Packaging Trends for Smartcard & eID Documents -...

Packaging Trends for Smartcard & eID Documents (From Product to System)

Peter Stampka ICMA Munich, October 7-8, 2015

Table of Content

Introduction

Status Quo of Packaging

Megatrends in Smartcard and eID Documents

Trends Semiconductor

Paradigm shift from device to system solution

Examples for successful system approach

Outlook / Recommendation

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3

4

5

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7

2 October 2015 Copyright © Infineon Technologies AG 2015. All rights reserved.

Table of Content

Introduction







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Forging a bridge

from Package

to System Solution


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Introduction







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High Power › Easy › 34mm › 62mm › Econo › Econo-

PACK™+ › Prime-

PACK™ › IHM › IHV › Hybrid

PACK™ Intelligent Power Modules › IRAM › CIPOS™ › µIPM™

Package Technology Portfolio

Through Hole

› TO, DIP SMD › TO › DSO › SSOP Leadless › ThinPAK › TDSON › TSDSON › DirectFETTM

› TISON › WISON › IQFN › HSOF › Blade

Power Modules

SMD leaded › SOT › SOD › TSOP › TSSOP Flat lead › TSFP › SC

Leadless › TSLP › TSSLP › TSNP Wafer level › WLP › WLL

Discretes Power

Sensors

Through Hole

› PSSO SMD Leaded › DSOSP Open cavity › DSOF

› Mold on LF

› Mold on flex

› UV Globetop

› Thermal Globe top

› Print on flex

› Flip Chip on Substrate

› Coil on Module

› Soldered IC on flex

› Bumped/thin Wafer

› Direct FlipChip

Chip Card & eID

Leadframe based

Packages Through Hole

› DIP 2)

SMD › PLCC 2)

› TSSOP › TQFP › LQFP › MQFP Leadless › VQFN › WQFN › PQFN › O-LQFN 1)

› XSON › USON

Power IC Wafer Level Packages, Bare Die

Surface Mount Technology (SMD) Wafer Level w/o redistribution

› WLP (fan-in)

w/redistribution

› WLB (fan-in)

› eWLB (fan-out)

Bare Die › Wirebond › Flip chip

Laminate based

Packages

SMD › OCCN 1,2)

› BGA › LBGA › xFBGA,

xFSGA


Antenna Technologies & Interconnect Portfolio

Al etched antenna

Cu Wire antenna

Al Laser (4E Technology)

different technologies

Print & Plate antenna

Ag printed

Cu etched antenna

Punched antenna

laser, conductive glue, inductive

Thermocompres- sion, inductive coupling

Direct flip chip w/ bump, conductive glue

direct flip chip w/ bump

conductive glue, inductive coupling

laser, conductive glue, inductive coupling

Package

or

direct flip chip

PET, adhesive: PC PVC

PET,PVC,PC

PET,PVC,PC

PVC,PC,PET

PET, adhesive: PC, PVC

PC,Paper, Teslin

Source: Avery Dennison


Table of Content

Introduction







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2

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Megatrends in Smartcard & eDocument

Contactless world

Package will play an active role in Security

Package system solution for mobile payment

Moore's law getting out of steam

Intelligent packaging solution

Reliability towards to '0 field reject'


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Introduction







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Semiconductor Know how for Packaging will be Key in Future

› Challenge for chip separation

› Lower mechanical stability

› Smaller ICs, reduced chip pad size

› New equipment for 300mm wafer

› Redistribution layer for easy packaging

› Less customization beside chip design regarding packaging requirements

› Complexity reduction, 'standardized' packages

65nm/40nm technology

Silicon Foundry

Flash

Low k Si material

› Challenge for direct Flip-Chip solution

› Optimized assembly process necessary Minimized kerf design


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Introduction







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Why do we need a System Approach?

Table of Content

Introduction







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Future needs system solution (examples)

› All in one package solution (multi-device)

› Plug & Play

Active NFC/

nanoSIM

› IC, Package, antenna and inlam (laminated inlays) construction developed and adjusted for easy integration at customer

Coil on Module /

Inlam

› Package taking over security function

Security Packaging

System in Package - Examples I


System in Package - Examples II

› Multi-IC package w/ redistributions layer

› Area optimized

› Easy to integrate at customer

Wafer level

Packaging

› System in Package approach offers secure access to internet for e.g. banking application (1time password)

› ‘All in one solution’

Display on Card

› Basis for intelligent packaging/SiP to establish test methods that reflects reality

› Example SeManTiK to forecast mech. rejects

Field reflecting

test methods

Future needs system solution

Liabili

ty in

the

Field

mech. Nutzugs –

base load (“USE”)

1 2 3 4 5

1

3

9

12

15

18

constant failure rate / year

in %

Liability of technology = Factor of technology (T)

=(𝝀1)

2

(100% * 3,05%) * T

SeManTik


Table of Content

Introduction







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Outlook

› New Chip technologies have major impact on current package technologies and have

to be strongly taken into consideration

› Direct FlipChip technology for 5,10y lifetime applications and thinner ICs could

become dominant in C‘less ChipCard and ID applications, if technology proofs simple,

cost effective and reliable (test method for temperature humidity bias (THB) of

contactless card)

› Future applications request new packaging system approach (e.g. multidevice

application)

› Preassembly will be key for mechanical behaviour of product and cost optimization in

the future

› Need for higher security will increase in future even on packaging/system solutions

› Test methods reflecting reality is key for next level of packaging/System in Package


Animationsfolien

Product to System Creating & Providing better solutions

Pre- assembly

Assembly

IC

Security

System know how

Quality/ Reliability (i.e. ISO 24789)

Enabling the better

Solution

System Integration

Application Design-In Support

Technology

Manu- facturing

Product to System Approach Need to combine

IC + Technology + Manufacturing + System Know how + Design Know to create & provide better solutions


Contactless market will double until 2019

0,0

100,0

200,0

300,0

400,0

500,0

600,0

700,0

2011 2012 2013 2014 2015 2016 2017 2018 2019

IHS Total - Contactless Only IHS Total - Dual Interface IHS Total - Contacted Only

Source: Govermental & Healthcare eID Worldmarket, IHS 2014

T/O in US$


Systemsolution nanoSIM/active NFC


Determination of field data (failure-rates)

SeManTiK – a funding project for a new approach to simulate the field by new test method

Determination of failure modes deduced from field data

Determination of lifetime-modell deduced from field data

Determination of field-liability- modell


Example MobCom Shrinkable Part of IC will become minor

Analog

NVM

Map RAM

ROM

SC HV NVM

CPU & SC

C120FL – M7601

– 7.60 mm²

C11FL – M7701

– 7.89 mm²

L90FL – M7690

– 4.61 mm²

NVM

HV NVM SC NVM

Map RAM

ROM

RAM Analog

CPU & SC

SC

RO

M

An

alo

g

CPU & SC

NVM

HV NVM Map RAM SC

C65FL – M9465

– 2.00 mm²

CPU RAM Analog

NVM

HV

-NV

M

SLE 76CF3601P

weighted area

weighted area

weighted area

weighted area

SLE 76CF5120P SLE 76CF4002P SLE 94CF4004P

RAM CPU

C40:1.x mm²w.a.


Intelligent Package Solution (Requirements) ‘Simple, best CoO, Reliable‘

› Highest Quality (0-field reject approach for all application)

› Cost optimized and option for further cost down

› Complexity reduction at customer

› Easy to integrate

› Solving problems at customer by fully understanding of application (system approach)

› Time to market ('innovation & development speed')

› First time right

› No over-engineering


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