PRISM: ERC-LIFE, Feb 25, 2007 Overview of Flexible Electronics for LIFE James C. Sturm and Sigurd...

PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007

Overview of Flexible Electronics for LIFE

James C. Sturmand Sigurd Wagner

Department of Electrical EngineeringDirector, Princeton Institute for the Science and

Technology of Materials (PRISM)

Princeton University, Princeton, NJ 08540 USAsturm: 609-258-5610, [email protected]

wagner: [email protected]

If you really need to reach me, my administrative ass’t. is Ms. Sheila Gunning, [email protected], 609-258-1575


Outline

• Conventional Microelectronics

• Large Area and Flexible Microelectronics

• Applications


Finished Silicon Wafer after fabrication

• Each square (cm x cm about) is its own circuit, with millions (billions) of connected transistors. 100’s of chips on wafer, typically.

• Also, miles and miles of wires (printed metal stripes) on them • The process of making them is known as “Very Large Scale

Integrated” technology (VLSI)• Typical features sizes today = 0.1 micron = 100 nanometer = 10-5 cm


One chip

• After it has been “diced” from the wafer.• Also known as a “die”• 0.5 – 2 cm on an edge, typically


• Each metal leg of the package is connected to a mini-wire which is connected to the chip.

Wire connection “pads”


The chip is put into a black plastic/ceramic package for use in applications

• Each metal leg of the package is connected to a mini-wire which is connected to the chip.

• These are ususally soldered into green “printed circuit boards” (e.g. 6” x 6”) that you see in electronic products

• Small, hard, and rigid,


Integrated Circuit Business Model

1. Make the transistors and wires on the chip smaller (nanotechnology)

2. chips are smaller and more chips fit on a wafer 3. The cost per chip is lower (or more on a chip for same

cost): costs per function DROP over time (108 x in 35 years)

4. Increase sales through more applications enabled by low cost

5. The business problem: it is getting harder to make things smaller and still have the transistors work and be cheaper. So what do you do? (“End of Moore’s Law”)


Outline

• Conventional Microelectronics


• Applications


Flat panel TV Princeton Macroelectronics Group

Samsung Apple Computer


Real time image processing in PC

Picture archiving and communications system (PACS)High

performance display

Flat panel

detector

High speed

network

Digital X-ray imager Princeton Macroelectronics Group

Richard Weisfield, dpiX


Solar electric module Princeton Macroelectronics Group

Akihiro Takano, Fuji Electric Advanced Technology


a pixellated surface

switch, amplifier

sensor actuator

cell (pixel)

interconnects

Architecture of an electronic surface

rigid, flexible, or deformable, or elastomeric substrate

Steel foil, thin glass, rollable or stretchable plastic, ...

Princeton Macroelectronics Group

“Backplane”: Electronics

“Front plane”: End function


A liquid-crystal display Princeton Macroelectronics Group

Frontplane


Was LCD readout (‘70s), laptop display (’80s), desktop monitor (90’s)

Is flat screen TV, X-ray imager, thin-film solar cell (’00s)

What will be next??? (’10s)

Much of large-area electronics was invented at the RCA Labs in Princeton:

- Paul Weimer … thin-film transistor in the ’60s

- George Heilmeier *62 … liquid-crystal display in the ‘60s

- David Carlson and Chris Wronski … amorphous-silicon thin-film solar cell in the ‘70s

A brief history of large-area electronics


Bend: Small deformation, elastic, one-time or repeated

Conformally shape: Large deformation, plastic, one-time

Stretch: Large deformation, elastic, repeated

3 degrees of shaping a “flexible” electronic surface

Princeton

E Ink - Princeton

Princeton

this case: steel foil substrate

this case: plastic foil substrate

elastomeric substrate

1950 1960 1970 1980 1990 2000 2010

0

50

100

150

200

250

$US

Bill

ion

s

Year

Semiconductor shipments Flat panel display shipments

Data courtesy of David Mentley, iSuppli; Ken Werner, Nutmeg Consultants; Barry Young, DisplaySearch

The display industry is developing the tools and is reducing the cost for making large electronic surfaces

Large area electronics is growing like microelectronics in the early ’90s


Section of 300-ft. long roll-to-roll solar cell manufacturing line

Energy Conversion Devices (USA)

Industrial a-Si:H PE-CVD systems are huge

Inline system for making solar cells on steel foil substrates


Silicon Thin Film Transistors on Flex Substrates

Motorola

TFT on steel

6 cm

Deformable plastic for 3-D shapes

E-ink display on backplane of a-Si TFT’s on steel foil


Outline• Conventional Microelectronics


• Applications: Think Potential Large Area Flex, Bend, Stretch, Deform Backplane (electronics) + frontplane (function) Arrays Function:

sense light, temperature, strain, chemical properties, sound control light, local heating (drug release?) actuate: move, bend, squeeze

I will give 2 examples directed at medicine


A surround display

Zenview

A digital dashboard

Miltos Hatalis, Lehigh U.

A Cyberhand

Cyberhand Project An e-SuitGivenchy Fall ‘99


Rigid Microelectrode Arrays In Vivo(Thanks to B. Morrison, Columbia and

S. Wagner, Princeton)

• Brain Computer Interface

Campbell, IEEE.Trans.Biomed.Eng., 1991

Micromachined silicon

Cyberkinetics Neurotechnology Systems

Titanium

Fofonoff, IEEE Trans.Biome.Eng., 2004

Kipke, IEEE Trans.NeuralSys.Rehab.Eng, 2003

SiliconMichigan Probe

UtahArray


Flexible vs. Stretchable MEAs

• Electrodes on Polyimide (5 GPa)

Flexible Ultimate limit

• 4% stretch• Bending

PDMS (1 MPa) Stretchable Ultimate limit

• Max ~ 50%– Uniaxial

Maintains conduction

Keesara, Proc.MRS, 2006

Polyimide

PDMS

gold film

Chambers, Proc.MRS, 2003


Traumatic Brain Injury Model

• Complex organotypic brain slice culture• Apply deformations consistent with TBI

Study the tissue response

Tissue

Well

Indenter

Membrane

Morrison, J.Neurosci.Meth., 2006

CA1

CA3DG

Nissl


Application 2:(E-problem: file corrupted)

• Front plane: “electret sensor” S. Bauer, U. Linz, Austria• Converts pressure to electricity

Array of pressure detectors – covering large area Array of microphones over some array

• Converts electricity into motion Can make thin film “breathe” in and out, local control

Will send rest of file later


END


Moore’s Law

• Not fundamental, just an observation• Has continued despite many predictions of demise• Billions of T’s on a single chip!!!!! (in DRAM memory, one bit

requires one transistor)


How do they get all that stuff on the chip: It’s a Small World!!

10-1

100

101

102

103

104

105

1960 1970 1980 1990 2000 2010 20201E-4

1E-3

0.01

0.1

1

10

100

Siz

e (N

anom

eter

s)

size of atoms

human hairTransistor Gate Length

Year

Siz

e (M

icro

ns)

Feature Sizes on Integrated Circuits(m

illi

onth

s of

met

ers,

thou

sand

ths

of m

illi

met

ers)

(bil

lion

ths

of m

eter

s,m

illi

onth

s of

mil

lim

eter

s)

Gate length is key number: often the smallest size of the width of a layer on a chip

Where Nanotechnology came from!

2006: gate length ~ 30 nm in advanced production

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PRISM: ERC-LIFE, Feb 25, 2007 Overview of Flexible Electronics for LIFE James C. Sturm and Sigurd...

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