Partial high current solutions WIRELAID · Seite 13 05.11.2013 Wires welded under the internal...

Partial high current solutions WIRELAID

The technology and technical application

Agenda

05.11.2013 www.we-online.de Seite 2

Introduction

WIRELAID versus

Standard

Design Guide

Example of use

Markets and target groups

Advantages of WIRELAID

Introduction

Power (3-200A) Signal (SMD, fine line)

Benefit


Requirements of the market:

Introduction

The priciple

Use of embedded copper wires to realise high current tracks

Combination of power and signal processing electronics

Competitive alternative to PCBs with thick copper technology or

parallel arrangement of additional layers

The technics

The copper wires are fixed onto the under side (treatment) of the copper foil using resistance welding

After lamination the process, wires are embedded by prepregs into a multilayer PCB

WIRELAID copper foil forms external layer and is structured with standard PCB processes

Therefore external layer are SMD-capable


Production process


1 • Welding first point

2 • Wire is cut to length

3 • Second welding point

4 • Turning the „WIRELAID foil“

5 • Lamination process

6 • Embedding wires

7 • Wirelaid Multilayer

Production process


1 • Anschweißen des ersten Punktes

2 • Ziehen und Ablängen des Drahtes

3 • Schweißung des zweiten Punktes

4 • Wenden der bestückten Folie

5 • Verpressen der Folie

6 • Einbetten der Drähte

7 • Fertiger Multilayer

Types of wires


Flat wire

_____________

F08 0,8 x 0,25mm²

Cross-sectional-area : 0,2mm²

F14 1,4 x 0,35mm² Cross-sectional-area : 0,5mm²

3 dimensional way of installation

Wirelaid 3D


Depth-milled slot

Suited for complicated installation space

Partial thick copper with “hinge” character

Bending radius <1mm

WIRELAID vs. Standard


Introduction

WIRELAID versus

Standard

Design Guide

Example of use



WIRELAID vs. Standard

WIRELAID Cross-sectional

area

track width Wirelaid

(35µm base Cu)

Track width standard

(35µm base Cu)

Reduction

F14 0,5mm² 1,9mm 8,9mm 78,7%


0,63mm² Requirements: 20A at 20K allowed temperature rise

WIRELAID use:

Reduction of

78,7%

8,9mm

1,9mm

4,5mm

Poll

1. Guess how many amps two wires (F14) can carry with maximum temperature rise

of 20K?

1. 12A

2. 23A

3. 38A


Design Guide


Introduction

WIRELAID versus

Standard

Design Guide

Example of use



Ampacity


Wires welded under the internal layer rise of temperature (ΔT in °C)

Strom [A] 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 60 62 64 66 68 70 72 74 76 78 80 82 84

Draht Leiterbreite [mm]

1x300 0.9 8 13 19 28 40 53 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2x300 1.8 3 6 8 12 16 21 25 31 38 45 52 62 . . . . . . . . . . . . . . . . . . . . . . . . . .

1x800 1.4 3 6 9 13 18 22 28 35 42 50 59 . . . . . . . . . . . . . . . . . . . . . . . . . . .

2x800 3.1 2 2 4 5 7 9 11 13 16 19 23 27 32 36 41 46 52 58 64 . . . . . . . . . . . . . . . . . . .

3x800 4.8 1 1 2 3 4 6 7 9 10 12 14 17 19 21 24 27 30 34 38 41 46 50 55 59 64 . . . . . . . . . . . . .

4x800 6.5 0 1 2 2 3 4 5 6 7 9 10 12 13 15 18 20 22 25 28 31 34 37 40 43 47 51 55 58 61 . . . . . . . . .

1x1400 2.0 2 2 3 5 5 7 9 11 13 16 19 22 26 30 34 38 43 48 53 59 65 . . . . . . . . . . . . . . . . .

2x1400 4.3 0 1 1 2 3 4 5 6 8 9 11 12 14 16 18 20 22 25 28 30 33 37 40 43 47 51 54 59 63 . . . . . . . . .

3x1400 6.6 0 0 1 1 2 2 2 3 3 4 5 6 8 10 12 13 15 16 18 20 22 24 25 27 29 31 34 36 38 41 44 47 50 54 58 62 66 .

4x1400 8.9 0 0 0 1 1 1 2 2 3 4 4 5 6 7 9 10 11 12 14 15 17 19 21 22 24 26 27 29 31 34 36 36 37 42 47 49 51 54

Strom [A] 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 60 62 64 66 68 70 72 74 76 78 80 82 84

Draht Leiterbreite [mm]

1x300 0.9 12 21 31 46 63 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2x300 1.8 5 9 13 17 24 30 39 47 58 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1x800 1.4 6 9 14 19 25 32 41 50 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2x800 3.1 2 4 6 8 11 14 17 20 24 28 34 40 46 52 59 67 . . . . . . . . . . . . . . . . . . . . . .

3x800 4.8 1 2 3 4 6 8 10 12 15 18 21 24 28 32 35 39 45 50 55 60 66 . . . . . . . . . . . . . . . . .

4x800 6.5 0 1 2 3 4 5 7 9 11 13 15 17 19 23 26 30 33 37 41 45 50 53 59 65 . . . . . . . . . . . . . .

1x1400 2.0 2 3 5 7 8 10 12 14 17 21 25 29 34 40 45 50 57 64 . . . . . . . . . . . . . . . . . . . .

2x1400 4.3 0 1 1 2 4 5 7 8 10 12 13 16 18 22 24 27 30 34 37 43 46 50 56 61 65 . . . . . . . . . . . . .

3x1400 6.6 0 0 1 2 3 3 4 5 6 7 9 10 12 14 16 18 20 22 24 26 29 31 35 39 43 46 50 53 57 62 66 . . . . . . .

4x1400 8.9 0 0 0 0 1 1 2 3 4 5 6 7 8 10 12 14 17 19 21 23 25 27 30 32 35 37 40 43 46 49 53 57 60 64 . . . .

Copper thickness conductor 70µm

35µm

38

20 2 x F14 4,3mm

4,3mm

Wirelaid sample


clearance – view on

embedded wires

depth-milled bendable area

Power

electronics

Signal

processing

electronics

cross-sectional area of

embedded wires

Example of use


Introduction

WIRELAID versus

Standard

Design Guide

Example of use



Frequently asked questions by customers

Mr Jürgen Westenkirchner

– Business Development – Sales – Technical Customer Support

FAQ about WIRELAID technology – experience from everyday professional life

1. Hot Spots aon angled wirelaid tracks

2. Connection of Wirelaid layers

3. Layouting Wirelaid layers



Hot Spots aon angled wirelaid tracks

Increased current density

Dinstance between wires according to design rules

Problem investigation

– Thermal analysis

– Explanation:

• Power derating on ohmic resistance

– P = I² x R, increased current density S

– Solution: No hot spots thriugh local high thermal capacity

Relation:


I [A] = 9,1 [mm²] 0,68 * ΔT [K]0,43


Connection of Wirelaid layers

– No „through wire connection“

– Distance between wires according to design guide

– Connection through pad after wire`s end

– The more vias the better the thermal management

Problem investigation

– Similar to angled wires, but with a higher local thermal capacity with the help of cable,

pressfits, etc

» in correlation with the conductivity and the emissivity (radiation, Cu

0,76))

– Leads to temperatur increment



Layout

For implementing the WIRELAID technology in your PCB build-up, use an additional help layer

showing the relevant wires (width and length) in Gerber format

The combination of “bottom” and “wirelaid_bottom” represents the “Wirelaid copper foil” in the

shown build-up


bottom

wirelaid_bottom

(Help layer)

top

Example of use a)

Permanent current load 70 A

Allowed temperature 80C°


before: 8 layer build-up, 6 inner layer 105µm Cu

after: 4 layer with embedded wires (highlighted) under one layer

Advantages in cost by reduced amount of layers and thickness of copper foil

Example of use b)

Permanent current load 50 A

Allowed temperature 80C°


Before: 3 PCBs, 6 layers with 70µm

After: 1 PCB , 6 layers with 70µm + Wirelaid 3D

Advantages in cost through production , solder process and omission of connectors



Introduction

WIRELAID versus

Standard

Design Guide

Example of use



Applications

Automotive


Automotive

Motor electr..

Gear box electr.

Comfort electr.

Sensor and monitoring

system

Energy supply

Hybrid techology

Applications

Industrial electronics


Industrial electronics

Con-/inverter

Motor drive

Power supply

Switching power supply

Voltage distribution

Thyristor activation

control system

Sensor systems

Perspective - Powerflex

Embedded wires into depth-milled „Semiflex-area“

Combination of Wirelaid 3D and Semiflex

– Transfer of signals through Semiflex area

– Transfer of currents through Wirelaid 3D


Advantages of Wirelaid


Introduction

WIRELAID versus

Standard

Design Guide

Example of use



Vorteile der Technologie

High currents without thick copper technology

– High currents within small areas

– Combination of power and signal processing electronics on one single layer

– Partial power management

– Thinner copper layers possible

Cost reduction

– Economical use of PCB area

– Reduction of layers

– Reduced efforts with soldering process

– Omission of connectors

Reliability

– Electrical connection without cable or connector

– Improvement of heat dissipation

Reduced system costs



I appreciate your attention.

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Partial high current solutions WIRELAID · Seite 13 05.11.2013 Wires welded under the internal...

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