P2020 Ardentec Probe Site Qualification

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12 April 2011

M82Y Qualification at Ardentec Probe

Goal• Objective is to qualify Ardentec Singapore as joint probe site for probing

all flavors of M82Y (0M82Y, 1M82Y).

• Local probe site will eliminate need to ship wafers to Austin and reduce overall product cycle time.

Considerations• Test platform and probe card is identical to that used in OHT.

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• Test platform and probe card is identical to that used in OHT.

• Test program and test limits used in Ardentec-Singapore is identical to that used in OHT.

M82Y Qualification PlanPre-correlation

Pre-Correlation items• Install and verified Prober setup files

• Install Probe Program and checked for loading errors.

• Validate Probe Card with local PCR and complete inspections on probe card locally.

Considerations• Test platform and probe card is identical to that used in OHT.

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• Test platform and probe card is identical to that used in OHT.

• Test program and test limits used in Ardentec-Singapore is identical to that used in OHT.

M82Y Qualification Plan

Correlation items• Perform Kappa analysis (Yield and Bin correlation) of 1 wafer.

Passing Criteria: Yield to Yield difference <3%; Bin to Bin swap < 6%.

• Confirm Probe marks on one wafer.

Passing Criteria: Verify marks are acceptable per global specification.

• Execute ILD experiment with 3 different overdrive settings, 2,4, and and 8 touchdowns on one wafer and de-process top layer for visual inspection of

underlying layers.

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Passing Criteria: No Electrical bin changes, and no under-pad damage.

P2020 ARDT Qualification Results Summary:

Test Status Results Date Completed

ILD: FSL Baseline Complete Pass 25-Mar-2011

Kappa Correlation Complete Pass 30-Mar-2011

ILD: ARDT Qual Complete Pass 7-Apr-2011

ARDT Audit Complete Pass 11-Apr-2011

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Probe ILD Plan:Wafer: Global Foundaries:WB01M82Y; QA0291; wafer 25

Probe Card:

MJC x1 Ultra LowK Card Design

BCF 0.5, tip dia. 0.6 mil

Platform:

Teradyne UFLEX with InTest/VSM

OPUSII

Inputs:

• Probe Overdrive:

CELL

Probe

Events

40um OD

from first

2X

4X

8X

60um OD

from first

2X

4X

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• Probe Overdrive:• 40• 60 (nominal)• 80

• Probe Events*:• 2 (typical)• 4• 8

* Note: A x1 card using double-touch probe process will make 2 touchdowns within a single probe event.

8X

80um OD

from first

2X

4X

8X

P2020 (M82Y) ASGP Probe ILD Summary:

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Conclusion: The ASGP M82Y probe process passes electrical stability and mechanical requirements for the 60um & 80um process cells.

FSL to ARDT Kappa:

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Conclusion / Recommendations

Conclusion• M82Y (0M82Y, 1M82Y) passes all correlation/qualification requirements

without any issues at Ardentec Singapore.

• Probe mark inspections pass all requirements without any issues.

• For ILD study: � no cells failed due to probe card related issues for any of the overdrive and

touch downs DOE conditions.

� No abnormalities noted on inspected pads post probe,

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� No abnormalities noted on inspected pads post probe,

� No abnormalities noted on underlying layers of de-processed wafer.

Recommendations• Probe of 0M82Y and 1M82Y can be released in Ardentec-Singapore.

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Data and Back-up Information

Probe Marks & ILD Inspection: 60um OD

Ardentec

4X

Events Probe Marks Under-Probe (ILD)

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8X

Results: Probe marks are well centered on the probe pads.Inspection of the de-processed wafer revealed no under-probe damage.Note that some etching and discoloration from the de-processing chemistry is observed.

Probe Marks & ILD Inspection: 80um OD

Ardentec

4X

Events Probe Marks Under-Probe (ILD)

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8X

Results: Probe marks are well centered on the probe pads.Inspection of the de-processed wafer revealed no under-probe damage.Note that some etching and discoloration from the de-processing chemistry is observed.