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Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial...

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29
Pressure sensor 2.008-spring-2003
Transcript
Page 1: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Pressure sensor

2008-spring-2003

Surface Micromachining

2008-spring-2003

Deposit sacrificial layer Pattern anchors

Depositpattern structural layer Etch sacrificial layer

Surface micromachining

Structure sacrificial etchant

Polysilicon Silicon dioxide HF1048708 SiNx PSG HF1048708 Silicon dioxide polysilicon XeF21048708 SiNx polysilicon XeF21048708 Aluminum photoresist oxygen plasma

2008-spring-2003

Residual stress gradients

2008-spring-2003

More tensile on top

More compressive on top

Just right

Clean Room

1048708 Gowning with bunny suit1048708 Class 1 10 100

A salt grain on a chip

2008-spring-2003

Class of clean rooms

1048708 Class 1 means one speckle of 05 μ partical in one ft31048708 Class 10 100 10001048708 HEPA filter AHU

2008-spring-2003

Air Filters

1048708 HEPA (High Efficiency Particulate Air) filters1048708 High efficiency low Δp good loading characteristics1048708 Glass fibers in a paper like medium1048708 97 retainment of incident particles of 03 μm or larger

2008-spring-2003

Class of clean rooms

2008-spring-2003

Class Temptolerance tolerance

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 2: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Surface Micromachining

2008-spring-2003

Deposit sacrificial layer Pattern anchors

Depositpattern structural layer Etch sacrificial layer

Surface micromachining

Structure sacrificial etchant

Polysilicon Silicon dioxide HF1048708 SiNx PSG HF1048708 Silicon dioxide polysilicon XeF21048708 SiNx polysilicon XeF21048708 Aluminum photoresist oxygen plasma

2008-spring-2003

Residual stress gradients

2008-spring-2003

More tensile on top

More compressive on top

Just right

Clean Room

1048708 Gowning with bunny suit1048708 Class 1 10 100

A salt grain on a chip

2008-spring-2003

Class of clean rooms

1048708 Class 1 means one speckle of 05 μ partical in one ft31048708 Class 10 100 10001048708 HEPA filter AHU

2008-spring-2003

Air Filters

1048708 HEPA (High Efficiency Particulate Air) filters1048708 High efficiency low Δp good loading characteristics1048708 Glass fibers in a paper like medium1048708 97 retainment of incident particles of 03 μm or larger

2008-spring-2003

Class of clean rooms

2008-spring-2003

Class Temptolerance tolerance

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 3: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Surface micromachining

Structure sacrificial etchant

Polysilicon Silicon dioxide HF1048708 SiNx PSG HF1048708 Silicon dioxide polysilicon XeF21048708 SiNx polysilicon XeF21048708 Aluminum photoresist oxygen plasma

2008-spring-2003

Residual stress gradients

2008-spring-2003

More tensile on top

More compressive on top

Just right

Clean Room

1048708 Gowning with bunny suit1048708 Class 1 10 100

A salt grain on a chip

2008-spring-2003

Class of clean rooms

1048708 Class 1 means one speckle of 05 μ partical in one ft31048708 Class 10 100 10001048708 HEPA filter AHU

2008-spring-2003

Air Filters

1048708 HEPA (High Efficiency Particulate Air) filters1048708 High efficiency low Δp good loading characteristics1048708 Glass fibers in a paper like medium1048708 97 retainment of incident particles of 03 μm or larger

2008-spring-2003

Class of clean rooms

2008-spring-2003

Class Temptolerance tolerance

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 4: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Residual stress gradients

2008-spring-2003

More tensile on top

More compressive on top

Just right

Clean Room

1048708 Gowning with bunny suit1048708 Class 1 10 100

A salt grain on a chip

2008-spring-2003

Class of clean rooms

1048708 Class 1 means one speckle of 05 μ partical in one ft31048708 Class 10 100 10001048708 HEPA filter AHU

2008-spring-2003

Air Filters

1048708 HEPA (High Efficiency Particulate Air) filters1048708 High efficiency low Δp good loading characteristics1048708 Glass fibers in a paper like medium1048708 97 retainment of incident particles of 03 μm or larger

2008-spring-2003

Class of clean rooms

2008-spring-2003

Class Temptolerance tolerance

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 5: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Clean Room

1048708 Gowning with bunny suit1048708 Class 1 10 100

A salt grain on a chip

2008-spring-2003

Class of clean rooms

1048708 Class 1 means one speckle of 05 μ partical in one ft31048708 Class 10 100 10001048708 HEPA filter AHU

2008-spring-2003

Air Filters

1048708 HEPA (High Efficiency Particulate Air) filters1048708 High efficiency low Δp good loading characteristics1048708 Glass fibers in a paper like medium1048708 97 retainment of incident particles of 03 μm or larger

2008-spring-2003

Class of clean rooms

2008-spring-2003

Class Temptolerance tolerance

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 6: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Class of clean rooms

1048708 Class 1 means one speckle of 05 μ partical in one ft31048708 Class 10 100 10001048708 HEPA filter AHU

2008-spring-2003

Air Filters

1048708 HEPA (High Efficiency Particulate Air) filters1048708 High efficiency low Δp good loading characteristics1048708 Glass fibers in a paper like medium1048708 97 retainment of incident particles of 03 μm or larger

2008-spring-2003

Class of clean rooms

2008-spring-2003

Class Temptolerance tolerance

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 7: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Air Filters

1048708 HEPA (High Efficiency Particulate Air) filters1048708 High efficiency low Δp good loading characteristics1048708 Glass fibers in a paper like medium1048708 97 retainment of incident particles of 03 μm or larger

2008-spring-2003

Class of clean rooms

2008-spring-2003

Class Temptolerance tolerance

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 8: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Class of clean rooms

2008-spring-2003

Class Temptolerance tolerance

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 9: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Particles

2008-spring-2003

Class

Federal Standard 209 Number of particles per cubic foot

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 10: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Toxicity

1048708 TLV (Threshold Limit Value)1048708 Upper limit material concentration that an average healthy person can be exposed without adverse effects ppm or mgm3

1048708 Notorious Poisons1048708 CO (100 ppm) CO2 (5000 ppm) HCN (110 ppm) H2S (10 ppm)1048708 SO2 (5 ppm) NH3 (50 ppm) 1048708 Arsenic trioxide AS2O3 (01g fatal)1048708 Hg (01 ppm via skin contact)1048708 All material are toxic in sufficient quantity 5g caffein is fatal

2008-spring-2003

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 11: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

MEMS Applications

2008-spring-2003

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 12: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Display Technologies

MarketLeader

Ramp DIssues

ScreenSize

2008-spring-2003

HDTV for 60rdquo ~ 80rdquo Home Theater1048698 Digital Presentation for 100 rdquo ~ 300rdquo Projector1048698 Key Factor Brightness

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 13: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Brightness of ProjectionDisplays

lux = lumen m2

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 14: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

96365-39 CORPORATE RESEARCH amp DEVELOPMENT

1st Optical MEMS devicePHOTONICS AND MICROMACHINING

DIGITAL MICROMIRROR DEVICE amp DLP TM

PROJECTOR

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 15: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

DMD Optical Switching Principle

DMD Mirror onoff plusmn 10o

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 16: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

DMD Cell Structure

Texas Instrumentsrsquos Technical Journal Vol 15 No 3 July-Sept 1998

2008-spring-2003

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 17: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

TMA

2008-spring-2003

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 18: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Light Modulation of TMAThinfilm Micromirror Array

2008-spring-2003

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 19: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Pixel Architecture

Via contact to MOS

Common Electrode

Drain Pad Gate Line Source Line

Anchor

Post contactto actuator

Mirror

Top Electrode

PZT

Bottom Electrode

Supporting Layer

2008-spring-2003

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 20: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

TMA vs DMD

Actuation

TiltingAngle

Gray ScaleControl

Drawbacks

DMDTM

(TexasInstrument) Electrostatic

-10o 0o +10o

OnOffComplex

bull Fatiguebull Stickingbull High Cost

TMATM

(DaewooElectronics) Piezoelectric

0o ~ 3o(continuous)

LinearSimple

bull Uniformity

2008-spring-2003

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 21: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Micromirror Arrays

VGA640 X 480307200 pixels

XGA1024 X 768

786432 pixels

2008-spring-2003

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 22: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Mirror Flatness (VGA)

2008-spring-2003

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 23: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Coupled Natures of Thin FilmProcesses

1048708 Forward coupling

1048708 Step coverage confromality

1048708 Backward coupling

1048708 Temperature dependent microstructural degradation

1048708 Overunder etch etch stop control

1048708 Side attack Passivation breakage

2008-spring-2003

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
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  • Slide 14
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  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 24: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Evolution of TMA Pixels

2008-spring-2003

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 25: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

MIT Bow-actuator Nick Conway MS 2003

2008-spring-2003

PiezoelectricAmplifiers

4-bar linkage design

End effector

Released

Fixed substrate

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 26: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Design of nanopipette (2)In-line array of nanopipettes

1048698 Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems1048698 Integration with Microfluidic channels1048698 Integration of nanopipettes in AFM in an 100 x 100 array

Single nanopipette2008-spring-2003

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 27: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Photonic crystal modeling

Microcavity waveguide finite-difference time-domain 1 mesh

2008-spring-2003

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 28: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Photonic band gap microcavity waveguide processing

1048708 design matrix of various geometries defect lengths waveguide width da number of holes1048708 Nanofabrication1048708 SiNx mask1 w electron-beam1048708 Proximity pattern transfer to resist1048708 130 nm minimum features

1048708 Hard mask from Cr lift-off 2

1048708 Optimized Si RIE

1 J Ferrera NanoStructures Laboratory MIT 2 J Foresi Kimerling group MIT2008-spring-2003

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
  • Slide 13
  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
  • Slide 18
  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29
Page 29: Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

Design Domains

1048698 Design is a mapping process1048698 From ldquoWhatrdquo to ldquoHowrdquo1048698 Small scale systems design

What How

N P Suh Axiomatic Design Oxford2008-spring-2003

  • Slide 1
  • Slide 2
  • Slide 3
  • Slide 4
  • Slide 5
  • Slide 6
  • Slide 7
  • Slide 8
  • Slide 9
  • Slide 10
  • Slide 11
  • Slide 12
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  • Slide 14
  • Slide 15
  • Slide 16
  • Slide 17
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  • Slide 19
  • Slide 20
  • Slide 21
  • Slide 22
  • Slide 23
  • Slide 24
  • Slide 25
  • Slide 26
  • Slide 27
  • Slide 28
  • Slide 29

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