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Optimizing Device, Packaging, Test: The Art of Fast Tracking a Design to Production

Matt Apanius

MEMS Technology Symposium

May 11, 2016

SMART Microsystems 2016 © 1

Today’s Presentation


1. Market Trends

2. Microelectronics for MEMS Sensors

3. New Product Development

4. Innovative Strategies

5. Case Study

New Types of Sensors

The Definition of “Sensor Device” Evolves


• “Classical” MEMS structures

• Capacitive touch

• Biosensors-chemical

• Other

SMART Connected Products

Evolution of the economy


• Michael Porter, Harvard Business School • IT in products creates new value for the product • Devices-networks-clouds • The value of information will increase

What does this mean for us?

Evolution of the economy


• The product hardware is one tenth of the system • Microelectronic packaging is the foundational critical path


Microelectronics for MEMS Sensors

Microelectronic Packaging

The Very First Connection to the Information


• Microelectronic packaging creates the primary interface between the sensor device, the environment, and the information it collects • Components • Mechanical interfaces • Interconnects

Information

Environment

Device


How Do Suppliers Support Emerging Applications


• Existing high volume microelectronic manufacturing processes may (or may not) support emerging sensor technologies for new niche markets • 50% of market share is in consumer applications • Significant growth is taking place in niche segments • Who becomes the supplier?


Market Drivers for New MEMS Sensor Solutions


• Integration of MEMS die into existing custom package

• Lower cost, better performance

• Challenge – design team had limited experience working with silicon die

• Wire bonding for high temperature application

• Process already developed for custom assembly

• Challenge – package assembly process made wire bond surfaces “un-wire bondable”


Market Drivers Continued…


• Disposable sensors for measuring chemicals in gas and liquid • Chemical sensors require use of specialized materials (eg., chemical, biological)

• Challenge – specialized materials have their own manufacturing process outside

of the semiconductor supply chain

• Additional Challenge – these materials affect the semiconductor manufacturing process


Manufacturing Processes and Supply Chain


• Therefore, design elements need to be evaluated in a manner so that processes can be quickly understood

Design Process Information


New Product Development


As We Know It Traditionally


• Design iterations are used to converge on a ”frozen” design • Preventable flaws are discovered by processing first samples • This requires another design iteration

• Serial iterations are slow and expensive • Additionally, they do not encompass the resources to properly address

the process portion of the development

• Worst case is that manufacturing the product is not sustainable


Traditional NPD Process


Concept Review DesignReview 2

DesignReview ?

Prototype test samples

LifeTest

Marketing has an Idea

Process Development

ProcessTesting

LifeTest

Design changes required for manufacturabilityDesign changes required for product functionality

Final Process changes required

A New Product is Launched

Idea

Design and Prototype Iterations

Process Iterations

Test Iterations

??????


Innovative Strategies

Test Early, Test Often

Let’s Address the Flaws in Traditional Methods


• Targeted testing early in the development cycle shortens the overall process

• It uncovers weaknesses by testing fundamental design and process assumptions

• Issues are addressed before finalizing the process

• Use low cost modular samples, instead of assembled prototypes • Rapid prototyping can be used for targeted tests using SLA • Learning gained can be incorporated into the design before “freezing” it

Test Early, Test Often

Examples


• Wire bonding for high temperature application

• Process for maintaining wire bonding surfaces developed before “freezing” design

• 100% nugget after shear

• Compatible materials required for chemical sensors

• Test coupons used for dispense and cure tests

• Using samples to test chemistry interactions

Concurrent Engineering

Superimpose Process Development with Design


• Create synergy between design and process engineering groups

• Design to consider process and process to consider design

Design Process



Example


• Development of die position tolerances

• Tolerances stack – equipment, fixture, part, bond site

• Scalable tooling can be used for initial volumes and does not have to be redesigned when volumes increase

IncomingInspectLot SPC

MRB

Conveyor automation required here to support volumes and reduce labor content

100% Final Inspect

(automated electrical)

MRB


Streamline Process with Fewer Iterations


Concept DesignReview

Process Development

Rapid Prototype test samples

ProductDesign

LifeTest

Marketing has an Idea A New Product is Launched

Concurrent Engineering Model

"Test Early Test Often"

$$$$


Case Study

Case Study

Background/Approach


• Device is a MEMS pressure sensor • New application area – not a derivative product • First prototype samples to be built and tested • The components are a PCB with a MEMS sense element and

a housing • Primary operations are adhesive dispense and assembly

Case Study

Dispense Tests Were Conducted to Understand Adhesive


• Lines dispensed on coupons • Develop and test cure profile • Peel test for adhesion quality • Use SLA parts for cure testing assemblies

Case Study

Fit and Form was Tested using Automatic Equipment


• Working height was tested for tooling design • Part topography – check access and area of dispense

locations • Dispense tests were used to select needle • SLA parts used to develop the programs for two operations

Case Study

Tooling was Designed and Tested in Manufacturing Equipment


• Scalable tooling was designed and tested using SLA parts • Operation 1 – Attach PCB sense element to body • Operation 2 – Attach backside lid

Case Study

A Leak Issue Observed with a Simple Test


• Leak testing showed incomplete cure of adhesive • Developed test with thermocouple to check cure profile • The issue was resolved by changing the cure profile • SLA parts were used

Case Study

Injection Molded Housings Arrive for Final Tests


• Initial adhesion tests showed possible issue from mold release

• An incoming cleaning process was developed and tested • A storage protocol was implemented

• Every other aspect of the process was in place before the

injected molded parts arrived

Case Study

Outcomes


• First prototype samples were built using volume manufacturing processes

• These samples were designed, built, and put on test in less than 90 days

• Zero failures after 1000 thermal cycles!

Conclusions


• The next generation of products will use sensors and integrated IT – SMART Connected Products

• Microelectronic interfaces will be a part of all of these products

• As the applications become widely varied, better methods for new product development will be needed

• Use a test early, test often approach integrated with concurrent engineering to get your new products to market faster and with less cost!


Thank You!

Matt Apanius Managing Director

SMART Microsystems Ltd. www.smartmicrosystems.com

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