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Optimizing SiP Test Cost with a Platform Approach

SiP Conferences China 2017

Pearl He

Greater China Semi BDM – National Instruments

The World of Converged Devices

More capability defined in software

Functions change rapidly

Increasingly complex to design and test

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NI equips engineers and scientists with systems that

accelerate productivity, innovation, and discovery.

Mission Statement

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IN 2016

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CUSTOMERS WORLDWIDE

Long-Term Track Record of Growth

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Committed to Your Success Worldwide

NI Sales Offices (Sales Engineers)

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National Instruments as a Test System Supplier

Semiconductor Production

Wireless Production

Automotive Electronics

Aerospace and Defense

Energy: Oil and Gas

Academic Research

Consumer Electronics

Mobile Devices

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d 150,000+ PXI Systems Shipped Since 1997

2,000+ Global Research and Development Engineers

1,000+ PXI Systems Deployed in Semiconductor Production

700+ Alliance Partners and System Integrators

300+ NI Semiconductor Test Systems Deployed

40+ Regional Application Engineering Support Offices

Unique Attributes of Smart Devices - Common Test Needs

More functionality

Ensure high reliability

Lowest cost

Fast time to market

CONVERGENCE LOWER PRICE RAPID CHANGE

Vendor Strategies for Test and Measurement

C L O S E D

• “Vendor knows best”

• Fixed-functionality

• Closed ecosystem

• Customer pays

P L A T F O R M

• “Customer knows best”

• Customizable solution

• Open, vibrant ecosystem

• Customer designs

A Smarter ApproachLabs

▪ Designed for automation

▪ Optimized for measurement quality

▪ Fast test cycles

Production Floor

▪ Designed for test cell

▪ Optimized for throughput

▪ Cost effective

Same Platform

▪ Maximize Leverage

▪ Code, setup, training

▪ Simpler correlation

▪ Faster test cycles

▪ Lower cost

Wireless Production Test

NI and the RF Semiconductor Industry

Production TestR&D (characterization)

time

Prototyping and Design

Semi Char.

Semi Prod.

Mobile Prod.

Prototyping

NI serves the complete RF semiconductor value chain

Markets for System-in-Package

RF and wireless devices

Integrated Passive Devices

Solid-state drives (SSDs)

Automotive applications

IoT for wearable and machine to machine (M2M) products

Power modules

Source: https://www.amkor.com/go/SiP

System-in-Package Implications on Test

Diverse markets and applications

Demand for plug-and-play

Demand for lower total cost

High volumes and rapid ramp

cycles

Economics of traditional test solutions disrupted!

Observed System-in-Package Test Challenges

• Algorithms not optimized for test throughput, often not multi-thread safe

• Parallel test becomes required due to test times, but difficult due to “black boxed” functionality

DUT control often “black-boxed”

• DUT control abstracted to higher-level protocols (TCP, USB, etc)

• Digital complexity reduced while Analog/RF complexity increased

Exposed functionality more abstracted than at component test

• Common requirement to integrate all test equipment into handler cabinet

Tester footprint must = zero

RF & Wireless, IOT

This is almost more like testing a phone than a chip!

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How can a platform approach help?

NI SERVICES AND SUPPORT

NI MODULAR HARDWARE

ONE-PLATFORM APPROACH

Support 700+ Field Engineers

700+ Support Engineers

50+ Worldwide Offices

Open Connectivity10,000+ Instrument and Device Drivers

1,000+ Sensor and Motor Drivers

Add-Ons400+ Software Add-Ons

5M+ Tools Network Downloads

Community300,000+ Online Members

450+ User Groups

9,000+ Code Examples

Partners1,000+ Alliance Partners

Industry-Leading Technology Partners

Academia8,000+ Classrooms Worldwide

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DEVELOPMENT SOFTWARE

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PXI System Overview

PXI Backplane

• Data Transfer

• Timing

• Synchronization

• Triggering

PXI Chassis

• Power

• Cooling

• System Monitoring

• Enclosure

PXI I/O Modules

• 600+ Products

• RF, DC, DIO…

Multicore

Embedded

Controller

Broad Modular Instrumentation Portfolio

Multifunction I/O

FPGA / Reconfigurable I/O

Digital I/O

Analog Input / Output

Vision and Motion

Counter / Timer / Clock

DAQ and Control

Oscilloscopes

High-Speed Digital I/O

DMM & SMU

Signal Generators

Switching

RF Analyzers & Generators

Instrumentation

GPIB, USB, LAN

RS232 / RS485

CAN, LIN, DeviceNet

SCSI, Ethernet

VXI - VME

Boundary Scan / JTAG

Interfaces

• FPGA-based servoing for

measurement acceleration

• Up to 1 GHz instantaneous bandwidth

for wide range of wireless technologies

• R&D-grade measurement performance

with up to -50 dB EVM for 802.11ax

Key Instruments for Semiconductor Test

NI Vector Signal Transceiver

(VST)

• Broad IV range: 200V(20W), 3A

• (10A pulse)

• Current resolution to 10fA

• Max sampling to 1.8MS/s

• SourceAdaptTM Technology for fast

settling in presence of capacitive loads

• Best in class channel density

NI Source Measure Units (SMUs)

• ATE-class digital (with PPMU) in PXI

• Out of the box Digital Pattern

Editor software

• Time sets, drive formats, opcodes,

HRAM, Source and capture,

history RAM, Shmoo

NI Digital Pattern Instrument

NI Semiconductor Test Software▪ Suite of software for test development, execution, and debug

▪ TestStand + TestStand Semiconductor Module

▪ Sequence Editor/Operator Interface

▪ Binning, Handler Integration, Pin/Channel Map, STDF, Multisite

▪ Built-in steps for common measurements (e.g. continuity, Vcc, etc)

▪ Open interface to integrate 3rd party instruments with multi-site support

▪ Digital Pattern Editor

▪ Code module development with NI LabVIEW/LabVIEW FPGA or C#/.NET

▪ STS Calibration and Diagnostics Software

Common Platform that Scales

NI STS T1NI PXI NI STS T4NI STS T2

PXI Chassis and Controller

PXI Instrumentation and Measurement Software

LabVIEW or C# (Code Module Development) and TestStand (Test Management)

STS Standardized Docking and Cabling Interface

Observed System-in-Package Test Challenges

▪ Traditional testers do not have parallel capacitance/inductance instruments at

low cost

▪ Traditional boxes missing factory integration features

• Production-ready Operator Interface

• Handler Control

• Binning

• Standard Datalogging (STDF)

• System calibration and diagnostics

Integrated Passive Devices

Case Study – SLT for Connectivity SiP

• The NI STS T1 is used for SiP(WiFi +BT) Test

• Quad site tester that communicates to a custom-designed handler

• STS Benefits:

• Vendor-supported ATE platform

• Test time: 17s vs 65s rack & stack solution

• Lower tester capital cost

• Zero footprint

BlueTooth

WiFi

DC Power Supplies

Bench Instruments Industrial PC

IPD Test Solution Overview

▪ PXIe Instrumentation

▪ 32x PXIe-4139 ±60 V, 3 A Precision System PXI Source Measure Units

▪ NI Software

▪ LabVIEW, TestStand, TestStandSemiconductor Module

▪ Handler Integration

▪ STDF Datalogging

▪ STS T2

▪ Manipulator Support

▪ Electrical interface

▪ Docking interface

Integrated Passive Device

STS T2

Semiconductor Test Partner Ecosystem

Test Development Services

Load Board Design Services

Manipulators/Docking Systems

Mechanical Customizations Enterprise Data Analytics

Summary

The diversity of SiP markets and applications require test solutions that can scale to meet targeted needs.

Traditional approaches for IC package and module test over-serve some requirements while not meeting others.

A platform approach to SiP test allows customers to use the elements they need while avoiding the elements (and costs) they don’t.

When these elements are available on the same platform or within the ecosystem they can be effectively leveraged to reduce overall cost of test.

P L A T F O R M

• “Customer knows best”

• Customizable solution

• Open, vibrant ecosystem

• Customer designs