jet stream opening toward theconductive circuit opposite the jetstream opening for electroplatingto form the bump contact point onthe surface of the conductive circuit.
UV-CUIIABU POWDER coan_u.s. Patent 6,017,593. Jan. 25, 2000A.T. Daly et al., assignors to MortonInternational Inc., Chicago
A method for producing a coatinghaving either a high or low glossappearance from a UV-curablepowder coating.
.DA' , "A'IIOII OPTHIID-DI......... MATERIALSU.S. Patent 6,017,613. Jan. 25, 2000T.R. Baum et al., assignors toInternational Business MachinesCorp., Armonk, N. Y.An electronic circuit package comprising a three-dimensional substrate including a circuitized dielectric and one or more,selectively metallized three-dimensional cone-shaped projections disposed on the surface ofthe dielectric.
DUAL THEIIIIAL AND UV-CURABLEPOWDER COAnNGSU.S. Patent 6,017,640. Jan. 25, 2000J. Muthiah et al., assignors toMorton International Inc., Chicago
An opaquely pigmented dual thermal and ultraviolet-curable powdercoating composition, which is ablend of an unsaturated resin selected from unsaturated polyacrylates, unsaturated polymethacrylates, and mixtures thereof;between 0.1 and 10 phr of a photoinitiator selected from a photolytically activated free radical generating compound; between 0.1 and 10phr of a thermal initiator selectedfrom a thermally activated freeradical generating compound; and,between 1 and 100 phr of an opacifier selected from pigments, fillers,and mixtures thereof, in which thecomposition is essentially fully curable, both on the surface andthroughout, with combined thermal and UV radiation cure.
HOT-DIP ALU.INIZED STEEL SHEETU.S. Patent 6,017,643. Jan. 25, 2000M. Kobayashi et al., assignors to
Nisshin Steel Co. Ltd., Tokyo
A hot-dip aluminized steel sheetcomprising a base-metal steelsheet; an AI-Si coating-metallayer having an Si content of 3 to13%; and an Fe-AI-Si alloylayer, formed between the basemetal steel sheet and the Al-Sicoating-metal layer.
PLATED LEAD FRAMEU.S. Patent 6,017,777. Jan. 25, 2000J. Kim et al., assignors to SamsungAerospace Industries Ltd.,Kyongsangnam-do, Rep. of Korea
A method of forming a platinglayer of a lead frame having ananticorrosive property comprisingsequentially plating at least aportion of a lead frame with anickel or nickel alloy and a palladium or palladium alloy; firstheating the plated portion of thelead frame to a first temperaturefor a predetermined amount oftime; and second heating the firstheated plated portion of the leadframe to a second temperaturehigher than the first temperature.
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