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Printing based Manufacturing and Integrationof Flexible Electronic Systems
Harri Kopola, Prof., VP Strategic ResearchVTT Technical Research Centre of [email protected] ,Tel.: +358405574867
Content
VTT Printed Intelligence 2012 | For external use
Printed and Flexible Electronics concept cases and applicationsPrinted and Flexible Electronics concept cases and applications
Hybrid In-mould IntelligenceHybrid In-mould Intelligence
Roll-to Roll Manufacturing and Hybrid IntegrationRoll-to Roll Manufacturing and Hybrid Integration
VTT and VTT Printed Intelligence
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PrintoCent for industrialisation and commercialisationPrintoCent for industrialisation and commercialisation
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SummarySummary66
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VTT Technical Research Centre of Finland
VTT ISa globally networked multi-technological applied research organisation
VTT HASextensive cross-disciplinary technological and business expertise unique research infrastructurecomprehensive global partnership networks in business, industrial and research communities
VTT CREATESnew technology and science-based innovations in co-operation with domestic and foreign partners
Turnover 316 M€ (2012) • Personnel 3,206 (31.12.2012)
VTT Center for Printed Intelligence in brief
Key customer sectors- Medical and diagnostics- Consumer electronics- Construction and energy- Materials and processes- Consumer packaging
Key customer offering- Contract R&D- Pilot production trials- IPR licensing and sales- Foresight and roadmaps
Key customer sectors- Medical and diagnostics- Consumer electronics- Construction and energy- Materials and processes- Consumer packaging
Key customer offering- Contract R&D- Pilot production trials- IPR licensing and sales- Foresight and roadmaps
Key research areas- Organic devices- Inorganic devices- Printed optoelectronics- Biobased power sources - Biobased indicators- Bio- and microsystems- Integrated solutions- Large-area manufacturing- Pilot manufacturing
Key research areas- Organic devices- Inorganic devices- Printed optoelectronics- Biobased power sources - Biobased indicators- Bio- and microsystems- Integrated solutions- Large-area manufacturing- Pilot manufacturing
Program evolution- Project mode late 90’s- R&D program 2006-- Commercialization
2010-- Pilot Factory 2012
R2R infrastructure- Laboratories- R2R printing lines- R2R evaporation unit- R2R laser equipment- R2R hybrid integration
Program evolution- Project mode late 90’s- R&D program 2006-- Commercialization
2010-- Pilot Factory 2012
R2R infrastructure- Laboratories- R2R printing lines- R2R evaporation unit- R2R laser equipment- R2R hybrid integration
VTT Printed Intelligence 2012 | For external use
The vision is to create easy to use and cost effective products based on sensing, light emitting surfaces, energy foils, optical films and electrical
circuits by using printing methods.
Printed Intelligence Is Based on…fluid processable materials technology
large area high-volume printing like mass-manufacturing methods
functionality from electronics, biotechnology, chemistry, optics, optoelectronics, etc. integrated as devices and systems
Generic, enabling technologies
Patterning, devices, integration, systems-on-foil, embedding 'electronics’ into products
R2R to hybrid processes & production equipment
Materials
+ possible interconnections of printed systems to wider IS/IT-systems
Impression roll
Printing rollDoctor blade
Ink
Film
Impression roll
Printing rollDoctor blade
Ink
Film
R2R deposition of functional materials
Pilot Factory for Printed Intelligence at VTT
R2R testing of functional layers
R2R injection moulding over printed structureR2R assembly of components
Example:
Deposition of 4 layers in register with wanteddeposition processup to 2 160m2 / day
Example:
Assembly of printedand Si-componentsfrom 300µm to 60mm sizeup to 100 000pcs / day
Example:
Injection moulding with selected plastic materialover printed layer with assembled components5 000pcs/day
Laboratory facilities to fine tune the inks, printing procesess and make proof of concept demonstrators
R2R processed Printed Intelligence product
VIDEO KONEISTASection from video:2:26-2:259
Example:
Testing of connectionsshort cuts and resistivitybetween points50 000 measures /day
Current R2R process capability
Pilot Factory for Printed Intelligence at VTT
Material possibilities
Available R2R processes:
- Forward gravure- Reverse Gravure- Flexo printing- Rotary Screen- Slot die coating- Hot embossing- Lamination- Diecutting
Drying methods:
- Hot air ovens- UV- IR
Multilayer processing:
- Up to 4 layersdeposited at one run
- +/-50µm accuracy in both direction
Process speeds:
- Speed range from0,1 to 30 m/min
- Gravure and hotembossing up to 120 m/min
Dimensions:
- 300mm wide web- 409,575mm repeat
length
Printing capability:- 100µm conductive
lines with 100µm gaps
- ITO patterning
Substrates used:- Around 100 different
substrates tested- Plastics from 36µm
to 500µm (OPP, PET, PEN, PMMA, CA etc.)
- Papers without and with coating
- Metal foils
Inks used:- Conductive inks- Isolative inks- Semiconductor inks- Commercial inks- Proprietary inks- Emitter inks- Light abosorbing
inks- Etc. A long list
13/10/2013 8
Concepts for Integration
• Printed, organic and flexible electronics
• Roll-to-roll manufacturing technologies for electronics, optics and sensors
• Integration to devices, systems and products
VTT creating functional products
from roll-to-roll printingR2R processed OPV foil Solar energy module Autonomous Energy Source
R2R processsed OLED foil 7-segment OLED display In-moulded OLED element
R2R printed memory Printed memory (WORM) Data-carrying card
R2R hot embossing Microfluidic channels Opto-fluidic sensor with light source
R2R Printed sensors Wide area sensor matrix Touch control for signage& passives
Business Forecasts
Freedom of Design
Organic Photovoltaicfor energy harvesting
Organic Light Emitting Diodesin product package
Microfluidic channels
Any shape for light emitting surfaces, solar cells, touch sensors, microfluidic channels etc. with printing
• Arbitrary shapes, any size, decorative design
• Flexible, thin and light-weight
• Various colours, transparency
• Scalability, customising
Printed & Flexible Electronics OpportunitiesBuildings
Key features:Easy integrationInvisible - DecorativeDistributed in large-area
Asset management with autonomous sensors in large-area surfaces:• Temperature, humidity, air flow &quality etc. Printed,
and/or Si, OFT switching• Arbitrary shape and decorative energy
harvesting &storage with printing • Zero-power electronics, wireless power
Energy efficiency and Comfort with Smart lighting:• Thin, conformal, large-area illuminated surfaces• Integrated smart control, wireless communication
and interoperability e.g. with 3D depth sensors• Hidden configurable user interfaces and control
panels is walls, furniture
Smart windows and active facades:• Controllable transmission windows with
electrochromic films• Transparent User Interfaces• Building integrated Photo Voltaic
Turn any surface to smart User Interface
Capacitive sensors –touchless
Resistive sensors –TransparencyCourtesy FP7 FLEXIBILITY
Force sensors –robustness
Wallpapers, construction elements or furniture canbecome User Interfaces
• Proximity sensing for wide-area user interfaces
• Hidden/visible UI elements for every surface -also conformal
• Thin modular structure for quick installation and configuration
• IoT compatibility – App and cloud connected
Printed & Flexible Electronics OpportunitiesAutomotive
Key features:Reduced weight, volume and cablingIncreased safety and comfortFuel savings and reduced emissions
Conformal In-mould Interiors:• Integrated lighting & overhead consoles• Control panels for doors, armrests, pillars and
central console• Printed Heaters for floors, seats
Conformal autonomous exteriors:• Photovoltaic and batteries • Tail lights• Embedded climatic sensors
Vision enhancement & info availability:• Transparent displays • Head-up-display optical films• Sun protection electrochromic films
Courtesy Fiat
Printed & Flexible Electronics OpportunitiesPersonal Wellbeing
Key features:Disposable Easy to useLow cost
Wellbeing:• Detect volatiles in breath or food with printed
sensors• Detect volatiles or bacteria in food • Disposable indicators for water quality
Cosmetics:• Flexible solution for electrical and light-based
skin care with disposable batteries, LEDs• Microfluidic solutions for liquid and fragrance
delivery
Health:• Printed medical diagnostics based on
microfluidistics• Flexible hybrid disposable healthcare sensors
with printable components such as sensors, displays and batteries.
New flexible products- case Disposable healthcare sensor
Single-patient use disposable healthcare sensor
• Concept demonstrated
• Simple flexible structure with polycarbonate foil, printed wirings, SMD components bonded with conductive adhesive
• Connector over-moulded on the functional foil: mechanical locking, electrical connections and plastic embedded SMD components.
Over-moulded connectorHealthcare sensor
Developed in TEKES funded project Mobisens for GE Healthcare
Printed & Flexible Electronics OpportunitiesConsumer Electronics & Accessories & Games
Key features:Design FreedomConformal functional surfacesReduced complexity and volume
Design Freedom :• Arbitrary shape and decorative battery life
extension with printed photo voltaic• Elimination of holes and interconnects with
printed touch controls• Thin, flexible, light-weight and robust for
wearable electronics with elastomer over-moulding
Integrated signage and lighting:• Conformal indicators and back-lighting with
ultra-small ILED and OLEDs• Secondary displays with ILEDs,
electrochromics and electrophoretic displays
New user experience:• Control by bending • Touch controls• Combining with graphical products
Printed & Flexible Electronics OpportunitiesRetail
Key features:Eye-catchingInteractiveProductivity
Point-of-purchase:• Attention and information• User interface connecting physical and digital
world for new WEB services• Interaction and cloud connection with NFC
smart phone
Interactive brand advertising:• Blinking lights with ILEDs and OLEDs +
wireless power• Changing images with active paper or
electrochromic displays• Electronic shelf labels
Logistics:• Logistic chain condition monitoring with printed
sensors, displays, memory, battery• Active 2D&3D RFID tags for goods &
container tracking & history• Stock management with force sensors
Flexible Signage and lighting
Flexible OLEDs LED chips on flex Hidden indicator lights
Indicators and backlighting elements to be integrated to thin, flexible and conformal end products
• Interactive packaging and point-of-sale products
• Gaming and entertainment applications
• Interactive graphical products such as posters with user interfaces
• Smart cards and smart labels
• Consumer electronics and interior design products
Hybrid in-mould intelligence
Integrated functionalities:Sensors & Sensor arrays • User feedback • Processing & Communication •
Power supplies & Storage • Antennas & Wiring
Integration of printed and surface mount discrete electronics components into freeform intelligent products
using roll-to-roll compatible mass manufacturing methods.
Next generation In-Mould-Labelling
from graphic overlays, front panels and labels
owardsmore integrated
Assembled Film Over Moulding
Assembled Film Over-moulding-Optics-electronics-mechanics combined
Smart covers In-moulded OLED Plastic optics
Next generation In-Mould-Labelling from graphic overlays, front panels and labels towards more integrated Assembled Film Over Moulding
• Flexible OLED foil embedded into 3-D mechanical structure
• LED bare dies/packages + light guiding optics• Capacitive touch controls, wirings, control
electronics etc.• Integrated battery compartment and on/off switch
can be formed in the injection moulding process without any additional post-processes
New Product concepts: Spin-offs
Commercialization case of hybrid In-mould Intelligence
• Company founded 2011• Cost-effective touch panels• Highly integrated, non-breakable structure• Tablet, phone and PC markets• Patented optical touch screen technology • www.tactotek.com
Increase the maturity level
Copyright VTT
Printed Intelligence Industrialisation - PrintocentCentre for business development in the area of Printed
Intelligence and Optical Measurement.
Offers a world-class Roll-to-Roll pilot manufacturing environment based on Printed Intelligence processes.
Brings together complementary players across the value chain - ranging from technology providers to customers.
New Printocent Industry Cluster: Eco-system building
Now 35 companies committed
Contact Director Ilkka Kaisto ([email protected])
Copyright VTT
GoodWillerOy
Micro & startup SME LSE
PrintoCent Industry Cluster members 31.8.2013
Copyright VTT
PrintoCent 2013 – 2015Cluster and the Three programmes
COLAE- pan-European supply chain in Organic and Large Area Electronics
COLAE project connects players within the industry to create and develop a pan-European supply chain that deliver tangible value and benefits for its members.
COLAE Services:Enhancing awareness OLAE trainingFeasibility networkVirtual OLAE foundry
More Info: www.colae.euAcronym: COLAEStarting date: 1 Sep 2011Duration: 36 monthsCall: FP7-ICT-2011-7EC budget: EUR 3.75MCoordinator: VTT Technical Research Centre of Finland
Summary
• Printed Intelligence and Electronics Technology and Components demonstrated
• Roll-to-Roll and Hybrid Integration Pilot Factory available• Time for System and Product development• We wellcome new Cooperation Partners to join our research and
commercialization effortscreating application driven value chainsmembership in PrintoCent Ecosystemor bilateral co-operation
Wireless power Hybrid integration Printed conductors Embedded Electronics Embedded Software
VTT creates business from technology
Contact information:Harri Kopola
Prof., VP Strategic [email protected]
Tel.: +358405574867
PRINSE’14 – Printed IntelligenceIndustrial SeminarIn Oulu, Feb. 25-26, 2014