Precision Machining

January 2013 1

Extreme Tolerances Exotic Materials (SiC, Sapphire, Ceramics, Hard Materials Sub-micron precision, small and large parts MEMs scale parts and features by direct machining

CNC Milling Wire EDM micro EDM Grinding Wafer Dicing Wafer Thinning Lapping, CMP Precision Tooling Diamond Turning* (fly cutting at sister shop, internally soon)

High Speed High Accuracy CNC Milling

January 2013 2

• Linear Motors• 14 in stages• .25 um accuracy• High Speed• Ceramics• Hard Metals

Wire EDM

January 2013 3

• 8 axis controller• Fine wire• Linear Motors• Sub-micron accuracy

Micro Sinker EDM

January 2013 4

• Linear Motors• Sub-micron accuracy• Holes as small as 5 um

Grinding

January 2013 5

• 4 surface grinders• Tropel flatness measurement• Air bearing spindles• Sub-micron flatness

Wafer Dicing

January 2013 6

Lapping & Polishing

• Sub-mircon position accuracy• Silicon• Compound Semi• Ceramics• Glass

• Diamond and other compounds• Hard and soft plates and pads• ELG (electronic lapping guides)• CMP

Complex Wafer Chuck

January 2013 7

Metrology

Light-weighted Zerodur backside Post Cr thin film transmission test

Precision sub-micro accuracy CNC machining of Zerodur glass

Semiconductor Wafer Tooling Examples

January 2013 8

SiC Wafer-to-Wafer Bonding Plates – Upper and Lower Pair

Zerodur Glass 300mm Wafer Chuck

SiC Vacuum Chuck Tools

January 2013

400 um x 200 um deep vacuum channels

800 um vacuum thru holes in 6 mm thick SiC

Lower Substrate Vacuum Chuck

Upper Bond Arm Pick Up Chuck for rectangular chip

9

SiC Tooling for National Lab Customer – Arc Design

January 2013 10

Fine Wire EDM

January 2013 11