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Penchem’s Profile - Perihal MIDA · Penchem’s Profile Founded: 1 OCTOBER 1999 Address: BUKIT...

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29/4/2014 1 Penchem’s Profile Founded: 1 OCTOBER 1999 Address: BUKIT MINYAK INDUSTRIAL PARK, PENANG, MALAYSIA Nature of Business: DESIGN, MANUFACTURE and SUPPLY of ADVANCED POLYMER and COMPOSITE MATERIALS for ELECTRONICS and MEDICALS Penchem General Electronics Materials Customer Applications Product Category Product Code Applications Special Features Chip On Board Epoxy (COB) EN453 EN485 EN525 EN690 Chip-On-Board Dam & Fill Encap and protect components and bonded wires Good mechanical and adhesion strength Low stress Good thermal-mechanical properties Good weather resistance Die Attach / SMT Epoxy / Silver Epoxy / Under Fill CB625 CB643 DA669 AG806 CB626 CB648 AG803 Bonding chip and component on PCB Die attach (Electrically & non- electrically conductive) Under-fill Good mechanical and adhesion strength Non sagging/smearing No bleeding and tailing High electrical conductivity (silver epoxy) Epoxy Sealant EN690 GL172 GL174 GL440 GL616 Relays & Contactors Fiber optic Lens Low thermal-mechanical stress High thermal and moisture resistance Good chemicals resistance Epoxy Potting / Silicone Potting PT365 PT497 PT638 PT910 Transformer Sensor Low stress Good thermal-mechanical properties Good weather resistance Good flow & self-leveling UV Epoxy UV367 UV379-1 UV405 UV702 Bonding Fiber optic Bonding Lens Tacking Coils Coating High Refractive index (RI=1.4 to 1.5) Good mechanical and adhesion strength Fast curing
Transcript

29/4/2014

1

Penchem’s Profile

Founded: 1 OCTOBER 1999

Address: BUKIT MINYAK INDUSTRIAL PARK, PENANG, MALAYSIA

Nature of Business: DESIGN, MANUFACTURE and SUPPLY of ADVANCED POLYMER and COMPOSITE MATERIALS for ELECTRONICS and MEDICALS

Penchem General Electronics Materials

Customer Applications Product Category

Product Code Applications Special Features

Chip On Board Epoxy (COB)

EN453 EN485 EN525 EN690

• Chip-On-Board • Dam & Fill • Encap and protect components and bonded wires

• Good mechanical and adhesion strength • Low stress • Good thermal-mechanical properties • Good weather resistance

Die Attach / SMT Epoxy / Silver Epoxy / Under Fill

CB625 CB643 DA669 AG806

CB626 CB648 AG803

• Bonding chip and component on PCB • Die attach (Electrically & non- electrically conductive) • Under-fill

• Good mechanical and adhesion strength • Non sagging/smearing • No bleeding and tailing • High electrical conductivity (silver epoxy)

Epoxy Sealant EN690 GL172 GL174 GL440 GL616

• Relays & Contactors • Fiber optic • Lens

• Low thermal-mechanical stress • High thermal and moisture resistance • Good chemicals resistance

Epoxy Potting / Silicone Potting

PT365 PT497 PT638 PT910

• Transformer • Sensor

• Low stress • Good thermal-mechanical properties • Good weather resistance • Good flow & self-leveling

UV Epoxy UV367 UV379-1 UV405 UV702

• Bonding Fiber optic • Bonding Lens • Tacking Coils • Coating

• High Refractive index (RI=1.4 to 1.5) • Good mechanical and adhesion strength • Fast curing

29/4/2014

2

Penchem Thermal Interface Materials (TIM)

Customer Applications Product Category

Product Code Applications Special Features

Silicone Pad TH933 TH936-1

• Heat sink for Power devices • High power IC for PC, Notebook, & Server • Heat sink for high power LED and controller • Heat sink for automobile and heat exchangers

• Very good thermal conductivity up to 7.1W/mK • 2 types of Pad: (a)Non-sticky and (b)One- side sticky • Can die cut to specific size and dimensions • Wide range of thickness (0.2mm up to 5mm)

Silicone Putty / Grease

TH931-2 TH932-2

• Excellent outdoor performance with good stability & reliability • Ease of use by dispensing or screen printing

Silicone Potting TH934 • 2-Part RTV potting compound • Good adhesion and weather resistance • Good flow and self-leveling

Thermal Conductive Epoxy

TH732-1 • 1-Part heat curable epoxy • Excellent adhesion and good mechanical strength • Good thermal conductivity

Penchem Optoelectronics Materials

Customer Applications Product Category

Product Code Applications Special Features

Casting Epoxy OP590 OP692 OP589

• Automobile lighting • Turn signal bulbs • Electronic signs • Signboards • Backlighting • Traffic signal lights Through-hole LED (3mm, 5mm, Oval, Flat-top, etc.) Super Flux Snap LED

• Outstanding performance for outdoor application • Pass TMCL -55°C/100°C, -40°C/120°C • Meet MSL specifications • Low Iv degradation (<10%) • Comply to REACH & RoHS requirements • Halogen free

Encapsulation Silicone

OP955 UV923

• Commercial lighting • Architectural lighting • Outdoor lighting High power LED

• Low thermal-mechanical stress • High thermal & radiation resistance • Low gas permeability • Refractive index 1.41 & 1.55 • Comply to REACH & RoHS requirements

Encapsulation Epoxy / Silicone

OP589 • Backlighting for signage, LCD panel (TV, hand phone, tablet, etc.) • Architectural Lighting • Automotive Accent Lighting SMD LED

• Good heat & UV resistance • Meet MSL specification • Comply to REACH & RoHS requirements

Potting Epoxy OP281 OP577

• S4 (seven Segment Display) for clocks, watches, digital instruments, and many household appliances

• Low stress • pass TMCL • Comply to REACH & RoHS requirements

29/4/2014

3

Penchem low

surface energy

ring barrier

Penchem UV

silicone

by needle

dispense

The finished High

Brightness LED

product

Self dome-forming silicone process replaced conventional

Molding Process. Saved customer 1 million USD per mold.

Customers seek us for engineering solutions

Penchem advanced epoxies with no shifting at high-low temperatures for fiber optics and

microwave devices. Replaced expensive brands with excellent engineering support.

Conventional Compression Mold

Automatic

dispenser

from syringe

needle

1

2 3

4

Microwave Fibre Optics Microwave (Aeroplanes)

Innovations

Customers seek us for engineering solutions

Penchem develop a one part silver conductive epoxy

with high peel strength, low out-gassing and

exceptionally low volume resistivity. This has help

the customer to save process cost with replacement

of two-part system

5

6 3

Hard Disk Drive

MEMS Microphone

Penchem UV and heat curable epoxies that meet

HDD cleanliness requirement. Extremely stable with

low shrinkage and no micro-movement or migration

at high-low temperatures and humidity test.

Successfully replace expensive brands.

Innovations

29/4/2014

4

Developing 3D Printer Technology & Materials

Labs are opened on weekends for “ideas”

2010

Custom Formulations

COB & Relay Sealants

Silver DA & SMT Epoxies

LED Epoxies & UV Cure Adhesives

Markets

Electronics

Automotive

Solar

Medical

Aerospace

Epoxy Technology Roadmap

1999

2001

2003

2006

Aerospace & Composites

Medical Devices

Silicone Epoxy Hybrids Fibre

Optics 2013

2014

2010

2015

29/4/2014

5

Penchem Analytical Capability Exploring Possibilities, Developing Solutions

GPC – Reaction progress

Pyrolizer GC-MS – Purity & rev. eng.

Micro-FTIR – Correct product

Sub-amb. TMA – CTE

TGA-DTA - Hi. temp. stability

Sub-ambient DSC

- % cure

UV Conveyor Oven

– UV polymers Tensile Tester

– Material strength

Silicone synthesis DMA – Modulus & flexibility

Spectrophotometer

– color & % T

High resolution NMR

– Silicone structure detn

& QC

Thermal

Conductivitimeter

- TIM

Applications Lab • Simulate customers process conditions • Help customers resolve material & process issues • Develop semiconductor packaging technology • Build prototypes

Die-Attach Machine

Wire Bond Machine

Color Check Light Box

Solder Reflow with Real Time Video Record Integrating Sphere Light Measurement Humidity Chamber

29/4/2014

6

Research Collaborations

1. UKM 2014: Graphenes & conductive ceramics to enhance thermal conductivity

2. Kannur University, India 2014: Silicone chemistry & technology

3. USM 2013: Carbon nanotube composites for high power ICs

4. USM 2012: Synthesis of silicones of useful functional groups

5. USM 2011: Synthesis of POSS silicones

6. USM 2010: Nano-silver adhesives, enhanced electrical conductivity

7. USM 2007: Synthesis of silicone resins

Global Standard

ISO 9001:2008

Quality Management ISO/TS 16949:2009

Automotive Quality ISO 14001:2004

Environmental

Penchem Certifications and Compliances

Meets Global Standard

Large multi-nationals are confident buying from us.

ISO 13485

Medical

29/4/2014

7

Global Footprint

New York China

California

France

Japan

Taiwan

Malaysia

Thailand

Germany

Some key reasons:

Wide range of high quality and performance products Custom formulations and solutions Cost effective alternative

• Synthesis of own key raw materials • Industry leading price and performance • Small Minimum Order Quantity, MOQ

Strong and comprehensive technical support • Provide competitors evaluations, incorporate with professional

system/equipment manufacturer to provide total solutions, materials failure analysis and process trouble shooting

RoHS compliant (test report issue by SGS and accredited test labs)

Why Penchem Products

29/4/2014

8

Penchem won Most Innovative SME Award 2012

2012 SME Innovation Award,

Manufacturing Category

Most Innovative SME Award 2012

with RM 1 Million Prize

Winning Together

21 June 2012

Penchem won Quality Management Excellence Award 2011

Learning, Exposure & Employee’s Ownership

24 October 2012

29/4/2014

9

Continuous Learning and Benchmarking Penchem Won 2013 Enterprise 50 Award

Penchem was among top 10 winners of 2013 Enterprise 50 Award 15 November 2013

Contact Information

Company Address: Penchem Technologies Sdn. Bhd. 1015, Jalan Perindustrian Bukit Minyak 7, Kawasan Perindustrian Bukit Minyak, 14100 Penang, Malaysia. Tel: +604-5015976, 77, 78 Fax: +604-5015979 Website: www.penchem.com Contact persons: KG Wong ([email protected]) Pierre Tham ([email protected])


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