Pixel Upgrade Carbon Foam and Outer Stave Update E. Anderssen, M. Cepeda, M. Garcia-Sciveres, M. Gilchriese, T. Johnson, J. Silber Lawrence Berkelely National Laboratory W. Miller, R. Ramirez, W. Shih Allcomp, Inc M. Oriunno and M. Convery SLAC AUW November 2010 Topics Outer stave concept Allcomp Inc carbon foam properties Prototypes constructed Prototype testing and design validation Finite element analysis summary Future plans Summary 2 Outer Pixel Stave Concept About 1.4m long, 4cm wide and 4-5mm thick. Thickness depends on final tube ID. Modules on both sides, overlap for full coverage, makes module mounting easier Embedded cable/wires for power, signals and HV (baseline). Option of cable on top (similar to strip staves) High-K, low density, all-carbon foam (Allcomp)(machined) + high stiffness/good K carbon fiber(K13D2U or better) Tube can be Ti or SS(or whatever). ID set by fluid/delta T requirements. CO2 cooling assumed End bend possible to minimize number of pixels hit, reduce material, reduce or eliminate need for disks 3 Support Concepts for Outer Staves 4 Similar to strip stave support. Conceptual. Deflections etc analyzed but no recent work Very conceptual. End support may be possible Bend angle, location not optimized Carbon Foam Key Component All designs in last 2 years are based on carbon foam from Allcomp Inc. Porosity (pores per inch or ppi) adjustable from about 30 to about 130 Density and thus thermal conductivity (K)can be tuned from about 0.1 W/m-K to about 0.8, although this is porosity dependent. Manufactured in blocks and machine to shape Significant development and foam properties measurement program since last AUW. Baseline Allcomp foam for recent and future development of outer staves 130 ppi with = (0.22 nominal) Also used for inner staves Blocks have now been sent to number of other groups. Buy directly from Allcomp Higher density (0.45 g/cc, K about 80) in use for strip stave prototypes 5 Foam Properties Talk at recent LBL meeting summarizing current knowledge atAccess password mech What has been measured (130 ppi baseline) Thermal conductivity, multiple methods at room T. K 35 CTE of foam near room temperature CTE of foam loaded with epoxy(Hysol 9396) and BN powder( 30%) for - 130C