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Packaging Tech Assembleon (K... · PDF filePackaging Tech Seminar . Confidential 2 ......

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  • Alex Nies

    Head of Product Management

    Advanced Packaging Business Line

    June 2015

    Packaging Tech Seminar

  • 2 Confidential

    Agenda

    In this presentation I will show:

    K&S company overview

    What solutions we offer for the Semiconductor Assembly Equipment

    market

    European Innovations and competitive manufacturing

    Technological Highlight

    What makes us different, What are we especially good in

    How does this help to stay in Europe

    K&S Hybrid machine

    Single machine solution for combined Flip Chip and SMD assembly

    Q&A

  • 3 Confidential

    About Kulicke & Soffa (K&S)

    Founded in the US in 1951 and incorporated in 1956

    Publicly traded since 1971 in NASDAQ: KLIC

    Strong presence in Asia with over 80% sales in Asia

    HQ in Singapore since 2010

    Acquisition of Assembleon January 9, 2015,

    Assemblon becomes a business line of K&S

    Over 2500 employees

    Global Technology & Market Leader

    in Semiconductor Assembly Equipment

  • 4 Confidential

    Semiconductor Assembly Equipment

    Advanced SMT Advanced Packaging Wire Bonding

    Hig

    h-E

    nd

    SM

    T

    Mo

    du

    les

    Em

    be

    dded D

    ie

    FO

    WL

    P

    SiP

    Po

    P

    WLP

    Flip

    Ch

    ip

    Th

    erm

    o-

    Com

    pre

    ssio

    n

    Wafe

    r L

    eve

    l

    Bo

    nd

    ing

    Wedge

    Bo

    nd

    ing

    Ba

    ll B

    on

    din

    g

    Beyond Semi Semiconductor Hybrid

  • 5 Confidential

    Israel, Yoknaem

    Bonding Tools, Manual Wire

    Bonding R&D and Manufacturing

    Singapore (Corporate HQ)

    Ball Bonder, Wedge Bonder,

    Wafer-Level Bonder,

    Advanced Packaging, Advanced SMT,

    R&D and Manufacturing

    USA, Santa Ana (CA)

    Wedge Bonder R&D

    USA, Fort Washington (PA)

    Equipment R&D

    Advanced Packaging R&D

    Switzerland, Berg

    Advanced Packaging and

    Software R&D

    K&S Manufacturing Plant

    K&S R&D Center

    Global Presence

    K&S Sales/Service Office

    China, Suzhou

    Bonding Tools Manufacturing

    Blades R&D, Manufacturing

    Software R&D, Advanced

    Packaging, Advanced SMT

    Veldhoven, Netherlands

    Advanced Packaging,

    Advanced SMT, R&D and

    Manufacturing

  • 6 Confidential

    Two Advanced Packaging BLs

    Thermo-compression

    K&S APAMA

    Bonded Die

    WLP/FOWLP

    Flip Chip

    Embedded Die

    Module

    Package-on-Package

    System-in-Package

    Bonded Die

    Or Chip

    AP (Local Reflow) BL

    AP (Mass Reflow) BL

    Reflow

    K&S

  • 7 Confidential

    Advanced Packaging Landscape

    C4

    TCB

    C2

  • 8 Confidential

    K&S Hybrid Machine

    Most advanced tool for applications combining FCs & SMDs

    Ideal solution for:

    SIP, Modules, MEMS, WLP, FOWLP, POP, etc.

    Best cost per unit ratio (total unit, FC & passives combined)

    Different transport systems for regular PCBs, wafers or panels up to

    800 x 457, Vacuum Transport, Carrier transport, lead frames

    Largest component range from 0.2x0.2mm 45x45mm

    Scalability within one machine

    UPH: up to max 15K for FC or > 120 K for SMDs or any combination

    Accuracy: Between 25m & 7m creating optimum combination of accuracy & UPH

    http://www.google.nl/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRxqFQoTCMzd3eWZksYCFUR8cgodn-UAOQ&url=http://www.assembleon.com/productgroup/pg_3/Hybrid&ei=Ugh_VczsCMT4yQOfy4PIAw&bvm=bv.95515949,d.bGQ&psig=AFQjCNFKfC4rT07flvtvK2625h3gQedrJg&ust=1434474935853689

  • 9 Confidential

    How does this help to stay in Europe

    Competitive Manufacturing:

    Cost of manufacturing is mainly defined by:

    Cost of equipment, which is about the same anywhere in the world

    Operational cost

    Majority of the cost is related to labor and energy

    Efficiency of manufacturing (output vs cost)

    To improve the cost per unit:

    Minimize the cost

    Minimize the energy consumption

    Minimize the need for operators

    Maximize the throughput of a production line

    Maximize manufacturing line efficiency

  • 10 Confidential

    Minimize the energy consumption

    The greenest pick and place solution

    0

    50000 100000

    150000 200000

    250000

    300000 350000

    400000

    Machine type

    En

    erg

    y c

    on

    su

    mp

    tio

    n *

    [kW

    h]

    Annual energy needed for rework [kWh]

    Annual energy needed for airco [kWh]

    Annual compressed air energy consumption [kWh]

    Annual energy consumption (machine) [kWh]

    K&S Hybrid Comp. A Comp. B Comp. C Comp. D Comp. E

    *: Based on 100K CPH in a year

  • 11 Confidential

    Maximize manufacturing line efficiency SIP Assembly Process Flow (Flip Chip) traditional (15 steps)

    Stencil Paste Place SMD

    Flip Chip attach Clean

    reflow

    Cure

    Plasma Clean Mold Cure Laser Mark

    Singulation

    Tray Load

    reflow

    Tray Load

    for Test

    Tray UnLoad

    SMT department

    BE department

    http://www.exsense.cn/ProductShow_24.htm

  • 12 Confidential

    Maximize manufacturing line efficiency SIP Assembly Process Flow (Flip Chip) - NEW (12 steps)

    Stencil Paste Place SMD Flip Chip attach Reflow Clean

    Cure Plasma Clean Mold Cure Laser Mark

    Singulation

    Tray Load

    for Test

    Both activities in one department

  • 13 Confidential

    Maximize manufacturing line efficiency Wafer Level Packaging

    Placement of Flip Chips fed from wafer feeding and passives like 0201, 01005

    or 008004 (0201metric) fed from tape feeders and onto a 12 wafer frame

    Example Project:

    > 900 circuits/wafer, each with 1 FC & 28 passives: Total > 26 K placements / wafer

    Combining Flip Chips and Passives onto 300 mm wafers

    http://www.google.nl/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRxqFQoTCMzd3eWZksYCFUR8cgodn-UAOQ&url=http://www.assembleon.com/productgroup/pg_3/Hybrid&ei=Ugh_VczsCMT4yQOfy4PIAw&bvm=bv.95515949,d.bGQ&psig=AFQjCNFKfC4rT07flvtvK2625h3gQedrJg&ust=1434474935853689

  • 14 Confidential

    Traditional manufacturing

    2 individual process steps

    FCs bonded by Semicon machines

    High accuracy (< 10 )

    UPH: max 5 K UPH

    Feeding from wafer

    Capable of bonding thin dies

    High cost per unit

    Passives placed by SMD machines

    Accuracy around 25 50

    UPH: > 100 K UPH possible

    Feeding from tape and reel

    Low cost per placement

    K&S Hybrid machine

    Single machine solution

    One modular system combining FC

    bonding and passive placement

    Accuracy up to 7 for FC placement

    UPH up to 15 K for FCs or 120 K for

    passives or any combination

    Feeding from wafer, waffle pack,

    JEDEC tray, tape and reel, etc

    Full controlled placement force for

    low profile passives

    K&S Hybrid, best of both worlds :

    High end, fast FC bonding

    Low cost passive placement

    Decreasing the cost of manufacturing

    http://www.google.nl/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRxqFQoTCLSrxNqokcYCFQXtFAodsvsAeg&url=http://www.assemblyonline.com/index.php/grid-lok-tooling/placement-machines/asm-siplace.html&ei=vZF-VfTYG4XaU7L3g9AH&bvm=bv.95515949,d.d24&psig=AFQjCNHtpRm9djulstnp2hqdEvLqzO5IlA&ust=1434444604577033http://www.google.nl/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRxqFQoTCKrKmIepkcYCFYhtFAode5sA7w&url=http://www.besi.com/products-technology/product-details/product/datacon-2200-evo/show/&ei=G5J-VerQBojbUfu2gvgO&bvm=bv.95515949,d.d24&psig=AFQjCNHbGHczsKHToe2McwOAdG7zqlRyoQ&ust=1434444681667866

  • 15 Confidential

    Decreasing the cost of manufacturing

    K&S Hybrid, single machine solution for SMT + Flip Chip assembly:

    Less material handling

    Less operators

    Less (cleanroom) floor space

    Less training

    Less maintenance

    Less Vendors

    Less process steps

    Lower capital investment

    Lower running cost

    Higher Efficiency

    Higher intrinsic quality

    Single pass reflow / curing

    K&S Hybrid, best of both worlds :

    High end, fast FC bonding

    Low cost passive placement

  • 16 Confidential

  • 17 Confidential

  • 18 Confidential

    This PowerPoint presentation

    and all of its contents are protected under

    International and United States Copyright laws.

    Any reproduction or use of all or any part

    of this presentation without the express

    written consent of K&S is prohibited.

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