA2333SKGD1 NA

55C to 210C JD OPA2333SJD OPA2333SJD

HKJ OPA2333SHKJ OPA2333SHKJ

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIWeb site at www.ti.com.

(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.

BARE DIE INFORMATION

BACKSIDE BOND PADDIE THICKNESS BACKSIDE F INISH

POTENTIAL METALLIZATION COMPOSITION

15 mils. Silicon with backgrind V- Al-Si-Cu (0.5%)

2 Submit Documentation Feedback Copyright 2009, Texas Instruments Incorporated

Product Folder Link(s):OPA2333-HT
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OUT A

-IN A

+IN A

V- +IN B

-IN B

OUT B

V+

| ||

|

962 mm

1490

mm

38 mm

|

|

38 mm

O P A 2 3 3 3 - H T


Table 2. BOND PAD COORDINATES

DESCRIPTION PAD NUMBER a b c d

OUT A 1 21.20 1288.50 97.20 1364.50

IN A 2 21.20 923.65 97.20 999.65

+IN A 3 21.20 533.05 97.20 609.05

V 4 31.30 172.20 107.30 248.20

+IN B 5 864.80 162.25 940.80 238.25

IN B 6 864.80 552.65 940.80 628.65

OUT B 7 864.80 897.10 940.80 973.10

V+ 8 854.70 1280.45 930.70 1356.45

Copyright 2009, Texas Instruments Incorporated Submit Documentation Feedback 3

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O P A 2 3 3 3 - H T


THERMAL CHARACTERISTICS FOR JD PACKAGEover operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

High-K board (2), no airflow 64.9Junction-to-ambient thermalJA C/Wresistance(1) No airflow 83.4

JB Junction-to-board thermal resistance High-K board without underfill 27.9 C/W

JC Junction-to-case thermal resistance 6.49 C/W

(1) The intent of JA specification is solely for a thermal performance comparison of one package to another in a standardized environment.This methodology is not meant to and will not predict the performance of a package in an application-specific environment.

(2) JED51-7, high effective thermal conductivity test board for leaded surface mount packages

THERMAL CHARACTERISTICS FOR HKJ PACKAGEover operating free-air temperature range (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

Junction-to-case thermal resistance (to bottom of case) 5.7JC C/W

Junction-to-case thermal resistance (to top of case lid - as if formed dead bug) 13.7

Absolute Maximum Ratings (1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Supply voltage 7 V

Signal input terminals, voltage (2) 0.3 (V+) + 0.3 V

Output short circuit (3) Continuous

Operating temperature range 55 210 C

Junction temperature 210 C

Human-Body Model (HBM) 4000ESD rating V

Charged-Device Model (CDM) 1000

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails shouldbe current limited to 10 mA or less.

(3) Short circuit to ground, one amplifier per package.

Electrical Characteristics: VS = 1.8 V to 5.5 VBoldface limits apply over the specified temperature range,TA = 55C to 210C. At TA = 25C, RL = 10 k connected to VS/2,VCM = VS/2, and VOUT = VS /2 (unless otherwise noted).

TA = 55C to 125C TA = 210C(1)

UNITPARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX

OFFSETVOLTAGE

Input offset vol tage VOS VS = 5 V 2 10 V

over temperature 22 26 V

vs temperature dVOS/dT 0.02 0.05 V/Cvs power supply PSRR VS = 1.8 V to 5.5 V 1 6 1.7 11 V/V

Long-term (2)stability(2)

Channel0.1 V/V

separation, dc

INPUT BIASCURRENT

(1) Minimum and maximum parameters are characterized for operation at TA = 210C, but may not be production tested at thattemperature. Production test limits with statistical guardbands are used to ensure high temperature performance.

(2) 300-hour life test at 150C demonstrated randomly distributed variation of approximately 1 V.



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O P A 2 3 3 3 - H T


Electrical Characteristics: VS = 1.8 V to 5.5 V (continued)Boldface limits apply over the specified temperature range,TA = 55C to 210C. At TA = 25C, RL = 10 k connected to VS/2,VCM = VS/2, and VOUT = VS /2 (unless otherwise noted).

TA = 55C to 125C TA = 210C(1)


Input bias current IB

70 200 pA

over150 5300 pA

Temperature

1060Input offset current IOS 140 400 pA0

NOISE

Input voltagenoise, 0.3 1.0 VPPf = 0.01 Hz to 1 Hz

Input voltagenoise, 1.1 1.5 VPPf = 0.1 Hz to 10 Hz

Input current noise,in 100 fA/ Hzf = 10 Hz

INPUT VOLTAGERANGE

Common mode (V) (V+) + (V) (V) +VCM Vvoltage range 0.1 0.1 0.25 0.25

Common-ModeCMRR (V) 0.1 V < VCM < (V+) + 0.1 V 102 130 91 dBRejection Ratio

INPUTCAPACITANCE

Differential 2 4.25 pF

Common mode 4 12.25 pF

OPEN-LOOPGAIN

Open-loop (V) + 100 mV < VO < (V+) 100 mV,AOL 104 130 85 93 dBvoltage gain RL = 10 k

FREQUENCYRESPONSE

Gain-bandwidthGBW CL = 100 pF 350 350 kHzproduct

Slew rate SR G = 1 0.16 0.25 V/ s

OUTPUT

Voltage outputRL = 10 k 30 50 mVswing from rail

over temperature RL = 10 k 85 150 mV

Short-circuitISC 5 mA

current

Capacitive loadCL

drive

(3)Open-loop f = 350 kHz, IO = 0 2 koutput impedance

POWER SUPPLY

Specified voltageVS 1.8 5.5 1.8 5.5 Vrange

Quiescent currentIQ IO = 0 17 25 Aper amplifier

over temperature 30 50 80 A

Turn-on time VS = 5 V 100 s

(3) See Typical Characteristics.



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1000

10000

100000

1000000

110 130 150 170 190 210 230

Continous TJ (C)

EstimatedLife(Hours)

Electromigration Fail Mode

O P A 2 3 3 3 - H T


Electrical Characteristics: VS = 1.8 V to 5.5 V (continued)Boldface limits apply over the specified temperature range,TA = 55C to 210C. At TA = 25C, RL = 10 k connected to VS/2,VCM = VS/2, and VOUT = VS /2 (unless otherwise noted).

TA = 55C to 125C TA = 210C(1)


TEMPERATURERANGE

Specified range -55 to 210 C

Operating range -55 to 210 C

Figure 1. OPA2333SKGD1 Operating Life Derating Chart

Notes:

1. See datasheet for absolute maximum and minimum recommended operating conditions.

2. Silicon operating life design goal is 10 years at 105C junction temperature (does not include packageinterconnect life).



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OFFSET VOLTAGE PRODUCTION DISTRIBUTION

Popu

lation

10

9

8

7

6

5

4

3

2

1 0 1 2 3 4 5 6 7 8 9

10

Offset Voltage (V)

OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION

Population

0

0.0

025

0.0

050

0.0

075

0.0

100

0.0

125

0.0

150

0.0

175

0.0

200

0.0

225

0.0

250

0.0

275

0.0

300

0.0

325

0.0

350

0.0

375

0.0

400

0.0

425

0.0

450

0.0

475

0.0

500

Offset Voltage Drift (V/_C)

OPENLOOP GAIN vs FREQUENCY

AOL

(dB)

10

120

100

80

60

40

20

0

20

Phase(_)

250

200

150

100

50

0

50

100

100k10k1k100

Frequency (Hz)

1M

COMMONMODE REJECTION RATIO vs FREQUENCY

CMRR

(dB)

1

140

120

100

80

60

40

20

0

100k10k1k10010

Frequency (Hz)

1M

POWERSUPPLY REJECTION RANGE vs FREQUENCY

PSRR

(dB)

1

120

100

80

60

40

20

0

10k 100k1k10010

Frequency (Hz)

1M

+PSRR

PSRR

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

OutputSwing(V)

0

3

2

1

0

1

2

3

1

Output Current (mA)

107 8 965432

40_C

40_C

40_C

+25_C

+25_C

+25_C

+125_C

+125_C

VS = 2.75V

VS = 0.9V

O P A 2 3 3 3 - H T


TYPICAL CHARACTERISTICS

At TA = 25C, VS = 5 V, and CL = 0 pF (unless otherwise noted).



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INPUT BIAS CURRENT vs COMMONMODE VOLTAGE

IB(pA)

0

100

80

60

40

20

0

20

40

60

80

1001

CommonMode Voltage (V)

5432

IB

+IB

VS = 5V

INPUT BIAS CURRENT vs TEMPERATURE

IB(pA)

50

200

150

100

50

0

50

100

150

20025

Temperature (_C)

1251007550250

VS = 5.5V

VS = 1.8VIB

IB

+IB

+IB

LARGESIGNAL STEP RESPONSE

OutputVoltage(1V/div)

Time (50s/div)

G = 1

RL = 10k

0

20

40

60

-55 -25 0 25 50 75 100 1 25 1 50 1 75 2 00 2 10

Temperature (C)

IQ(A)

QUIESCENT CURRENT vs TEMPERATURE

m

POSITIVE OVER- VOLTAGE RECOVERY

2V/d

iv

0

1V/div

0

Time (50s/div)

Input

Output

10k

1k

OPA2333

+2.5V

2.5V

SMALLSIGNAL STEP RESPONSE

OutputVoltage(50mV/div)

Time (5s/div)

G = +1

RL = 10k

O P A 2 3 3 3 - H T


TYPICAL CHARACTERISTICS (continued)


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NEGATIVE OVER- VOLTAGE RECOVERY

2

V/div

0

1V/div 0

Time (50s/div)

Input

Output

10 k

1k

OPA2333

+2.5V

2.5V

SETTLING TIME vs CLOSEDLOOP GAIN

SettlingTime(s)

1

600

500

400

300

200

100

0

10

Gain (dB)

100

0.001%

0.01%

4V Step

0.1Hz TO 10Hz NOISE

500nV/div

1s/div

SMALLSIGNAL OVERSHOOT vs LOAD CAPACITANCE

Overshoot(%)

10

40

35

30

25

20

15

10

5

0100

Load Capacitance (pF)

1000

CURRENT AND VOLTAGE NOISE SPECTRAL DENSITY

vs FREQUENCY

VoltageNoise(nV//Hz)

1

1000

100

10

CurrentNoise(fA//Hz)

1000

100

101k10010

Frequency (Hz)

10k

Current Noise

Voltage Noise

Continues with no 1/f (flicker) noise.

O P A 2 3 3 3 - H T


TYPICAL CHARACTERISTICS (continued)



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5k

OPA233310mA max

+5V

VIN

VOUT

IOVERLOAD

Current- limiting resistor

required if input voltage

exceeds supply rails by

0.5V.

O P A 2 3 3 3 - H T


APPLICATION INFORMATION(1)

The OPA2333 is unity-gain stable and free from unexpected output phase reversal. It uses a proprietaryauto-calibration technique to provide low offset voltage and very low drift over time and temperature. For lowestoffset voltage and precision performance, circuit layout and mechanical conditions should be optimized. Avoidtemperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from

connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by ensuring theyare equal on both input terminals. Other layout and design considerations include:

Use low thermoelectric-coefficient conditions (avoid dissimilar metals)

Thermally isolate components from power supplies or other heat sources

Shield op amp and input circuitry from air currents, such as cooling fans

Following these guidelines will reduce the likelihood of junctions being at different temperatures, which can causethermoelectric voltages of 0.1 V/C or higher, depending on materials used.

Operating Voltage

The OPA2333 op amp operates over a power-supply range of 1.8 V to 5.5 V (0.9 V to2.75 V). Supply voltages higher than 7 V (absolute maximum) can permanently damage the device. Parametersthat vary over supply voltage or temperature are shown in the Typical Characteristics section of this data sheet.

Input Voltage

The OPA2333 input common-mode voltage range extends 0.1 V beyond the supply rails. The OPA2333 isdesigned to cover the full range without the troublesome transition region found in some other rail-to-railamplifiers.

Normally, input bias current is about 70 pA; however, input voltages exceeding the power supplies can causeexcessive current to flow into or out of the input pins. Momentary voltages greater than the power supply can betolerated if the input current is limited to 10 mA. This limitation is easily accomplished with an input resistor(seeFigure 2).

Figure 2. Input Current Protection

Internal Offset Correction

The OPA2333 op amp uses an auto-calibration technique with a time-continuous 350-kHz op amp in the signalpath. This amplifier is zero corrected every 8 s using a proprietary technique. Upon power up, the amplifierrequires approximately 100 s to achieve specified VOS accuracy. This design has no aliasing or flicker noise.

(1) At TA = 25C (unless otherwise noted).


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VOUT

RP = 20k

Op Amp V = Gnd

OPA2333

VIN

V+ = +5V

5VAdditional

Negative

Supply

O P A 2 3 3 3 - H T


Achieving Output Swing to the Op Amp Negative Rail

Some applications require output voltage swings from 0 V to a positive full-scale voltage (such as 2.5 V) withexcellent accuracy. With most single-supply op amps, problems arise when the output signal approaches 0 V,near the lower output swing limit of a single-supply op amp. A good single-supply op amp may swing close tosingle-supply ground, but will not reach ground. The output of the OPA2333 can be made to swing to ground, orslightly below, on a single-supply power source. To do so requires the use of another resistor and an additional,

more negative, power supply than the op amp negative supply. A pulldown resistor may be connected betweenthe output and the additional negative supply to pull the output down below the value that the output wouldotherwise achieve (see Figure 3).

Figure 3. VOUT Range to Ground

The OPA2333 has an output stage that allows the output voltage to be pulled to its negative supply rail, orslightly below, using the technique previously described. This technique only works with some types of outputstages. The OPA2333 has been characterized to perform with this technique; however, the recommendedresistor value is approximately 20 k. Note that this configuration will increase the current consumption byseveral hundreds of microamps. Accuracy is excellent down to 0 V and as low as 2 mV. Limiting and nonlinearity occurs below 2 mV, but excellent accuracy returns as the output is again

driven above 2 mV. Lowering the resistance of the pulldown resistor allows the op amp to swing even furtherbelow the negative rail. Resistances as low as 10 k can be used to achieve excellent accuracy down to10 mV.

General Layout Guidelines

Attention to good layout practices is always recommended. Keep traces short and, when possible, use a printedcircuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible.Place a 0.1-F capacitor closely across the supply pins. These guidelines should be applied throughout theanalog circuit to improve performance and provide benefits, such as reducing the electromagnetic interference(EMI) susceptibility.

Operational amplifiers vary in their susceptibility to radio frequency interference (RFI). RFI can generally beidentified as a variation in offset voltage or dc signal levels with changes in the interfering RF signal. TheOPA2333 has been specifically designed to minimize susceptibility to RFI and demonstrates remarkably lowsensitivity compared to previous-generation devices. Strong RF fields may still cause varying offset levels.



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+ +

+

+

4.096V

0.1F

+5V

Zero Adj.

K- Type

Thermocouple

40.7V/ C

R2549

R9150k

R5

31.6k

R16.04k

R6200

+5V

0.1F

R22.94k

VO

R360.4

R46.04k

OPA2333

D1

REF3140

R1

VEX

VOUT

VREF

R1

OPA2333

RR

R R

+5V

O P A 2 3 3 3 - H T


Figure 4. Temperature Measurement

Figure 5 shows the basic configuration for a bridge amplifier.

Figure 5. Single Op-Amp Bridge Amplifier

A low-side current shunt monitor is shown in Figure 6. RN are operational resistors used to isolate the ADS1100from the noise of the digital I2C bus. Since the ADS1100 is a 16-bit converter, a precise reference is essential formaximum accuracy. If absolute accuracy is not required, and the 5-V power supply is sufficiently stable, theREF3130 may be omitted.


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OPA2333

ADS1100

Load

V

I2C

R14.99k

R34.99k

R448.7k

R249.9k

+5V3V

REF3130

R71.18k

RSHUNT1

R671.5k RN

56

RN56

(PGA Gain = 4)

FS = 3.0V

NOTE: 1% resistors provide adequate commonmode rejection at small ground- loop errors.

Stray Ground- Loop Resistance

ILOAD

OPA2333

Output

RSHUNT

Load

V+

V+

RG

RL

R1(2)

10k

RBIAS

+5V

zener(1)

Two zener

biasing methodsare shown.(3)

MOSFET rated to

stand- off supply voltagesuch as BSS84 forup to 50V.

(1) zener rated for op amp supply capability (that is, 5.1V for OPA2333).(2) Current- limiting resistor.(3) Choose zener biasing resistor or dual NMOSFETS (FDG6301N, NTJD4001N, or Si1034)

NOTES:

O P A 2 3 3 3 - H T


Figure 6. Low-Side Current Monitor

Figure 7. High-Side Current Monitor


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OPA2333

3VNTC

Thermistor

1 M 60 k

100 k

1 M

V1In

V2+In

R1

R22

3

5

6

1

R2

OPA2333

OPA2333

INA152

VO

VO = (1 + 2R2/R1) (V2 V1)

O P A 2 3 3 3 - H T


Figure 8. Thermistor Measurement Figure 9. Precision Instrumentation Amplifier



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PACKAGING INFORMATION

Orderable Device Status (1) PackageType

PackageDrawing

Pins PackageQty

Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

OPA2333SHKJ ACTIVE CFP HKJ 8 1 TBD Call TI N / A for Pkg Type

OPA2333SJD PREVIEW CDIP SB JD 8 45 TBD Call TI Call TI

OPA2333SKGD1 ACTIVE XCEPT KGD 0 500 TBD Call TI Call TI

(1)The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Nov-2009

Addendum-Page 1
http://www.ti.com/productcontenthttp://www.ti.com/productcontent

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I M P O R T A N T N O T I C E

T e x a s I n s t r u m e n t s I n c o r p o r a t e d a n d i t s s u b s i d i a r i e s ( T I ) r e s e r v e t h e r i g h t t o m a k e c o r r e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m p r o v e m e n t s , a n d o t h e r c h a n g e s t o i t s p r o d u c t s a n d s e r v i c e s a t a n y t i m e a n d t o d i s c o n t i n u e a n y p r o d u c t o r s e r v i c e w i t h o u t n o t i c e . C u s t o m e r s s h o u l do b t a i n t h e l a t e s t r e l e v a n t i n f o r m a t i o n b e f o r e p l a c i n g o r d e r s a n d s h o u l d v e r i f y t h a t s u c h i n f o r m a t i o n i s c u r r e n t a n d c o m p l e t e . A l l p r o d u c t s a r e s o l d s u b j e c t t o T I s t e r m s a n d c o n d i t i o n s o f s a l e s u p p l i e d a t t h e t i m e o f o r d e r a c k n o w l e d g m e n t .

T I w a r r a n t s p e r f o r m a n c e o f i t s h a r d w a r e p r o d u c t s t o t h e s p e c i f i c a t i o n s a p p l i c a b l e a t t h e t i m e o f s a l e i n a c c o r d a n c e w i t h T I s s t a n d a r d

w a r r a n t y . T e s t i n g a n d o t h e r q u a l i t y c o n t r o l t e c h n i q u e s a r e u s e d t o t h e e x t e n t T I d e e m s n e c e s s a r y t o s u p p o r t t h i s w a r r a n t y . E x c e p t w h e r e m a n d a t e d b y g o v e r n m e n t r e q u i r e m e n t s , t e s t i n g o f a l l p a r a m e t e r s o f e a c h p r o d u c t i s n o t n e c e s s a r i l y p e r f o r m e d .

T I a s s u m e s n o l i a b i l i t y f o r a p p l i c a t i o n s a s s i s t a n c e o r c u s t o m e r p r o d u c t d e s i g n . C u s t o m e r s a r e r e s p o n s i b l e f o r t h e i r p r o d u c t s a n d a p p l i c a t i o n s u s i n g T I c o m p o n e n t s . T o m i n i m i z e t h e r i s k s a s s o c i a t e d w i t h c u s t o m e r p r o d u c t s a n d a p p l i c a t i o n s , c u s t o m e r s s h o u l d p r o v i d e a d e q u a t e d e s i g n a n d o p e r a t i n g s a f e g u a r d s .

T I d o e s n o t w a r r a n t o r r e p r e s e n t t h a t a n y l i c e n s e , e i t h e r e x p r e s s o r i m p l i e d , i s g r a n t e d u n d e r a n y T I p a t e n t r i g h t , c o p y r i g h t , m a s k w o r k r i g h t , o r o t h e r T I i n t e l l e c t u a l p r o p e r t y r i g h t r e l a t i n g t o a n y c o m b i n a t i o n , m a c h i n e , o r p r o c e s s i n w h i c h T I p r o d u c t s o r s e r v i c e s a r e u s e d . I n f o r m a t i o np u b l i s h e d b y T I r e g a r d i n g t h i r d - p a r t y p r o d u c t s o r s e r v i c e s d o e s n o t c o n s t i t u t e a l i c e n s e f r o m T I t o u s e s u c h p r o d u c t s o r s e r v i c e s o r a w a r r a n t y o r e n d o r s e m e n t t h e r e o f . U s e o f s u c h i n f o r m a t i o n m a y r e q u i r e a l i c e n s e f r o m a t h i r d p a r t y u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f t h e t h i r d p a r t y , o r a l i c e n s e f r o m T I u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f T I .

R e p r o d u c t i o n o f T I i n f o r m a t i o n i n T I d a t a b o o k s o r d a t a s h e e t s i s p e r m i s s i b l e o n l y i f r e p r o d u c t i o n i s w i t h o u t a l t e r a t i o n a n d i s a c c o m p a n i e d b y a l l a s s o c i a t e d w a r r a n t i e s , c o n d i t i o n s , l i m i t a t i o n s , a n d n o t i c e s . R e p r o d u c t i o n o f t h i s i n f o r m a t i o n w i t h a l t e r a t i o n i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r s u c h a l t e r e d d o c u m e n t a t i o n . I n f o r m a t i o n o f t h i r d p a r t i e s m a y b e s u b j e c t t o a d d i t i o n a l r e s t r i c t i o n s .

R e s a l e o f T I p r o d u c t s o r s e r v i c e s w i t h s t a t e m e n t s d i f f e r e n t f r o m o r b e y o n d t h e p a r a m e t e r s s t a t e d b y T I f o r t h a t p r o d u c t o r s e r v i c e v o i d s a l l

e x p r e s s a n d a n y i m p l i e d w a r r a n t i e s f o r t h e a s s o c i a t e d T I p r o d u c t o r s e r v i c e a n d i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r a n y s u c h s t a t e m e n t s .

T I p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e i n s a f e t y - c r i t i c a l a p p l i c a t i o n s ( s u c h a s l i f e s u p p o r t ) w h e r e a f a i l u r e o f t h e T I p r o d u c t w o u l d r e a s o n a b l y b e e x p e c t e d t o c a u s e s e v e r e p e r s o n a l i n j u r y o r d e a t h , u n l e s s o f f i c e r s o f t h e p a r t i e s h a v e e x e c u t e d a n a g r e e m e n t s p e c i f i c a l l y g o v e r n i n g s u c h u s e . B u y e r s r e p r e s e n t t h a t t h e y h a v e a l l n e c e s s a r y e x p e r t i s e i n t h e s a f e t y a n d r e g u l a t o r y r a m i f i c a t i o n s o f t h e i r a p p l i c a t i o n s , a n d a c k n o w l e d g e a n d a g r e e t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r a l l l e g a l , r e g u l a t o r y a n d s a f e t y - r e l a t e d r e q u i r e m e n t s c o n c e r n i n g t h e i r p r o d u c t s a n d a n y u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s , n o t w i t h s t a n d i n g a n y a p p l i c a t i o n s - r e l a t e d i n f o r m a t i o n o r s u p p o r t t h a t m a y b e p r o v i d e d b y T I . F u r t h e r , B u y e r s m u s t f u l l y i n d e m n i f y T I a n d i t s r e p r e s e n t a t i v e s a g a i n s t a n y d a m a g e s a r i s i n g o u t o f t h e u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s .

T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n m i l i t a r y / a e r o s p a c e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e T I p r o d u c t s a r e s p e c i f i c a l l y d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e o r " e n h a n c e d p l a s t i c . " O n l y p r o d u c t s d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e m e e t m i l i t a r y s p e c i f i c a t i o n s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t a n y s u c h u s e o f T I p r o d u c t s w h i c h T I h a s n o t d e s i g n a t e d a s m i l i t a r y - g r a d e i s s o l e l y a t t h e B u y e r ' s r i s k , a n d t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r c o m p l i a n c e w i t h a l l l e g a l a n d r e g u l a t o r y r e q u i r e m e n t s i n c o n n e c t i o n w i t h s u c h u s e .

T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n a u t o m o t i v e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e s p e c i f i c T I p r o d u c t s a r e d e s i g n a t e d b y T I a s c o m p l i a n t w i t h I S O / T S 1 6 9 4 9 r e q u i r e m e n t s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t , i f t h e y u s e a n y n o n - d e s i g n a t e d p r o d u c t s i n a u t o m o t i v e a p p l i c a t i o n s , T I w i l l n o t b e r e s p o n s i b l e f o r a n y f a i l u r e t o m e e t s u c h r e q u i r e m e n t s .

F o l l o w i n g a r e U R L s w h e r e y o u c a n o b t a i n i n f o r m a t i o n o n o t h e r T e x a s I n s t r u m e n t s p r o d u c t s a n d a p p l i c a t i o n s o l u t i o n s :

P r o d u c t s A p p l i c a t i o n s A m p l i f i e r s a m p l i f i e r . t i . c o m A u d i o w w w . t i . c o m / a u d i o D a t a C o n v e r t e r s d a t a c o n v e r t e r . t i . c o m A u t o m o t i v e w w w . t i . c o m / a u t o m o t i v e D L P P r o d u c t s w w w . d l p . c o m B r o a d b a n d w w w . t i . c o m / b r o a d b a n d D S P d s p . t i . c o m D i g i t a l C o n t r o l w w w . t i . c o m / d i g i t a l c o n t r o l C l o c k s a n d T i m e r s w w w . t i . c o m / c l o c k s M e d i c a l w w w . t i . c o m / m e d i c a l I n t e r f a c e i n t e r f a c e . t i . c o m M i l i t a r y w w w . t i . c o m / m i l i t a r y L o g i c l o g i c . t i . c o m O p t i c a l N e t w o r k i n g w w w . t i . c o m / o p t i c a l n e t w o r k P o w e r M g m t p o w e r . t i . c o m S e c u r i t y w w w . t i . c o m / s e c u r i t y M i c r o c o n t r o l l e r s m i c r o c o n t r o l l e r . t i . c o m T e l e p h o n y w w w . t i . c o m / t e l e p h o n y R F I D w w w . t i - r f i d . c o m V i d e o & I m a g i n g w w w . t i . c o m / v i d e o R F / I F a n d Z i g B e e S o l u t i o n s w w w . t i . c o m / l p r f W i r e l e s s w w w . t i . c o m / w i r e l e s s

M a i l i n g A d d r e s s : T e x a s I n s t r u m e n t s , P o s t O f f i c e B o x 6 5 5 3 0 3 , D a l l a s , T e x a s 7 5 2 6 5 C o p y r i g h t 2 0 0 9 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d
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