Patent Pending

SinkPADTM

Th ll Effi i t PCB T h l f

Patent Pending

Thermally Efficient PCB Technology for the LED Application

Sinkpad Corporation

1

R3Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.

PRESENTATION OUTLINE

Thermal Challenges In The LED Applications

How it is Addressed? Metal Back PCB Technology

Is There a Better Way? SinkPADTM Technologyy gy

What Would I Gain Using SinkPADTM?

Comparisons Of “Metal Back” & “SinkPADTM” Comparisons Of Metal Back & SinkPADTM

Potential Applications

Test Data

Conclusion

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THERMAL CHALLANGES

Increasing Trend For LED Power Increasing Trend For LED Power

Increasing Trend For Higher Brightness

Primary Thermal Path: Conduction Cooling

Higher Thermal Resistance

Power Density Increasing – more LEDs in a small area

Long Life Expectation Long Life Expectation

3R3

How Heat Issues Addressed Historically?

Metal Back PCB TechnologyExample: MCPCB, Aluminum PCB etc…type products

THERMALLY CONDUCTIVE DIELECTRICS Arlon 92ML – 2.0W/m.kExample: MCPCB, Aluminum PCB etc…type products Bergquist – 2.2-3.0W/m.k Doosan – 2.0W/m.k Denka Hit Plate – 2.0-8.0 W/m.k DuPont CoolLam – Polyimide based – 0.80W/m.k ITEQ- IT859 GTA – 2.0W/m.k Laird Technology HKA 3 0W/m k

Thermally Conductive Dielectric

Laird Technology HKA – 3.0W/m.k Polytronics – 2.7W/m.k Sekisui – 2.0W/m.k Ventec - VT 4A1 – 1.6W/m.k

Thermally Conductive Dielectric (TC~ 1 to 4 W/m.k)

Thermal Pad Z-axis HeatThermal Pad or Bond Pad

Metal Thermal Conductivity (TC)Al ~135-180W/m.k

Z-axis Heat Transfer rate:

Only 1-4 W/m.kCu ~385W/m.k

Z-axis heat transfer is limited by the TC & thickness of the Dielectric Material4R3

Is There a Better Way to Remove Heat?

YES

SinkPADTM TechnologySinkPADTM Technology

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What is SinkPAD?

SinkPADTM is a MCPCB Technology gyWhich Provides

Direct Thermal Path to Hot LEDDirect Thermal Path to Hot LED

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“SinkPADTM” TECHNOLOGY

Direct Heat TransferPatent Pending

To view & download this info “Register” belowRegister below.

If you already have Registered before; click on “login” below

Or send an email request at

Z-axis Heat

qeng@sinkpad.com

Metal Thermal Conductivity (TC)Al ~135-180W/m.kCu ~385W/m.k

Transfer rate: 150-385 W/m.k

Cu 385W/m.k

Z-axis heat transfer is same as the TC of the base material used7R3

What would I gain using SinkPAD?

SinkPAD PCB will Lower LED Junction Temperature

Which means :

1) O ti t LED t l j ti t t1) Option to run LED at lower junction temperature i.e Increase Life of the LED Fixture

2) Option to run LED at higher power / maintain temperature i.e. Get more lumens per LED

3) R d b f LED li h3) Reduce number of LEDs to get same light i.e. Reduces Fixture Cost

4) Hi h D i C t B i ht Li ht F C t

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4) Higher Drive Currents, Brighter Light, Fewer Components

“SinkPADTM” TECHNOLOGY

Top View of a SinkPADTM PCBPatent Pending

SinkPAD

Circuit padCircuit traces

9R2

SinkPADTM Product FamilyPatent Pending

SinkPAD P/N Base Metal Base Metal thickness

SP-A530 ALUMINUM 5052 ~0.032” (~0.80mm)

SP-A540* ALUMINUM 5052 ~0.040” (~1.0mm)

SP-A560* ALUMINUM 5052 ~0.063” (~1.60mm)

SP-A630 ALUMINUM 6061 ~0.032” (~0.80mm)

SP-A640 ALUMINUM 6061 ~0.040” (~1.0mm)SP A640 ALUMINUM 6061 0.040 ( 1.0mm)

SP-A660 ALUMINUM 6061 ~0.059” (~1.50mm)

SP-C40 COPPER ~0.040” (~1.0mm)

SP-C60 COPPER ~0.059” (~1.50mm)

* Most running product

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COMPARISION OF “METAL BACK” & “SinkPAD”

“Metal Back PCB” “SinkPADTM PCB”Patent Pending

To view & download this infoTo view & download this info “Register” below.

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Or send an email request at eng@sinkpad.com

Higher Thermal Resistance Slow Heat Transfer Rate

Special Dielectric Required

Thick Base Metal Required

Direct Thermal Path Fast Heat Transfer Rate

Standard Dielectric Used

Thinner Base Metal Optionsq

Limited to Epoxy dielectric only Metal is Insulated Thermally From The Component

p

Epoxy, Polyimide or any typical dielectric can be used Metal is Connected Thermally to the Component

“No” PCB Design Change Required No PCB Design Change Required

9R5

“SinkPADTM” TECHNOLOGY

Multilayer Examples

“ l k C ” “SinkPADTM PCB”

Patent Pending

Does not increase thermal resistanceSubstantial increase in thermal resistance

“Metal Back PCB” SinkPADTM PCB

To view & download this info “Register” below.

If you already have Registered before; click on “login” below

Or send an email request at eng@sinkpad comeng@sinkpad.com

Limitation: Components can be assembled only on one side of the PCB12R3

REQUIREMENT TO USE SinkPADTM

T i & d l d thi i fTo view & download this info “Register” below.

If you already have Registered before; click on “login” below

Or send an email request at eng@sinkpad.com

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POTENTIAL APPLICATIONS

Commercial / Industrial lights

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POTENTIAL APPLICATIONS

Street lights

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POTENTIAL APPLICATIONS

Back lights

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POTENTIAL APPLICATIONS

PAR38 bulbs

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POTENTIAL APPLICATIONS

Residential down lights

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POTENTIAL APPLICATIONS

LED Packaging Substrate

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TEST DATA

SinkPAD v/s MCPCB thermal data

thSinkPAD Rth: 0.45 0C/W

th MCPCB Rth : 1.75 0C/W

deg

C)

deg

C)

Power (W)Power (W)

dT*

dT*

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SinkPADTM makes a lot of sense at mid to high power application, for example the new Cree XML can be driven up to 3A. At this power level, It can be a big difference in junction temp

TEST DATA, Cree 1-XPG

SinkPAD v/s Typical Aluminum back PCB thermal data

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TEST DATA, Cree XP-G

SinkPAD v/s Conventional MCPCB thermal data (IR Camera)

MCPCB SinkPAD PCB- Cree XPG 9 LEDs- Current: 1 Amp.- Power: 3W each- PCB ~ 1”x1” To view & download this infoTo view & download this info

“Register” below.

If you already have Registered before; click on “login” below

1410 C 1190 C

Or send an email request at eng@sinkpad.com

22R3

SinkPADTM PCB & Aluminum PCB mounted onto a separate heatsink. LEDs on a SinkPADTM pcb running ~220C cooler than on the conventional MCPCB

TEST DATA, Luxeon Rebel at 700mA

SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)

- Luxeon Rebel at 700mALuxeon Rebel at 700mA

MCPCB Type-1MCPCB Type 1MCPCB Type-24

MCPCB-1MCPCB 1

MCPCB-2

Test was conducted by Quadica Developments Inc

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LED on a SinkPADTM PCB running ~290C cooler than on the MCPCB-1 and 100C cooler than the MCPCB-2

TEST DATA, Luxeon Rebel at 1A

SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)

- Luxeon Rebel at 1000mALuxeon Rebel at 1000mA

MCPCB Type-1MCPCB Type-1

MCPCB Type-24

MCPCB-1

MCPCB-2

Test was conducted by Quadica Developments Inc

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LED on a SinkPADTM PCB running ~470C cooler than on the MCPCB-1 and 160C cooler than the MCPCB-2

Other Available Test Data

Nichia N219

Luxeon RebelLuxeon Rebel

Cree MTG

Osram Oslon SSLOsram Oslon SSL

Cree XML

Customize Your TestCustomize Your Test

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Highlights and Q&A

Magnitude Higher Thermal Transfer Rate Direct Thermal Path

Patent Pending

Direct Thermal Path 135 to 385W/m.k vs. 1 to 4 W/m.k LOWER JUNCTION TEMPERATURE

High Tg (Up to 225oC)

Multilayer Possible Without Increase In Thermal Resistance

Weight Saving Possibly thinner profile

Di t R l t f MCPCB M t l B k PCB & Al i PCB Direct Replacement for MCPCB, Metal Back PCB & Aluminum PCB

Most Economical Direct Thermal Path Solution Any Questions….. Contact usy Q

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THANK YOUTHANK YOUFor more information contact

eng@sinkpad.comVisit us at www.sinkpad.com

714-660-2944

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Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.